TWI232931B - Inspecting method for end faces of brittle-material-made substrate and device therefor - Google Patents

Inspecting method for end faces of brittle-material-made substrate and device therefor Download PDF

Info

Publication number
TWI232931B
TWI232931B TW091133882A TW91133882A TWI232931B TW I232931 B TWI232931 B TW I232931B TW 091133882 A TW091133882 A TW 091133882A TW 91133882 A TW91133882 A TW 91133882A TW I232931 B TWI232931 B TW I232931B
Authority
TW
Taiwan
Prior art keywords
material substrate
brittle material
face
light
end surface
Prior art date
Application number
TW091133882A
Other languages
Chinese (zh)
Other versions
TW200300493A (en
Inventor
Hideaki Funada
Hiroaki Yoshimura
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200300493A publication Critical patent/TW200300493A/en
Application granted granted Critical
Publication of TWI232931B publication Critical patent/TWI232931B/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958Inspecting transparent materials or objects, e.g. windscreens
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

An inspecting device for the end faces of a brittle-material-made substrate is provided, comprising light sources (16a, 17a, 16b, 17b) for applying light beams to the end faces (Va, Vb) of the brittle-material-made substrate (2) placed horizontally on a table (1) moving in a specified direction, and a quantity-of-light detecting means (14a, 15a, 14b, 15b) for receiving light beams reflected from the end faces (Va, Vb) of the substrate (2), whereby the device determines that the end faces (Va, Vb) of the substrate (2) have a chip when the light quantity of a received reflected beam is above a specified upper limit or below a specified lower limit.

Description

1232931 玖、發明說明 [發明所屬之技術領域] 本發明係關於脆性材料基板端面部之檢查方法及其裝 置。 [先前技術] 液晶顯示面板,通常,係在一對玻璃基板之液晶面板 間設置液晶層來形成。在一邊之液晶面板的表面上設有多 數之配線,又,彼此相鄰之各邊邊緣部分表面上,分別設 有各配線之電極端子。此種液晶面板基板,係藉由切斷大 面積之母液晶面板基板,同時製造複數片。 脆性材料基板中之一種的玻璃基板,係以劃線裝置在 玻璃表面形成劃線,接著,以斷開裝置施加彎曲力矩於玻 璃基板上,據以沿劃線加以切斷。液晶面板基板,也是藉 由切斷母液晶面板基板,來同時製造複數片之液晶面板基 板。又,母液晶面板基板,係在切斷之液晶面板基板之各 區域中,預先配線及設有電極端子,又,在切斷之液晶面 板基板的端面部形成配線及電極端子。 切斷此種母液晶面板基板來製造液晶面板基板時,在 切斷之液晶面板基板的端面部若有缺口,則此缺口有可能 會對預先設置之電極端子,或者,在後面製程中所製造之 電極端子造成傷害。又,該缺口若演變成鋸齒狀之缺陷(像 貝殼狀之缺口),則設置在液晶面板基板之電極端子也有可 能會被切斷。如此,使用在端面部有缺口之液晶面板基板 來製造液晶顯示面板時,由於所製造之液晶顯示面板會無 1232931 法正常運作而成不良品,造成良率降低,存有液晶顯示面 板的製造成本增加之問題。 爲了防止如此的問題,在切斷母液晶面板基板製造液 晶面板基板時,在將所製造之液晶面板基板搬送至後部製 程前,發現液晶面板之端面部有無缺陷一事,即變得非常 重要。 以往,切斷母液晶面板基板製造液晶面板基板之後, 以目視來檢查液晶面板基板的端面部有無缺陷,可是,如 此之目視檢查方法,有可能會遺漏掉液晶面板基板端面部 之微小的缺陷等。而且,要目視液晶面板基板的端面部, 必須有檢查人員,因此,這也成爲增加液晶顯示面板之製 造成本的要因。 對於如此之檢查方法,有人考慮用攝影裝置來拍攝液 晶面板基板的端面部周邊,以影像處理的方法來處理所拍 攝之影像資料,藉此來檢查缺口等缺陷的有無。可是,以 這樣的方法來檢測缺口等之缺陷的有無,需要以3次元來處 理影像資料,而且,造成缺陷之缺口的形狀並不一致,使 得以影像資料來判定良品與否並不容易,因此,存在著無 法實現價廉之檢查裝置的問題。 本發明爲解決如此之問題的發明,以提供新的檢查方 法以及檢查裝置爲目的,以便可以自動檢查在脆性材料基 板的端面部是否有缺口等之缺陷。 [發明內容] 本發明之檢查裝置,具備:以水平狀態承載脆性材料 1232931 基板之平台;使該平台往既定方向移動之平台移動機構; 使該平台沿水平方向旋轉之平台水平旋轉機構;照射光線 於該脆性材料基板端面部之光源,·用以感光該光源所照射 、從該脆性材料基板端面部反射出來之反射光之光量檢測 機構;以及根據該光量檢測機構所感光之從前述端面部反 射出來之光量,以判定前述端面部之品質好壞之判定機構 ;藉此來達成上述目的。 前述判定機構,其特徵在於··係預先設定前述光量檢 測機構所感光之反射光光量的上限値及下限値,該光量檢 測機構所感光之反射光量高於該上限値、或低於該下限値 時,即判定前述脆性材料基板端面部爲品質不良。 前述判定機構,其特徵在於:區別前述脆性材料基板 端面部之品質不良的種類。 前述光源,具備對前述脆性材料基板之端面部於垂直 方向照射光線之第1光源,與從前述脆性材料基板端面部之 兩側斜向照射之第2光源;前述光量檢測機構,具備在以該 第1光源照射光線於該脆性材料基板的端面部時,檢測來自 該脆性材料基板端面部之反射光量的第1光量檢測機構,以 及以該第2光源照射光線於該脆性材料基板的端面部時,檢 測來自該脆性材料基板端面部之反射光量的第2光量檢測機 構;前述第1光量檢測機構與前述第2光量檢測機構中,至 少使用一個光量檢測機構。 前述光量檢測機構爲CCD攝影機。 前述光量檢測機構爲感光元件。 1232931 又,其進一步包含拍攝形成前述脆性材料基板角隅之 兩邊,以擷取形成前述脆性材料基板角隅之兩邊的影像資 料的攝影機構,根據該影像資料來辨識前述脆性材料基板 之角隅的位置。 前述攝影機構爲CCD攝影機。 本發明之檢查方法,係判定脆性材料基板端面部之品 質是否良好,其特徵在於,包含:以沿著該端面部相對移 動之方式照射光線於該端面部的步驟,將來自該端面部之 反射光予以感光的步驟,以及韻據所感光之反射光量來判 定該端面部品質是否良好的步驟,藉此來達成上述目的。 前述判定步驟,係預先設定所感光之前述反射光光量 的上限値及下限値,當所感光之該反射光光量高於上限値 ,或低於下限値時,即判定前述脆性材料基板之端面部爲 品質不良。 前述判定步驟,進一步包含區別前述脆性材料基板端 面部之品質不良種類的步驟。 前述照射步驟,包含於垂直方向對前述脆性材料基板 之端面部照射光線的第1照射步驟,與由前述脆性材料基板 端面部之兩側斜向照射光線的第2照射步驟;前述感光步驟 ,包含在以該第1照射步驟對該脆性材料基板的端面部照射 光線時,將來自該脆性材料基板端面部來之反射光量予以 感光的第1感光步驟,與在以第2照射步驟對該脆性材料基 板的端面部照射光線時,將來自該脆性材料基板端面部來 之反射光量予以感光的第2感光步驟;前述第1感光步驟及 1232931 則述第2感光步驟中’至少係進彳了其中一^個。 又,前述感光步驟是以CCD攝影機來進行。 又,前述感光步驟是以感光元件來進行。 又,其進一步包含拍攝形成前述脆性材料基板角隅之 兩邊,以擷取形成前述脆性材料基板角隅之兩邊的影像資 料的步驟,以及根據該影像資料來辨識前述脆性材料基板 之角隅位置的步驟。 前述擷取2邊之影像資料的步驟,是以CCD攝影機來進 行的。 [實施方式] 以下,根據圖式詳細說明本發明之實施形態。 圖1,係顯示本發明中檢測脆性材料基板端面部缺口之 原理的立體圖。本發明之檢查方法,使用對玻璃板1〇1(於 箭頭A方向以一定速度移動之脆性材料基板)之端面部照射 點光103的LED光源102,以及將此LED光源102所照射、來 自玻璃板101端面部之反射光予以感光的CCD攝影機104, 藉由CCD攝影機104來檢測來自玻璃板101端面部來之反射 光量。當玻璃板101端面部上有缺口時,LED光源102所照 射之光線被該缺口反射後,該反射光量與其它沒有缺口的 部分相比較,會有若干減少,或反而會增加。 實際上,從LED光源102照射光線於玻璃板101端面部 ,並檢測該反射光量時,若反射光量大致一定的話,沒有 缺口存在,可是,反射光量明顯變多的部分及明顯變少的 部分,都是有缺口存在的部分。因此,若預先將LED光源 1232931 102所照射並被玻璃板101端面部反射之反射光,設定一上 限値及下限値,當來自該端面部之反射光高於設定之上限 値或低於下限値,即可判定該端面部有缺口(端面部品質不 良)。 圖2,顯示本發明1實施形態之脆性材料基板端面部的 檢查裝置50的立體圖。平台1,係以真空吸力來固定脆性材 料基板2,設置在移動底座4上,藉由伺服馬達3,可在移動 底座4上作水平方向(箭號0所示之方向)旋轉。該移動底座4 5係藉由伺服馬達5、以及藉由伺服馬達5進行軸旋轉之滾 珠螺絲6,來沿2條軌道7往箭頭X所示之方向移動。 由兩側支柱8所支撐之橋板9,係橫跨在軌道7上方,延 伸於箭頭Y所示之方向。該橋板9上,藉由伺服馬達l〇a及以 伺服馬達l〇a作軸旋轉之滾珠螺絲11a,設有往Y方向移動的 移動底座12a滾珠。該移動底座12a上,設有以垂直之狀態 延伸於與橋板9正交之X方向的檢查機器安裝板13a。又,設 有與上述同樣構成、往Y方向移動之移動底座12b,該移動 底座12b上,設有以垂直之狀態延伸於與橋板9正交之X方向 的檢查機器安裝板13b。 在檢查機器安裝板13a上,爲了拍攝脆性材料基板2之 一端面部Va,沿著X方向隔著適當的間隔,設置有一對分 別朝著下方之第1CCD攝影機14a及第2CCD攝影機15a。設 置在橋板9之遠側的第1CCD攝影機14a的下端部,爲了能從 上方照射該拍攝區域,以包圍第1CCD攝影機14a之下端部 全周的方式,設置有配置成“口”字型之第1LED光源16a 1232931 。該第1LED光源16a,係在與第1CCD攝影機14a的光軸同軸 的狀態下照射光線。 鄰近橋板9所設置之第2CCD攝影機lh的拍攝區域,係 以在X方向具有既定長度之一對第2LED光源17a所照射之光 線來照明。各第2LED光源’藉由適當之支撐構件安裝 在檢查機器安裝板13a上’從兩側照明脆性材料基板2之前 述端面部Va(第2CCD攝影機15a之拍攝區域)。作爲各第 2LED光源17a,例如,雖然是使用白色LED,但只要是能獲 得用以拍攝脆性材料基板2之前述端面部Va所需亮度之光源 的話,則不限定於此。 在另一個檢查機器安裝板13b上,爲了拍攝脆性材料基 板2之另一邊端面部Vb ’沿X方向隔著適當的間隔,設置有 一對分別朝著下方之第3CCD攝影機14b及第4CCD攝影機 15b。設置在橋板9之遠側的第3CCD攝影機14b的下方’爲 了能從上方照射該拍攝區域’係以包圍第3CCD攝影機14b 之下端部全周的方式,設置有配置成“口”字型之第3LED 光源16b。該第3LED光源16b,係在與第3CCD攝影機14b的 光軸同軸的狀態下照射光線。 鄰近橋板9所設置之第4CCD攝影機15b的拍攝區域,係 以在X方向具有既定長度之一對第4LED光源17b所照射之光 線來照明。各第4LED光源17b ’係藉由適當之支撐構件, 設置在檢查機器安裝板13b上,從兩側照明脆性材料基板2 之前述端面部Vb(第4CCD攝影機1%之拍攝區域)。作爲各 第4LED光源17b,例如,雖然是使用白色LED,但只要是能 12 1232931 獲得用以拍攝脆性材料基板2之前述端面部Vb時所需亮度之 光源的話,則不限定於此。 圖3,係顯示上述檢查裝置50之動作流程圖,以下,依 照該流程圖來說明檢查裝置50的動作。 用該檢查裝置50進行檢查時,首先,進行步驟S1到步 驟S5的初期設定。 在步驟S1,設定第1CCD攝影機14a、第3CCD攝影機 14b、第2CCD攝影機15a及第4CCD攝影機15b之曝光時間, 在步驟S2 ·,設定第1CCD攝影機14a '第3CCD攝影機14b、 第2CCD攝影機1 5a及第4CCD攝影機15b之擷取線數(初期値 :例如480)。在步驟S3,設定第1CCD攝影機14a、第3CCD 攝影機14b、第2CCD攝影機15a及第4CCD攝影機15b之視野 。此處,第1CCD攝影機14a、第3CCD攝影機14b、第2CCD 攝影機15a及第4CCD攝影機15b之視野,係在第1CCD攝影 機14a、第3CCD攝影機14b、第2CCD攝影機15a及第4CCD攝 影機15b本身之解析度(例如,512 X 480像素)範圍內任意設 定。 在步驟S4,係設定對第1CCD攝影機14a、第3CCD攝影 機14b、第2CCD攝影機15a及第4CCD攝影機15b所擷取之影 像資料進行影像處理所需之各種參數。在步驟S5,設定檢 查裝置50自動運轉時所需之機械參數。 檢查裝置50之初期設定完成後,在步驟S6,開始啓動 檢查裝置50之自動運轉。第1LED光源16a、第3LED光源16b 、第2LED光源17a及第4LED光源17b點亮,照射第iccd攝 13 12329311232931 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a method and an apparatus for inspecting an end portion of a brittle material substrate. [Prior art] A liquid crystal display panel is generally formed by providing a liquid crystal layer between a pair of glass substrate liquid crystal panels. A plurality of wirings are provided on the surface of one side of the liquid crystal panel, and electrode terminals of the respective wirings are provided on the surfaces of the edge portions of the sides adjacent to each other. Such a liquid crystal panel substrate is manufactured by cutting a large area of a mother liquid crystal panel substrate, and simultaneously manufacturing a plurality of pieces. A glass substrate of one of the brittle material substrates is formed on the glass surface by a scribing device, and then a bending moment is applied to the glass substrate by a breaking device, and the glass substrate is cut along the scribing line. The liquid crystal panel substrate also cuts the mother liquid crystal panel substrate to manufacture a plurality of liquid crystal panel substrates at the same time. The mother liquid crystal panel substrate is pre-wired and provided with electrode terminals in each region of the cut liquid crystal panel substrate, and wirings and electrode terminals are formed on end surfaces of the cut liquid crystal panel substrate. When the mother liquid crystal panel substrate is cut to manufacture a liquid crystal panel substrate, if there is a gap in the end face portion of the cut liquid crystal panel substrate, the gap may be caused to a preset electrode terminal or manufactured in a later process. The electrode terminals may cause injury. In addition, if this notch develops into a jagged defect (like a shell-like notch), the electrode terminal provided on the liquid crystal panel substrate may be cut. In this way, when a liquid crystal display panel is manufactured by using a liquid crystal panel substrate with a notch on the end surface, the manufactured liquid crystal display panel will operate without a defective product without the 1232931 method, resulting in a decrease in yield and the manufacturing cost of the liquid crystal display panel. Increased problems. In order to prevent such a problem, when cutting the mother liquid crystal panel substrate to manufacture the liquid crystal panel substrate, it is very important to find out whether there is a defect in the end surface portion of the liquid crystal panel before transferring the manufactured liquid crystal panel substrate to the rear process. In the past, after the mother liquid crystal panel substrate was cut and the liquid crystal panel substrate was manufactured, the end face portion of the liquid crystal panel substrate was visually inspected for defects. However, such a visual inspection method may miss minute defects such as the end surface portion of the liquid crystal panel substrate. . In addition, an inspector is required to visually inspect the end face portion of the liquid crystal panel substrate. Therefore, this has also become a factor for increasing the manufacturing cost of the liquid crystal display panel. With regard to such an inspection method, some people have considered using a photographing device to photograph the periphery of the end face portion of the liquid crystal panel substrate, and use the image processing method to process the captured image data to check the existence of defects such as notches. However, to detect the presence or absence of defects such as gaps in this way, it is necessary to process the image data in 3 dimensions, and the shapes of the gaps that cause defects are not consistent, making it difficult to judge the quality of the products with the image data. There is a problem that an inexpensive inspection device cannot be realized. The present invention is an invention to solve such a problem, and aims at providing a new inspection method and an inspection device so that defects such as a notch on the end face portion of a brittle material substrate can be automatically inspected. [Summary of the invention] The inspection device of the present invention is provided with: a platform carrying a brittle material 1232931 substrate in a horizontal state; a platform moving mechanism that moves the platform to a predetermined direction; a horizontal rotation mechanism of the platform that rotates the platform in a horizontal direction; irradiation of light A light source at the end face portion of the brittle material substrate, a light amount detection mechanism for sensing reflected light irradiated by the light source and reflected from the end face portion of the brittle material substrate; and reflected from the end face portion according to the light amount detection mechanism The amount of light that comes out is used to determine the quality of the aforementioned end portion; thereby achieving the above purpose. The aforementioned determination mechanism is characterized in that: the upper limit 下 and the lower limit 値 of the amount of reflected light light received by the light amount detection mechanism are set in advance, and the amount of reflected light received by the light amount detection mechanism is higher than the upper limit 値, or lower than the lower limit 値In this case, it is determined that the end face portion of the brittle material substrate is of poor quality. The judging means is characterized by differentiating between types of poor quality of the end face portion of the brittle material substrate. The light source includes a first light source that irradiates light to an end surface portion of the brittle material substrate in a vertical direction, and a second light source that radiates obliquely from both sides of the end surface portion of the brittle material substrate; and the light amount detection mechanism includes: When a first light source irradiates light on the end face of the brittle material substrate, a first light amount detection mechanism that detects the amount of reflected light from the end face of the brittle material substrate, and when the second light source irradiates light on the end face of the brittle material substrate A second light amount detection mechanism that detects the amount of reflected light from the end face of the brittle material substrate; at least one light amount detection mechanism is used in the first light amount detection mechanism and the second light amount detection mechanism. The light amount detection mechanism is a CCD camera. The light amount detection mechanism is a photosensitive element. 1232931 Furthermore, it further comprises a photographing mechanism for photographing two sides forming the corners of the brittle material substrate to capture image data forming the sides of the corners of the brittle material substrate, and identifying the corners of the brittle material substrate based on the image data. position. The aforementioned photography mechanism is a CCD camera. The inspection method of the present invention is to determine whether the quality of the end surface portion of the brittle material substrate is good, and is characterized in that it includes the step of irradiating light onto the end surface portion so as to move relatively along the end surface portion, and reflecting the reflection from the end surface portion. The step of photosensitizing light and the step of judging whether the quality of the end surface portion is good based on the amount of reflected light photosensitized by the rhyme, thereby achieving the above purpose. The foregoing determination step is to set the upper limit 下 and lower limit 値 of the light quantity of the reflected reflected light which is photosensitive in advance. When the light quantity of the reflected reflected light is higher than the upper limit 値, or lower than the lower limit 値, the end face portion of the brittle material substrate is determined. For poor quality. The judging step further includes a step of discriminating the type of the poor quality of the end surface portion of the brittle material substrate. The irradiation step includes a first irradiation step of irradiating light to the end surface portion of the brittle material substrate in a vertical direction, and a second irradiation step of irradiating light obliquely from both sides of the end surface portion of the brittle material substrate; the photosensitizing step includes When irradiating light to the end face of the brittle material substrate in the first irradiation step, a first photosensitizing step of sensitizing the amount of reflected light from the end face of the brittle material substrate and the brittle material in the second irradiation step When the end surface of the substrate is irradiated with light, the second light-sensing step of light-reflecting the amount of reflected light from the end surface of the brittle material substrate; the first light-sensing step and 1232931 described in the second light-sensing step include at least one of them. ^ A. The photosensitizing step is performed by a CCD camera. The photosensitive step is performed by a photosensitive element. Furthermore, it further comprises the steps of photographing both sides of the corner of the brittle material substrate to form image data of the corners of the brittle material substrate, and identifying the position of the corners of the brittle material substrate based on the image data. step. The aforementioned steps of capturing the image data of the two sides are performed by a CCD camera. [Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a perspective view showing the principle of detecting a notch in an end face portion of a brittle material substrate in the present invention. The inspection method of the present invention uses an LED light source 102 that irradiates spot light 103 on an end surface of a glass plate 101 (a brittle material substrate that moves at a certain speed in the direction of arrow A), and that is irradiated from the LED light source 102 with glass. The CCD camera 104 that is sensitive to the reflected light from the end surface of the plate 101 detects the amount of reflected light from the end surface of the glass plate 101 by the CCD camera 104. When there is a notch on the end surface of the glass plate 101, after the light radiated by the LED light source 102 is reflected by the notch, the amount of reflected light will be slightly reduced or increased, compared with other parts without the notch. Actually, when the light source is irradiated with light from the LED light source 102 to the end face of the glass plate 101 and the reflected light amount is detected, if the reflected light amount is approximately constant, there is no gap, but the part where the amount of reflected light is significantly increased and the part where it is significantly decreased, All have gaps. Therefore, if the reflected light irradiated by the LED light source 1232931 102 and reflected by the end face of the glass plate 101 is set to an upper limit 値 and a lower limit 当, when the reflected light from the end face is higher than the set upper limit 値 or lower than the lower limit 値, It can be judged that there is a gap in the end surface portion (the quality of the end surface portion is poor). Fig. 2 is a perspective view showing an inspection apparatus 50 for an end portion of a brittle material substrate according to an embodiment of the present invention. The platform 1 is used to fix the brittle material substrate 2 with a vacuum suction force, and is arranged on the moving base 4. The servo motor 3 can rotate the moving base 4 in a horizontal direction (direction indicated by arrow 0). The moving base 45 is moved along the two rails 7 in a direction indicated by an arrow X by a servo motor 5 and a ball screw 6 whose shaft is rotated by the servo motor 5. The bridge 9 supported by the pillars 8 on both sides spans above the track 7 and extends in the direction shown by the arrow Y. The bridge plate 9 is provided with a ball 12a which moves in the Y direction by a servo motor 10a and a ball screw 11a rotating with the servo motor 10a as an axis. The moving base 12a is provided with an inspection machine mounting plate 13a extending vertically in the X direction orthogonal to the bridge plate 9. Further, a moving base 12b having the same structure as described above and moving in the Y direction is provided. The moving base 12b is provided with an inspection machine mounting plate 13b extending vertically in the X direction orthogonal to the bridge plate 9. A pair of a first CCD camera 14a and a second CCD camera 15a facing downward are provided on the inspection machine mounting plate 13a so as to image the end surface Va of the brittle material substrate 2 at appropriate intervals along the X direction. A lower end portion of the first CCD camera 14a provided on the far side of the bridge plate 9 is provided in a "mouth" shape so as to cover the entire periphery of the lower end portion of the first CCD camera 14a in order to illuminate the shooting area from above. The first LED light source 16a 1232931. The first LED light source 16a irradiates light in a state coaxial with the optical axis of the first CCD camera 14a. The photographing area of the second CCD camera 1h provided adjacent to the bridge plate 9 is illuminated by the light irradiated by the second LED light source 17a having a predetermined length in the X direction. Each second LED light source 'is mounted on the inspection machine mounting plate 13a by an appropriate supporting member' and illuminates the aforementioned end face portion Va (the imaging region of the second CCD camera 15a) of the brittle material substrate 2 from both sides. As the second LED light sources 17a, for example, although a white LED is used, the light source 17a is not limited as long as it can obtain the required brightness for imaging the end face portion Va of the brittle material substrate 2. A pair of a third CCD camera 14b and a fourth CCD camera 15b facing downward are provided on another inspection machine mounting plate 13b so as to photograph the other end surface portion Vb 'of the brittle material substrate 2 at appropriate intervals in the X direction. The "CCD" 14b is arranged below the third CCD camera 14b on the far side of the bridge 9 so as to illuminate the shooting area from above. It surrounds the entire lower end of the third CCD camera 14b. Third LED light source 16b. The third LED light source 16b irradiates light in a state coaxial with the optical axis of the third CCD camera 14b. The shooting area of the fourth CCD camera 15b provided adjacent to the bridge plate 9 is illuminated by the light irradiated by the fourth LED light source 17b with one of a predetermined length in the X direction. Each of the fourth LED light sources 17b 'is provided on the inspection machine mounting plate 13b with an appropriate supporting member, and illuminates the aforementioned end face portion Vb of the brittle material substrate 2 from both sides (1% of the imaging region of the fourth CCD camera). As each of the fourth LED light sources 17b, for example, although a white LED is used, as long as it is a light source capable of obtaining the required brightness for photographing the aforementioned end surface portion Vb of the brittle material substrate 2, it is not limited to this. Fig. 3 is a flowchart showing the operation of the inspection device 50. Hereinafter, the operation of the inspection device 50 will be described with reference to this flowchart. When the inspection is performed by the inspection device 50, first, the initial settings of steps S1 to S5 are performed. In step S1, the exposure times of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b are set. In step S2, the first CCD camera 14a ', the third CCD camera 14b, the second CCD camera 15a, and The number of capture lines of the fourth CCD camera 15b (initial 値: for example, 480). In step S3, the fields of view of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b are set. Here, the fields of view of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b are the resolutions of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b. (For example, 512 X 480 pixels). In step S4, various parameters required for image processing of the image data captured by the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b are set. In step S5, the mechanical parameters required for the automatic operation of the inspection device 50 are set. After the initial setting of the inspection device 50 is completed, the automatic operation of the inspection device 50 is started in step S6. The first LED light source 16a, the third LED light source 16b, the second LED light source 17a, and the fourth LED light source 17b are turned on and irradiated by the iccd photo 13 1232931

影機14a、第3CCD攝影機14b、第2CCD攝影機15a及第4CCD 攝影機15b之拍攝區域。此等光源之點尺寸’係能充分覆蓋 第1CCD攝影機14a、第3CCD攝影機14b、第2CCD攝影機15a 及第4CCD攝影機15b之拍攝區域的尺寸。亦即,拍攝區域 ,係藉由該等光源,由CCD攝影機拍攝拍攝區域,爲了以 檢查時所需之精度擷取拍攝區域之影像資料’以所需之亮 度來照射。在接下來的步驟S7中,以搬運機器人(未圖示) 將脆性材料基板2載於平台1上,吸附固定。在步驟S8中’ 爲了以4台CCD攝影機14a及14b、或15a及15b拍攝脆性材料 基板2之角隅Ca,Cb,而驅動伺服馬達3及驅動伺服馬達5 ’ 來定位吸附固定檢查對象之脆性材料基板2的平台1。 在步驟S9中,對使用4台CCD攝影機14a及14b、或15a 及15b所拍攝之脆性材料基板2之端面部的影像資料,進行 影像處理,藉由脆性材料基板2端面部之影像辨識,在矩形 範圍內分別決定構成脆性材料基板2之2個角隅Ca,Cb的2邊 。圖5,係顯示步驟9中,在矩形範圍內對構成脆性材料基 板2的2個角隅Ca、Cb之任一角隅的2邊進行影像辨識的狀態 。又,影像資料,並非以像素而是以像素的線由CCD攝影 機來擷取。 在步驟S10中,決定構成角隅Ca之2邊,以運算使該2邊 近似於直線,算出該2條直線之交點,辨識出一角隅Ca的位 置。在步驟S11中,指示出構成角隅Cb之2邊,以運算使該2 邊近似於直線,算出該2條直線之交點,辨識出另一角隅Cb 的位置。 14 1232931 接下來,在步驟S12中,係以伺服馬達3,使平台1往0 方向旋轉而進行對準,以使待檢之脆性材料基板2端面部與 平台1的移動方向一致。然後,在步驟S13中,平台1,係藉 由滾珠螺絲6(因伺服馬達5之驅動而進行繞軸旋轉)以既定速 度沿2條軌道7往X方向移動。平台1以既定之速度往X方向 移動期間,在步驟S14中,係以2組檢查裝置,亦即,以第1 檢查裝置(l〇a〜17a)及第2檢查裝置(1 〇b〜17b)來檢查脆性 材料基板2之兩端面部Va,Vb。 圖4,顯不在此步驟S14中檢查之細節的流程圖。以下 ,參照圖4之流程圖,說明在步驟S 14中檢查之細節。 在步驟S51中,對於移動中之平台1上之脆性材料基板2 ,使用第1CCD攝影機14a、第2CCD攝影機15a,來拍攝脆 性材料基板2之端面部Va,擷取脆性材料基板2端面部Va之 影像資料,對該影像資料作影像處理。又,第1CCD攝影機 14a及第2CCD攝影機15a的拍攝區域,例如1邊爲〇.5mm〜 2mm。同樣的,與第1CCD攝影機14a及第2CCD攝影機15a之 影像擷取並行,第3CCD攝影機14b及第4CCD攝影機15b亦 執行同樣的影像擷取。 在步驟S52中,判定平台1是否已移動了既定距離(例如 ,相當於拍攝範圍之長度40mm)。若判定平台1已移動既定 距離時,即進行步驟S53。若判定平台1尙未移動既定距離 時,則重複步驟S51及步驟S52,直到移動既定距離(40mm) ,以第1CCD攝影機14a、第2CCD攝影機15a,拍攝脆性材 料基板2之端面部Va,擷取脆性材料基板2端面部Va之影像 15 1232931 資料,對該影像資料作影像處理。又,同時,以第3CCD攝 影機14b、第4CCD攝影機i5b,拍攝脆性材料基板2之端面 部Vb,擷取脆性材料基板2端面部vb之影像資料,對該影 像資料作影像處理。 在步驟S53中,對第iCCD攝影機14a、第2CCD攝影機 15a所擷取之移動既定距離(4〇mm長)之脆性材料基板2端面 部Va的影像資料,判定脆性材料基板2端面部上缺口之有無 (端面部品質是否良好)。 圖6,係顯示來自脆性材料基板2端面部之反射光量的 矩形圖。此矩形圖中,來自脆性材料基板2端面部之反射光 量,係藉由對CCD攝影機所擷取之移動既定距離(40mm長) 之脆性材料基板2端面部的影像資料作影像處理,而以〇〜 255階濃淡度之濃度來表示。將反射光量在既定上限値之判 定最高濃度、與既定下限値之判定最低濃度之間,作爲端 面部品質之判定基準。亦即,端面部上之各點所反射之光 量,在判定最高濃度與判定最低濃度之間時,即判定在其 端面部上之各點無異常,若端面部上之各點所反射之光量 ,高於該判定最高濃度或低於判定最低濃度時,即判定在 其端面部上之各點有異常。 判定脆性材料基板2端面部之品質好壞後,第1CCD攝 影機14a及第2CCD攝影機15a所拍攝之脆性材料基板2端面 部的同一點來的反射光量,有時兩個皆未在判定最高濃度 與判定最低濃度之間,有時第1CCD攝影機14a及第2CCD攝 影機15a拍攝到之脆性材料基板2端面部的同一點來的反射 1232931 光量,有時只有一個未在判定最高濃度與判定最低濃度之 間。考慮此種情形,至少第1CCD攝影機14a及第2CCD攝影 機15a的任一方所拍攝之脆性材料基板2端面部的同一點來 的反射光量,若未在判定最高濃度與判定最低濃度之間時 ,即判定該端面部上的點爲品質不良。同樣地,第3CCD攝 影機14b及第4CCD攝影機15b的任一方所拍攝之脆性材料基 板2端面部的同一點來的反射光量,若未在判定最高濃度與 判定最低濃度之間時,即判定該端面部上的點爲品質不良 〇 在步驟S54,判定是否已完成對脆性材料基板2上單邊 全長的掃瞄。脆性材料基板2上單邊全長的掃瞄未完成時, 在步驟S51,重新執行下一個既定距離(40mm長)之端面部的 影像資料製作。此處,之所以將脆性材料基板2端面部之品 質好壞以每個既定距離(40mm長)來加以區分之原因,係在 以既定速度使平台1移動時,若爲既定距離所收集到之資料 ,即能在該既定距離之移動時間內進行影像判定之故,可 配合影像處理機械及順序控制器的處理能力,改變平台1的 移動速度及既定距離(在此說明中爲40mm長之設定値)。又 ,在選擇影像處理裝置及CCD攝影機時,本發明之檢查裝 置的檢查能力及平台1的移動速度,會受到所選擇之影像處 理裝置的記憶體及CCD攝影機的像素數量所影響。 在步驟14中判定脆性材料基板2端面部之品質不良後, 在步驟S15中,平台1旋轉90度,對應平台1的90度旋轉,第 1檢查裝置(l〇a〜17a)及第2檢查裝置(10b〜17b)即被移動至 17 1232931 既定位置。然後,在步驟S16中’平台1即開始移動至既定 除材位置,之後,在步驟S17中’對剩餘2邊的端面部,進 行與步驟S14同樣的檢查。 在步驟S18中,檢查完畢後平台1往既定之除材位置移 動。之後,在步驟S19中,重置(reset)已擷取之端面部的影 像資料,在步驟S20中,判斷下一個檢查之脆性材料基板2 是否在既定之待機位置上。當下一個檢查之脆性材料基板2 在既定之待機位置上時,即回到步驟S7,重複上述一連串 的檢查。若下一個檢查之脆性材料基板2未在既定之待機位 置上時,檢查即結束。 如前所述,爲了辨識脆性材料基板之角隅需要如CCD 攝影機等之拍攝機構法,但若僅檢測來自脆性材料基板端 面部之反射光量而僅檢查端面部上是否有缺口的話,以價 廉之單一感光元件取代CCD攝影機亦可。 本發明,提供一種可檢測脆性材料基板端面部上缺口 之檢查裝置。爲了檢測此種脆性材料基板端面部上的缺口 ,微調照明之角度等是有必要的。在本發明中,使第1LED 光源16a、第3LED光源16b之光軸與第1CCD攝影機14a、第 3CCD攝影機14b之拍攝中心大致一致,並且使第2LED光源 17a、第4LED光源17b之角度,如圖7所示的對脆性材料基 板2的表面成30〜60度的角度,來從脆性材料基板2端面部 之兩側照射,藉此,即能自動進行前述缺口的檢測。 再者,如圖8(a)及(b)所示,若以透過照明112從下方照 射透明之脆性材料基板111的下面的話,即能檢測透明脆性 18 1232931 材料基板的端面部及端面部內部之裂縫等。圖8(a),係顯示 透過照明112、透明脆性材料基板111、CCD攝影機113之位 置關係的側視圖,圖8(b)係其前視圖。在圖8(a)及圖8(b)所 示之構成例中,CCD攝影機113係在對透過透明脆性材料基 板Π 1之光線與透明脆性材料基板1 1 1的表面單一方向傾斜 約60度的狀態下感光。 進一步的,本發明之檢查裝置,可根據來自脆性材料 基板端面部之個點之反射光量的判定最高濃度與判定最低 濃度之濃度差,來判定脆性材料基板端面部之品質不良的 種類。作爲可判定之脆性材料基板端面部之品質不良的種 類,在使用第1LED光源16a、第3LED光源16b來作爲光源時 ,有測長、缺口、凹陷、鋸齒狀缺陷、(端面之)彎曲、(脆 性材料基板上之)貼合片之貼合片斷裂、破裂等,在使用第 2LED光源17a、第4LED光源17b來作爲光源時,有缺口、凹 陷、鋸齒狀缺陷、斷片殘留、薄皮殘留、(液晶面板基板上 之)封入口之圓柱欠缺等。又,作爲可判定之透明脆性材料 基板端面部之品質不良的種類,在光源之透過照明的垂直 方向設置攝影機時,有缺口、鋸齒狀缺陷、角隅欠缺等, 在光源之透過照明的斜側方向設置攝影機時,有裂縫等。 如以上之說明,本發明,係照射光線於脆性材料基板 端面部上,當來自脆性材料基板端面部之反射光量高於既 定之上限値或低於既定之下限値時,即判定脆性材料基板 端面部上存在有缺口之缺陷(品質不良),藉此,可以提供使 用較爲簡單之機器機構,而能以高精度檢測脆性材料基板 19 1232931 端面部缺陷之檢查方法及其裝置。 [圖式簡單說明] (一)圖式部分 圖1,係用來說明本發明之檢測原理的立體圖。 圖2,係用來檢查顯示本發明1實施形態之脆性材料基 板端面之檢查裝置的立體圖。 圖3,係顯示圖2中之檢查裝置之控制動作的流程圖。 圖4,係顯示圖3中之流程圖步驟S14之詳細的流程圖。 圖5,係顯示檢測脆性材料基板角隅之方法的圖。 圖6,係顯示來自脆性材料基板端面部之反射光量的矩 形圖。 圖7,係顯示本發明實施形態中所使用之LED光源與脆 性材料基板間之位置關係的圖。 圖8(a)、(b),係顯示本發明1實施形態中所使用之透過 光源與檢查對象之透明脆性材料基板間之位置關係的圖。 (二)元件代表符號 1 平台 2 脆性材料基板 4 移動基座 5 伺服馬達 7 軌道 8 支柱 9 橋板 l〇a,l〇b 伺服馬達 20 1232931 12a,12b 13a,13b 14a,1 5a 14b,15b 16a,16b 17a,17b 50 Va,Vb Ca,Cb 101 102 103 104 移動底座 檢查機器安裝板 CCD攝影機 CCD攝影機 同軸LED光源 LED光源 檢查裝置 端面部 角隅 玻璃板 LED光源 點光 CCD攝影機The shooting areas of the camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b. The dot size of these light sources is a size that can sufficiently cover the shooting areas of the first CCD camera 14a, the third CCD camera 14b, the second CCD camera 15a, and the fourth CCD camera 15b. That is, the shooting area is a CCD camera that captures the shooting area by using these light sources. In order to capture the image data of the shooting area with the accuracy required for inspection, it is illuminated with the required brightness. In the next step S7, the brittle material substrate 2 is placed on the platform 1 by a transfer robot (not shown), and fixed by suction. In step S8 ', in order to capture the corners 隅 Ca and Cb of the brittle material substrate 2 with the four CCD cameras 14a and 14b, or 15a and 15b, the servo motor 3 and the servo motor 5 are driven to position and fix the brittleness of the inspection object. Material substrate 2 platform 1. In step S9, image processing is performed on the image data of the end surface portion of the brittle material substrate 2 taken by using the four CCD cameras 14a and 14b, or 15a and 15b. The two sides constituting the two corners Ca and Cb of the brittle material substrate 2 are determined within the rectangular range. FIG. 5 shows a state in which image recognition is performed on two sides of one of the two corners Ca and Cb constituting the brittle material substrate 2 in a rectangular range in step 9. FIG. In addition, image data is captured by a CCD camera not by pixels but by pixel lines. In step S10, the two sides constituting the corner 隅 Ca are determined, and the two sides are approximated to a straight line by calculation, the intersection of the two straight lines is calculated, and the position of the corner 隅 Ca is identified. In step S11, the two sides constituting the angle 隅 Cb are instructed, and the two sides are approximated to a straight line by calculation, the intersection of the two straight lines is calculated, and the position of the other angle 隅 Cb is identified. 14 1232931 Next, in step S12, the servo motor 3 is used to rotate the platform 1 in the 0 direction to perform alignment so that the end surface of the brittle material substrate 2 to be inspected coincides with the moving direction of the platform 1. Then, in step S13, the stage 1 is moved along the two tracks 7 in the X direction at a predetermined speed by the ball screws 6 (rotated around the axis by the drive of the servo motor 5). While the platform 1 is moving in the X direction at a predetermined speed, in step S14, two sets of inspection devices are used, that is, the first inspection device (10a to 17a) and the second inspection device (10b to 17b). ) To inspect both end faces Va, Vb of the brittle material substrate 2. FIG. 4 is a flowchart showing details of checking in this step S14. Hereinafter, the details of the check in step S14 will be described with reference to the flowchart of FIG. 4. In step S51, for the brittle material substrate 2 on the moving platform 1, the first CCD camera 14a and the second CCD camera 15a are used to photograph the end surface portion Va of the brittle material substrate 2 and extract the end surface portion Va of the brittle material substrate 2. The image data is used for image processing. The imaging areas of the first CCD camera 14a and the second CCD camera 15a are, for example, 0.5 mm to 2 mm on one side. Similarly, in parallel with the image capture by the first CCD camera 14a and the second CCD camera 15a, the third CCD camera 14b and the fourth CCD camera 15b also perform the same image capture. In step S52, it is determined whether the platform 1 has moved a predetermined distance (for example, 40 mm in length corresponding to the shooting range). If it is determined that the platform 1 has moved a predetermined distance, step S53 is performed. If it is determined that the platform 1 尙 has not moved a predetermined distance, repeat steps S51 and S52 until the predetermined distance (40mm) is moved, and use the first CCD camera 14a and the second CCD camera 15a to capture the end surface Va of the brittle material substrate 2 and capture The image 15 1232931 data of the end surface portion Va of the brittle material substrate 2 is subjected to image processing. At the same time, the third CCD camera 14b and the fourth CCD camera i5b are used to capture the end surface portion Vb of the brittle material substrate 2 and capture the image data of the end surface portion vb of the brittle material substrate 2 to perform image processing on the image data. In step S53, the image data of the end surface portion Va of the brittle material substrate 2 moved by a predetermined distance (40 mm length) captured by the iCCD camera 14a and the second CCD camera 15a is determined to determine the gap on the end surface portion of the brittle material substrate 2. Presence or absence (whether the quality of the end face is good). Fig. 6 is a histogram showing the amount of reflected light from the end face of the brittle material substrate 2. The amount of reflected light from the end face of the brittle material substrate 2 in this rectangular diagram is based on the image data of the end face of the brittle material substrate 2 moved by a predetermined distance (40 mm length) captured by the CCD camera for image processing. It is expressed as a density of 255 steps. The amount of reflected light between the determined maximum concentration of the predetermined upper limit 値 and the determined minimum concentration of the predetermined lower limit 値 is used as a criterion for determining the quality of the face. That is, when the amount of light reflected by each point on the end face is between the highest concentration and the lowest concentration, it is determined that there is no abnormality at each point on the end face. If the amount of light reflected by each point on the end face is When it is higher than the determined maximum concentration or lower than the determined minimum concentration, it is determined that there is an abnormality at each point on the end surface portion. After judging the quality of the end face of the brittle material substrate 2, the amount of reflected light from the same point on the end face of the brittle material substrate 2 captured by the first CCD camera 14a and the second CCD camera 15a may not be determined at the highest concentration and Between the determination of the minimum concentration, there may be only one reflection of 1229331 light from the same point of the end face of the brittle material substrate 2 captured by the first CCD camera 14a and the second CCD camera 15a, and sometimes only one is not between the determination of the maximum concentration and the determination of the minimum concentration. . Considering this situation, if at least one of the first CCD camera 14a and the second CCD camera 15a captures the amount of reflected light from the same point on the end face portion of the brittle material substrate 2, if it is not between the highest concentration and the lowest concentration, The point on this end surface part was judged as bad quality. Similarly, the amount of reflected light from the same point on the end face of the brittle material substrate 2 taken by either the third CCD camera 14b or the fourth CCD camera 15b is determined if the maximum concentration and the minimum concentration are not determined. The point on the part is poor quality. In step S54, it is determined whether the scanning of the full length of one side of the brittle material substrate 2 has been completed. When the scanning of the single-sided full length on the brittle material substrate 2 is not completed, in step S51, image data production of the end surface portion of the next predetermined distance (40 mm length) is performed again. Here, the reason why the quality of the end face of the brittle material substrate 2 is distinguished by each predetermined distance (40mm length) is that when the platform 1 is moved at a predetermined speed, it is collected for the predetermined distance. Data, that is, the image can be judged within the movement time of the predetermined distance. The movement speed of the platform 1 and the predetermined distance can be changed in accordance with the processing capabilities of the image processing machinery and the sequence controller (in this description, the setting is 40mm long) value). In addition, when selecting an image processing device and a CCD camera, the inspection capability of the inspection device and the moving speed of the platform 1 of the present invention are affected by the memory of the selected image processing device and the number of pixels of the CCD camera. After it is determined in step 14 that the quality of the end face of the brittle material substrate 2 is not good, in step S15, the stage 1 is rotated 90 degrees, corresponding to the 90 degree rotation of the stage 1, the first inspection device (10a to 17a) and the second inspection The device (10b ~ 17b) is moved to the predetermined position of 17 1232931. Then, in step S16, the 'platform 1 starts to move to the predetermined material removal position, and thereafter, in step S17, the same inspection as in step S14 is performed on the end portions of the remaining two sides. In step S18, the platform 1 moves to a predetermined removal position after the inspection is completed. After that, in step S19, the captured image data of the end surface is reset, and in step S20, it is judged whether or not the fragile material substrate 2 to be checked next is at a predetermined standby position. When the fragile material substrate 2 to be inspected next is at the predetermined standby position, the process returns to step S7 and the above-mentioned series of inspections are repeated. If the brittle material substrate 2 for the next inspection is not in the predetermined standby position, the inspection ends. As mentioned above, in order to identify the corners of a brittle material substrate, a photographing mechanism method such as a CCD camera is required. However, if only the amount of reflected light from the end surface portion of the brittle material substrate is detected and only the end surface is inspected for a gap, it is inexpensive. It is also possible to replace the CCD camera with a single photosensitive element. The invention provides an inspection device capable of detecting a notch on an end surface portion of a brittle material substrate. In order to detect a notch on the end face of such a brittle material substrate, it is necessary to fine-tune the angle of illumination and the like. In the present invention, the optical axes of the first LED light source 16a and the third LED light source 16b are substantially aligned with the shooting centers of the first CCD camera 14a and the third CCD camera 14b, and the angles of the second LED light source 17a and the fourth LED light source 17b are as shown in the figure. The surface of the brittle material substrate 2 shown in 7 is irradiated from both sides of the end face portion of the brittle material substrate 2 at an angle of 30 to 60 degrees, whereby the aforementioned notch detection can be performed automatically. In addition, as shown in FIGS. 8 (a) and 8 (b), if the lower surface of the transparent brittle material substrate 111 is irradiated from below with the transmission light 112, the end portion of the transparent substrate 18 1232931 and the inside of the end portion can be detected. Cracks, etc. Fig. 8 (a) is a side view showing the positional relationship of the transmission illumination 112, the transparent brittle material substrate 111, and the CCD camera 113, and Fig. 8 (b) is a front view thereof. In the configuration example shown in FIGS. 8 (a) and 8 (b), the CCD camera 113 is inclined about 60 degrees in a single direction with respect to the light passing through the transparent brittle material substrate Π 1 and the surface of the transparent brittle material substrate 1 1 1. Photosensitivity. Further, the inspection device of the present invention can determine the type of poor quality of the end face portion of the brittle material substrate based on the difference between the determined maximum concentration and the minimum concentration of the reflected light amount from a point on the end surface portion of the brittle material substrate. As the types of the inferior quality of the end face portion of the brittle material substrate that can be determined, when the first LED light source 16a and the third LED light source 16b are used as the light source, there are length measurement, notches, depressions, jagged defects, (end surface) bending, ( When the second LED light source 17a and the fourth LED light source 17b are used as the light source, the bonding piece of the bonding piece on the brittle material substrate has cracks, dents, jagged defects, residual fragments, thin skin residue, ( The column on the substrate of the LCD panel) is missing. In addition, as a type of the inferior quality of the end face of the transparent and brittle material substrate that can be judged, when the camera is installed in the vertical direction of the transmission light of the light source, there are notches, jagged defects, lack of corners, etc., on the oblique side of the transmission light of the light source. When the camera is installed in the direction, there are cracks. As described above, the present invention irradiates light on the end face of the brittle material substrate. When the amount of reflected light from the end face of the brittle material substrate is higher than the predetermined upper limit or lower than the predetermined lower limit, the end face of the brittle material substrate is determined. There are gap defects (poor quality) on the part, so that it is possible to provide a relatively simple machine mechanism and an inspection method and a device for detecting defects at the end surface of the brittle material substrate 19 1232931 with high accuracy. [Brief description of the drawings] (I) Schematic part FIG. 1 is a perspective view for explaining the detection principle of the present invention. Fig. 2 is a perspective view of an inspection device for inspecting and showing an end face of a brittle material substrate according to the first embodiment of the present invention. FIG. 3 is a flowchart showing a control operation of the inspection device in FIG. 2. FIG. 4 is a detailed flowchart showing step S14 of the flowchart in FIG. 3. FIG. 5 is a diagram showing a method for detecting corners of a substrate of a brittle material. Fig. 6 is a rectangular diagram showing the amount of reflected light from the end face of a brittle material substrate. Fig. 7 is a diagram showing a positional relationship between an LED light source and a substrate of a brittle material used in the embodiment of the present invention. 8 (a) and 8 (b) are diagrams showing a positional relationship between a transparent light source and a transparent brittle material substrate to be inspected used in the first embodiment of the present invention. (II) Symbols for components 1 Platform 2 Brittle material substrate 4 Mobile base 5 Servo motor 7 Track 8 Pillar 9 Bridge plate 10a, 10b Servo motor 20 1232931 12a, 12b 13a, 13b 14a, 1 5a 14b, 15b 16a, 16b 17a, 17b 50 Va, Vb Ca, Cb 101 102 103 104 Mobile base inspection machine mounting plate CCD camera CCD camera coaxial LED light source LED light source inspection device end face corner glass plate LED light source point light CCD camera

