TWI236948B - CMP compositions containing iodine and an iodine vapor-trapping agent - Google Patents

CMP compositions containing iodine and an iodine vapor-trapping agent Download PDF

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Publication number
TWI236948B
TWI236948B TW092115234A TW92115234A TWI236948B TW I236948 B TWI236948 B TW I236948B TW 092115234 A TW092115234 A TW 092115234A TW 92115234 A TW92115234 A TW 92115234A TW I236948 B TWI236948 B TW I236948B
Authority
TW
Taiwan
Prior art keywords
patent application
grinding
scope
substrate
weight
Prior art date
Application number
TW092115234A
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English (en)
Chinese (zh)
Other versions
TW200404640A (en
Inventor
Tao Sun
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200404640A publication Critical patent/TW200404640A/zh
Application granted granted Critical
Publication of TWI236948B publication Critical patent/TWI236948B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
TW092115234A 2002-06-06 2003-06-05 CMP compositions containing iodine and an iodine vapor-trapping agent TWI236948B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/165,133 US6641630B1 (en) 2002-06-06 2002-06-06 CMP compositions containing iodine and an iodine vapor-trapping agent

Publications (2)

Publication Number Publication Date
TW200404640A TW200404640A (en) 2004-04-01
TWI236948B true TWI236948B (en) 2005-08-01

Family

ID=29269895

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092115234A TWI236948B (en) 2002-06-06 2003-06-05 CMP compositions containing iodine and an iodine vapor-trapping agent

Country Status (3)

Country Link
US (1) US6641630B1 (enExample)
JP (1) JP4087753B2 (enExample)
TW (1) TWI236948B (enExample)

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US20020111024A1 (en) * 1996-07-25 2002-08-15 Small Robert J. Chemical mechanical polishing compositions
US7192886B2 (en) * 2002-10-25 2007-03-20 Intersurface Dynamics, Inc. Method for using additives in the caustic etching of silicon for obtaining improved surface characteristics
JP2006066874A (ja) * 2004-07-27 2006-03-09 Asahi Denka Kogyo Kk Ｃｍｐ用研磨組成物および研磨方法
US7161247B2 (en) * 2004-07-28 2007-01-09 Cabot Microelectronics Corporation Polishing composition for noble metals
JP4012180B2 (ja) * 2004-08-06 2007-11-21 株式会社東芝 Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
KR100648264B1 (ko) * 2004-08-17 2006-11-23 삼성전자주식회사 루테늄을 위한 화학적기계적 연마 슬러리, 상기 슬러리를이용한 루테늄에 대한 화학적기계적 연마 방법, 그리고상기 화학적기계적 연마 방법을 이용한 루테늄 전극 형성방법
US7524347B2 (en) * 2004-10-28 2009-04-28 Cabot Microelectronics Corporation CMP composition comprising surfactant
US7608082B2 (en) 2005-01-06 2009-10-27 Tyco Healthcare Group Lp Surgical seal for use in a surgical access apparatus
TWI332982B (en) * 2005-04-14 2010-11-11 Mitsui Chemicals Inc Polishing material
WO2006133249A2 (en) * 2005-06-06 2006-12-14 Advanced Technology Materials, Inc. Integrated chemical mechanical polishing composition and process for single platen processing
KR20070012209A (ko) * 2005-07-21 2007-01-25 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마 방법
JP4708911B2 (ja) * 2005-08-09 2011-06-22 ニッタ・ハース株式会社 研磨用組成物
US7265055B2 (en) * 2005-10-26 2007-09-04 Cabot Microelectronics Corporation CMP of copper/ruthenium substrates
US7732393B2 (en) * 2006-03-20 2010-06-08 Cabot Microelectronics Corporation Oxidation-stabilized CMP compositions and methods
US8591763B2 (en) * 2006-03-23 2013-11-26 Cabot Microelectronics Corporation Halide anions for metal removal rate control
US7820067B2 (en) * 2006-03-23 2010-10-26 Cabot Microelectronics Corporation Halide anions for metal removal rate control
US7368066B2 (en) * 2006-05-31 2008-05-06 Cabot Microelectronics Corporation Gold CMP composition and method
US7776230B2 (en) * 2006-08-30 2010-08-17 Cabot Microelectronics Corporation CMP system utilizing halogen adduct
US7922926B2 (en) 2008-01-08 2011-04-12 Cabot Microelectronics Corporation Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
JP5314329B2 (ja) * 2008-06-12 2013-10-16 富士フイルム株式会社 研磨液
WO2010074002A1 (ja) * 2008-12-22 2010-07-01 花王株式会社 磁気ディスク基板用研磨液組成物
US9070399B2 (en) 2008-12-22 2015-06-30 Kao Corporation Polishing liquid composition for magnetic-disk substrate
US8491806B2 (en) * 2010-01-12 2013-07-23 International Business Machines Corporation Chemical-mechanical polishing formulation and methods of use
JP5429397B2 (ja) * 2010-10-21 2014-02-26 株式会社Ｍｏｒｅｓｃｏ ガラス基板研磨用潤滑組成物及び研磨スラリー
JP5940270B2 (ja) 2010-12-09 2016-06-29 花王株式会社 研磨液組成物
US8865013B2 (en) * 2011-08-15 2014-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing tungsten
US9039914B2 (en) 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
JP6638208B2 (ja) * 2015-04-02 2020-01-29 日立化成株式会社 研磨剤、研磨剤用貯蔵液及び研磨方法
CN107615380B (zh) * 2015-05-20 2020-09-11 Hoya株式会社 玻璃基板的研磨方法、研磨液、玻璃基板的制造方法、磁盘用玻璃基板的制造方法和磁盘的制造方法
CN108699396B (zh) * 2015-12-29 2021-01-26 嘉柏微电子材料股份公司 包含烷基胺及环糊精的化学机械抛光加工组合物
CN111879585B (zh) * 2020-07-27 2023-08-01 北京市永康药业有限公司 一种检测用药品自动研磨装置
CN117025288B (zh) * 2023-07-26 2025-11-04 国家石油天然气管网集团有限公司 一种喷砂浆料及其制备方法和应用

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US4769046A (en) 1985-07-25 1988-09-06 Fujimi Kanmazai Kogyo Kabushiki Kaisha Of Japan Process for polishing surface of memory hard disc
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5527423A (en) 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
DE69734868T2 (de) 1996-07-25 2006-08-03 Dupont Air Products Nanomaterials L.L.C., Tempe Zusammensetzung und verfahren zum chemisch-mechanischen polieren
US5958288A (en) 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
US6126532A (en) 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
AU7138198A (en) 1997-04-18 1998-11-13 Cabot Corporation Polishing pad for a semiconductor substrate
US6001269A (en) 1997-05-20 1999-12-14 Rodel, Inc. Method for polishing a composite comprising an insulator, a metal, and titanium
US6117000A (en) 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
WO2000013217A1 (en) 1998-08-31 2000-03-09 Hitachi Chemical Company, Ltd. Abrasive liquid for metal and method for polishing
JP2000109804A (ja) 1998-10-08 2000-04-18 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
KR100463315B1 (ko) 1998-12-28 2005-01-07 히다치 가세고교 가부시끼가이샤 금속용 연마액 재료, 금속용 연마액, 그 제조방법 및그것을 사용한 연마방법
US6290736B1 (en) 1999-02-09 2001-09-18 Sharp Laboratories Of America, Inc. Chemically active slurry for the polishing of noble metals and method for same
US6299795B1 (en) 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
CN1200984C (zh) 2000-01-18 2005-05-11 普莱克斯.S.T.技术有限公司 抛光浆料
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP3945964B2 (ja) 2000-06-01 2007-07-18 株式会社ルネサステクノロジ 研磨剤、研磨方法及び半導体装置の製造方法
US6468137B1 (en) 2000-09-07 2002-10-22 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with an oxidized halide-containing polishing system

Also Published As

Publication number Publication date
JP4087753B2 (ja) 2008-05-21
TW200404640A (en) 2004-04-01
US6641630B1 (en) 2003-11-04
JP2004027224A (ja) 2004-01-29

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