TWI242593B - Adhesive tape for semiconductor apparatus - Google Patents

Abstract

An adhesive tape for a semiconductor apparatus comprises an insulating film and a thermosetting adhesive layer, and when a product of the reciprocal number of the thickness of the thermosetting adhesive layer and loss modulus of the thermosetting adhesive layer at 200 DEG C after curing is larger than 0.25 MPa/mum, superior wire bonding characteristics are obtained. Furthermore, when a product of the reciprocal number of the thickness of the thermosetting adhesive layer and storage modulus of the thermosetting adhesive layer at 200 DEG C after curing is larger than 1 MPa/mum, the adhesive tape for a semiconductor apparatus exhibits more superior wire bonding characteristics.

Description

1242593 说明, Po Ming explanation [Technical field to which the invention belongs] The present invention relates to an adhesive tape for semiconductor devices, which can be used in the combined engineering of semiconductor devices, and is a tape-and-tape automatic bonding (TAB) suitable for high-density construction of devices. : Tape Automated Bonding) TAB adhesive tape; suitable for ball grid array (bga: & id Ay), chip scale package (CSP: Chip Sca) e pack; tape; lead frame ) Fixing adhesive tape; and the method of connecting the lead frame and the film conveying tape by wire bonding, etc., especially suitable for surface-mounted semiconductor devices. ^ [Prior art] Nearly flat, light; E of The requirements for high-density semiconductor devices are increasing. The core of electronic components and the number of pins (semiconducting Γ: t) are closed. The conventional peripheral connection type has gradually changed to the area connection type BGA and CSP. High-density Ic package. Following the CSP, a surface grid-shaped solder ball is provided on the inside of the package as a terminal for connection to the outside. Ic is formed on an IC package (BGa, csp) mounted on a circuit substrate for rewiring (bottom: Ran rewiring substrate), and is constructed in a main substrate such as a rigid printed circuit board.

Rr 嶋 is roughly classified into rigid plastic A (P-BGA) and flexible film BGA (T BGA) according to the type of rewiring substrate. In T B, there are = internal lead paste ILB with ^ ΤΑΒΘ: h take the mountain ad Bonding) h is connected to the fresh line ⑼⑽—㈡ The type is called Fu Zeng Geng 315196 5 1242593 is called precision pitch ball grid Fbga: Fine pitch Baii

Grid Array) or flexible film wafer size structure (T_csp ·

Size Package) ° In the past, the redistribution substrates of the above BGAs were made of hard slabs such as glass epoxy substrates. In recent years, with the popularization of mobile phones, the demand for 5L thinning of Mo Erli has been raised. Generally speaking, making high-density wiring is also easier than rigid substrates, so flexible thin-film substrates have become mainstream. T_BGA (Tcp-type and FBGA or Ding-CSP) using this flexible thin-film substrate is widely used. In particular, Tcsp has been changed from the FanMW method of the previous MW to the Fan__ method to achieve miniaturization and reduction of the installation area. It can be expected to expand further in the future. The above-mentioned can be used in the TAB method of packaging (Tcp), 叩 〇a for the use of the soil sheet system "by the" coating agent "metal foil laminated on the polyimide film used in households U 纟Adhesives are required to have tackiness. In addition, since the softener is self-adhesive at the connection temperature, because the softener is at a high temperature and has a margin of trust, the T_csp of the bonding wire bonding method is used. In welding, a gold linear film substrate is used. When the aluminum electrode portion on the 1C wafer and the TAE substrate ^ electrode wiring portion (the ridge portion) are provided, the hardness of the adhesive at high temperatures is required due to the high temperature and the pressure applied. That is, the thin film substrate has excellent Bonding wire bonding requires a certain degree of hardness during adhesion. In soft & special film substrates, since it is a packaging substrate, it requires structural properties such as general edge and copper, and copper. Migration and other reliability and other reliability. 6 1242593 Conventional adhesives mentioned above are based on thermosetting resin_ (acrylonitrile · butadiene polymer) -based adhesives (Japanese patent = "_Tiger bulletin No. 2" To page 5) and hungry adhesion . Among them, ^ = 7 is cheap, easy to use, etc., and is not limited to ^ substrates and is widely used.鈇 .. ^ • ',,' And the filial piety film substrate using% oxygen resin / NBR-based adhesives is being recorded by people who know, 'Spring is connected, because the flexibility of NBR makes the heavy, metal wire There is a problem that the bonding property of the bonding wire is not adhered to the solid part. In addition, under the temperature change of time and high temperature and high humidity, there are doors with resistance to tanning, wire bonding, and insulation. The reason is that NBR is based on the diene alkylated manganese as the starting material. After being exposed to high temperature for a long time, it is contained in the main chain: Also: It is cracked due to oxidation, gradually loses its elasticity, and the stress relaxation effect is gradually lost. The reason for the problem of transporting U-shaped temples. In addition, when the fine pitch of the cloth substrate is further advanced, the adsorption of copper ions by ancient, θ, and quaternary acrylonitrile groups, etc., will cause copper migration problems due to the roles of Ding J and W Temple. [Summary of the Invention] The purpose of the present invention is to solve the problems of conventional adhesives, and to provide an adhesive sheet for semiconductor devices with excellent fresh wire bonding. It is only determined by the storage modulus of the parent system. The thickness of the adhesive is also specified as a general thickness, but this is not set based on the consideration of the bondability of the wire. According to the results of the dedicated study and discussions conducted by the 7 people in the case of Tan Dan T, it was learned that even if the storage is completed, the buckle and the mold loss are set low, σ should be fooled by the clumsy ^ /, and the thickness of the agent must be reduced. Improving the wire bonding property of soft film for semi-monthly and month-old KK. 315) 96 1242593 That is, the semiconducting μ @ of the present invention is a kind of adhesive tape with a insulation film, 彖 n 4 film, and the insulation ^ R, amine, and ^, A thermosetting adhesive tape for semiconductor devices is provided on one side, which is characterized in that: the inverse of the thickness of the above thermosetting :: adhesive layer and the thermosetting adhesive layer after the thermosetting are added to 20 〇 . The product below 〇 refers to the product obtained by multiplying the product of y b a + by the loss of plate 1 more than 0.25 MPa / m. In the adhesive sheet for semiconductor placement of the present invention, the above-mentioned thermosetting adhesive sound, the reciprocal of 9 and the thermosetting adhesive after the thermosetting are layered at 200. The product stored below is stored in the description of the yak, and the product of your puzzle 1 is preferably greater than j MPa / // m. The thermosetting adhesive layer contains a polyamide resin, and the polystyrene resin is preferably obtained by using an unsaturated fatty acid dimer having 36 carbon atoms. The unsaturated fatty acid dimer is preferably made of linoleic acid. [Embodiment] (Best Mode for Implementing the Invention) The present invention will be described in detail below. (Adhesive Tape for Semiconductor Device) For the semiconductor device of the present invention Adhesive moon belts are those that form a thermosetting adhesive layer on at least one side of the insulating film. The inverse of the thickness (// m) of the thermosetting adhesive layer and the thermosetting adhesive layer after curing are at 2㈧. ^ The product obtained by multiplying the loss modulus (MPa) below (loss modulus χ iy thickness) is greater than 0.25 MPa / # m., 1242593 (insulating film) The insulating film of the present invention has electrical insulation The film can be made of ❹, ，, 乂, 乂, 乂, 乂, 乂, 乂, 乂, 乂, 乂, 乂, 乂, 坤, 坤, 坤, 聚, 亚, 聚, 聚, ——female polyether 醯 imine, polybenzyl sulfide, polyether _ ==. Among them, polyimide film has the best insulation and resistance to rubidium. Sex ^ imine is a commercially available product, using the trade name of Toray DuPont Co., Ltd. (Polyimide), Ube Kosan Co., Ltd.

Upilex (from biphenyl ... imine), Zhongyuan Chemical Industry Co., Ltd .: Apical (Polyimine), etc. are preferred. The thickness of the stone-edge film is 2—G " m is better, ^ = 5 "is more preferable. The thickness of the insulation film is not stricter than that of the 〇 士 寺 口, which makes the portability worse, but It is difficult to obtain a small-sized semiconductor device if everything is done. (Thermosetting adhesive layer) The layer formed by the adhesive of the layer of the thermosetting adhesive in the present invention. The inverse of the sound (") of the thermosetting adhesive and the thermosetting; I 'is the product of the thickness of the thickness of the thickness of the product (i.e. MPa). (In short, loss] / Dwelling) is greater than the change, you bite 4 days > low on the same day $ the thickness of the adhesive is thick and thick, you can improve the bondability of the south wire. Therefore, the 模 of the loss modulus of the agent layer and the thickness of the adhesive layer is determined by the adhesion. The ideal is a thermal hard work; jin… λν ^ ^ 9 The inverse of the ochre ochre φ 伖 chemical heat hardening adhesive layer at 2… 'more L multiplied by the loss modulus in 315] The product of 96 9 1242593 is above 0.6MPa /// m. The product of the reciprocal of the thickness of the thermosetting adhesive layer and the temperature of the thermosetting adhesive at 2000 ° C. The product obtained by multiplying the value of 卜 is equal to or less than ^ / ^ In the case of r, the gold wire is not attached to the m 1 wire during the wire bonding step, and the gold wire is not completely connected to the wall. Therefore, after the wire bonding step, the left and right low temperatures are raised to the set value: One heat treatment hour or so. In order to achieve: from Γ ° to below π bite from returning, you can also use low-molecular reactive substances such as fat, polyimide resin, polyimide resin, and the content of Tree material. The hardening of the lice tree: hard :: The thickness of the sex point agent layer, if taking into account the electric penetration and adhesive force, it is better to be more than 仏, at this time the collar loss can be set to 0 75MJPa static mode When the amount is high, when the swell of the thermosetting adhesive layer of the test heart and the static modulus are different, and it is easy to curl, it is expected that the thickness of the thermosetting adhesive layer is thin / heat of physical material ::: sticky Hard: The thickness of the adhesive layer thickness (") _ (storage mode θ 'is Θ layer square; the product obtained by multiplying the storage modulus at 200 c: the broad number and the thermosetting adhesive layer after heat curing are at 2 When the product obtained by multiplying the modulus of the line by the people is enough, in the fresh temple, Mo Yan fully connected the gold wire to the crotch. Change! The reciprocal of the thickness of the sword layer Thermal hardening after thermal hardening] 〇315196 1242593 The product obtained by multiplying the storage modulus of the adhesive layer at 200 ° C is particularly preferably greater than 3MPa // zm, and more preferably greater than 10Mpa /// m In order to achieve the above, the molecular weight between the crosslinking points of the polyamide resin and the phenol resin can be made small, and the thermosetting adhesive layer can be made to contain a high modulus at room temperature. Resin is used. Here, the loss modulus and storage modulus can be determined by a Dynamic Mechanical Analyzer (DMA: Dynamic Mechanical Analyzer) >#, j ^ 〇 ^ ^ ^ and the measurement conditions of the storage modulus are in the examples. Explanation. (Materials for the adhesive layer) The materials for the adhesive layer used in the thermosetting adhesive layer are adhesives that have hardening properties due to osmium. The materials can be exemplified by polyamine resins and those containing hardening properties. Resin. (Polyamine resin) Polyamine resin is synthesized by the fusion of aliphatic diamines with 4 or more carbon atoms and non-amplified fatty acid dimers. The specific examples of the tribe- 脍 ximu sister yt are tired of the number 4 yue-yue girl can be listed as: succindiamine, pentanediamine, =, di-di Γ, decanediamine, dodecadiamine, etc. Among them, It is better to use carbon as ..., fatty diamine is more preferred, aliphatic monoamine having 4 to 12 carbon atoms is more preferable, and aliphatic monoamine having 6 to 12 carbon atoms is used. Carbon original early seal 4 ... Yayue female is the best. (Such as aliphatic diamine, 埶 砀 servant + knife) the day of the moon ... dagger 'The adhesive layer also exhibits gf properties at high temperatures), and due to the high viscosity (methane strength), the adhesive strength with insulation can be obtained .... Contains poly_lipid ... In the case of Φ, it is possible to use the ㈣ layer to reduce the heat shrinkage even if it is lower than 、, 、, 仔, 仔, 阿, 仔, ', 315, 1242593 and the fatty acid dimer with 36 carbon atoms due to irreversibility and It is suitable for use at the point of == sex. Permanent object h can be obtained by condensing a fatty acid with a carbon number of 18 and an unsaturated fatty acid with a number of 18 as an example. Such as: oleic acid, linoleic acid, linolenic acid, etc. Among them, linoleic acid is particularly preferable because it is easy to adjust the above (loss modulus x degree) to more than 0.25 MPa / # m. It is more preferably composed of oleic acid or linolenic acid from M "to Bailey's linoleic acid plate 001 to temporary denier" to 20 Bailey%. In addition, in the synthesis of polyamide resin, in addition to carbon In addition to a dibasic acid diamine having an atomic number of 4 or more and an unsaturated fatty acid dimer, a small amount of trifunctional or higher functional acid components and trifunctional or higher amine components may be used as auxiliary components to synthesize a 2-branched polyamine resin. The trifunctional or higher functional acid component (or trifunctional or higher amine component) of the secondary component is preferably within 20 mol% of the total acid component (or amine component) in the polyamide resin, and 10 mol is preferred. It is better to be less than%. If the secondary component exceeds 20 mol%, the flexibility of the thermosetting adhesive layer after hardening is deteriorated. From the viewpoints of pairing / combining J / combining properties, etc. The mass average molecular weight is preferably 50,000 to 50,000, and more preferably ^ ⑼ to "... ⑽". The mass average molecular weight is determined by gel permeation chromatography (Gpc: to) permeatjng

Chromatography). In addition, the amine valence of the polyamine resin is preferably from 0.5 to 60 ', which is more preferable. "When the amine value is less than 0.05", the electrical insulation is likely to deteriorate. When the amine value exceeds 60, unreacted amine remains. Base makes the circuit easy to be polluted and easy to cause the problem of ignition failure. Also, when using two kinds of polyamine resins with different amine values, it is easy to control the thermosetting viscosity after curing 315 196 1242593 adhesive layer; # 卜 4 i ϋ, the polysaline 枓 2 'The amine valence of the polyamine resin is the "partial fat dissolved in toluene / n-butanol mixed". An alcohol solution is used as an indicator. · _Acid is used; officials use two =, expressed by the equivalent of potassium hydroxide. ^ Performed as a diarrhea solution. In addition, the sum of the amount of fluorenyl resin in amine resin is divided by 2 ^ inflammation. ] In the knife (the molecule of acid and diamine is reduced and it is confirmed that 1 level ^ Du 50 to 400, the cohesive strength of the adhesive at room temperature is guaranteed to maintain its tenacity, as a result, the thermosetting adhesive ¥ " The sticky sheet ▼ is very good. "The layer improves its workability because it is not curled, so it is (hardening resin)." Human "summarizes the composition of the adhesive hardening resin as long as it is used. The hardening resin of the branch. Any chemical resin can be used, such as 1 ', sclerosis, petrochemical, and light hardening, etc. ~ soil, because it can obtain excellent electrical insulation and high resistance. Examples of lipids include "A", "Novolac resin, phenol resin, etc." In particular, ψ ^, formazan resin, polyparaben, and resol resin can obtain high resistance, and can be lowered to the right The hardening properties of the epoxy resin are 埶 hardening properties & | β and are nephews. Phenolic resins are important to obtain "more important" heat resistance of 2,000 to 50, _, to 2, _ to] 5, _ Is better, and a knife is better. 'It is better because it can obtain heat resistance. For those who are more than MC, it can be improved. The softening point of the heat is good, and the epoxy resin can be used as long as it is present. Specific examples are: bis, bis, bisphenol F, bisphenol F, 315196, etc. 13 1242593 = type w resin, naphthalene type epoxy resin, ㈣ varnish type = 嶋 type ring her, tetraglycid § E type epoxy resin, "u propylene propylene * yuan type epoxy resin, epoxy amine type ring Difunctional or polyfunctional epoxy resins such as oxyresin and tri-dimethyl = oxyresin are especially suitable for use with long-term, low-molecular, multifunctional epoxy resins. Moreover, imine resins are bifunctional It is suitable for maleimide imide. Ρ For the adhesive layer material, hardening resin components other than the above-mentioned phenol resins and oxymethylene resins can also be used in combination. The polymerization accelerator may also contain a polymer. Amine, acid liver, compounds, and the content of 'polyamine resin in the hardening adhesive layer is 20 to 80% by mass of the resin component including the hardening resin, based on heat resistance and chemical resistance. It is better from the point of view, and it is more preferable if it is 30 to 70% by mass. The agent layer may contain a thermoplastic resin wax in addition to a polyurethane resin and a curable resin. By including the thermoplastic resin, the hardenable thermosetting adhesive layer can be attached to a profitable thermoplastic resin. Examples of the resin system include polyamine resins having a composition different from that of the above polyamine resins (for example, polyamidoresin having an aliphatic diamine of 3 or less carbon atoms); acrylonitrile-butadiene containing a carboxyl group Copolymers, acrylonitrile-butadiene copolymers containing fluorenyl groups, acrylonitrile-butadiene copolymers, such as acrylonitrile-butadiene copolymers containing epoxypropyl groups; thermoplastic polystyrene Acid rubber, styrene-butadiene copolymer, and the like are applicable as long as they are thermoplastic resins having functional groups such as amine groups and carboxyl hydrocarbon groups. 315]% 14 1242593 Furthermore, the thermosetting adhesive layer may contain fillers having an average particle size of ≦ 1 or less. The filler can also use any of inorganic fillers such as silicon oxide, titanium oxide, oxide @ 'nitride m, quartz powder, magnesium oxide, and resin powders such as polysiloxane resin, polyimide resin, and phenol resin. The organic filler is composed of these insulating fillers. The filler is added in an amount of less than 30 parts by mass based on 100 parts by weight of the solid content of the resin. (Manufacturing of Adhesive Tape for Semiconductor Device) + When manufacturing the adhesive tape for semiconductor device of the present invention, the material for the above-mentioned piercing layer is dissolved and mixed with an organic solvent to form a liquid resin composition. As a coating material, a thermosetting adhesive layer is formed by coating, laminating, and drying on at least one side of an insulating film. The thickness of the thermosetting layer after drying is preferably 3 "to 15 () / ^, and more preferably 20" m. The state of the thermosetting layer is better. King + hardening in the manufacturing When the adhesive sheet for a semiconductor device of the invention is used, the liquid 2 resin composition can be directly coated on an insulating film, or an adhesive sheet obtained from a temporary carrier such as a peelable film can be attached to the insulating film. Suitable organic solvents for the resin composition can be exemplified by: N_: base ..., n, n-dimethyl ethyl amine, N is dimethyl formate, methyl ethyl ketone, methyl isobutyl ketone, fluorene Ben, Di 、 :::: alcohol, isopropanol, fluorene-based cellosolve, etc., or two or more of them can be used in combination. Furthermore, a protective film 315196 is provided on the surface of the thermosetting adhesive layer. 15 1242593 is better. When using the present invention only 4 π two cows ¥ limb clothing placement point belt, then peel off the melamine and use it. Films such as vinegar and paraffin, II ;! It is applicable to use ethylene glycol phthalate release film. It is provided with a peeling example after the peeling treatment is carried out: In the following, it is explained in accordance with the examples Invention. Example 1 Compound 1 on the single side of a protective film made of peeling treatment with a thickness of 3 DH # M + + p-dibenzoate, coated with a coating to make dry selection ...: an adhesive layer For forming. The dwelling degree is 12 // m, and it is dried at 130 ° C for 5 minutes to make an adhesive film. Next, an insulating film made of polyimide film with a thickness of 75 # m is pasted on the adhesive film. Then, the waste is heated and extended under the conditions of 10 (rc, 1 kg / cm2) to prepare an adhesive sheet for a semiconductor device of the present invention. (Coating for forming a spotting agent layer) 25% by mass of 90% by mass of linoleum is mixed Unsaturated fatty acid dimer obtained from an acid and 10% by mass of acetic acid, and isopropyl alcohol, a polyamine resin having an amine value of 20 and a mass average molecular weight of 2,800 as a thick synthetic component. / Mebenzyl mixed solution: 64 parts by mass of 50 parts by mass of 50% by mass of a naphthalene-type epoxy resin (manufactured by Daiyoku Ink Chemical Co., Ltd., trade name: EPOKURON HP7200) of D: S solution: 15 parts by mass and 50 parts by mass. /. Ding acid varnish stupid resin (manufactured by Showa Polymer Co., Ltd., CKM24〇〇) Solution: 6.5 parts by mass 315196 16 1242593 mixed with 50% by mass of bismuth plate varnish stupid resin ((manufactured by the trade name ELS373Z) Ding volume solution: 13 quality denier knife male 0 parts mixed 1% by mass 2_B Base solution of methyl ice methyl sulfide: 3 masses except that the following composition is used as the priming agent layer to form the remaining material, which is the same as the semiconductor coating of the present invention. The thickness of the occupant agent layer is 20 " m. Use * Zhan ". Viscosity (I accounts for the coating for the formation of the agent layer) 25% by mass of an unsaturated fatty acid dimer prepared from 85% by mass of linoleum and 15% by mass of oleic acid, Polyisopropyl alcohol / xanthezine mixed solution, which is 50% by weight and has a mass average molecular weight of 2,300, as a thick synthetic component: 47 parts by mass, 50% by mass, and 80% by mass of Asia Polybutylene amine resin (amine value of 15 and mass average molecular weight of 8,000) of unsaturated fatty acid dimer obtained from oleic acid and 20% by mass of oleic acid and hexamethylenediamine as a thick synthetic component, butylene g Same solution: 20 parts by mass and 50 parts by mass. /. Novolac resin (manufactured by Showa Polymer Co., Ltd., trade name: CKM908A) butyl solution: 33 parts by mass Example 3 Except that the following composition was used as a coating for forming an adhesive layer, the rest were the same as in Example 1 An adhesive tape for a semiconductor device of the present invention is produced. The thickness of the adhesive layer is 1 2 // m. (Coating for forming adhesive) 25% by mass of 80% by mass of linoleic acid and 20% by mass of 315196 17 1242593 oleic acid, an unsaturated fatty acid dimer and hexamethylenediamine as a thick synthetic polymer Amine resin (amine value of 20, mass average molecular weight of 2,300) in isopropyl alcohol / xylene mixed solution: 64 parts by mass and 50% by mass of a naphthalene-type epoxy resin (manufactured by Dainippon Ink Chemical Industry Co., Ltd., trade name) : EPIKURON HP7200) methyl ethyl ketone solution: 15 parts by mass mixed with 50% by mass of novolac phenol resin (manufactured by Showa Polymer Co., Ltd., trade name: CKM2400): methyl ethyl ketone solution: 6.5 parts by mass mixed with 50% by mass of novolak Butanone solution of phenol resin (manufactured by Showa Polymer Co., Ltd., trade name: ELS373Z): 13 parts by mass of a 2-ethyl-4-fluorenimidazole butanone solution mixed with 1 part by mass: 3 parts by mass Example 4 Except the following Except that the column composition was used as a coating material for forming an adhesive layer, the rest were the same as in Example 1 to prepare an adhesive sheet for a semiconductor device of the present invention. The thickness of the adhesive layer is 8 // m. (Paint for forming an adhesive layer) 25% by mass of a polyisocyanate resin (manufactured by Henkel Corporation, Japan, trade name: MACROMELT6238, amine value 7, mass average molecular weight 8,000) of an isopropyl alcohol / benzylbenzene mixed solution: 40 parts by mass of 30% by mass of a solution of polyimide resin (mass average molecular weight: 40,000) in a tetrahydrofuran solution: 22 parts by mass of 50% by mass of a naphthalene-type epoxy resin (manufactured by Dainippon Ink Chemical Industries, Ltd., trade name) : EPIKURON HP7200) butanone solution: 20 315196 1242593 parts by mass mixed with 50% by mass novolac phenol resin (manufactured by Showa High Polymers Co., Ltd., trade name: CKM2400) butanone solution: 6.5 parts by mass mixed with 2% by mass 2 -Ethyl-4-fluorenimidazole butanone solution: 5 parts by mass of Example 5 Except that the following composition was used as a coating for forming an adhesive layer, the rest were the same as in Example 1 to produce an adhesive sheet for a semiconductor device of the present invention. band. The thickness of the adhesive layer is 3 // m. (Coating for forming an adhesive layer) 25% by mass of a polyamine resin (manufactured by Ben Henkel, trade name: MACROMELT6900, acid value of 2, amine value of 0.5, and mass average molecular weight of 55,000) Isopropyl alcohol / xanthene mixed solution: 63 parts by mass mixed with 50% by mass of epoxy resin (manufactured by Grease Chemical Co., Ltd., trade name: EPIC〇Τ 1001) butanone solution: 20 parts by mass mixed with 50% by mass of phenolic Varnish phenol resin (manufactured by Showa Polymer Co., Ltd., trade name: CKM2400) methyl ethyl ketone solution: 13 parts by mass mixed with 1 mass% of 2-ethyl-4-fluorenimidazole butanone solution: 5 parts by mass Comparative Example 1 Except Except that the following composition was used as a coating material for forming an adhesive layer, the remainder was made in the same manner as in Example 1 to prepare an adhesive sheet for a semiconductor device for comparison. The thickness of the adhesive layer is 12 μm. (Coating for layer formation) 315196 1242593 25% by mass of polyisocyanate resin (amine value: 7, mass average molecular weight: 10,000) in isopropyl alcohol / benzylbenzene solution: 40 parts by mass and 30% by mass Tetrahydrofuran solution of polyimide resin (mass average molecular weight: 40,000): 22 parts by mass of 50 parts by mass of 50% by mass of naphthalene-type epoxy resin (manufactured by Daiyoku Ink Chemical Co., Ltd., EPIKURON HP7200) butanone Solution: 20 parts by mass of 50% by mass of a novolak phenol resin (manufactured by Showa Polymer Co., Ltd., CKM2400) butanone solution: 6.5 parts by mass of 1% by mass of 2-ethyl-4-fluorenyl A solution of imidazole in methyl ethyl ketone: 5 parts by mass of the compound ^ [Column 2 except that the following composition was used as a coating material for forming an adhesive layer, the rest were made in the same manner as in Example 1 to prepare an adhesive sheet for a semiconductor device for comparison. The thickness of the adhesive layer is 1 2 // m. (Paint for forming an adhesive layer) 25% by mass of a polyamide resin (manufactured by Ben Henkel, trade name: MACROMELT6900, acid value of 2, amine value of 0.5, and mass average molecular weight of 55,000) of isopropyl alcohol / Benzene mixed solution: 63 parts by mass mixed with 50% by mass of epoxy resin (manufactured by Grease Chemical Co., Ltd., trade name: EPICOT 1001) butanone solution: 20 parts by mass mixed with 50% by mass of novolac phenol Methyl ketone solution of resin (manufactured by Showa Polymer Co., Ltd., trade name: CKM2400): 13 parts by mass of mixed methyl ethyl ketone solution of 2-ethyl-4-fluorenimidazole: 5 mass 20 3J5196 1242593 parts Comparative Example 3 ^ ^ Shell ^ Example〗 Similarly, an adhesive sheet for a semiconductor device for comparison is produced. However, the thickness of the adhesive layer is 100 // m. (The thermosetting adhesive layer refers to the ioss modiilus and the storage modulus), and the semiconductor devices of Examples 1 to 5 and Comparative Examples 1 to 3 are used for adhesion After the protective film is torn, the laminated body of the insulating film and the thermosetting adhesive gas layer f is heated in the ah, and the heat is peeled from the insulating film while peeling the adhesive layer. Next, when the garment is used as the test object described below, the thermosetting adhesive layer is heated to harden under conditions that the thermosetting adhesive layer is adhered to the electrolytic copper and heated. For the thermosetting adhesive layer after heat curing, the following dynamic mechanical analyzer (DMA:

Dyn_c Meehanieal tilt) to determine its presence]. The loss modulus and storage modulus in c are as shown in Table 1 and Table 2. A dynamic viscoelasticity spectrometer (manufactured by Dongfang Technology Co., Ltd., KlitC3VIBRON DDV-II_EP) was used as DMA, and the measurement was performed at a frequency of 110 Hz, a heating chirp vr / ·, and a radon / blue fan degree 3 and a load of 5.0 g. The width of the sample was 0.5 cm, the length was 3 cm, and the thickness was the thickness of the adhesive layer after coating. (Evaluation of Adhesive Tapes for Semiconductor Devices) (1) Production of Test Objects: The protective film of the adhesive tapes for semiconductor devices of Examples 1 to 5 and Comparative Examples 1 ^ ^ to 3 was peeled in a thermosetting state. Adhesive Tian Guangyou ^ on the level will be about 18 // m thick% copper fg to 1 3 0. 〇, 1 kg / cm2 stoppage μ. Laminated under the pieces. However, after 315196 21 1242593, the temperature rises from 160 ° C to 70 ° C over 8 hours. (: The laminated body is heated, and then 6 bb small ice, also π,…,] is added at 170 GC to harden the thermosetting adhesive layer. Then, a photoresist film is laminated on the copper foil. Order the picture ^ exposure, last name engraving, mining records, bond gold to form a welding wire for bonding wire bonding ^ ^ By doing so, you can get a formed circuit with a gold plating thickness of 0.5 // m (2) Evaluation of characteristics: ※ Bondability of bonding wire: τ = τ =: The wafer solder joints of the wafers of the test specimens of Examples 1 to 5 and Comparative Examples 1 to 3 are placed on the IC chip after the day. A, Gong Meng, and Quan used the wire bonding method to connect the aluminum electrode part on the 1C wafer and the solder joint on the strip. 1 Connection: The gold wire after the bonding was pulled on the wide wire tensile tester to measure a The strength is 3, and the welding wire is pulled to Table 1 5 ^ and °, the freshness and spring bonding properties are estimated, and the results are shown in Table 1 and Table 2. Although the barrier-free connection is still used, the strength is about 8gf due to temperature. .Hui line connected., Here is at 20 ℃, the frequency is 60kHz

(MPa) Table 1 Thickness of poisonous agent layer (// m) Loss modulus X (1 / thickness of adhesive layer) (MPa /// m)

Tensile strength is approximately saturated at 8 to 9 gf 315 196 22 1242593

The tensile strength is approximately saturated at 8 to 9 gf. Comparative Example 2 〃 As can be seen from Tables i and 2, the semiconductor device of the present invention has a tensile strength of 8 g or more without practical problems. Dogs can also consider adhesives that are not suitable for wire bonding due to their low modulus. The thickness of the adhesive layer can be reduced to ensure wire bondability. s', (Industrial availability) As explained above, the adhesive insulating glands of the semiconductor device of the present invention 5 ", _f system-placement of spot-on wafers / semiconductors with thermosetting adhesive layer" 2τ The objective is to multiply the thickness of the above-mentioned thermosetting adhesive layer and the thermosetting adhesive layer after thermosetting by giving a product of greater than 0 25M. For example, Jiang inch is the main source of the μ Welding Welding Wire Connection 4 ...… + ¥ The adhesive tape for the thick device is used in the BGa 咼 density-developed semiconductor sealing temple table high welding wire connection ...: Good workability, and I have a more reliable semiconductor package for the guilty of connection. "" Secondly, in the semiconductor device of the present invention, for example, the reciprocal of the thickness of the above-mentioned thermosetting elixir layer and the thermal curing after thermal curing 315196 23 1242593 adhesive layer at 200 ° C When the product obtained by multiplying the storage modulus is greater than 1 MPa / // m, it has good wire bonding. 315196

Claims (1)

1242593 Patent No. 92131052 Patent Application Revised Patent Scope (March 18, 1994) 1.-An adhesive sheet for semiconductor devices' has an insulating film and is thermally cured on at least one side of the insulating film The thermosetting adhesive layer contains any one selected from the group consisting of polyimide resin, polyimide resin, polyimide resin, phenol resin, and epoxy resin. The product of the reciprocal of the thickness of the thermosetting adhesive layer and the loss modulus of the thermosetting adhesive layer at 200t after thermosetting is greater than 0.25MPa / // m. 2. If the adhesive sheet for semiconductor devices according to item 丨 of the patent application range, wherein the reciprocal of the thickness of the above thermosetting adhesive layer and the storage modulus of the thermosetting adhesive layer after thermal curing under 2000 The product obtained by multiplication is greater than IMPa / # m. 3. The adhesive tape for semiconductor devices, such as the item No. 1 in the scope of the patent application, in which the above-mentioned I donkey amine resin is obtained by using an unsaturated fatty acid dimer having a carbon number of 36. 4. For an adhesive sheet for a semiconductor device according to item 3 of the patent application, the unsaturated fatty acid dimer having a stone anion number of 36 is obtained by using linoleic acid. 1 315196 revision