TW200415976A - Reference hole boring machine, and method for estimating guide mark coordinates for multilayer printed circuit board - Google Patents

Abstract

The objective of the present invention is to estimate true coordinates for a guide mark, with the effect of altitude removed out of a guide mark X-ray image formed on a multilayer printed circuit board conductor layer.To solve the problem, a guide mark M formed in a conductor layer in a multilayer printed circuit board 60 is irradiated with X-rays emitted radially and linearly from an X-ray source A which is virtually a point. An image Z is formed on a fluorescent plane of an X-ray camera positioned directly under the guide mark M, and an x-coordinate c1 and a y-coordinate d1 are determined for the image Z. Relative to the X-ray camera, the wiring board is moved by L1 in the x-direction and by L2 in the y-direction for the guide mark M to move to the position M2. Then an x-coordinate c2 and a y-coordinate d2 are determined for the image Z2 of the guide mark M2. The coordinates (Lx, Ly) estimated for the guide mark M, which are calculated by using the guide mark coordinates estimation formulas [Lx=L1× c1/(c2-c1), Ly=L2× d1/(d2-d1)] in reference to (c), (d), are not affected by the distance between the guide mark M and the X-ray camera fluorescent plane.

Description

200415976 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to an observation and estimation of an image formed by irradiating a mark formed on each conductor layer constituting an inner layer of a multilayer printed wiring board with X-rays The layout of the wiring pattern of the multilayer printed wiring board is a reference hole punching machine that forms a reference hole. [Prior Art] Recently, with the miniaturization of 1C chips, resistors, capacitors, and other surface-mounted electronic components, higher density has been required to mount these printed wiring boards, and many have been multilayered. Multi-layer printed wiring boards with up to four or six layers of conductors are also used in people's livelihoods, while high-layer printed wiring boards with more layers are used in industrial applications. The multilayer printed wiring board is composed of an outer conductor layer 'exposed on both the front and back layers and a plurality of inner conductor layers which are not exposed. An insulating substrate is inserted between each of the conductor layers. It has a structure in which a conductor layer is adhered. As a conductor layer of a multilayer printed wiring board, for example, a copper foil having a thickness of about J 8 μm is used. As the substrate material, thermosetting glass and epoxy resin have become the mainstream. In high multilayer wiring boards, heat-resistant resins such as glass, polyimide resin, and glass B T resin are also used. The multilayer printed wiring board has more than six layers and only the inner layer has a large number of conductors. Therefore, as a method for manufacturing a multilayer printed wiring board, refer to i 〇 (2) (2) 200415976 and Figure Π below. The method of manufacturing a six-layer multilayer printed wiring board is illustrated in detail. Figure 10 (a) is a perspective view schematically showing the structure of the six-layer wiring board. Figure 10 (b) is a diagram schematically showing the formation of an inner layer. A plan view of a printed pattern of a conductor portion of a double-sided wiring board. Fig. 10 (c) is a side view showing a formwork used in the following lamination. Figure 11 shows the cross-section of a six-layer wiring board (a) is the state before the hot pressing process, and (b) is a multi-φ wiring by hot pressing and thermosetting and thermosetting bonding by hot pressing. The status of the board. As shown in FIG. 10 (a), the six-layer multilayer wiring board 60 is between the two-layer exposed conductor layers 6 2, 6 2 and the two double-sided printed wiring boards 6 1 and 6 1 which become the inner layer. It is formed by sandwiching the substrate materials 6 4, 6 4 a, and 6 4. The printed wiring boards 6 1 and 61 on both sides constituting the inner layer are usually formed by etching with a single wiring board pattern 61 a, which is a final product (six in the figure), ... 6 la And so on on the front and back copper foil surfaces. At least two guide holes 65 and 65 for positioning are opened in advance on the above-mentioned two-sided φ wiring boards 61 and 61, and a pattern 6 1 a on the front and back sides is formed using the guide holes 65 and 65 as a reference. .... 6 1 a etc. Therefore, the patterns on the front and back of the printed wiring boards 6 1 and 61 on both sides keep their positions on the plane. In this way, patterns 61a, ..., 61a, etc. are formed in the two double-sided wiring boards 6 1, 6 1 using the guide holes 6 5, 65 having the same coordinate position. A pattern of printed wiring board 6 1 is printed on both sides of the inner layer board. In addition to the patterns of single wiring board 6 1 a, ......... 6 1 a, a plurality of patterns are prepared for use in subsequent processes. 66, 66 (two parts in the central part-6- (3) (3) 200415976) or 66b (... four parts in each corner) for the reference hole, and Marks 6 6 a indicating the positions of reference holes for front and back identification are also formed by etching. A printed wiring board is printed on both sides with a plurality of etched inner layers superimposed, and the positional relationship between the patterns formed on the conductor portions of the wiring boards is called a junction layer (Layup). Prepare a work template 6 8 with two pins 6 8 a and 6 8 a. The center distances of the pins 6 8 a and 6 8 a are equal to the guide holes 65, used when the patterns 6 1 a, ..., 6 1 a, etc. are formed on both sides of the φ printed wiring board 61. Center distance of 65. The pins 68a and 68a of the die plate 68 are inserted into the guide holes 65 and 65 of one of the etched two-sided substrates 61 and placed on the die plate 68. A substrate material 64a before heating with the via holes 65 and 65 formed thereon is placed thereon. In addition, the guide holes 6 5 and 6 5 of the other two-sided substrate 6 1 are inserted through the pins 6 8 a and 6 8 a of the die plate 6 8 and overlapped with the die plate 6 8. At this stage, the outer periphery of the two double-sided substrates 6 1 and 61 and the intermediate substrate material 64 a in between are temporarily fixed to complete the lamination. As shown in the cross-sectional view of FIG. 11 (a), the two printed wiring boards 6 1 and 6 1 with two layers on the two sides are laminated on both sides of the substrate material 6 4 and 6 4 and the copper foil of the conductor material. 62, 62 and pressurized heating by hot pressing, the substrate materials 64, 64a, 64 inserted between the copper foil 62 or the two-sided substrate 61 are thermally hardened to change into (insulating) substrates 63, and are also completed The adhesion between the conductors becomes a multilayer printed wiring board 60 shown in FIG. 11 (b). Thereafter, a new reference hole 'corresponding to the inner layer pattern of the multilayer printed wiring board 60 is opened, and the hole for the etching of the outermost conductor wiring pattern is processed using this new reference hole as a reference. In addition, a plating process, an anti-rust treatment process (4) (4) 200415976, etc. are used to divide into single wiring boards by machining and cut them into a desired external shape to complete a multilayer printed wiring board. In order to avoid confusion, the positioning hole used for the bonding layer is called a guide hole, and the positioning hole used in a process after hot pressing is called a reference hole. As described above, in the pattern formed on the inner layer board, in addition to the patterns 6 1 a, ..., 6 1 a of the single wiring board, a plurality of marks 66, 66 for preparing the reference holes are prepared. '6 6a etc. and the mark is also etched in the etching process. The coordinates of these marks are related to the pattern of the single wiring board 6 1 a, ......... 6 1 a. They are positioned and maintained in a certain positional relationship. Therefore, if the positions of these marks are determined, Identify the coordinates of the patterns that make up the circuit. In order to open new reference holes corresponding to the marks 66 and 66 formed on the inner layer of the multilayer substrate 60, an X-ray reference hole puncher is usually used. As described above, the outer surfaces of the front and back surfaces of the multi-layered substrate that is pressurized and hot-pressed are covered with a scale-free conductive layer, and it is impossible to clearly see through the marks formed on the inner layer with visible light. Generally, a multi-layered substrate is seen through a weak X-ray, and the method of measuring the position of the mark formed on the inner layer φ plate is measured. Generally, a mark is a conductor layer of any one of a group of inner-layer boards formed at least in the junction layer. In order to specifically express the degree of deformation of the inner layer plate, at least two marks are formed at mutually spaced positions. Recently, in order to capture the deformation of the inner layer plate, there is a tendency to increase the number of marks. As shown in Figure 10, the marks are 6 6 b, ... 6 6 b. Marks are formed on the four corners of a conductor layer, and the degree of deformation can be measured in two directions orthogonal to the plane. (For example, an example of four marks is shown in Fig. 10) -8-(5) (5) 200415976 In the manufacture of a multilayer substrate, the inner layer is inevitably deformed due to pressure and heating during hot pressing. The markers are also different from the coordinates originally set. The distance between the marks is often different from the design. However, the reference mark used in the post-drawing project is inserted into the pin provided on the work template, so the center distance of the reference hole, that is, the interval between the reference hole and the pin of the work template is made equal. More practical. In this way, the method of creating a predetermined reference hole at a center distance from the reference hole and opening the reference holes at intervals is called a screening method. The number of reference 0 holes to be used at the same time may be arbitrarily selected from two or more. In addition, due to the characteristics of the work template used in subsequent projects, the positions and numbers of the marks provided on the inner layer plate and the reference holes that are actually perforated are largely different. In addition, when there are two reference holes, an additional reference hole may be added for the front and back identification. In order to wear and deform the reference hole inserted into the pin of the work template, several sets of reference holes are preliminarily set according to the number of subsequent works. Case 0 The coordinate system used when designing the pattern of the conductor layer of a multilayer printed wiring board is now referred to as a design coordinate system. Coordinates 标记 of the marks formed on the conductor layer are represented by the design coordinate system. Also, a mechanical coordinate system that is fixed to a fixed part such as a housing of a hole punch and that has a coordinate axis parallel to the movement direction of the main component is assumed. Figure 2 (d) shows the relationship between the design coordinate system where the coordinate axes are Vd and Ud, and the origin of the coordinate is 0d, and the mechanical coordinate system (coordinate axes X m, Y m, origin 0 m) set in the punching machine. An example. Here, the (local) coordinate system (X, Y, 0) is set in the field of view of the observation device. -9- (6) (6) 200415976 In Figure 2 (d), the multilayer printed wiring board 60 forming the reference hole is set in a hole punch. A plurality of marks formed on the inner layer board are housed in a mark frame 21 formed in a corner of the wiring board 60. The wiring pattern of the internal conductor layer is irrelevant to the shape of the wiring board 60 ', and in this state, the position of the origin θd of the design coordinate system and the inclination (β) of the coordinate axis are unknown. For example, when an X-ray camera is used to observe the mark through X-ray perspective markers, the position on the hole punch of each mark is used to obtain the coordinate 値 represented by the mechanical coordinate system. Statistically process this coordinate 値 to find the most accurate number 设 of the coordinate origin of the coordinate system where the Φ coordinate system is set. The reference hole coordinates represented by the design coordinate system can also be converted into the mechanical coordinate system. coordinate. The position of the reference hole is displayed by a mechanical coordinate system. The mandrel of the reference hole drill can be moved to open the reference hole. The reference hole drilling machine is based on the measurement of the coordinates of the marked image. Various calculation methods have been proposed for the calculation means of the above-mentioned design coordinate system elements (the origin θd and the inclination Θ of the coordinate axis). φ The nearest multilayer printed wiring board is a way to record the status of each layer. Marks are arranged on all the conductor layers of each inner layer to form a mark group where the marks are grouped in a frame. It is often the case that the information of each layer is fetched. Generally, a total of four or more (at least three) such marker groups are located on the corners of the inner plate. The hole drilling machine is to observe these mark groups, and can determine the coordinates of the inner layer plate (the origin position of the design coordinate system and the inclination of the coordinate axis -10- 200415976 The multilayer printed wiring boards illustrated in Figures 10 and 11 have only about six layers. The number of multilayer printed wiring boards used in reality is increasing, and the number of mainstream layers is also increasing. The number of layers is more than 10. Increasing the number of layers increases the thickness of the multilayer printed wiring board, and the difference in the thickness direction of the marks formed on each layer also increases. The X-rays used to observe the marks are usually from The light source, which is regarded as a point light source, emits and diffuses through the multilayer printed wiring board while radiating while forming the image of the shadow on the fluorescent surface of the X-ray camera. Below the camera, the X-ray is obliquely touching the mark, and the mark The size and position of the image are magnified. The distance between the fluorescent surface and the mark is different from the position in the thickness direction of the inner layer. If the difference between the positions is large, the observed position of the mark The scale error becomes larger. As an example, Fig. 3 (a) schematically shows the relationship between the X-ray generating tube 4a of the X-ray source and the X-ray camera 6 and the multilayer printed wiring board 60; it is formed in X-ray fluorescence The labeled image of the fluorescent film 31 of the doubling tube 30 is taken into the cc D photographing element 35. The image is enlarged to L2 / L1, and the coordinate 値 is also enlarged at the same ratio. The larger the angle α in FIG. 3 (b), the greater the distance in the thickness direction (11 and 12) between the marks (B1 ......... B4) in Table 3 (c). A larger value indicates an increase in error. The present inventor proposes the arrangement of the marks in the mark boxes as shown in FIG. 12 and FIG. 13 in Japanese Patent Application Publication No. 2001-168537. -11-(8) (8) 200415976 Fig. 12 is a perspective view showing the arrangement of the markers in the marker frame and breaking a part of the vicinity of the marker frame to remove the substrate and the substrate material; Fig. 13 is a schematic sectional view showing the vicinity of the marker frame And the top view of the mark. The shape of the mark is as shown in Fig. 1 (c). The hollow mark nE is used to remove the conductor from the center of the square and the ground is left circular. There are two types of conductor solid marks η Μ. Here η is the sequential addition of the conductor layer to which they belong. Φ When designing the pattern of a conductor layer, the solid conductor η Μ and the hollow mark (n +1) The center of gravity of E is the same. In addition, the entity of the hollow marker nE is a hollow circular portion formed by deleting the copper foil forming the conductor layer; the center of gravity of the hollow marker nE is the center of gravity of the hollow circular portion. Function as a mark. Fig. 13 (a) shows the copper foil conductor 62 placed on five double-sided wirings 61-1, 61-2, ... via the substrate material 63 as viewed from the thickness direction. A cross-sectional view of a 12-layer multilayer printed wiring board 60 with a layer formed on the front and back of 61-5; Table φ shows the arrangement of the marks. For example, it is arranged so that the positions of the centers of gravity of the two marks formed by the solid mark 2M in the conductor layer of the second layer and the hollow mark 3E of the conductor layer in the third layer are the same. Thereafter, the positions of the center of gravity of the solid mark 3M formed on the conductor layer of the third layer and the hollow mark 4E of the conductor layer formed on the fourth layer are arranged to be the same. In this way, the solid mark nM and the -12- (9) (9) 200415976 hollow mark (1) E with the same center of gravity are formed on the adjacent junction layers, and are continuously formed until they are formed on the 11th and 11th layers. The solid label 10M and the hollow label iiE. These marks are usually placed in a mark frame 'formed on the corners of a multilayer printed wiring board as an example, and are arranged as shown in Fig. 13 (b). The mark frame is divided into 9 squares inside, and a solid mark n M and a hollow mark (η + 1) E are arranged in the squares. As a practical size, one side F of the marker frame 21 is approximately 10 mm square. 0 A solid mark η M and a hollow mark (η + 1) are formed in each divided square, and all other copper foils are removed. Therefore, when the marker group 2 0 in the marker frame 21 is irradiated with X-rays, in the dark part, the outer diameter d 2 of three rows and three columns and the inner diameter D 1 are arranged in a circle in FIG. 1 (b). The (nine in the picture) ring is observed as the bright part. The outer diameter of the ring corresponds to the hollow mark E, and the inner diameter of the ring corresponds to the solid mark M. The coordinates of the center of gravity of the solid mark ηM and the center of gravity of the spring circle (bright part) of the hollow mark (η + 1) E are obtained. A group of solid and hollow marks arranged at a common center of gravity position are formed on adjacent conductive layers. Therefore, as shown in FIG. 3 (c), the height difference of the marks is the thickness of the absolute substrate of the two-sided wiring board. , Or the thickness of the substrate material, the X-ray irradiation angle [α in FIG. 3 (b)] at this position is also approximately the same. Therefore, the error between the solid mark ηM and the hollow mark (η + 1) E is extremely small. This operation is performed successively on each adjacent layer ', and the coordinate 要求 of each mark formed on the overall conductor layer can be obtained within the accuracy required of -13- (10) (10) 200415976. From the coordinates of the mark, the design coordinate system of the conductor pattern is obtained with excellent accuracy. The inference method for designing a coordinate system by the least inventors method according to the present inventors is described in Japanese Patent Application Laid-Open Nos. 2000-1-1 8 5 8 6. However, 'the size of the fluorescent surface of the X-ray camera is limited in the structure of the above mark, so one set of marks that can be formed in one mark frame is a limit of nine groups on each side of the three-division mark frame, which is difficult. Increase this more. Therefore, as shown in Figure 13 (a), it becomes the inner layer 10 layers, and the number of layers of the multilayer printed wiring board added with the front and back conductor layers is 12 layers, which is the limit. In this way, the comparison is sequentially formed. The method of marking on adjacent layers is to meet the accuracy requirements, but two markers must be provided on each conductor layer. 'Thus increasing the number of layers of the multilayer printed wiring board and increasing the number of marking layers' However, not all marks can be accommodated in one mark frame, and each of the four corners of the multilayer printed wiring board becomes two or more mark frames. On the outer periphery of the wiring pattern of the inner layer board, the name of the inner layer board, various identification numbers, various marks or reference holes are recorded, especially the corners are too dense. There is a problem that it is difficult to obtain space for resetting the marking frame. . Moreover, the operation of forming a large number of marks also has the disadvantage of increasing the number of design work and increasing the cost easily. Also, this method minimizes the error in the thickness direction of the multilayer printed wiring board due to the mark, but it is difficult to affect the measurement of the mark position due to variations in the thickness of the substrate or substrate material constituting the multilayer printed wiring board. The degree of change is handled numerically. There is also a sales problem in which the present method is shown to a user who lacks the persuasive power of -14- (11) (11) 200415976. [Summary of the Invention] The purpose of the present invention is to eliminate the irregular movement of the marker image caused by the change in the distance between the marker and the fluorescent surface or the difference in the flatness arrangement, and the same number of marker frames correspond to more layers. The multilayer printed wiring board can be used to infer the design coordinates of each conductor layer. The present invention is to solve the above-mentioned problems, and provides a reference hole punching machine, which is provided with: a frame fixed to a frame body of the reference hole punching machine; and both sides including constituent elements for forming irradiation on a multilayer printed wiring board An X-ray source that emits the marked X-rays of the conductor layer of the printed wiring board, and an X-ray camera that observes the marked image formed by the transmission of the marked X-rays, and an observation device supported by a stand; printed on multiple layers Opening device for opening a reference hole in a wiring board; Φ transfer device that relatively changes the multilayer printed wiring board with the observation device and the opening device; and inferring the true coordinates of the mark from the observation coordinates of the image of the mark observed by the observation device値 and the design coordinate system of the multilayer printed wiring board, and a control device that controls the transfer device; the control device is characterized in that the control device is an image having a first mark from the coordinate system fixed to the observation device; And the second observation of the marked image after moving relative to the multilayer printed wiring board. Zhi predetermined amount, and moves the multilayer printed wiring board, inferred labeled -15- (12) (12) 200 415 976 true coordinates of the marker coordinate Zhi Zhi estimating function. Furthermore, the mark coordinate 値 inference function of the reference hole punching machine of the present invention is to set the X coordinate of the observation coordinate 値 of the first marked image represented by the coordinate 値 of the coordinate system fixed to the observation device as c; Let the y-coordinate be d 1; Let the X-coordinate of the observation coordinate 値 of the second-labeled image be c 2 and the y-coordinate; Let the quantitative X-axis component of the mobile transfer device be L1 and the γ-axis component When it is L2, it is assumed that the X coordinate φ of the true coordinate 値 of the mark at the first observation is Lx, and the y coordinate is Ly, which is inferred as Lx = L1 xcl / (c2-cl) and Ly = L2 The true coordinates of the mark xdl / (d2-dl) are calculated. In addition, the present invention provides a method for estimating a mark coordinate 値 of a multilayer printed wiring board, which is characterized in that an X-ray source and an X-ray source emitted from an X-ray source of an observation device including an X-ray camera are formed on a multilayer. The conductor layer marking of the printed wiring board constituting the requirements of the printed wiring board, the image of the marking is observed by an X-ray camera, and the coordinate is set as the coordinate of the coordinate system of the observation device to obtain the coordinate of the marked image. ; Relatively perform the second project determined by the movement of the multilayer printed wiring board mounted on the transfer device; Observe the coordinates of the second labeled image by the observation device after the movement of the second project The third project of ；; and from the observation coordinates 値 of the first marked image which is fixed by the coordinate system fixed to the observation device, and the multilayer printed wiring board is moved relatively -16- (13) 200415976 after the quantitative The second observation of the observed mark image is based on the fourth process of estimating the first measurement of the coordinate 记 of the multilayer printed wiring board. In the fourth process of the marker coordinate method of the multilayer printed wiring board of the present invention, the observation coordinate of the first mark image represented by the coordinates fixed to the observation device is set to white / c 1, and the y coordinate is set to d 1; the X coordinate of the second labeled image is c 2 and the y coordinate is d 2; and: the quantitative X-axis component of the relative movement of the plate is L 1 as L 2; the first The X of the labeled true coordinate 値 at the time of the observations and the y coordinate as Ly are inferred as Lx = Ll X and Ly = L2 xdl / (d2-dl). [Embodiment] An embodiment of the present invention will be described using the following items 1. The configuration of a reference hole punching machine. 2. Features of an observation device mounted on a hole punch. 3. Coordinate 値 of the mark according to the embodiment of the present invention; 1 · Observation of the structure of the reference hole punching machine The coordinate frame 基准 of the reference hole is formed by arranging the mark group with a multi-layered printed wiring board such as a square corner and the like. Coordinates of the inferred system when the mark is shifted, X-coordinates as observation coordinates, multi-layer printed wiring, and L-axis component coordinates as Lx cl / (c2-c1). The so-called multi-point screening • 17- (14) (14) 200415976 type reference hole punching machine will be described with reference to FIGS. 6 to 8. FIG. 6 is a perspective view showing the external appearance of the above-mentioned hole punching machine 1 through the frame body 2. FIG. Fig. 7 (a) is a front view showing the punching machine; Fig. 7 (b) is a side view showing the same. Tables 8 (a) and (b) are plan views showing the positions of the movable table 12 of the hole puncher 1 are changed; both Fig. 7 and Fig. 8 are perspective views of the frame 2 and show the inside. Also, the mechanical coordinate system (origin 0 m, coordinate axes X m, Y m, Z m) recorded in each figure is the coordinate fixed to the fixed part of the punching machine 1 (for example, ^ frame 1 or stand 3) System, and the moving direction of the various mechanical parts of the transfer device is parallel to the coordinate axis. Coordinates obtained by observing the marks of a multilayer substrate with an X-ray camera or the opening coordinates of a reference hole are basically calculated using this coordinate system. The blank arrow 17 in FIG. 6 is the positioning amount of the worker. The worker is standing in the direction of the arrow (the positive direction of the Y m axis), and inputs a marking observation to open a multilayer printed wiring board (not shown in the figure) ), The final project is taken out from the punching machine 1. φ In the following description, the multilayer printed wiring board as a workpiece is shown as the second group (d), as the mark group 2 1 ......... 2 1 in the observation box, and A person who opens a reference hole from a predetermined position determined by observations. A stand 3 is fixed inside the housing 2 of the hole punch 1. A pair of left and right X moving stages 10 and 10 are formed approximately in a channel shape, and are formed in a mirror image relationship on the left and right sides. The X-moving gantry 10, 10 is supported by linear guides 10a, 10a arranged on the upper end of the gantry 3. The ball screw 1 〇b and the ball nut (not shown) mounted on the lower part of the X-moving stage 1 〇 engaged with it -18- (15) (15) 200415976 'according to the wiring board with the reference hole The size is moved in parallel on the Xm axis in advance so that the mark stands by at an observable position. In addition, in order to individually drive the X moving stages 10 and 10, the ball screws 10b are arranged at each X moving stage 10. X-ray generating devices 4 and 4 are fixed to the upper part of the X moving stand 10 and 10, and a linear guide is installed at the lower part. a. Also, γ moves the stage;! J, 1 1 is supported by the linear guide 1 1 a. With the ball screw 1 i b and a ball nut (not shown) mounted below the engaged Y moving stage 1 丨, the Y moving stages 11 and 11 can move in parallel on the Y m axis. The γ moving stages 11 and 11 are formed in a channel shape. An X-ray protective tube 5 'is arranged on the upper part, and as shown in Fig. 7, a chuck 9 and an air cylinder 9a for moving the chuck 9 are provided side by side. A mandrel 7 and an X-ray camera 6 are fixed to the lower portion. A linear guide 12a and a ball screw 12b, which are arranged in parallel to the Ym axis and fixed to the center of the frame, are supported and driven to move the movable stage 12 on which the multilayer printed wiring board is mounted. . The movable table 12 is a multilayer printed wiring board on which a workpiece having a reference hole is mounted at a position of 12A, and is moved along the Y-axis to reach a mark measurement, and a reference hole position is opened. The control devices that drive the ball screws 10a, 1b, and 1b and control the movement of the X-moving stage 10, 10 and the Y-moving stage U, and the movable stage 12 are not shown. Here 'as the main constituents of the hole-opening machine, the observation device with X-ray generator 9 and X-ray protective tube 5 and X-ray camera 6 mark; (16) (16) 200415976 spindle 7 and chuck 9 Form a hole-opening device; X moving gantry 10 and γ moving gantry 11 and movable pedestal 12 and linear guides that support and drive these are 〇a, 1! A, 1 2 a, ball screws 1 0 b, 1 1 b, 1 2 b, etc. form a driving device. In addition, a control device (not shown) is generally composed of a CPU, a memory device, a sequencer, and the like, and controls the above-mentioned various devices in accordance with a series of operation procedures. In addition, the coordinate 値 is calculated from the X-ray image of the marker observed by the observation device, and the position of the reference hole is also calculated from the coordinate 値 and the design coordinates of the reference hole input in advance. The calculation of the coordinate and inference expression of the marker according to the embodiment of the present invention described below is also performed in the control device. A method of observing the multilayer printed wiring board 60 shown in Fig. 2 (d) by forming four marker frames 2 1 ......... 2 1 at four corners will be described. First of all, the dimensions of the wiring board to be opened and the (design) coordinates of the marker frame 2 1 ......... 2 1 determine the direction along which the X-moving stage 1 0, 1 0

For the position of the Xm axis, the X-moving gantry 10, 10 is moved there in advance and is waiting there. The movable table 12 is at a position 12 A (of FIG. 6), and the worker places the multilayer printed wiring board 60 at a predetermined position on the movable table 12. The wiring board 60 is temporarily fixed to the movable table 12. The movable table 12 is a position where the two left and right marker frames 21, 21 in the front move to a position below the X-ray generating tube 4a which is built in the X-ray camera 4. As shown below, the marker frames 2 1 ......... 21 are seen through the X-rays and observed with the X-ray cameras 6, 6 to measure the marks formed by the conductor layers nM, HE, etc. in the frame. The coordinates of the image (on the fluorescent surface of the X-ray camera). Coordinate 値 -20- (17) (17) 200415976 is a memory device stored in a control device (not shown). The rear marker frame 2 1 ......... 2 1 reaches the distance below the X-ray generating tube 4 a ′ and moves the movable stage 12 only in the direction of Y m. After that, X-rays are irradiated, and the marker frames 2 1 and 21 are observed with the X-ray cameras 6 and 6. The labels of each conductor layer and the coordinates of the image of nE are stored. Then, in the control device, the arrangement of the design coordinate system is calculated from the coordinates of the marked images in the four sets of marker frames 2 1 ......... 21, and the coordinates of the reference hole formed thereby are calculated. The movable table 12 moves in the direction of Y m to reach the position of the reference hole, so that the mandrels 7 and 7 move to the coordinates of the reference hole, and the reference hole is opened. The reference holes are not shown. The movable table is moved to the input position 1 2 A, and the worker takes out the perforated wiring board 60 to complete the reference hole processing process. With reference to Fig. 9, the operation of the equipment mounted on the X and γ moving gantry during the above processing will be described.

Fig. 9 (a) is a front view showing the X-moving gantry 10 and Y-moving gantry 11 on the left when viewed from the position of the operator; Fig. 9 (b) is a plan view showing the top half of the X-moving gantry 10, showing γ Move the top of the gantry 11. Fig. 9 (c) (d) shows the X-moving stage 10 viewed from the positive direction of the Xm axis, and Fig. 9 (c) schematically shows the observation time of the punctuation point according to the X-ray camera 6. '9 (d ) Is a diagram schematically showing the opening of the mandrel 7. The observations of the marker boxes 2 1 ...... 21 are performed at the X-ray observation positions shown in Fig. 9 (c). The X-ray protective tube 5 and the X-ray camera 6 come directly under the X-ray generating tube 4a. -21-(18) (18) 200415976 The X-ray generator is activated by a command from a control device (not shown). The X-ray emitted from the X-ray generator tube 4a is the hole 5a through the center of the X-ray protective tube. Inside (not shown), a marker frame on the inner layer of the wiring board 60 placed on the movable table 12 is seen through without drawing and captured by the X-ray camera 6 as an image. The image is sent to the control device. The computer calculates the coordinates of each marked image and memorizes them. After applying the coordinates of the marker to the estimation formula, move the marker frame relative to the xy direction for a certain amount, and then observe the same marker frame. The coordinates 値 of the mark φ itself can be estimated from the coordinates 値 of the marked image before and after the movement. The configuration of the design coordinate system is inferred from the marked coordinates 値 (as the mechanical coordinates 値) to determine the coordinates of the reference hole to be opened. The reference hole is opened at a drill 7b at the front end of the mandrel. At the time of opening, the movable stage 1 2 is moved according to the calculated coordinates of the reference hole. When the X-moving stage 10 moves to the Xm-axis coordinate of the reference hole, and the Y-moving stage 11 moves to the Ym-axis coordinate of the reference hole. Fine adjustment. The Y moving stage 11 is often set to operate with the center of the X-ray camera 6 as the reference φ. In fact, as shown in FIG. 9 (c), the Y-axis moving stage 11 is a multi-movement X only. The distance S between the center of the line camera 6 and the center of the mandrel 7. The mandrel 7 is a high-speed motor using an air turbine or a high-frequency motor as a rotation source, and a reference hole is opened in the wiring board through a chuck 7 a mounted on the rotating shaft, and a drill 7b made of hard alloy is usually installed. Although not shown in the figure, the cutting bit 7b is fed by moving the cylinder or servomotor of the spindle 7 up and down. The chuck 9 disposed directly above the mandrel 7 is an actuator -22- (19) (19) 200415976 mounted on the cylinder 9, and if it is lowered, it pushes the wiring board 60 placed on the movable table 12 and The wiring board 60 is prevented from moving during the opening. The above is an observation mark group, and a mechanical sequence of a hole-opening machine for opening reference holes according to the observation results. Hereinafter, the method of calculating the position of the conductive layer on the inner layer of the multilayer printed wiring board 60 will be described based on the observation results of the marker group. In the case of designing the conductor pattern of the inner conductor layer of the multilayer printed wiring board 60, a design coordinate system having orthogonal U d and V d common to all the inner conductor layers as the coordinate axis has been set. When the hole punch is put into use, it is decided that, for example, the Ud axis is approximately parallel to the xm axis of the mechanical coordinate system, and the Vd axis is also approximately parallel to the Ym axis. In addition, the mark which is a constituent element of the four-point mark group is displayed at a predetermined mark position simultaneously with the conductor pattern. Usually, one mark is arranged for each conductor layer in one mark group. If the marker frame is at the corners of the wiring board, four markers are formed on a conductor layer. From the two observations of the four labeled images, the coordinates represented by the four labeled mechanical coordinate system can be calculated. Also, the shape of the labeled group is as shown in Figure 5 (b). From the measurement of the four marks formed at the four corners of a conductor layer, it is inferred that the design coordinate system of Ud'Vd is located there, and it is regarded as the configuration of the conductor layer. That is, the coordinate 値 which represents the origin of the design coordinate system by a mechanical coordinate system, and the tilt of the Vd axis with respect to the Xm axis can be obtained. Statistically, there are various methods to calculate the correctness from the measurement, but it is common to use the point of observation (the solid mark 2 2) as the unit particle to find its center of gravity. The center of gravity is regarded as immovable and is marked by design. The coordinate 値 and the coordinate 値 of the mark determined by -23- (20) (20) 200415976, and the method of obtaining the tilt of the X m axis with the sum of the squares of the distances as the minimum U d axis. A specific example of the calculation sequence is explained by the same applicant in Japanese Patent Application Laid-Open Nos. 2 0 1-1 8 5 8 6 and the like, and is therefore omitted. From (at least three) marks formed on a specific conductor layer, the configuration of the design coordinate system (the origin position and the tilt of the coordinate axis) of that layer can be calculated. In addition, by using the full marks formed on all the conductor layers, it is also possible to obtain a design coordinate system uniform as a whole. It is usually a design coordinate system that infers the average of the latter as a whole to determine the coordinates of the reference hole. The difference between the arrangement of the design coordinate system of the specific layer and the average overall design coordinate system is the data of the inter-layer deviation called the specific inner layer. The number of deviations between the layers of each conductor layer is stored in the memory of the hole puncher ', and can be provided to the customer as required. In addition, quality management for the manufacturer is also useful information. The opening of the reference hole after hot pressing is a necessary process for subsequent processes such as pattern etching of surface conductor layers, openings such as through holes, and cutting out the shape of a single wiring; The interlayer deviation of the inner conductor layer can be measured without increasing the processing time. The above is explained as the reference hole punching machine, but the hole punching machine only removes the hole punching function 'becomes a measuring device for observing marks and memorizing data. The large-capacity billion-meter device is a measuring device characterized by high-speed measurement. It is also an independent product field. However, measuring methods such as X-ray cameras are almost the same as the hole-cutting machine. The description of the hole-cutting machine also includes Functional description of the measuring device-24- (21) (21) 200415976 2 · Features of the observation device mounted on the hole punch (X-ray source and X-ray camera) The observation device of the hole punch is usually viewed with X-rays Mark and observe the image as the coordinates of the mark. The X-ray generating tube and the X-ray camera of the main components of the observation device will be described with reference to Fig. 3. Figure 3 (a) is a schematic diagram showing a χ-ray camera; Figure 3 (b) is a schematic diagram showing the position of a mark and the shape of the output image of the X-ray camera; Figure 3 (c) is a table φ A schematic diagram showing the change in the position of an image according to the thickness of the subject. Usually, an X-ray fluorescent multiplier tube 30 is provided in the X-ray camera 6 as its image receiving section. As shown in FIG. 3 (a), the X-ray fluorescent doubler tube 30 is an input target composed of a fluorescent film 31 and a photoelectric surface 32, and the convergent electrode s, the anode A, and the fluorescent film are output. 3 3 etc. The X-ray emitted from the X-ray generating tube 4a is an inner conductor layer formed through the mark 66 of the multilayer printed wiring board 60 of the subject, etc., and enters the fluorescent surface of the fluorescent film 31, and occurs. The fluorescent film 3 is converted into an optical image 36. The photo 'photoelectrons are released from the photoelectric surface 3 2 arranged in close contact with the inner surface of the fluorescent film 3]. The output beam is multiplied by increasing the acceleration voltage and the like, and an image is connected to the output fluorescent film 33. This image is taken into a charge-bonding element via the optical lens system 34 (

Charge CD Device 35). In Fig. 3 (a), li is the distance from the X-ray source to the multilayer printed wiring board 60. L2 is the distance from the X-ray source to the fluorescent surface of the fluorescent film 31 of the X-ray doubling tube. Unlike visible light, x-rays cannot use optical lenses, because the image 36 of the fluorescent surface of the gastric fluorescent film 31 is photographed as a line formed in a multi-layer printing. -25- (22) (22) 200415976 line The shadow of the board is approximately similar in shape, and its size is enlarged to [(L2) / (L1)] in proportion to the distance from the light source. Recently, since the sensitivity of the CCD imaging element 35 is increased, the CCD imaging element 35 is placed close to the rear of the egg light fe 31, and the image of the fluorescent surface of the fluorescent film 3] is directly taken into the CCD imaging element, and An X-ray camera in which the doubling tube 30 is omitted is also used, but the above relationship is the same. The relationship between the position of the image on the fluorescent surface and the shape of the subject and the image will be described with reference to FIG. 3 (b). For the mark B 1 with a graphic center of gravity in the center of the field of view of the camera, the image Z 1 formed directly by the X-rays emitted by the X-ray generating tube is similar to the original mark B 1, and its center of gravity (graphic center) is also It is located in the center of the field of view at the same position as the original mark B 1. At this time, regardless of l 1 and L2, there is no change in the position of the center of gravity. The image Z2 of the marker B2 incident on the X-ray at an angle of α is changed in size due to the proportional expression of the foregoing term. With a slight change in the angle α, the shape of the marker B 2 and the image Z2 are strictly not similar. The outline shape is circular, so the image Z2 becomes ellipse. However, the center of the circle is projected on the center of the ellipse, and the position of the center of gravity is on the line of the angle α. When the center of gravity of the marker is not the center of the field of view, the position of the center of gravity is also used to position the line on the angle α, and it can be corrected by a simple ratio calculation. In this way, if L 1 in the above-mentioned proportional expression is constant, the influence of distortion of the image due to the X-ray incident angle α can be avoided. In addition, the fluorescent film of the X-ray fluorescent doubler tube 30 may also have a spherical surface, and it is not allowed to be added, but the increase component of the error is very small. As shown in Figure 3 (c), if there are markings on the front and back of the multi-layer printing assembly (23) (23) 200415976 of the line board 60, the distance between the marks (thickness of the wiring board) 11. t2 makes the position different. Actually, the marks B1 and B2 on the back of the table are arranged concentrically. When the X-ray has an incident angle α, the images Z1 and Z2 do not become concentric. If the thickness 11 is small, it means that the amount of inaccuracy Q 1 is small in the upper half, and if the thickness 12 is large, it means that the amount of inaccuracy Q 2 is extremely large in the lower half. If it is enlarged, if two marks Overlapping, as two marks cannot be recognized, and cannot be inferred. As an example, the mark placed on the corner of the figure 5 (b) is that the L1 phase difference is about 0.5mm (thickness t2 is 0.5mm). 'The inaccurate amount Q2 is about 0.01mm, which is close to the use limit. . 3. Marked coordinate and estimation method A description of a labeled coordinate and estimation method according to an embodiment of the present invention will be described. This coordinate 値 estimation method is applicable to the reference hole puncher described above, and the observation device of the hole puncher is to use the aforementioned X-ray source and X-ray camera. Φ The method of estimating the coordinates of this mark is to estimate the coordinates of the mark from the observation results of the previous and second marks. After observing the first mark image, the relative movement of the multi-layer printed wiring board is performed. Observation of the second labeled image. From the first and second observation results and the predetermined amount of movement of the multilayer printed wiring board, the true coordinates 値 of the mark can be completely inferred mathematically. A description will be given of an inferred expression of the true coordinate 値 of the marker according to the aspect of the present invention with reference to FIG. 1. Fig. 1 (a) is a schematic perspective view showing the observation device of a hole punching machine-27- (24) (24) 200415976; it shows the movement of the mark by the relative movement of the multilayer printed wiring board and the movement with the movement The relationship of the displacement of the mark image on the fluorescent surface. An XY coordinate system of an observation device with an orthogonal coordinate axis placed on the fluorescent film film is set with an approximate center of the fluorescent surface of the fluorescent film of the X-ray camera of the opening observation device as the coordinate origin 0. The X-ray source A is fixed at a point directly above the coordinate origin 0 (on the Z axis). Observe the mark M of the conductor layer formed on the inner layer of the multilayer printed wiring board 60 mounted on a movable table (not shown) and fixed. The mark M is a specific one within the mark frame of the multilayer printed wiring board 60. The multilayer printed wiring board mounting surface of the movable stage is made parallel to the xy plane, and the movable stage is moved in parallel to the xy plane. Therefore, the mark M formed on the fixed multilayer printed wiring board 60 placed on the movable table is moved in a plane parallel to the X y plane. Let p be the intersection point of the plane parallel to the X y plane with the mark M and the straight line (consistent with the Z axis) indicated by the one-point chain line connecting a · 〇; p; let the distance of A φ • P be a; The distance of 0 is b. Here, the distance between the X-ray source A and the coordinate origin 0 on the fluorescent surface of the X-ray camera is fixed at a + b. Let the position of the first observation mark be M; and the position of the second observation after the movable platform moves in the X, y direction for a certain amount as M2. The mark can be reached from M to M2 by any path, but here as the path of M, M1, M2, from M to M1 is a distance that moves L 1 parallel to the x axis; and from M1 to M2 is parallel to The y-axis moves by a distance of L2. -28- (25) (25) 200415976 As the marker moves, the image on the fluorescent surface moves to Z, Z 1, Z2. As described above, the X-ray is straight, so A · M · Z, A · Ml · Z1, A · M2 · Z2 are on a straight line, respectively. Figure 1 (b) shows A · M · Z, A · Ml · for the xy plane

Projections of Zl, A · M2 · Z2; Figure 1 (c) is a projection showing a baseline XX that is parallel to the X axis and located on the xy plane and is projected onto a projection plane [B] that is parallel to the xz plane; 1 (d) is a projection φ diagram including a baseline YY parallel to the y-axis and located on the xy plane and projected to a projection plane [C] parallel to the yz-plane. In addition, the arrangement of the first (b), (c), and (d) diagrams is represented by the first angle method. Here, as the projection method, a so-called front view method is used. The front view method uses a projection line orthogonal to the projection surface as its feature. For example, a light plane parallel to the y-axis is used on the projection plane [B] which is parallel to the xz plane, and a light beam parallel to the x-axis is used on the projection plane [c] which is parallel to the yz plane. φ Now, move the point with coordinates (X, y, z) parallel to the X axis to the coordinates (Z1, y, z), and project to a projection plane [8] parallel to the χζ plane, with coordinates (\, The point 2) moves to the coordinates (乂 1, 2). The amount of movement is a real size which becomes (χΐ-χ). In addition, when a point having coordinates (X, y, Z) is moved to the coordinates (X, yl, Z), the projection on the projection plane [B] is a point where both become the points of the coordinates (X, Z). The coordinates have not changed and the amount of movement is zero. The X-position -29- (26) (26) 200415976 of the image Z and the y-coordinate d 1 can be obtained by the first observation on the fluorescent surface labeled M. After that, only the measured amount of L1 is moved parallel to the x-axis, and parallel to}, the measured amount of L2 is moved only parallel to the axis to move the movable table to move the marked bit g. Female mouth As mentioned above, it is shown that the moving path from M to M 2 is to move to M1, and then M1 is reached, and then M1 is moved to L2 and M2. This relationship has the same meaning as the X component of the vector Z2 is L1 and the y component is L2. The second observation after the movement can obtain the X coordinate c2 and the y coordinate d2 of the image Z2 on the fluorescent surface of the marker M2. The triangle A · P · M on the projection plane [B] is similar to the triangle A · Ο · Z. The following formula is established by the ratio of the corresponding side lengths a: (a + b) '. a / (a + b) = (Ρ · Μ) / (0 · Z) = L χ / c 1 Similarly, the triangle A · M · M 2 is similar to the triangle A · Z · Z 2 and the corresponding side length The ratio is still a: (a + b). The following formula is established. a / (a + b) = (Μ · M2) / (Z · Z2) = Ll / (c2-cl) Thus, Lx / cl = Ll / (c2-cl) in which both a and b are deleted can be obtained. Therefore, Lx ^ Llxcl / (c2-cl) can be obtained. Similarly, as shown in Fig. 1 (d), since the line passing through A · 0 is parallel to the projection plane [C], the projection plane [C] is also AP = a and P0 = b. Therefore, the triangle A · P · M on the projection plane [C] is similar to the triangle A · 〇 · Z and the ratio of the sides is a: (a + b), and the following formula a / (a + b) = (P · Μ) / (〇 · Z) = Ly / d 1 The same relationship exists between triangle A · M · M2 and triangle A · Z · Z2 '(27) (27) 200415976 the following formula a / (a + b) = ( M · M2) / (Z · Z2) = L2 / (d2-dl) to obtain Ly = L2xdl / (d2-dl), that is, by marking the first image of Z on the fluorescent surface of M Second observation: X coordinate C 1, y coordinate d 1 and moving amount L 1, L 2 ′ of the multilayer printed wiring board, and second observation of image Z on the fluorescent film labeled M 値 X coordinate e 2 ′ y coordinate d2, the true coordinates 値 Lx, Ly φ of the marker M at the first observation are obtained by the following formula.

Lx = L1 xc 1 / (c2-c 1), Ly = L2xd 1 / (d2-d 1) The formula for inferring the true coordinates of the above-mentioned mark 値 Lx, Ly is called the marked coordinate 値 inferred formula, and is loaded in Coordinate calculation method for the control device of the punching machine. The above formula is a measurement method that implies that the distance a to the X-ray source of the mark and the distance b to the fluorescent surface are not increased, and the number of layers of the multilayer printed wiring board is increased. The thickness deviation in the thickness direction becomes larger, and the influencers can be excluded theoretically. The xy coordinate system used in the above description is a coordinate system fixed to an X-ray camera, and is generally an image in the field of view of a camera of about 10 mm square. The coordinate system set in the reference hole punching machine will be described with reference to FIG. 2. Fig. 2 (a) is an explanatory diagram showing the coordinate system of the reference hole punching machine as viewed from above. As described above, in the fixed part of the mechanical stand or frame that is not moved to the ground of the reference hole puncher, set the coordinate origin to 0m, -31-(28) (28) 200415976 and set the coordinate axis as Xm, Ym mechanical coordinate system. The mark image is observed with the (local) coordinate system of the coordinate axes x and y at the origin 0 of the X-ray camera set at the observation device. That is, the coordinates 値 c 1, d1, c2, and d2 of the marked image are the coordinates 値 read out at the local coordinates. The X axis of the local coordinate axis is set to be parallel to the Xm axis, and the y axis is set to be parallel to the Ym axis. It is known that the coordinate 既 of the local coordinate origin 0 is the coordinate of the mechanical coordinate system. In this way, the coordinates of the points represented by the local coordinate system can be simply converted into the coordinates of the mechanical coordinate system. For example, to compare the group of marks formed on the four corners of the multilayer printed wiring board, the coordinate system of the mark is converted into a mechanical coordinate system. The movements Tx and Ty of the movable table are also set to be parallel to the coordinate axis of the mechanical coordinate system. When the observation device is not moved, the origin 0 of the local coordinates is not moved. As shown in Fig. 1 (a), in this state, if the table on which the multilayer printed wiring board is placed is moved parallel to X m and Y m, a predetermined amount of the movable mark can be moved. The description of the above formula is that the table on which the multilayer printed wiring board is placed is parallel to the X m and Y m axes of the mechanical coordinate system and moves T and T in the X and Y directions. The X-ray source and the X-ray camera are for The fixed mechanical coordinate system will be explained. At this time, the table moves incrementally parallel to the Xm and Ym axes of the mechanical coordinate system, and the mark M is moved to M1 and M2. The mark of the moving direction of the table is positive when the coordinate of the mark observed by the local coordinate system increases. That is, the positive and negative directions of the moving direction of the table are consistent with the positive and negative of the mechanical base -32- (29) (29) 200415976 standard system. As mentioned above, the conventional punching machine is for the convenience of mechanical structure. The movable stage on which the multilayer printed wiring board is placed moves only in one direction, and an observation device is moved at a right angle to the direction to move and move the coordinate of the mark The construction.

In this way, even if a device other than the movable table is moved, the X-ray camera as the observation device recognizes the movement of the marker, and thus moves the other device relative to the movable table to move the marker. I Also, since it is easy to perform calculations during coordinate transformation, the coordinate axes of each coordinate system are usually set in parallel, but basically, the coordinate axis or direction of movement is arbitrary. For example, if the movable stage on which the multilayer printed wiring board is placed is arbitrarily moved without determining the direction, the coordinate system set in the X-ray camera shows that the movement amount in the X-axis direction and the y-axis direction is sufficient. As shown in Fig. 2 (b), the illustrated reference hole opening machine is a table (multilayer printed wiring board) moving in the Ym axis direction of the mechanical coordinate system, and when viewed in the mechanical coordinate system, the mark M is followed by Ty of the table moves to M2, but does not move in the Xm direction. In the Xm direction, an overall observation device including an X-ray source and an X-ray camera is used to move the mechanical stage and change the position of the multilayer printed wiring board. At this time, because the overall observation device moves, the local coordinate system fixed to the observation device also moves in the direction of the Xm axis of the mechanical coordinate system. Because the observation device itself moves, the projection on the projection plane [B] is as shown in Fig. 2 (c), the position of M (M 1) does not change, the X-ray source A moves to A 1, and the camera The center 〇 moves to 〇 1 and the local coordinates are -33- (30) (30) 200415976. The position of the X-ray source is changed, so the marked image projection is shifted by z2. In Fig. 2 (C), the triangle α · P · M and the triangle A · 0 · Z are similar and the corresponding side length ratio is a: (a + b). Similarly, the triangle A1 · P1 · M and the triangle a · 〇1 · Z2 is similar and the corresponding side length ratio is a: (a + b). Thus, a / (a + b) = (ρ · M) / (0 · Z) = Lx / cl, and · a / (a + b) = (Pi · M2) / (01- Z2) = (Ll + Lx) / c2, and Lx / cl = (Ll + Lx) / c2 is obtained. Sorting this formula, we get Lx = Llx c 1 / (c 2-c 1). Comparing this expression with Lx = Llxcl / (c2-cl) when the observation device is not moved, the shape is exactly the same. From the original assumption, Lx, cl, and c2 are all positive, and in order to establish this formula, the movement amount L 1 of the observation device must also be a positive number. That is, if the observation device moves to the negative direction of the Xm axis of the mechanical coordinate system and is defined as adopting φ positive 値, then in any state of Fig. 2 (a), (b), Lx = Ll xcl / (c2-cl). Since the x-axis of the local coordinate system moves in the direction of extension, the image on the projection plane [C] does not change. Therefore, Ly = L2 xdl / (d2-dl) is when the table moves in two directions, or when the table moves in the direction of Ym, and the observation device moves in the direction orthogonal to each other in the Xm direction. Any situation does not change, but the same can be used. formula. In addition, along the coordinate axis opposite to the above example, the observation device moves in the direction of Y m -34- (31) (31) 200415976 and the table moves in the direction of X m. It will also be defined by the positive and negative directions of the direction when the local coordinate system moves. Same as the above example, the coordinates of the mark 标记 inference can still be used. In this way, either one or both of the mobile table or the observation device 'uses a coordinate of the mark 値 inference formula for moving the image of the mark relative to the local coordinate system set on the observation device (in the x-axis and y-axis directions). The marked true coordinate 値 can be calculated as the coordinate 値 of the local coordinate system. The above-indicated coordinate 标记 inference formula has the subtraction terms of (c 2-C 1) and (d2-dl) in the denominator, and according to the number cl of cl, c2, dl, and d2, there is a subtraction in the calculation of the CPU. The so-called bit difference may increase the number of errors to the same degree and increase the error of the residual error. By analogy with the number of digits used for calculation, the meaningful way of the numbers (c2-cl) and (d2-dl) must determine the lower limit of each number, and it is also effective to appropriately change the operation form such as the deformation of the formula. In this way, the coordinates of all the markers in the marker frame at several places are obtained with excellent accuracy. As shown in Figure 2 (d), considering the coordinates of all the markers, the coordinates of the markers on the movable table of the punching machine are determined. The position on the punch of the design coordinate system (origin 0 d, coordinates U d, V d) of the multilayer printed wiring board, that is, the position determined by the origin of the mechanical coordinate system (Om, Xm, Ym). , The tilt of the coordinate axis U d (0). The position of the reference hole formed by the hole puncher is determined by this, but the calculation method and the like are not the purpose of the present invention and are omitted. An example of the form of a mark when the coordinate 値 inference formula of the mark according to the embodiment of the present invention is used will be described with reference to Figs. 4 and 5. -35- (32) (32) 200415976 Fig. 4 is a perspective view showing the arrangement of the markers in the marker frame. ′ In order to observe only the markers, a cross-sectional view of the substrate and other substrates is prepared to remove the peripheral substrate. Fig. 5 (a) is a schematic cross-sectional view showing the vicinity of the marker frame as viewed from the thickness direction of the multilayer printed wiring board; Fig. 5 (b) is an example of the arrangement of the markers in the marker frame; Fig. 5 (c) is the marker Monolithic shape. Figures 4 and 5 correspond to Figures 1, 2, and 13 of the conventional example. As shown in Fig. 5 (c), the shape of the mark is of two types: a hollow mark nE in which a conductor is circularly removed from the center of a square and a solid mark nM in which a conductor is circularly left. Here, η is a number indicating the number of the conductor layer. When designing a pattern, the arbitrary solid mark M and the hollow mark E are arranged so that their centers of gravity coincide. In the figure, the labels of the conductor layers arranged adjacent to each other are grouped, but the labels of the conductor layers arranged adjacent to each other are not necessarily grouped. The hollow mark E is a hollow circular portion formed by removing the copper foil forming the conductor layer, and the center of gravity of the hollow mark E is the center of gravity of the hollow circular portion. The peripheral square has no function as a mark. Fig. 5 (a) is a cross-sectional view showing a multilayer printed wiring board 60 which is laminated on the front and back surfaces of nine two wiring boards 61 through a substrate material-carrying conductor (copper foil) when viewed in the thickness direction; In the figure, the middle solid mark M is formed in the conductor layer on the upper side of the double-sided wiring board 61 constituting the multilayer printed wiring board 60 so that the position of the center of gravity of the hollow mark ε coincides with the lower conductor layer. It is not necessary to sequentially compare the marks of adjacent conductor layers, and therefore it is sufficient to form one mark on each conductor layer. -36- (33) (33) 200415976 These marks are usually formed on the four corner corners of a multilayer printed wiring board, and are arranged as shown in Fig. 5 (b) as an example. The inside of the marker frame 21 is divided into nine squares', and each of the solid markers M and the hollow markers E, each of which has the same center of gravity, is formed to form a marker group 20. As an example of the practical size, referring to the mark in Figure 13 (b), one side F of the marker frame 21 is approximately 10 mm square; the interval a between the marks is approximately 3 mm; the outer diameter D of the solid mark 1 is 1.4 mm, and the diameter D 2 of the hollow mark 23 is approximately 2.4 mm. The size F of the marker frame 21 is set to be slightly smaller than the effective field of view of the X-ray camera. The multilayer printed wiring board that ends the hot pressing process is slightly deformed. Even if the position of each mark is changed, it is fully stored in the field of view of the X-ray camera. 0 Mark The frame is set in the same position on all inner layers. As described above, each of the solid mark M and the hollow mark E is formed in each divided square, and no other conductive layer exists in the square. Therefore, when the marker group 20 in the marker frame 21 is irradiated with X-rays, in the dark part, the outer diameter D2 and the inner diameter D1 arranged in three rows and three columns are observed in FIG. 13 (b). Bright round parts. The outer diameter of the ring is equivalent to the circumferential portion of the hollow mark E, and the inside of the ring is equivalent to the circumferential portion of the solid mark M. Take the dichotomized portrait with an appropriate threshold, and find the coordinates of the center of gravity of the solid mark M and the center of gravity of the circle (light portion) of the hollow mark E. _ _ (34) (34) 200415976 The center of gravity is calculated by counting only the dark points in the bright part of the ring; the center of gravity of the hollow mark E is, for example, after replacing all the dark parts of the solid mark M with the bright part, and counting only the bright points. Observation of markers using marker coordinates 値 inferred is performed in the following @ _ order. First, the observed multilayer printed wiring board is placed on the movable table, and the mark is placed in the field of view of the observation device. Based on the first observation of the first project, the coordinates 値 (equivalent to c 1 and d 1) of the center of gravity of 18 marks arranged in a mark frame are obtained. As a second process, the multilayer printed wiring board is relatively moved to move the X and y components of LI and L2 in a predetermined amount. Based on the second observation of the third project, the coordinates 値 (equivalent to c2 and d2) of the center of gravity of 18 marks arranged in a mark frame are obtained. In the above, a second observation is used, and the coordinates of the previous mark are applied to each of the marks. The estimation formula Lx = L1 xcl / (c 2-c 1), and Ly = L2xdl / (d2-dl) are performed. The estimated coordinates of the position where the first measurement of each mark was performed are calculated. Observation of the marked frame at the last part above. The calculation of the coordinates of the mark 値 inference formula is a calculation method of the coordinates 在 in the control device of the punching machine, and the results are also stored in the storage device in the control device. The above is the sequence of marking observation on the hole punch. Comparing Fig. 5 (a) and Fig. 13 (a), it is known that 18 marks in a mark frame correspond to a multilayer printed wiring board with 12 conductor layers, but the coordinates of the mark are used. In the inferred formula, it is possible to correspond to a multilayer printed wiring board having 20 conductor layers by the same tag group. When designing the wiring pattern of the conductor layer, the placement of the wiring pattern such as a mark on the outer part of -38- (35) (35) 200415976 can still correspond to the increase in the number of layers of the conductor layer, so there is no need to change the standard drawing. Helps save effort in design. In the present invention, the difference in distance between the conductive layer forming the mark and the fluorescent surface of the X-ray camera is essentially eliminated, so that the difference in accuracy between the outer periphery of the field of view of the X-ray camera and the vicinity of the center can be avoided. That is, there is no influence of α in FIG. 3 (b). In addition, if Z3 and Z4 shown in Fig. 3 (c) are enlarged, if the two marks do not overlap, the respective coordinates of the center of gravity can be measured. If there is a normal substrate φ or the thickness of the substrate material and the size of the exemplified mark, a combination of marks of any layer may be used. [Effects of the Invention] As described above, the coordinate 値 inference formula of the mark of the present invention offsets the position in the thickness direction of the inner layer plate during observation, and can infer the mark position of the true mark. In principle, even if there is a mark on any layer of the multilayer printed wiring board, it is expected to improve the measurement accuracy of the mark, and it can be used as an X-ray camera with a wider field of view than the conventional φ. By introducing the coordinate inference formula of the marker of the present invention, nine sets (18) of markers controlled in the field of view of the camera of a conventional punching machine can correspond to a multilayer printed wiring board up to 20 layers, and can correspond to For most multilayer printed wiring boards that are usually manufactured. The wiring pattern of the conductor layer changes the internal circuit part according to its condition, but the name, batch mark, and other peripheral parts of the marker frame are mostly designed as standard designs. Therefore, the periphery of the wiring pattern of the multilayer printed wiring board -39- (36) (36) 200415976 is still the current standard design and does not need to be changed, which has the advantage of not increasing the number of wiring pattern design labors for the user. It is not necessary to change the hardware surface of the reference hole punching machine in order to load the coordinate 値 inference formula of the mark of the present invention. Only the order of adding the marker measurement process can be supported by software that implements the marker coordinate estimation method. The conventional machine can also be made into a punching machine with the function of the present invention by changing or re-changing the software. New functions can be installed without significantly increasing the original cost of production, and there is no need for a large price φ for improving the functions and services of already sold products, and the effect of serviceability is also large. [Brief description of the drawings] The first (a) and (b) are three-dimensional views showing the image of the mark and the image of its fluorescent surface, which illustrate the calculation method of the true coordinates of the mark according to the embodiment of the present invention, and an orthographic projection according to the angle method Illustration. Figures 2 (a) to 2 (d) show the relationship between various coordinate systems, such as the mechanical coordinate system of the reference hole punching machine set in the embodiment of the present invention, φ and the design coordinate system of the multilayer printed wiring board. Illustration. Figs. 3 (a) to 3 (c) are schematic diagrams showing a marker observation method according to X-rays, and a schematic diagram illustrating distortion of a marker image. Fig. 4 is a perspective view showing an example of the arrangement of markers formed in a marker frame. 5 (a) to 5 (c) are schematic diagrams showing the shape of a mark formed in a mark frame within the mark frame. Fig. 6 is a perspective -40- (37) (37) 200415976 showing a reference hole punching machine for opening a reference hole. Figures 7 (a) and 7 (b) are front and side views showing the reference hole punching machine. Figures 8 (a) and 8 (b) are plan views showing the movable table of the reference hole punching machine. Figures 9 (a) and 9 (d) are projection views showing the X-movement stage of the reference hole punching machine in each direction. Figures 10 (a) to 10 (c) are a perspective view and a plan view showing the structure of a multilayer printed wiring board, and schematic diagrams of a work template used in a hot pressing process. Figures 11 (a) and 11 (b) are cross-sectional views showing the structure of a multilayer printed wiring board. Fig. 12 is a perspective view showing an example of a conventional arrangement of a marker group that reduces errors due to the height of the marker. 13 (a) to 13 (c) are schematic diagrams showing the shape of the mark shown in Fig. 12. [Symbol description] 1 Opening machine 2 Frame 3 Stand 4 X-ray generating device 4a X-ray generating tube 5 X-ray protective tube -41-(38) 200415976 5 a 孑 L 6 X-ray camera 7 Mandrel 7a Chuck 7b Drill bit 7c, 9a Cylinder 8 Mandrel stand 9 Fixture 10 X mobile stand 11 Y mobile stand 12 Movable stand 10a, 1 1 a, 1 2 a Linear guide (10b, 1 1 b, 1 2 b Ball screw 16 hole position (1, 2 holes) 16a Opening position (3, 4 holes) 17 Operator position (blank arrow 20 Mark group 2 1 Mark frame nM Solid mark nE Hollow mark 30 X-ray fluorescent doubler 3 1 Fluorescence Film 32 Photoelectric surface 33 Output fluorescent film

LM guide) -42- (39) (39) 200415976 34 Optical lens system 35 CCD photographic element (charge combining element) 36 Image A Anode S Converging electrode 5 0 Mechanical coordinate system (X m, Y m, Z m, mechanical Origin 0 m) 5 1 Design coordinate system (Ud, Vd, origin Od) 60 Multilayer printed wiring board 6 1 Double-sided wiring board 6 1 a Single wiring board pattern 62 Conductor 63 (insulation) substrate 6 4 Substrate material 64a Substrate Material (with guide holes) 65 guide holes

66, 66a, 66b, P mark 6 7, 孑 Reference 孑 L 6 8 Laminating die 6 8 a Locating pin 69 Maximum wiring board shape 69a Minimum wiring board shape 70 Scope of influence

Ha Case Identification Mark -43

Claims (1)

(1) (1) 200415976 Patent application scope 1 · A reference hole punching machine, which is provided with: a frame fixed to the frame of the reference hole punching machine: having the constituent elements for forming irradiation on a multilayer printed wiring board An X-ray source that emits the marked X-rays of the conductor layer of the double-sided printed wiring board, and an X-ray camera that observes the image of the marked that is formed by the transmission of the marked X-rays, and is supported by the stand An opening device that opens a reference hole in the multilayer printed wiring board; a transfer device that relatively converts the multilayer printed wiring board with the observation device and the hole opening device; and the marking device observed by the observation device The observation coordinates of the image 値 infer the true coordinates of the mark, and the configuration of the design coordinate system of the multilayer printed wiring board, and a control device that controls the transfer device. The control device is characterized in that the control device is Observation coordinate 値 of the first marked image indicated by the coordinate system of the observation device, and the relative movement Observation coordinate image of the second of the marker after a predetermined amount of the multilayer printed wiring board observed Zhi, and moves the multilayer printed wiring board of the above quantitative estimation of the mark of the true coordinates Zhi the marker coordinate Zhi estimating function. 2. The reference hole drilling machine according to item 1 of the scope of patent application, wherein the marker coordinate 値 inference function is the first marking indicated by the coordinates 値 of a coordinate system fixed to the observation device. The X coordinate of the observation coordinate 値 of the image is c 1 and the y coordinate is d 1; the x coordinate of the observation coordinate 値 of the second-44- (2) (2) 200415976 labeled image is c 2, and y The coordinate is d2, and the above-mentioned quantitative X-axis component moving the transfer device is L1 and the Y-axis component is L2, and the X-coordinate of the true coordinate 标记 marked at the first observation is Lx, If the y-coordinate is used as Ly, the calculation method is calculated as the true coordinates of the markers that are Lx = Ll X cl / (c2-cl) and Ly = L2 xd 1 / (d 2 · d 1). 3. A method for estimating the marking coordinates 多层 of a multilayer printed wiring board, which is characterized in that an X-ray source and an X-ray emitted from the X-ray source of an observation device including an X-ray camera are formed on the multilayer printed wiring The marking of the conductor layer of the printed wiring board, which constitutes the requirements of the board, is to observe the image of the mark with an X-ray camera as the first step of obtaining the coordinates of the mark image by setting the coordinates of the coordinate system of the observation device; Relatively perform the second process quantitatively determined by the movement of the multilayer printed wiring board placed on the transfer device; observe the image of the mark after the second process is moved by the observation device, and obtain the second mark The third process of the coordinate 値 of the image; and the observation coordinate 値 of the image of the above-mentioned mark for the first time indicated by the coordinate system fixed to the observation device, and the relative movement of the multilayer printed wiring board Observe the observation coordinates 値 of the marked image for the second time, and move the multilayer printed wiring board as described above to estimate the view. The fourth process of the above-mentioned marked coordinate 値 at the time of the first marking -45- (3) (3) 200415976 4. The method for estimating the marked coordinate 値 of the multilayer printed wiring board as described in the third item of the scope of patent application Where the fourth project is to set the X coordinate of the observation coordinate 値 of the first labeled image indicated by the coordinate 値 of the coordinate system fixed to the observation device as c 1 and the y coordinate as d 1; The X-coordinate of the observation coordinate 値 of the second-labeled image is C2, and the y-coordinate is d2; and the quantitative X-axis component of the relative movement of the multilayer printed wiring board is L1 and the Y-axis component is At L2; Let the x-coordinate of the above-mentioned true coordinate 値 of the above-mentioned mark at the first observation be Lx, and the y-coordinate be Ly, then inferred as Lx = l1 χ cl / (c2_cl) and Ly = L2 xdl / ( d2-dl). -46-