21twenty one

Claims (1)

1232931 拾、申請專利範圍 \ 議 93年10月 第91 133882號申請案,申請專利範圍修正本 1、一種脆性材料基板端面部之檢查裝置,其特徵在於 ’具備: 平台,係以水平狀態承載脆性材料基板,· 平台移動機構,用以使該平台往既定方向移動,· 平台水平旋轉機構,用以使該平台沿水平方向旋轉; 光源’用以對該脆性材料基板之端面部照射光線; 第丨至第4攝影機構,用以感光該光源所照射、從該脆 性材料基板端面部反射出來之反射光; 第仏查機為安叙板,係為拍攝該脆性材料基板之一端 面部而安裝該第1攝影機構與該第2攝影機構,能往與前述 平台之移動方向正交的方向移動; 第才欢查機益安1板,係為拍攝該脆性材料基板之一端 面部而安裝該第3攝影機構與該第4攝影機構,能往與前述 平台之移動方向正交的方向移動;以及 、、山判定機構,根據該第1至第4攝影機構所感光之來自前 L而面=反射光光!,以判定前述端面部之品質好壞; 卜Λ第1攝〜機構或该第1攝影機構、與第3攝影機構或 第4攝影機構’來拍攝形成該脆性材料基板之角隅的以, 以辨識該脆性材料基板之角隅,該平台水平旋轉機構係使 該脆性材料基板之端面部與該平台之移動方向一致。 22 1 、如申請專利範圍第1項之脆性材料基板端面部之檢 1232931 查裝置,其中,前述判定機構,係保持預先設定之前述攝 影機構所感光之反射光光量的上限值及下限值,當該攝影 機構所感光之反射光量高於該上限值、或低於該下限值時 ’即判定前述脆性材料基板之端面部為品質不良。 3、 如申請專利範圍第1項之脆性材料基板端面部之檢 查叙置’其中,前述判定機構’係根據前述光量大小來區 別前述脆性材料基板端面部之品質不良的種類。 4、 如申請專利範圍第1或2項之脆性材料基板端面部之 檢查裝置,其中: 前述光源,具備對前述脆性材料基板之端面部於垂直 方向照射光線之第1光源及第3光源,與從前述端面部之兩 側斜向照射之第2光源及第4光源; 前述第1攝影機構,係在以該第1光源照射光線於該端 面部時,檢測來自該端面部之反射光光量,該第2攝影機構 ’係在以該第2光源照射光線於該端面部時,檢測來自該脆 性材料基板端面部之反射光光量,該第1攝影機構與該第2 攝影機構中,至少使用一個攝影機構; W述第3攝影機構,係在以該第3光源照射光線於該端 面部時,檢測來自該端面部之反射光光量,該第4攝影機構 ,係在以該第4光源照射光線於該端面部時,檢測來自該脆 性材料基板端面部之反射光光量,該第3攝影機構與該第4 攝影機構中,至少使用一個攝影機構。 5、 如申請專利範圍第丨項之脆性材料基板端面部之檢 查裝置,其中,前述攝影機構為CCD.影機。 23 1232931 6、 一種脆性材料基板端面部之檢查方法,係判定脆性 材料基板端面部品質之好壞,其特徵在於,包含: 拍攝形成該脆性材料基板之角隅的2邊,並擷取形成該 脆性材料基板角隅之2邊之影像資料的步驟; 根據该影像資料辨識該脆性材料基板角隅之位置,使 該脆性材料基板之端面部與該脆性基板材料之移動方向一 致的步驟; 一邊沿該端面部相對移動、一邊照射光線於該端面部 的照射步驟; 將來自該端面部之反射光予以感光的步驟;以及 根據所感光之反射光光量來判定該端面部品質好壞的 步驟。 7、 如申請專利範圍第6項之脆性材料基板端面部之檢 查方法,其中,前述判定步驟,係將預先設定所感光之前 述反射光光量的上限值及下限值加以保持後,當所感光之 該反射光光量高於上限值、或低於下限值時,即判定前述 脆性材料基板之端面部為品質不良的判定步驟。 8、 如申請專利範圍第6項之脆性材料基板端面部之檢 查方法,其中,前述判定步驟,$ —步包含區別前述脆性 材料基板端面部品質不良之種類的步驟。 9、 如申請專利範圍第6或7項之脆性材料基板端面部之 檢查方法,其中: 前述照射步驟,包含於垂直方向對前述脆性材料基板 之端面部照射光線的第1照射步驟,由前述脆性材料基板端 1232931 面α卩之兩側斜向照射光線的第2照射步驟,在以該第1照射 步驟對該脆性材料基板的端面部照射光線時、將來自該脆 性材料基板端面部之反射光光量予以感光的第1感光步驟, 與在以第2照射步驟對該脆性材料基板的端面部照射光線時 將來自4脆性材料基板端面部之反射光^量予以感光的 第2感光步驟; 前述第1感光步驟及前述第2感光步驟中,至少係進行 其中一個。 1〇、如申請專利範圍第6項之脆性材料基板端面部之檢 查方法,其中,前述感光步驟是以CCD攝影機來進行。 11、 如中請專利範圍第6項之脆性材料基板端面部之檢 查方法,其中,前述感光步驟是以感光元件來進行。 12、 如中請專利範圍第6項之脆性材料基板端面部之檢 查方法,其中,擷取前述2邊之影像資料的步驟,是以CCd 攝影機來進行。1232931, Patent application scope \ Negotiation of October, 1993, application No. 91 133882, patent application scope amendment 1, a device for inspecting the end face of a brittle material substrate, characterized by 'equipped with: a platform, which carries brittleness in a horizontal state Material substrate, · platform moving mechanism to move the platform to a predetermined direction, · platform horizontal rotation mechanism to rotate the platform in a horizontal direction; light source 'to irradiate light to the end face of the brittle material substrate;丨 to the fourth photographing mechanism for sensing the reflected light irradiated by the light source and reflected from the end surface portion of the brittle material substrate; the second inspection machine is a security panel, which is installed to photograph one end surface portion of the brittle material substrate The first photographing mechanism and the second photographing mechanism can move in a direction orthogonal to the moving direction of the aforementioned platform; the first inspection machine Yi'an 1 plate is used for photographing an end portion of the brittle material substrate and installing the third The photography mechanism and the fourth photography mechanism can move in a direction orthogonal to the moving direction of the aforementioned platform; and, the mountain determination mechanism, According to the first to fourth photographing mechanisms, the light from the front L comes from the surface = reflected light! To determine the quality of the aforementioned end surface portion; [1] The first photo-taking mechanism or the first photo-taking mechanism, and the third photo-taking mechanism or the fourth photo-taking mechanism 'are used to photograph the corners forming the brittle material substrate. Identifying the corners of the brittle material substrate, the platform horizontal rotation mechanism makes the end surface of the brittle material substrate coincide with the moving direction of the platform. 22 1. The inspection device such as the inspection of the end face of the brittle material substrate according to item 1 of the patent application 1232931, wherein the aforementioned determination mechanism maintains the upper limit value and the lower limit value of the amount of reflected light received by the aforementioned photography mechanism. When the amount of reflected light received by the photographing mechanism is higher than the upper limit value or lower than the lower limit value, it is judged that the end portion of the brittle material substrate is of poor quality. 3. For example, in the inspection and description of the brittle material substrate end surface portion of the scope of application for patent No. 1, where the aforementioned determination mechanism is used to distinguish the types of the poor quality of the brittle material substrate end surface according to the amount of light. 4. The inspection device for the end face of a brittle material substrate, such as the item 1 or 2 of the scope of patent application, wherein: the light source includes a first light source and a third light source that irradiate light to the end surface of the brittle material substrate in a vertical direction; A second light source and a fourth light source that are obliquely irradiated from both sides of the end surface portion; the first photographing mechanism detects the amount of reflected light from the end surface portion when the first light source irradiates light on the end surface portion, The second photographing mechanism 'detects the amount of reflected light from the end surface of the brittle material substrate when the second light source is irradiated with light on the end surface. At least one of the first photographing mechanism and the second photographing mechanism is used. Photographing mechanism; W said the third photographing mechanism, when the third light source is irradiated with light on the end surface portion, detects the amount of reflected light from the end surface portion, the fourth photographing mechanism is irradiated with the fourth light source At the end surface portion, the amount of reflected light from the end surface portion of the fragile material substrate is detected. At least one of the third and fourth photographing mechanisms uses the photographing mechanism. 5. The inspection device for the end face of a brittle material substrate such as the one described in the patent application, wherein the aforementioned photography mechanism is a CCD camera. 23 1232931 6. A method for inspecting the end face portion of a brittle material substrate is to determine the quality of the end face portion of the brittle material substrate, which is characterized by comprising: photographing two sides forming a corner of the brittle material substrate, and extracting and forming the A step of image data of the two sides of the brittle material substrate corner; the step of identifying the position of the corner of the brittle material substrate according to the image data, so that the end portion of the brittle material substrate is consistent with the moving direction of the brittle substrate material; An irradiation step of irradiating light on the end face while the end face is relatively moved; a step of sensitizing reflected light from the end face; and a step of determining the quality of the end face according to the amount of the reflected light. 7. For the method for inspecting the end face portion of the brittle material substrate such as in the scope of patent application No. 6, wherein the aforementioned determination step is to maintain the upper limit value and the lower limit value of the light quantity of the reflected light which is photosensitive beforehand, When the light quantity of the reflected reflected light is higher than the upper limit value or lower than the lower limit value, it is a judgment step of judging that the end face portion of the brittle material substrate is of poor quality. 8. The method for inspecting the end face of a brittle material substrate such as in item 6 of the patent application scope, wherein the aforementioned determination step, step $-includes a step of discriminating the kind of the poor quality of the end face of the brittle material substrate. 9. The method for inspecting the end face portion of a brittle material substrate according to item 6 or 7 of the patent application scope, wherein: the aforementioned irradiation step includes a first irradiation step of irradiating light to the end face portion of the brittle material substrate in a vertical direction from the aforementioned brittleness The second irradiation step of irradiating light obliquely on both sides of the material substrate end 1232931 surface α 卩. When the first irradiation step irradiates light to the end face of the brittle material substrate, the reflected light from the end face of the brittle material substrate is reflected. A first photo-sensitizing step of photosensitizing the light amount, and a second photo-sensitizing step of photo-reflecting the amount of reflected light from the end face of the 4 brittle material substrate when irradiating light to the end face of the brittle material substrate in the second irradiation step; At least one of the 1 photosensitive step and the aforementioned second photosensitive step is performed. 10. The method for inspecting the end face portion of a brittle material substrate according to item 6 of the patent application scope, wherein the aforementioned photosensitizing step is performed with a CCD camera. 11. For example, please refer to the inspection method for the end face of a brittle material substrate according to item 6 of the patent, wherein the aforementioned photosensitive step is performed with a photosensitive element. 12. For example, please refer to the inspection method for the end face of the brittle material substrate in item 6 of the patent, wherein the step of capturing the image data of the two sides mentioned above is performed with a CCd camera. 拾壹、圖式 如次頁 25Pick up, Schematic as next page 25
TW091133882A 2001-11-20 2002-11-20 Inspecting method for end faces of brittle-material-made substrate and device therefor TWI232931B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001354784 2001-11-20

Publications (2)

Publication Number Publication Date
TW200300493A TW200300493A (en) 2003-06-01
TWI232931B true TWI232931B (en) 2005-05-21

Family

ID=19166585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091133882A TWI232931B (en) 2001-11-20 2002-11-20 Inspecting method for end faces of brittle-material-made substrate and device therefor

Country Status (6)

Country Link
JP (1) JP3875236B2 (en)
KR (1) KR100565413B1 (en)
CN (1) CN1261751C (en)
AU (1) AU2002349646A1 (en)
TW (1) TWI232931B (en)
WO (1) WO2003044507A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4626982B2 (en) 2005-02-10 2011-02-09 セントラル硝子株式会社 Defect detection device and detection method for end face of glass plate
CN102235982A (en) * 2010-03-31 2011-11-09 旭硝子株式会社 End face inspection method and end face inspection device of light-transmitting rectangular plate-shaped object
JP5022507B1 (en) * 2011-08-30 2012-09-12 日東電工株式会社 Product panel continuous manufacturing method, detection system, and detection method
KR102120507B1 (en) * 2012-10-12 2020-06-08 스미또모 가가꾸 가부시키가이샤 Detection apparatus, method for manufacturing optical member-bonded body, and method for manufacturing optical member-bonded body
KR101535945B1 (en) * 2014-01-10 2015-07-13 크룹스(주) System and method for inspecting burrs on cases of mobile phones and tablet PCs
CN104391390B (en) 2014-12-18 2017-05-10 合肥鑫晟光电科技有限公司 Substrate checking device and method
CN104655645B (en) 2015-03-06 2017-05-24 合肥京东方光电科技有限公司 Base plate damage detecting device, production system and detecting method
CN105157954A (en) * 2015-08-25 2015-12-16 广州赛西标准检测研究院有限公司 Lighting and video display photoelectric characteristic detection device
CN106442560A (en) * 2016-08-23 2017-02-22 汕头大学 Positioning measurement and defect detection method of display screen
CN107884417A (en) * 2017-12-11 2018-04-06 苏州精濑光电有限公司 A kind of substrate edges check machine and marginal check method
JP2018072355A (en) * 2017-12-25 2018-05-10 三星ダイヤモンド工業株式会社 Substrate inspection device
KR102580389B1 (en) * 2018-02-13 2023-09-19 코닝 인코포레이티드 Apparatus and method for inspecting a glass sheet
JP7246774B2 (en) * 2019-02-28 2023-03-28 吉野石膏株式会社 Plate-shaped body inspection device
KR102175502B1 (en) * 2019-03-28 2020-11-06 주식회사 에이치비테크놀러지 Hybrid Display Panel Inspection Device Capable of Aligning the Theta Axis of Both the Original Plate and the Separated Plate
JP2021124401A (en) * 2020-02-05 2021-08-30 住友金属鉱山株式会社 Device and method for inspecting substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5841459B2 (en) * 1974-10-28 1983-09-12 キヤノン株式会社 BUTSUTAIRIYO BUKETSUKAN KENSAHOHO
JPH01169343A (en) * 1987-12-25 1989-07-04 Nippon Sheet Glass Co Ltd Cut defect detector for glass plate
JP3013903B2 (en) * 1991-01-31 2000-02-28 セントラル硝子株式会社 Defect detection device for sheet glass
JPH0894541A (en) * 1994-09-21 1996-04-12 Nachi Fujikoshi Corp Method for detecting chipped corner of subject for inspection
JPH10213551A (en) * 1997-01-30 1998-08-11 Advanced Display:Kk Chipping detection device for glass substrate and chipping detecting method
JP2002062267A (en) * 2000-08-21 2002-02-28 Asahi Glass Co Ltd Device for inspecting defect

Also Published As

Publication number Publication date
JPWO2003044507A1 (en) 2005-03-24
AU2002349646A1 (en) 2003-06-10
CN1537227A (en) 2004-10-13
KR100565413B1 (en) 2006-03-30
WO2003044507A1 (en) 2003-05-30
JP3875236B2 (en) 2007-01-31
KR20040044410A (en) 2004-05-28
TW200300493A (en) 2003-06-01
CN1261751C (en) 2006-06-28

Similar Documents

Publication Publication Date Title
TWI232931B (en) Inspecting method for end faces of brittle-material-made substrate and device therefor
JP3967759B2 (en) Inspection device for transparent substrate end face and inspection method thereof
JP5583102B2 (en) Glass substrate surface defect inspection apparatus and inspection method
KR101067647B1 (en) Crack inspection apparatus of head side part for accuracy screw's
TWI773032B (en) An arched illumination device, an imaging system with the same and a method for imaging
KR101080216B1 (en) Apparatus for inspecting glass edge and method for inspecting glass edge using thereof
WO2006088150A1 (en) Glass substrate inspection equipment and inspection method
JP2011158363A (en) Soldering inspection device for pga mounting substrate
JP4362335B2 (en) Inspection device
KR20190032195A (en) Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
JP2007333491A (en) Visual insepction device of sheet member
WO2012056858A1 (en) Apparatus for observing edge of subject to be observed and apparatus for inspecting edge of subject to be observed
JP2003098122A (en) Visual examination device for glass board
JP2008021884A (en) Inspection apparatus
JP5288672B2 (en) Surface defect inspection equipment
TWI621192B (en) A chip appearance inspection device and method
JP2000046747A (en) Method and apparatus for inspecting appearance of liquid crystal substrate
JP4177204B2 (en) Container foreign matter inspection system
JP2000074849A (en) Foreign matter detecting method and device
KR100825968B1 (en) Apparatus for inspecting edge of flat panel display
CN215493243U (en) Detection device
JP2776299B2 (en) Electronic component appearance inspection method
CN116539525A (en) Device and method for inspecting internal defects of electronic component
JP2007170929A (en) Inspection device of glossy plane
TWM601821U (en) Split position inspection device for liquid crystal glass substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees