TWI230571B - Reference hole boring machine, and method for estimating guide mark coordinates for multilayer printed circuit board - Google Patents

Reference hole boring machine, and method for estimating guide mark coordinates for multilayer printed circuit board Download PDF

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Publication number
TWI230571B
TWI230571B TW092128690A TW92128690A TWI230571B TW I230571 B TWI230571 B TW I230571B TW 092128690 A TW092128690 A TW 092128690A TW 92128690 A TW92128690 A TW 92128690A TW I230571 B TWI230571 B TW I230571B
Authority
TW
Taiwan
Prior art keywords
coordinate
mark
wiring board
printed wiring
observation
Prior art date
Application number
TW092128690A
Other languages
English (en)
Chinese (zh)
Other versions
TW200415976A (en
Inventor
Masatoshi Araki
Tsutomu Saito
Original Assignee
Muraki Kk
Seiko Precision Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muraki Kk, Seiko Precision Kk filed Critical Muraki Kk
Publication of TW200415976A publication Critical patent/TW200415976A/zh
Application granted granted Critical
Publication of TWI230571B publication Critical patent/TWI230571B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Control Of Cutting Processes (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW092128690A 2002-10-16 2003-10-15 Reference hole boring machine, and method for estimating guide mark coordinates for multilayer printed circuit board TWI230571B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002301998A JP3954474B2 (ja) 2002-10-16 2002-10-16 基準穴穴開け機、および、多層プリント配線板のガイドマーク座標値の推定法

Publications (2)

Publication Number Publication Date
TW200415976A TW200415976A (en) 2004-08-16
TWI230571B true TWI230571B (en) 2005-04-01

Family

ID=32450199

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092128690A TWI230571B (en) 2002-10-16 2003-10-15 Reference hole boring machine, and method for estimating guide mark coordinates for multilayer printed circuit board

Country Status (3)

Country Link
JP (1) JP3954474B2 (ko)
KR (1) KR100561282B1 (ko)
TW (1) TWI230571B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542046B2 (ja) * 2006-01-30 2010-09-08 セイコープレシジョン株式会社 穴開け方法及び穴開け装置
KR101184231B1 (ko) 2011-05-03 2012-09-19 이오에스(주) 가상 시뮬레이션을 이용한 인쇄회로기판의 랜드부 천공 가공 방법
KR101825832B1 (ko) * 2016-09-23 2018-02-05 가부시키가이샤 무라키 다층전자회로판드릴링머신에 응용되는 자동운송장치
CN108712826B (zh) * 2018-08-09 2023-12-01 深圳凯世光研股份有限公司 一种PCB板Mark点识别装置及其识别方法
TWI742641B (zh) * 2020-04-30 2021-10-11 寶翔精密有限公司 X光打靶機電路板靶位自動對位方法及其送料裝置
CN113419485B (zh) * 2021-06-25 2022-07-15 吉安砺芯半导体有限责任公司 定位打孔方法、设备、存储介质及装置
TWI772188B (zh) * 2021-09-24 2022-07-21 健鼎科技股份有限公司 多層電路板的穿孔成形方法、多層電路板製造方法、多層電路板及多層電路板製造系統

Also Published As

Publication number Publication date
TW200415976A (en) 2004-08-16
KR20040034440A (ko) 2004-04-28
KR100561282B1 (ko) 2006-03-15
JP3954474B2 (ja) 2007-08-08
JP2004140095A (ja) 2004-05-13

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees