TWI230571B - Reference hole boring machine, and method for estimating guide mark coordinates for multilayer printed circuit board - Google Patents

Abstract

The objective of the present invention is to estimate true coordinates for a guide mark, with the effect of altitude removed out of a guide mark X-ray image formed on a multilayer printed circuit board conductor layer. To solve the problem, a guide mark M formed in a conductor layer in a multilayer printed circuit board 60 is irradiated with X-rays emitted radially and linearly from an X-ray source A which is virtually a point. An image Z is formed on a fluorescent plane of an X-ray camera positioned directly under the guide mark M, and an x-coordinate c1 and a y-coordinate d1 are determined for the image Z. Relative to the X-ray camera, the wiring board is moved by L1 in the x-direction and by L2 in the y-direction for the guide mark M to move to the position M2. Then an x-coordinate c2 and a y-coordinate d2 are determined for the image Z2 of the guide mark M2. The coordinates (Lx, Ly) estimated for the guide mark M, which are calculated by using the guide mark coordinates estimation formulas [Lx=L1xc1/(c2-c1), Ly=L2xd1/(d2-d1)] in reference to (c), (d), are not affected by the distance between the guide mark M and the X-ray camera fluorescent plane.

Description

1230571 (1) Description of the invention [Technical field to which the invention belongs] The present invention relates to an estimation of an image formed by irradiating a mark formed on each conductor layer constituting an inner layer of a multilayer printed wiring board by X-ray irradiation. The layout of the wiring pattern of the multilayer printed wiring board is a reference hole punching machine that forms a reference hole. [Prior art] Φ Recently, with the miniaturization of 1C chips, resistors, capacitors, and other surface-mounted electronic components, higher density has been required to install these printed wiring boards, and many have been multilayered. Multi-layer printed wiring boards with up to four or six layers of conductors are also used in people's livelihoods, while high-layer printed wiring boards with more layers are used in industrial applications. The multilayer printed wiring board is composed of an outer conductor layer exposed on two front and back layers, and several inner conductor layers that are not exposed. An insulating substrate is interposed between the conductor layers. It becomes a 0 structure where a conductor layer is adhered. As a conductor layer of a multilayer printed wiring board, for example, a copper foil having a thickness of about J 8 μm is used. As the substrate material, thermosetting glass and epoxy resin have become the mainstream, and heat-resistant resins such as glass, polyimide resin, and glass BT resin have also been used in local multilayer wiring boards. The multilayer printed wiring board has six or more layers and has only a large number of conductors. Therefore, as a method for manufacturing a multilayer printed wiring board, reference is made to i 〇 »5- (2) 1230571 and Figure 11 below. The manufacturing method of a six-layer multilayer printed wiring board will be briefly explained. FIG. 10 (a) is a perspective view schematically showing the structure of the six-layer wiring board. FIG. 10 (b) is a diagram showing the formation of the inner layer. A plan view of a printed pattern of the conductor portion of the double-sided wiring board. Fig. 10 (C) is a side view showing a formwork used in the following layer formation. FIG. 11 shows (a) the cross-section of the six-layer wiring board before the hot pressing process, and (b) shows that it becomes a multi-layer wiring board by hot pressing and thermosetting and thermosetting bonding. status. As shown in FIG. 10 (a), the six-layer multilayer wiring board 60 is a conductor layer 6 2, 6 2 exposed on the double layer, and two double-sided printed wiring boards 6 1 and 6 1 which become the inner layer. The substrate materials 6 4, 6 4 a, and 6 4 are interposed therebetween. The printed wiring boards 6 1 and 61 on both sides constituting the inner layer are usually formed by etching with a single wiring board pattern 61 a, which is a final product (six in the figure), ... 6 la And so on on the front and back copper foil surfaces. At least two guide holes 6 5 and 6 5 for positioning are opened in the above-mentioned two-sided wiring boards 6 1 and 6 1 in advance, and the front and back patterns 6 1 a are formed on the basis of the guide holes 6 5 and 6 5. ......... 6 1 a etc., so the patterns on the front and back of the printed wiring boards 6 1 and 6 1 on both sides keep their positions on the plane. In this way, patterns 61a, ..., 61a, etc. are formed in the two double-sided wiring boards 6 1, 6 1 using the guide holes 6 5, 65 having the same coordinate position. A pattern of printed wiring board 6 1 is printed on both sides of the inner layer board. In addition to the patterns of single wiring board 6 1 a, ......... 6 1 a, a plurality of patterns are prepared for use in subsequent processes. 66, 66 (two parts of the central part-6- (3) 1230571) or 66b (... four parts at each corner) for the reference hole, and the front and back identification The reference mark 66a of the position of the reference hole is engraved with uranium to make these marks. A plurality of etched inner layers are printed on both sides of the printed wiring board, and the positions of the patterns formed on the conductor portions of the wiring boards are aligned to form a layer (Layup). Prepare a work template 6 8 with two pins 6 8 a and 6 8 a. The center distance of the pins 6 8 a is equal to the center of the guide holes 6 5, 6 5 used when the patterns 6 1 a, ..., 6 1 a, etc. are formed on the printed wiring board 6 1. distance. The pins 68a and 68a of the work 68 are inserted into the guide holes 65 and 65 of one of the etched two-sided substrates 61 and placed on the work template 68. A substrate material 6 4 a before heating, in which the via holes 6 5 and 65 are heated, is placed thereon. Further, pins 6 8 a and 6 8 a of the die plate 6 8 are inserted into the guide holes 6 5 and 6 5 of the other surface substrate 6 1 and the die plate 6 8. At this stage, the outer periphery of the two double-sided substrates 6} and the intermediate substrate material 6 4 a is temporarily fixed to complete the lamination. As shown in the cross-sectional view of FIG. 1 1 (a), the printed wiring boards 6 1 and 6 1 on both sides of the junction layer are sandwiched by the substrate materials 6 4 and 6 4 and the copper foils 62 and 62 of the lead. The substrate material 64, 64a, 64 inserted between the foil 62 or the two-sided substrate 61 is heated to change the (insulating) substrate 6 3 by hot pressing and pressure heating, and the bonding between the conductors is also completed as One multilayer printed wiring board 60 shown in Fig. 11 (b). After that, "the hole corresponding to the inner layer pattern of the multilayer printed wiring board 60 is opened", and the new reference hole is used as a reference to perform the opening processing of the etched through hole of the outermost conductor wiring. In addition, the plating process is applied, and the rust prevention treatment is also shaped and is called, 6 8 a. The two overlaps 61 and 2 bodies opened by the two-sided template are hardened in copper to form a new base pattern project (4)! 23〇571, etc. , Multi-layer printed wiring board is completed by cutting into a single wiring board by machining and cutting into a desired external shape. In order to avoid confusion, the positioning hole used for the bonding layer is called a guide hole, and the positioning hole used in a process after hot pressing is called a reference hole. As described above, in the pattern formed on the inner layer board, in addition to the patterns 6 1 a, ..., 6 1 a of the single wiring board, a plurality of marks 66, 66 for preparing the reference holes are prepared. , 6 6a, etc. and the mark is also etched in the etching process. The coordinates of these marks are related to the pattern of the single wiring board 6 1 a, ......... 6 1 a, and the positioning is maintained in a certain positional relationship. Therefore, if the positions of these marks are measured, it can be determined The coordinates of the pattern that makes up the circuit. In order to open new reference holes corresponding to the marks 66 and 66 formed on the inner layer of the multilayer substrate 60, an X-ray reference hole puncher is usually used. As described above, the outer surfaces of the front and back surfaces of the multi-layered substrate that is pressurized and hot-pressed are covered with a scale-free conductive layer, and it is impossible to see through the marks formed on the inner layer with visible light using the naked eye. Generally, a multi-layer substrate is seen through a weak X-ray, and the method of measuring the position of the mark formed on the inner layer is generally measured. Generally, a mark is a conductor layer of any one of a group of inner-layer boards formed at least in the junction layer. In order to specifically express the degree of deformation of the inner layer plate, at least two marks are formed at mutually spaced positions. Recently, in order to capture the deformation of the inner layer board, there is a tendency to increase the number of marks. As shown in Figure 10, the marks are 66b, ... 66b, The four corners form a mark, and the degree of deformation can be measured in two directions orthogonal to the plane. (For example, an example of four marks is shown in Figure 10.) -8- 1230571 In the manufacture of multilayer substrates, pressure is applied to heat press, and it is impossible to avoid the deformation of the inner layer board. The set coordinates are different. The distance between the marks is also different from the design: In many cases, however, the reference hole used in subsequent works is inserted through the pin provided on the work template. Therefore, the center distance of the reference hole is also That is, it is convenient in practice to make the interval between the reference holes equal to the interval between the pins of the working plate. In this way, the method of creating a predetermined reference hole at a center distance from the reference hole and opening the reference holes at intervals is called a screening method. The number of reference holes to be used simultaneously may be arbitrarily selected from two or more. In addition, due to the characteristics of the work template used in subsequent projects, the positions and numbers of the marks provided on the inner layer plate and the reference holes that are actually perforated are largely different. In addition, when there are two reference holes, an additional reference hole may be added for the front and back identification. In order to wear and deform the reference hole inserted into the pin of the work template, several sets of reference holes are preliminarily set according to the number of subsequent works. Case 0 The coordinate system used when designing the pattern of the conductor layer of a multilayer printed wiring board is now referred to as a design coordinate system. Coordinates 标记 of the marks formed on the conductor layer are represented by the design coordinate system. Also, a mechanical coordinate system that is fixed to a fixed part such as a housing of a hole punch and that has a coordinate axis parallel to the movement direction of the main component is assumed. Figure 2 (d) shows an example of the relationship between a design coordinate system with coordinate axes Vd and Ud and a coordinate origin of 0d, and a mechanical coordinate system (coordinate axes Xm, Ym, origin Om) set in a hole punching machine. . Here, the (local) coordinate system (X, Y, 0) is set in the field of view of the observation device. -9- (6) 1230571 In Figure 2 (d), the multilayer printed wiring board 60 for forming the reference hole is set in a hole punch. A plurality of marks formed on the inner layer board are housed in a mark frame 21 formed in a corner of the wiring board 60. The wiring pattern of the inner conductor layer has nothing to do with the shape of the wiring board 60, and in this state, the position of the origin d of the design coordinate system and the inclination (0) of the coordinate axis are unknown. For example, when an X-ray camera is used to observe the mark through X-ray perspective markers, the position on the hole punch of each mark is used to obtain the coordinate 値 represented by the mechanical coordinate system. The coordinate 値 is processed statistically, and the most accurate number 的 of the coordinate origin of the coordinate system of the design coordinate system and the direction of the coordinate axis is obtained. The reference hole coordinate indicated by the design coordinate system can also be converted into the coordinate of the mechanical coordinate system. The position of the reference hole is displayed by a mechanical coordinate system. The mandrel of the reference hole drill can be moved to open the reference hole. The reference hole drilling machine is based on the measurement of the coordinates of the marked image. Various calculation methods have been proposed for the calculation means of the above-mentioned design coordinate system elements (the origin θd and the inclination Θ of the coordinate axis). The most recent multilayer printed wiring board is a way to record the status of each layer. Marks are arranged on all the conductor layers of each inner layer, and a mark group is formed in which the marks are collected in a frame. There are many cases of information entering each layer. Generally, a total of four or more (at least three) such marker groups are located on the corners of the inner plate. The hole drilling machine is to observe these mark groups, and can determine the coordinates of the inner layer plate (the origin position of the design coordinate system and the inclination of the coordinate axis -10- 7 1230571 The multilayer printed wiring boards illustrated in Figures 10 and 11 have only about six layers. The number of layers of multilayer printed wiring boards used in reality is increasing, and the number of mainstream layers It also has a condition of more than 10 layers. Increasing the number of layers increases the thickness of the multilayer printed wiring board, and the difference in the thickness direction of the marks formed on each layer also becomes larger. The X-rays used to observe the marks are usually Emitted from a light source that is considered as a point light source, it diffuses radially while transmitting through a multilayer printed wiring board to form the image of the shadow on the fluorescent surface of the X-ray camera. Below the camera, the X-ray is obliquely touching the mark, and The size and position of the mark are enlarged. The distance between the fluorescent surface and the mark is different at the position in the thickness direction of the inner layer. If the difference between the positions is large, the observed mark ’s The scale error becomes larger. As an example, Fig. 3 (a) schematically shows the relationship between the X-ray generating tube 4a of the X-ray source, the X-ray camera 6 and the multilayer printed wiring board 60; The labeled image of the fluorescent film 31 of the tube 30 is taken into the CCD imaging element 35. The image is enlarged to L2 / L1, and the coordinate 値 is also enlarged at the same ratio. This trend is not shown in section 3 (b) The larger the angle α in the figure, the larger the distance (tl and 12) in the thickness direction between the marks (B1 ......... B4) shown in Figure 3 (c) indicates that the error will increase. The inventor proposes the arrangement of the marks in the mark boxes as shown in FIG. 12 and FIG. 13 Japanese Patent Laid-Open No. 2 0 0 1-1 6 8 5 3 7 (8) 1230571 No. 12 It is a perspective view showing the arrangement of the marks in the mark frame, and a part of the vicinity of the mark frame is broken, and the substrate and the substrate material are removed; FIG. 13 is a schematic sectional view showing the vicinity of the mark frame, and a plan view of the mark. As shown in Fig. 13 (C), the hollow mark nE, which removes the conductor from the center of the square, is used to leave the conductor circularly. There are two types of solid mark nM. Here n is the sequential addition of the conductor layer to which it belongs. When designing the pattern of the conductor layer, the solid mark nM and the hollow mark (η + 1) Ε are arranged on adjacent conductor layers. The center of gravity of the hollow marker nE is a hollow circular portion formed by removing the copper foil forming the conductor layer; the center of gravity of the hollow marker nE is the center of gravity of the hollow circular portion. The square on the outer periphery has no function as a marker. Figure 1 3 (a) shows the copper foil conductor 62 placed on five two-sided wirings 61-1, 61-2, .........- 5 is a cross-sectional view of a 12-layer multilayer printed wiring board 60 with a layer formed on the front and back of 5; the arrangement of marks is shown. For example, it is arranged so that the positions of the centers of gravity of the two marks formed by the solid mark 2M in the conductor layer of the second layer and the hollow mark 3E of the conductor layer in the third layer are the same. Thereafter, the positions of the center of gravity of the solid mark 3M formed on the conductor layer of the third layer and the hollow mark 4E of the conductor layer formed on the fourth layer are arranged to be the same. In this way, the solid mark nM and (9) 1230571 hollow mark (η + 1) E with the same center of gravity are formed on the adjacent junction layers, and the solid mark is continuously formed until the solid mark is formed on the 10th and 11th layers. Marker 1 0 M and hollow marker 1 1 E. These marks are usually placed in a mark frame 'formed on the corners of a multilayer printed wiring board as an example, and are arranged as shown in Fig. 13 (b). The marker frame is divided into 9 squares, and the solid center η M and the hollow marker (n + 1) E are arranged in the squares. As a practical size, one side F of the marker frame 21 is approximately 10 mm square. A solid mark η M and a hollow mark (η + 1) E are formed in each divided square, and all other copper foils are removed. Therefore, when the marker group 20 inside the marker frame 21 is irradiated with X-rays, in the dark part, the outer diameter d 2 and the inner diameter D 1 of the three rows and three columns are arranged in a circle in FIG. 13 (b). The ring (nine in the picture) is observed as the bright part. The outer diameter of the ring corresponds to the hollow mark E, and the inner diameter of the ring corresponds to the solid mark M. Find the center of gravity coordinates of the center of gravity η Μ and the circle (bright part) of the hollow marker (^ + 1) Ε. A group of solid and hollow marks arranged at a common center of gravity position are formed on adjacent conductive layers. Therefore, as shown in FIG. 3 (c), the height difference of the marks is the thickness of the absolute substrate of the two-sided wiring board , Or the thickness of the substrate material, the x-ray irradiation angle [α in FIG. 3 (b)] at this position is also approximately the same. Therefore, there are very few false colds between the solid mark ηM and the hollow mark (η + 1) ε. This operation is performed successively on each adjacent layer, and the coordinate 値 of each mark formed on the overall conductor layer can be obtained within the required accuracy of -13- (10) 1230571.

From the coordinates of the mark, the design coordinate system of the conductor pattern is obtained with excellent accuracy. The inference method of designing a coordinate system by the inventor using the least square method is described in Japanese Patent Application Laid-Open No. 2 0 0 1-1 8 5 8 6 3 However, in the structure of the above mark, the fluorescent light of the X-ray camera Because the size of the surface is limited, a set of marks that can be formed in one mark frame is a limit of nine groups on each side of a three-division mark frame, and it is difficult to increase the above. Therefore, as shown in FIG. 13 (a), the number of layers is 10 for the inner layer, and the number of layers of the multilayer printed wiring board with the front and back conductor layers added is 12 and the limit becomes 0. In this way, the comparison is made sequentially The method for marking on adjacent layers can meet the requirements in accuracy, but two markers must be provided for each conductor layer. Therefore, the number of layers of the multilayer printed wiring board is increased to increase the number of layers. However, not all marks can be accommodated in one mark frame, and each of the four corners of the multilayer printed wiring board becomes two or more mark frames. On the outer periphery of the wiring pattern of the inner layer board, the name of the inner layer board, various identification numbers, various marks or reference holes are recorded, especially the corners are too dense. There is a problem that it is difficult to obtain space for resetting the marking frame. . Moreover, the operation of forming a large number of marks also has the disadvantage of increasing the number of design work and increasing the cost easily. Also, this method minimizes the error in the thickness direction of the multilayer printed wiring board due to the mark, but it is difficult to affect the measurement of the mark position due to variations in the thickness of the substrate or substrate material constituting the multilayer printed wiring board. The degree of change is handled numerically. It also creates a sales problem that shows that this method is inadequate for the user -14- (11) 1230571. [Summary of the Invention] The object of the present invention is to eliminate the change in the distance or the plane due to the distance between the mark and the fluorescent surface. The irregular movement of the mark image generated by the difference in the configuration may correspond to a multilayer printed wiring board with a higher number of layers with the same number of mark frames, and the design coordinates of each conductor layer can be inferred. The present invention is to solve the above-mentioned problems, and to provide a reference hole Φ hole punching machine, which is provided with: a frame fixed to the frame body of the reference hole punching machine; An X-ray camera for observing the X-ray source of the conductor layer of the printed wiring board on both sides, and an X-ray camera for observing the image of the mark formed by the transmission of the X-ray of the irradiation mark, and an observation device supported by a stand; Opening device for opening a reference hole on a printed wiring board; φ transfer device for relatively changing the multilayer printed wiring board to the observation device and the opening device; and inferring the trueness of the mark from the observation coordinates of the image of the mark observed by the observation device The arrangement of the coordinate system and the design coordinate system of the multilayer printed wiring board, and a control device that controls the transfer device; It is characterized in that the control device has the first mark indicated by the coordinate system fixed to the observation device Observation coordinates 値 of the image, and observation of the second mark image observed after moving relative to the multilayer printed wiring board Zhi coordinate, and moves the multilayer printed wiring board quantitative, inferred labeled -15- (12) 1230571 true coordinates of the marker coordinate Zhi Zhi estimating function. In addition, the mark coordinate 标记 estimation function of the reference hole punching machine of the present invention is to set the X coordinate of the observation coordinate 値 of the first marked image represented by the coordinate 値 of the coordinate system fixed to the observation device as c 1, Let the y-coordinate be d 1; the X-coordinate of the observation coordinate 値 of the second-labeled image be c 2, and the y-coordinate be d2; and the quantitative X-axis component of the mobile transfer device be L1 and the Y-axis component When it is L2, it is assumed that the X coordinate φ of the true coordinate 値 of the mark at the first observation is Lx, and the y coordinate is Ly, and it is inferred as Lx = Ll X c 1 / (c2-cl) and Ly = L2 X dl / (d2-dl) The true coordinates of the mark. In addition, the present invention provides a method for estimating a mark coordinate 値 of a multilayer printed wiring board, which is characterized in that an X-ray source and an X-ray source emitted from an X-ray source of an observation device including an X-ray camera are formed on a multilayer. The first step of the marking of the conductor layer of the printed wiring board, which is a component of the printed wiring board, is to observe the marked image with an X-ray camera, and set φ to the coordinates of the coordinate system of the observation device. ; Relatively perform the second project determined by the movement of the multilayer printed wiring board mounted on the transfer device; Observe the coordinates of the second labeled image by the observation device after the movement of the second project The third process of ；; and from the observation coordinates 比 of the first marked image which is fixed to the coordinate system of the observation device, and the multilayer printed wiring board is moved relative to -16- (13) 1230571 after quantitative Observed coordinate 値 of the image of the second mark to be observed, and the measured amount of the moving multilayer printed wiring board, to estimate the position of the coordinate 値 of the mark when the first mark was observed. Project posed. The fourth process of the method for estimating the mark coordinate 値 of the multilayer printed wiring board of the present invention is the X coordinate of the observation coordinate 値 of the first mark image represented by the coordinate 値 of the coordinate system fixed to the observation device. Let c be the y coordinate as d 1; the X coordinate of the observation coordinate 値 of the second labeled image be c2 and the y coordinate as d2; and the relative X of the multilayer printed wiring board to move relative to each other. When the axis component is L 1 and the Y axis component is L 2; the X coordinate of the marked true coordinate 标记 at the first observation is Lx 'and the y coordinate is L y, it is inferred as LX = L 1 X c 1 / (c 2-c 1) and Ly = L2 xdl / (d2-dl). [Embodiment] An embodiment of the present invention will be described using the following items. 1. The structure of the reference hole drilling machine. 2. Features of an observation device mounted on a hole punch. 3. Explanation of Coordinates and Inferred Formulas of Marks in the Embodiment of the Present Invention 1. Observation of the structure of the reference hole punching machine The mark frame in which the mark group is arranged and the multilayer printed wiring board such as the corners of the wiring board The so-called multi-point screening -17- (14) 1230571 method of forming a reference hole is described with reference to FIGS. 6 to 8. Fig. 6 is a view showing the appearance of the above-mentioned hole punching machine 1 of the casing 2. Fig. 7 (a) is a front view showing the punching machine 1; Fig. 7 (b) shows a side view. Figures 8 (a) (b) are plan views showing the positions of the stage 12 of the hole punching machine 1 are changed; Figures 7 and 8 both see through the surface of the housing 2. In addition, the mechanical coordinate system (origin 0 m, axis Xm, Ym, Zm) recorded in each figure is a coordinate system fixed to the fixed part (frame 1 or stand 3) of the hole punching machine 1, and the transfer device The movement direction of the various machines is parallel to the coordinate axis. The coordinate 値 or the opening coordinate of the reference hole obtained by observing the marks of the multi-plates on the X-ray camera is basically calculated using this coordinate system. In addition, the blank arrow 17 in FIG. 6 is the positioning amount of the operator. The staff is standing in the direction of the arrow (the positive direction of the Ym axis), and is put into the observation of a multilayer printed wiring board (not shown) with a reference hole. The project is taken out of the punching machine 1. It will be described below that the multilayer printed wiring board as a workpiece is a group within the marker frame 2 1 ......... 2 1 for observing the corners 隅 as shown in FIG. 2 and is determined from the observation 値The reference hole is opened at the predetermined position. A stand 3 is fixed inside the housing 2 of the hole punch 1. The left and right moving platforms 10 and 10 are formed approximately in a channel shape, and are formed in a mirror shape on the left and right. The X-moving gantry 10, 10 is supported by linear guides 10a, 10a arranged at the end of the gantry. The spherical screw 10b is attached to the lower spherical nut of the X-moving gantry 10 which is engaged with it (the unillustrated perspective view is a movable internal coordinate, such as a part of the base, which also causes the end of the operation line mark (d) to mark the X image. ί is shown on 3) • 18- (15) 1230571 'According to the size of the wiring board where the reference hole is opened, move in parallel on the χ m axis in advance so that the mark stands by at an observable position. In addition, in order to individually drive the X moving stages 10 and 10, the ball screws 10b are arranged at each of the X moving stages 10. X-ray generators 4 and 4 'are fixed to the upper portions of the X moving frames 10 and 10, and linear guides 11a and 11a are attached to the lower portions. The γ moving stages 11 and 11 are supported by the linear guide 1 1 a. With the ball screw 1 丨 b and a ball nut (not shown) mounted below the engaged Y moving stand 11, the Y moving stand 1 1 and 1 1 can move in parallel on the Y m axis. The Y moving stages 11 and 11 are formed in a channel shape. An X-ray protective tube 5 is arranged on the upper part. As shown in Fig. 7, a chuck 9 and an air cylinder 9a for moving the chuck 9 are provided side by side. A mandrel 7 and an X-ray camera 6 are fixed to the lower portion. A linear guide 12a and a ball screw 12b, which are arranged in parallel to the Ym axis and fixed to the center of the frame, are supported and driven to move the movable stage 12 on which the multilayer printed wiring board is mounted. . The movable table 12 is a multilayer printed wiring board on which a workpiece having a reference hole is mounted at a position of 12 A, and moves along the Ym axis to reach a mark measurement to open a reference hole position. The control devices for driving the ball screws 丨 〇 b, 丨 I b, and 1 2 b and controlling the movement of the X-moving stage 10, 10, and Y; and the movement of the Π, Η, and the movable stage 12 are not shown. Here, as the main components of the hole-opening machine, an X-ray generating device 9 and an X-ray protective tube 5 and an X-ray camera 6 form an observation device; and -19- (16) 1230571 spindle 7 and chuck 9 Form a hole-opening device; X moving gantry 1 Q and Y moving gantry 11 and movable stage 12 and support these and drive linear guides 10a, 1 la, 1 2 a, ball screws 1 0 b, 1 1 b, 1 2 b and the like form a driving device. In addition, a control device (not shown) is generally composed of a CPU, a memory device, a sequencer, and the like, and performs control of the above-mentioned various devices in accordance with a series of operation sequences. In addition, the coordinate 値 is calculated from the X-ray image of the marker observed by the observation device, and the position of the reference hole is also calculated from the coordinate 値 and the design coordinates of the reference hole input in advance. The calculation of the coordinate and inference expression of the marker according to the embodiment of the present invention described below is also performed in the control device. A method of observing the multilayer printed wiring board 60 shown in Fig. 2 (d) by forming four marker frames 2 1 ......... 2 1 at four corners will be described. First, the dimensions of the wiring board to be opened and the (design) coordinates of the marker frame 2 1 ......... 2 1 determine the X moving platform 1 0, 10 along the

For the position of the Xm axis, the X-moving gantry 10, 10 is moved there in advance and is waiting there. The movable table 12 is at a position of 12 A (of FIG. 6), and the worker places the multilayer printed wiring board 60 at a predetermined position on the movable table 12. The wiring board 60 is temporarily fixed to the movable table 12. The movable table 12 is a position where the two left and right marker frames 21, 21 in the front move to a position below the X-ray generating tube 4a which is built in the X-ray camera 4. As shown below, the marker frames 2 1 ......... 21 are seen through the X-rays and observed with the X-ray cameras 6, 6 to measure the marks formed by the conductor layers nM, nE, etc. in the frame. The coordinates of the image (on the fluorescent surface of the X-ray camera). Coordinate 値 -20- (17) 1230571 is a memory device stored in a control device (not shown). The rear marker frame 2 1 ......... 2 1 reaches the distance below the X-ray generating tube 4 a ′ and moves the movable stage 12 only in the direction of Y m. After that, X-rays are irradiated, and the marker frames 2 1 and 21 are observed with the X-ray cameras 6 and 6. The coordinates 値 of the images of the markers η M and η E of each conductor layer are memorized. After that, in the control device, the arrangement of the design coordinate system is calculated from the coordinates of the marked images in the four sets of marker frames 2 I ...... 21, and the coordinates of the reference hole formed thereby are calculated. The movable table 12 moves in the direction of Y m to reach the position of the reference hole, so that the mandrels 7 and 7 move to the coordinates of the reference hole, and the reference hole is opened. The reference holes are not shown. The movable table moves all the way to the input position 1 2 A, and the operator removes the wiring board 60 which has been perforated, and ends the reference hole processing project. With reference to Fig. 9, the operation of the equipment mounted on the X and γ moving gantry during the above processing will be described. Fig. 9 (a) is a front view showing the X-moving gantry 10 and Y-moving gantry 11 on the left when viewed from the position of the operator; Fig. 9 (b) is a plan view showing the top half of the X-moving gantry 10, Shows the top of the Y moving table. Fig. 9 (C) (d) shows the χ moving stage 10 viewed from the positive direction of the Xm axis, and Fig. 9 (c) shows the observation of the punctuation point according to the X-ray camera 6 schematically. ) Is a diagram schematically showing the opening of the mandrel 7. The observations of the marker boxes 2 1 ...... 21 are performed at the X-ray observation positions shown in Fig. 9 (c). The X-ray protective tube 5 and the X-ray camera 6 come directly below the X-ray generating tube 4a. (18) 1230571 The X-ray generator is activated by an instruction from a control device (not shown). The X-rays emitted from the X-ray generator tube 4a are located in the hole 5a (not shown) through the center of the X-ray protective tube. A marker frame on the inner layer of the wiring board 60 mounted on the movable table 2 is shown in the drawing, and the X-ray camera 6 captures it as an image. The image is sent to a computer in the control device to calculate each marker. Coordinates of the image, and memorize them. After applying the coordinates of the marker to the estimation formula, move the marker frame relative to the xy direction for a certain amount, and then observe the same marker frame. The coordinates 値 of the mark itself can be estimated from the coordinates 値 of the marked image before and after the quantitative movement. The configuration of the design coordinate system is inferred from the marked coordinates 値 (as the mechanical coordinates 値) to determine the coordinates of the reference hole to be opened. The reference hole is opened by a drill 7b at the front end of the mandrel. At the time of opening, the movable stage is made according to the calculated coordinates of the reference hole; [2 moves, when the X moving stage 10 moves to the Xm axis coordinate of the reference hole, and the γ moving stage 1 1 moves to the Ym axis coordinate of the reference hole Fine-tuning. The Y moving stage 11 is often set to operate with the center of the X-ray camera 6 as a reference. Therefore, as shown in FIG. 9 (c), the γ-axis moving stage 11 is a multi-moving X-ray camera only. The distance S between the center of 6 and the center of the mandrel 7. The mandrel 7 is a commercial-speed motor that uses an air turbine or a high-frequency motor as a rotation source, and a reference hole is opened in the wiring board through a chuck 7a mounted on the rotating shaft, and a drill 7b made of cemented carbide is usually installed. Although not shown in the figure, the cutting bit 7b is fed by moving the cylinder or servomotor of the spindle 7 up and down. The chuck 9 disposed directly above the mandrel 7 is an actuator (19) 1230571 mounted on the cylinder 9 'When it is lowered, the wiring board 60 placed on the movable table 12 is pushed to prevent wiring when opening the hole. The movement of the board 60. The above is a mechanical sequence of a hole punching machine for opening a reference hole based on the observation mark group '. The method of calculating the position of the inner conductor layer of the multilayer printed wiring board 60 will be described below based on the observation results of the marker group. In the case of designing the conductor pattern of the inner conductor layer of the multilayer printed wiring board 60, a design coordinate system using orthogonal U d 'V d common to all inner conductor layers as a coordinate axis has been described. When the hole punch is put into use, it is determined that, for example, the U d axis is approximately parallel to the X m axis of the mechanical coordinate system, and the v d axis is also approximately parallel to the Y m axis. In addition, the mark which is a constituent element of the four-point mark group is displayed at a predetermined mark position simultaneously with the conductor pattern. Usually, one mark is arranged for each conductor layer in one mark group. If the marker frame is at the corners of the wiring board, four markers are formed on a conductor layer. From the two observations of the four labeled images, the coordinates represented by the four labeled mechanical coordinate system can be calculated. Also, the shape of the labeled group is as shown in Figure 5 (b). From the measurement of the four marks formed at the four corners of a conductor layer, the design coordinate system of U d and V d is inferred, and it is regarded as the configuration of the conductor layer. That is, the coordinates 表示, which represent the origin of the design coordinate system by a mechanical coordinate system, and the tilt of the Vd axis with respect to the Xm axis can be obtained. Statistically, there are various methods to calculate the correctness from the measurement, but often use the observation point (neutral mark 22) as the unit mass point to find its center of gravity. The center of gravity is regarded as fixed, and the coordinates of the design mark are used.値 and the coordinates of the mark determined by • 23- (20) 1230571, and how to calculate the tilt of the Xm axis with the sum of the square of the distance as the minimum Ud axis. The specific example of the order of g ten counts is explained by the same applicant in Japanese Patent Application Laid-Open Nos. 2 0 1-1 8 5 8 6 and the like, and is therefore omitted. From (at least three) marks formed on a specific conductor layer, the configuration of the design coordinate system (the origin position and the tilt of the coordinate axis) of that layer can be calculated. In addition, by using the full marks formed on all the conductor layers, it is also possible to obtain a configuration of a design coordinate system as a whole. It is usually a design coordinate system that infers the average of the latter as a whole to determine the coordinates of the reference hole. In addition, the difference between the arrangement of the design coordinate system of a specific layer and the average overall design coordinate system is the data of the inter-layer deviation called a specific inner layer. The number of deviations between the layers of each conductor layer is memorized in the memory of the hole puncher, and can be provided to the customer as required. In addition, quality management for the manufacturer is also useful information. The opening of the reference hole after hot pressing is necessary for subsequent processes such as etching of through-holes in the pattern of the surface conductor layer and the cut-out of the shape of a single wiring. In the opening of the reference hole, The interlayer deviation of the inner conductor layer can be measured without increasing the processing time. The above is explained as the reference hole punching machine. However, only the hole punching function is removed by the hole punching machine, and it becomes a measuring device for observing marks and memorizing data. A large-capacity memory device, a measuring device characterized by high-speed measurement, is also an independent product field. However, the measuring methods such as X-ray cameras are almost the same as the hole punching machine. -24- (21) 1230571 2. Features of the observation device (X-ray source and X-ray camera) mounted on the hole drilling machine The observation device of the usual hole drilling machine is marked with X-ray perspective and observed This image is used as the coordinate of the mark. The X-ray generating tube and the X-ray camera of the main components of the observation device will be described with reference to Fig. 3. Figure 3 (a) is a schematic diagram showing the X-ray camera; Figure 3 (b) is a schematic diagram showing the position of the mark and the shape of the output image of the X-ray camera; Figure 3 (c) is Table 0 A schematic diagram showing the change in the position of an image according to the thickness of the subject. The X-ray camera 6 is usually provided with an X-ray fluorescent multiplier tube 30 in its image receiving section. As shown in FIG. 3 (a), the X-ray fluorescent doubler tube 30 is an input target composed of a fluorescent film 31 and a photoelectric surface 32, a convergent electrode S, an anode A, and an output fluorescent film 3 3 Wait. X-rays emitted from the X-ray generating tube 4a are inner conductor layers formed by marking 66 of the multilayer printed wiring board 60 of the subject, etc., and are incident on the fluorescent surface of the fluorescent film 31 to generate fluorescence. The film 31 is converted into an optical image 36. By this light, the photoelectrons are emitted from the photoelectric surface 3 2 arranged in close contact with the inner surface of the fluorescent film 31. The output beam is multiplied by increasing the acceleration voltage and the like, and an image is connected to the output fluorescent film 33. This image is taken into a charge-bonding element via the optical lens system 34 (

Charge Coupled Device) CCD multiviewer 35. In Figure 3 (a), L1 is the distance from the X-ray source to the multilayer printed wiring board 60; L2 is the fluorescent film from the X-ray source to the X-ray multiplier tube 3 1 distance of the fluorescent surface. Unlike visible light, X-rays cannot use optical lenses, so the image 3 of the fluorescent surface of the fluorescent film 3 1 is illuminated as a mark formed on a multilayer printed board. 25- (22) 1230571 Line board The shadows of approximately similar shapes are enlarged to [(L2) / (L1)] in proportion to the distance from the light source. Recently, since the sensitivity of the CCD imaging element 35 has been improved, the CCD imaging element 35 is arranged in close contact with the fluorescent film 31, and the image of the fluorescent surface of the fluorescent film 3] is directly taken into the CCD imaging element, and An X-ray camera in which the doubling tube 30 is omitted is also used, but the above relationship is the same. The relationship between the position of the image on the fluorescent surface and the shape of the subject and the image will be described with reference to FIG. 3 (b). For the mark B 1 with a graphic center of gravity in the center of the field of view of the camera, the image Z 1 formed directly by the X-rays emitted by the X-ray generating tube is similar to the original mark B 1, and its center of gravity (graphic center) is also It is located in the center of the field of view at the same position as the original mark B 1. At this time, regardless of L 1 and L 2, there is no change in the position of the center of gravity. The image Z2 of the marker B2 incident on the X-ray at an angle of α is changed in size due to the proportional expression of the preceding term. With a slight change in the angle α, the shape of the marker B2 and the image Z2 are strictly not similar. For example, the marker B2 If the outline shape is circular, the image Z2 becomes an ellipse. However, the center of the circle is projected on the center of the ellipse, and the position of the center of gravity is on the line of the angle α. When the center of gravity of the marker is not the center of the field of view, the position of the center of gravity is also used to position the line on the angle α, and it can be corrected by a simple ratio calculation. In this way, if L 1 in the above-mentioned proportional expression is constant, the influence of distortion of the image due to the X-ray incident angle α can be avoided. In addition, the fluorescent film of the X-ray fluorescent doubling tube 30 also has a spherical surface, and it may not be allowed to be added, but the increase component of the error is very small. As shown in Fig. 3 (c), if there are markings on the front and back of the multi-layer printed layout of the subject -26- (23) 1230571 wire plate 60, the distance between the marks (thickness of the wiring board) t 1, 12 make the position different. In fact, the marks B 1 and B 2 on the back of the table are arranged concentrically. When the X-ray is pushed to have an incident angle α, the images Z 1 and Z 2 do not become concentric. If the thickness 11 is small, if the surface is not accurate, the amount of Q1 is small. If the thickness t2 is large, if it is large, the amount of Q2 is extremely large in the lower half. If it is enlarged, if two marks Overlapping, as two marks cannot be recognized, and cannot be inferred. As an example, the mark arranged in the corner of the figure 5 (b) is that the difference between L1 is about 0.5mm (thickness t2 is 0.5mm), and the inaccuracy Q2 is about 0.01 mm, which is close to the use limit. . 3. Coordinate Coordinate Estimation Method for Markers A description will be given of a method for coordinating the marker coordinate data as an example of the embodiment of the present invention. This coordinate 値 estimation method is applicable to the reference hole puncher described above, and the observation device of the hole puncher is to use the aforementioned X-ray source and X-ray camera. The method of estimating the coordinates of this mark is to estimate the coordinates of the mark from the observation results of the two previous and next marks. After observing the first mark image, the relative movement of the multilayer printed wiring board is carried out to perform Observation of secondary marker images. From the first and second observation results and the predetermined amount of movement of the multilayer printed wiring board, the true coordinates 値 of the mark can be completely inferred mathematically. A description will be given of an inferred expression of a true coordinate 値 of a mark according to an embodiment of the present invention with reference to FIG. Fig. 1 (a) is a schematic perspective view showing the observation device of a hole punching machine-27- (24) 1230571; showing the status of the marker moving by the relative movement of the multilayer printed wiring board and the fluorescent light accompanying the movement The relationship of the mark image displacement on the surface. An approximate center of the fluorescent surface of the fluorescent film of the X-ray camera of the apertured observation device is used as the origin of the coordinates, and an X y coordinate system of the observation device on which the orthogonal coordinate axis is placed on the fluorescent film is set. The X-ray source A is fixed at a point directly above the coordinate origin 0 (on the Z axis). Observe the mark M formed on the conductor layer of the inner layer of the multi-layer printed circuit board 60 mounted on the movable table (not shown) and fixed. The mark µ is a specific one within the mark frame of the multilayer printed wiring board 60. The multilayer printed wiring board mounting surface of the movable stage is made parallel to the X y plane, and the movable stage is moved in parallel on the xy plane. Therefore, the mark µ formed on the fixed multilayer printed wiring board 60 mounted on the movable table is moved in a plane parallel to the X y plane. Let p be the intersection point of the plane (parallel to the Z axis) indicated by the plane parallel to the xy plane with the mark M and a point chain linking a · 〇; p; let the distance of A φ • P be a; Distance as b. Here, the distance between the X-ray source A and the coordinate origin 0 on the fluorescent surface of the X-ray camera is fixed at a + b. Let the position of the first observation mark be M; and the position of the second observation after the movable platform moves in the x, y direction for a certain amount as M2. The mark can be reached from M to M 2 by an arbitrary path, but here is the path of μ, M 1, and M 2, from M to M 1 is a distance of 1 parallel to the χ axis; and from M1 to M2 is Those who move a distance of L2 parallel to the y-axis. -28- (25) 1230571 As the marker moves, the image on the fluorescent surface moves to Z, Z 1, Z2. As described above, the X line is straight, so A · M · Z, A · Ml · Z1, A · M2 · Z2 are on a straight line, respectively. Figure 1 (b) is a projection diagram showing A · M · Z, A · Ml · Z1, A · M2 · Z2 for the xy plane; Figure 1 (c) is a diagram showing Baseline XX on the y-plane is projected onto the projection plane [B] parallel to the X-z plane; Figure 1 (d) shows the baseline YY that is parallel to the y-axis and is located on the xy-plane is projected on parallel to yz A projection of a plane projection plane [C]. The arrangement of Figs. 1 (b), (c), and (d) is represented by the first angle method. Here, as the projection method, a so-called front view method is used. The front view method uses a projection line orthogonal to the projection surface as its feature. For example, a light plane parallel to the y-axis is used on the projection plane [B] which is parallel to the xz plane, and a light beam parallel to the x-axis is used on the projection plane [c] which is parallel to the yz plane. Now, move the point with coordinates (X, y, z) parallel to the X axis to the coordinates (z 1, y, z), and project to a projection plane [8] parallel to the X z plane, with coordinates (\ , 2) moves to the coordinates (\ 1, 2). The amount of movement is a real size which becomes (xl-X). In addition, when a point having coordinates (X, y, Z) is moved to the coordinates (X, yl, z), the projection on the projection plane [B] is a point where both become the points of the coordinates (X, z). The coordinates have not changed and the amount of movement is zero. By the first observation, the x-coordinate of image 2 on the fluorescent surface labeled M (26) 1230571 coordinate c 1 and y-coordinate d 1 can be obtained. Thereafter, only the measured amount of L 1 is moved parallel to the x-axis, and parallel to}, the measured amount of L 2 is moved only parallel to the x-axis to move the movable table to move the position of the mark. As described above, it is shown that the moving path from M to M 2 is mobile L], and then M1 is reached, and then M1 is moved to L2 and then M2. This relationship has the same meaning as the X component of the vector Z2 is L1 and the y component is L2. The second observation after the movement can obtain the X coordinate c2 and the y coordinate d2 of the image Z2 on the fluorescent surface labeled M 2. The triangle A · P · M on the projection plane [B] is similar to the triangle a · 0 · z. The ratio of the side lengths is a: (a + b), and the following formula is established. a / (a + b) = (ρ · M) / (0 · Z) = Lx / cl Similarly, triangle A · M · M 2 is similar to triangle A · Z · Z 2 and the ratio of corresponding side lengths Still a: (a + b). The following formula is established. a / (a + b) = (Μ · M2) / (Z · Z2) = L 1 / (c2-c 1) Thus, Lx / cl = Ll / (c2-cl ). Therefore, Lx = Llxcl / (c2-cl) is obtained. Similarly, as shown in Fig. 1 (d), since the straight line passing through A · 0 is parallel to the projection plane [C], the projection plane [c] is also AP = a and PO = b. Therefore, the triangle A · P · Μ on the projection plane [C] is similar to the triangle A · Ο • Z and the ratio of the sides is a: (a + b), and the following formula a / (a + b) = (P · Μ) / (〇 · Z) = Ly / dl Triangle A · M · M2 and triangle A · Z · Z2 have the same relationship. (27) 1230571 The following formula a / (a + b) = (Μ · M2) / (Z · Z2) = L2 / (d2-dl)

Ly 2 L2 x d1 / (d 2-d 1), that is, the first observation of the image Z on the fluorescent surface of the mark M, the x-coordinate c 1, y-coordinate d 1 and the multilayer printed wiring board The amount of movement L 1, L 2 ′ and the second observation of the image Z on the fluorescent film labeled M (X coordinate c2, y coordinate d2, the true coordinates of labeled M at the first observation) Lx, Ly stomach It is obtained by the following formula.

Lx = L 1 xc 1 / (c2-c 1), L y = L 2 xd 1 / (d 2-d 1) The inference of the true coordinates of the above-mentioned mark 値 The formula of Lx, Ly is called the mark's coordinates 値 inference Coordinate calculation method for the coordinates of the control device installed in the hole punching machine. The above-mentioned formulas imply that there is no measurement method concerning the distance a to the X-ray source of the mark and the distance b to the fluorescent surface 'increasing the number of layers of the multilayer printed wiring board, even if the marks arranged on each inner layer make The position difference in the thickness direction becomes larger, and the influencers can be excluded theoretically. The xy coordinate system used in the above description is a coordinate system fixed to an X-ray camera, and is usually an image in the field of view of a camera of about 10 square meters. The coordinate system set in the reference hole punching machine will be described with reference to FIG. 2. Fig. 2 (a) is an explanatory diagram showing the coordinate system of the reference hole punching machine as viewed from above. As described above, in the fixed part of the mechanical stand or frame that is not moved on the ground of the reference hole puncher, the coordinate origin is set to 0m, -31-(28) 1230571, and the coordinate axis is set to Xm, Ym's mechanical coordinate system. The mark image is observed with the (local) coordinate system of the origin X of the X-ray camera set at the observation device and the coordinate axes X and y. That is, the coordinates 値 c1, d1, c2, and d2 of the marked image are the coordinates 读 出 read out at the local coordinates. The X axis of the local coordinate axis is set to be parallel to the Xm axis, and the y axis is set to be parallel to the Ym axis. It is known that the coordinate 既 of the local coordinate origin 0 is the coordinate of the mechanical coordinate system. In this way, the coordinates of the points represented by the local coordinate system can be simply converted into the coordinates of the mechanical coordinate system. For example, to compare the group of marks formed on the four corners of the multilayer printed wiring board, the coordinate system of the mark is converted into a mechanical coordinate system. The movements Tx and Ty of the movable table are also set to be parallel to the coordinate axis of the mechanical coordinate system. When the observation device is not moved, the origin 0 of the local coordinates is not moved. As shown in FIG. 1 (a), in this state, if the table on which the multilayer printed wiring board is placed is moved parallel to Xm and Ym, a predetermined amount of the movable mark can be moved. The description of the above formula is that the table on which the multilayer printed wiring board is placed is parallel to the Xm and Ym axes of the mechanical coordinate system to move Ty and Tx in the X and Y directions. Create a fixed one and explain it. At this time, the table moves incrementally parallel to the Xm and Ym axes of the mechanical coordinate system, and the mark M is moved to M1 and M2. The mark of the moving direction of the table is positive when the coordinate of the mark observed by the local coordinate system increases. That is, the positive and negative directions of the moving direction of the table are the same as those of the mechanical base -32- (29) 1230571 standard system. As mentioned above, the conventional punching machine is for the convenience of mechanical structure. The movable stage on which the multilayer printed wiring board is placed moves only in one direction, and an observation device is moved at a right angle to the direction to move and move the coordinate of the mark. The construction. In this way, even if a device other than the movable table is moved, the X-ray camera as the observation device recognizes the movement of the marker, and thus moves the other device relative to the movable table to move the marker. In addition, since the calculation at the time of coordinate conversion is easy, the coordinate axes of each coordinate system are usually set in parallel in a large number, but basically the coordinate axis or the movement direction is arbitrary. For example, if the movable stage on which the multilayer printed wiring board is placed is arbitrarily moved without determining the direction, the coordinate system set in the X-ray camera shows that the movement amount in the X-axis direction and the y-axis direction is sufficient. As shown in Fig. 2 (b), the illustrated reference hole opening machine is a table (multilayer printed wiring board) moving in the Ym axis direction of the mechanical coordinate system, and when viewed in the mechanical coordinate system, the mark M is followed by The movement of Ty on the table moves to M2, and it does not move in the Xm direction. In the Xm direction, an overall observation device including an X-ray source and an X-ray camera is used to move the mechanical stage and change the position of the multilayer printed wiring board. At this time, because the overall observation device moves, the local coordinate system fixed to the observation device also moves in the direction of the Xm axis of the mechanical coordinate system. Because the observation device itself moves, the projection on the projection plane [B] is as shown in Fig. 2 (c), the position of M (M 1) does not change, the X-ray source A moves to A 1, and the camera Center 0 moves to 0, and the local coordinates are -33- (30) 1230571. Measured from 0. There is a change in the position of the X-ray source 'so the marked image projection is moved by Z2. In Fig. 2 (C), the triangle A · P · M is similar to the triangle A · 0 · Z and the corresponding side length ratio is a: (a + b). Similarly, the triangle A 1 · P 1 · M and The triangle A · 0 1 · Z 2 is similar and the corresponding side length ratio is a: (a + b). From this, it becomes a / (a + b) = (Ρ · M) / (0 · Z) = Lx / cl and a / (a + b) = (PI · M2) / (01- Z2) = (Ll + Lx) / c2, and we get L x / c 1 = (L 1 + L x) / c 2. Sort the formula to get L x = L 1 x cl / (c2-cl). Compare this formula with Lx = Ll x cl / (c2-cl) when the observation device is not moving. The shape is exactly the same. The original assumption was that Lx, cl, and c2 were all positive, and in order to establish this formula, the movement amount L 1 of the observation device must also be a positive number. That is, if the observation device is in the negative direction of the Xm axis of the mechanical coordinate system When moving is defined as taking positive unitary, then in any state of Figure 2 (a), (b), it often becomes XL Lx = L 1 xcl / (c2-cl). Also, the x-axis of the local coordinate system is As it moves in its extension direction, the image on the projection plane [C] does not change. Therefore, Ly = L2 xdl / (d2-dl) is When the stage moves in two directions, or when the table moves in the direction of Ym, the observation device moves in the direction orthogonal to each other in the direction of Xm does not change, and the same formula can be used. The coordinate axis, the observation device moves in the direction of Ym -34- (31) 1230571 and the table moves in the direction of X m. The positive and negative definitions of the direction when the local coordinate system is moved are also made the same as the above example, then the marked coordinates 的 inference formula In this way, either or both of the mobile table or the observation device can be used to move the image of the marker relative to (the X-axis and y-axis directions) the local coordinate system set on the observation device, using the marker's Coordinate 値 inference can be used to calculate the true coordinate 标记 of the mark as the coordinate 局部 of the local coordinate system. The above-mentioned inference formula for marked coordinates 値 is a subtraction term with (c2-cl) and (d 2-d 1) in the denominator. According to the numbers of c 1, c 2, d 1, and d 2, in the calculation of the CPU, there may be a so-called difference in the number of bits in which the number of errors of the same degree is subtracted and the residual error becomes large. Decimal digits and so on, (c2- cl), (d2-dl) has an interesting way to determine the lower limit of each number, and it is also effective to change the operation form of the formula appropriately, such as the transformation of the formula. In this way, the Coordinates are obtained with excellent accuracy. As shown in Figure 2 (d), considering the coordinates of all these marks, the design coordinate system of the multilayer printed wiring board placed on the movable table of the punching machine (origin 0d) , Coordinates U d, V d) on the hole-cutting machine, that is, the inclination (0) of the coordinate axis Ud according to the position of the origin θd of the mechanical coordinate system (〇m, Xm, Ym). The position of the reference hole formed by the hole puncher is determined by this, but the calculation method and the like are not the purpose of the present invention and are omitted. An example of the form of a mark when the coordinate 値 inference formula of the mark according to the embodiment of the present invention is used will be described with reference to Figs. 4 and 5. -35- (32) 1230571 Fig. 4 is a perspective view showing the arrangement of the markers in the marker frame. Only the markers are observed, and substrates such as substrates and substrates are removed. Fig. 5 (a) is a schematic cross-sectional view showing the vicinity of the marking frame from the thickness direction of the multilayer printed wiring board; Fig. 5 (b) is an example of the arrangement of the marking marks; and Fig. 5 (c) is the shape of a single mark. Figures 4 and 5 are equivalent to Figures 1, 2, and 3 of the conventional example. As shown in Fig. 5 (c), two types of marks are used: a hollow mark nE in which a conductor is circularly removed from the center and a conductive mark nM is left in a circular shape. Here, η is a number indicating the conductor layer. When designing a pattern, the arbitrary solid mark M and the center of gravity of the middle E are aligned. In the figure, conductors arranged adjacent to each other are described as a group, but it is not necessary to specifically configure adjacent conductors as a group. The hollow mark E is an empty circular portion formed by removing the copper foil forming the conductor layer. The center of gravity of the hollow mark E is a hollow circular portion, and the outer square does not have a function as a mark. Fig. 5 (a) is a cross-sectional view showing the brush wiring board 60, which is formed by laminating the conductors (copper foils) on the front and back surfaces of the nine two mating substrates through the substrate material in the thickness direction; In the figure, the conductor layer mark M on the upper side of the two-sided wiring board 61 of the multilayer printed wiring board 60 is the same as the mark of the center of gravity of the hollow mark E and the conductor on the lower side. It is not necessary to sequentially compare the marks of adjacent conductor layers. The body layer may be formed with a mark. For the cross-sectional view of the frame, the number in the square body is the center of gravity of the body layer of the empty mark layer. The wire plate 6 1 is printed in multiple layers to form a solid layer. In each guide -36- (33) 1230571, these marks are usually arranged in the four corners of a multilayer printed wiring board 标记 mark box as an example, and are arranged as shown in Fig. 5 (b). The marker frame 21 is internally divided into nine squares, and a solid marker M and a hollow marker E each having the same center of gravity are arranged to form a marker group 20. As an example of the practical size, referring to the mark in Fig. 13 (b), one side F of the marker frame 21 is approximately 10 mm square; the interval A between the marks is approximately 3 mm; the outer diameter D of the solid mark 1 is 1.4 mm, and the diameter D2 of the hollow mark 23 is approximately 2.4 mm. The size F of the marker frame 21 is set to be slightly smaller than the effective field of view of the X-ray camera. The multilayer printed wiring board that ends the hot pressing process is slightly deformed. Even if the position of each mark is changed, it is fully stored in the field of view of the X-ray camera. 0 Mark The frame is set in the same position on all inner layers. As described above, the solid mark M and the hollow mark E are formed in each of the divided squares, and no other conductive layer exists in the squares. · Therefore, when the marker group 20 in the marker frame 21 is irradiated with X rays, the outer diameter D 2 and the inner diameter D arranged in three rows and three columns are observed in the dark part in FIG. 13 (b). Nine circular bright parts of 1. The outer diameter of the ring is equivalent to the circumferential portion of the hollow mark E, and the inner diameter of the ring is equivalent to the circumferential portion of the solid mark M. Take the dichotomized image with an appropriate threshold, and find the coordinates of the center of gravity of the solid mark M and the center of gravity of the circle (bright part) of the hollow mark E. 37- (34) 1230571 The center of gravity of the solid mark M It is obtained by counting only the dark points in the bright part of the ring. The center of gravity of the hollow mark E is, for example, after replacing all the dark parts of the solid mark M with the bright part, and counting only the bright points. Observation of markers using the coordinates of the markers 値 inferred is performed in the following order. First, the observed multilayer printed wiring board is placed on the movable table, and the mark is placed in the field of view of the observation device. Based on the first observation of the first project, the coordinates 値 (equivalent to c 1 and d 1) of the center of gravity of 18 marks arranged in a mark frame are obtained. As a second process, the multilayer printed wiring board is relatively moved to move the X and y components of LI and L2 in a predetermined amount. Based on the second observation of the third project, the coordinates 値 (equivalent to c2 and d2) of the center of gravity of 18 marks arranged in a mark frame are obtained. In the above, the second observation is used, and the coordinates of the previous mark are applied to each of the marks. The estimation formula Lx = Ll xcl / (c2-cl) and Ly = L2xdl / (d2-dl) are performed. The estimated coordinates of the position where the first measurement of each mark was performed are calculated. Observation of the marked frame at the last part above. The calculation of the coordinates of the mark 値 inference formula is a calculation method of the coordinates 在 in the control device of the punching machine, and the results are also stored in the storage device in the control device. The above is the sequence of marking observation on the hole punch. Comparing Fig. 5 (a) and Fig. 13 (a), it is known that 18 marks in a mark frame correspond to a multilayer printed wiring board with 12 conductor layers, but the coordinates of the mark are used. In the inference formula, the same mark group can correspond to a multilayer printed wiring board having 20 conductor layers. When designing the wiring pattern of the conductor layer, the layout of the -38- (35) 1230571 layout of wiring patterns such as markers can still correspond to the increase in the number of layers of the conductor layer. Therefore, it is not necessary to change the standard diagram, which helps Labor-saving design. In the present invention, the difference in distance between the conductive layer forming the mark and the fluorescent surface of the X-ray camera is essentially eliminated, so that the difference in accuracy between the outer periphery of the field of view of the X-ray camera and the vicinity of the center can be avoided. That is, there is no influence of α in FIG. 3 (b). In addition, if Z3 and Z4 shown in Fig. 3 (c) are enlarged, if the two marks do not overlap, the respective coordinates of the center of gravity can be measured. If the thickness of an ordinary substrate or a substrate material and the size of an exemplary mark are exemplified, a combination of marks of an arbitrary layer may be used. [Effects of the Invention] As described above, the coordinate 値 inference formula of the mark of the present invention offsets the position in the thickness direction of the inner layer plate during observation, and can infer the mark position of the true mark. In principle, even if there is a mark on any layer of the multilayer printed wiring board, it is expected to improve the measurement accuracy of the mark, and it can be used as an X-ray camera with a wider field of view than before. By introducing the coordinate inference formula of the marker of the present invention, nine sets (18) of markers controlled in the field of view of the camera of a conventional punching machine can correspond to a multilayer printed wiring board up to 20 layers, and can be Corresponds to most multilayer printed wiring boards that are generally manufactured. The wiring pattern of the conductor layer is changed in accordance with the condition of the internal circuit part ’, but the name, batch mark, and other peripheral parts of the marker frame are mostly designed as standard designs. Therefore, the periphery of the wiring pattern of the multilayer printed wiring board -39- (36) 1230571 is still the current standard design and does not need to be changed ', which has the advantage of not increasing the number of wiring pattern design users. It is not necessary to change the hardware surface of the reference hole punching machine in order to load the coordinate 値 inference formula of the mark of the present invention. Only the order of adding the marker measurement process can be supported by software that implements the marker coordinate estimation method. The conventional machine can also be made into a punching machine with the function of the present invention by changing or re-changing the software. New functions can be loaded without significantly increasing the original cost of production ', and there is no need for a large price for functional services that increase the already sold products, and the effect of serviceability is also great. [Brief description of the drawings] The first (a) and (b) are three-dimensional views showing the image of the mark and the image of its fluorescent surface, which illustrate the calculation method of the true coordinates of the mark according to the embodiment of the present invention, and an orthographic projection according to the angle method Illustration. Figures 2 (a) to 2 (d) show the relationship between various coordinate systems such as the mechanical coordinate system of the reference hole punching machine set in the embodiment of the present invention, and the design coordinate system of the multilayer printed wiring board. Illustrating. Figs. 3 (a) to 3 (c) are schematic diagrams showing a marker observation method according to X-rays, and a schematic diagram illustrating distortion of a marker image. Fig. 4 is a perspective view showing an example of the arrangement of markers formed in a marker frame. 5 (a) to 5 (c) are schematic diagrams showing the shape of a mark formed in a mark frame inside the mark frame. Fig. 6 is a perspective -40- (37) 1230571 view of a reference hole punching machine for opening a reference hole. Figures 7 (a) and 7 (b) are a plan view and a side view of a standard tying machine. Figures 8 (a) and 8 (b) are plan views showing the movable table of the reference hole punching machine. Figures 9 (a) and 9 (d) are projection views showing the X-movement stage of the reference hole punching machine in each direction. Figures 10 (a) to 10 (c) are a perspective view and a plan view showing the structure of a multilayer printed wiring board, and schematic diagrams of a work template used in a hot pressing process. Figures 11 (a) and 11 (b) are cross-sectional views showing the structure of a multilayer printed wiring board. Fig. 12 is a perspective view showing an example of a conventional arrangement of a marker group that reduces errors due to the height of the marker. 13 (a) to 13 (c) are schematic diagrams showing the shape of the mark shown in Fig. 12. [Symbol description] 1 Hole machine 2 Frame 3 Stand 4 X-ray generating device 4a X-ray generating tube 5 X-ray protective tube -41-1230571 ι38) 5a hole 6 X-ray camera 7 spindle 7 a chuck 7b drill 7 c, 9 a Cylinder 8 Mandrel stand 9 Fixture 10 X mobile stand 11 γ mobile stand 12 Movable stand 10a, 11a, 12a Linear guide (LM guide) 1 0 b, 1 1 b, 1 2 b Ball screw 16 open Hole position (1, 2 holes) 16a Opening position (3, 4 holes) 17 Operator position (blank arrow) 20 Marking group 2 1 Marking frame η Medium solid mark η Hollow mark 30 X-ray fluorescent doubler tube 3 1 Fluorescent film 3 2 Photoelectric surface 3 3 Output fluorescent film -42- (39) (39) 1230571 34 Optical lens system 3 5 CCD photographic element (charge-coupled element) 36 Image A anode S receiving electrode 5 0 Mechanical Coordinate system (X m, Y m, Z m, mechanical origin 0 m) 5 1 Design coordinate system (Ud, Vd, origin Od) 60 Multilayer printed wiring board 6 1 Double-sided wiring board 6 1 a Single wiring board pattern 62 conductor 63 (insulation) substrate 64 substrate material 64a substrate material (with via hole) 65 via hole

66, 66a, 66b, P mark 6 7, 孑 Reference 孑 L 6 8 Laminating die 6 8 a Locating pin 69 Maximum wiring board shape 69a Minimum wiring board shape 70 Scope of influence

Ha Case Identification Mark -43-

Claims (1)

(1) 1230571 Patent application scope 1 · A reference hole punching machine is provided with: a gantry fixed to the frame body of the reference hole punching machine; two-sided printing provided with constituent elements for irradiation to be formed on a multilayer printed wiring board An X-ray source that emits the marked X-rays of the conductor layer of the wiring board, and an X-ray camera that observes the image of the mark formed by the transmission of the marked X-rays, and an observation device supported by the stand; An opening device for opening a reference hole in the multilayer printed wiring board; a transfer device that relatively changes the multilayer printed wiring board with the observation device and the opening device; and observation of the marked image observed by the observation device The coordinate 値 infers the true coordinate 上述 of the mark, and the configuration of the design coordinate system of the multilayer printed wiring board, and controls the transfer device. The control device is characterized in that: the control device is provided with a slave fixed to the observation device. The coordinate of the first observation of the marked image indicated by the coordinate system, and the relative movement The second observation coordinate 値 of the marked image observed after the multi-layer printed wiring board is measured, and the real coordinate 座 mark coordinate 値 estimation function of the mark is estimated by moving the multi-layer printed wiring board. 2 · The reference hole drilling machine according to item 1 of the scope of the patent application, wherein the above-mentioned mark coordinate 値 inference function is the first mark indicated by the coordinates 値 of the coordinate system fixed to the observation device. The X coordinate of the observation coordinate 値 of the image is c 1 and the y coordinate is d 1; the X coordinate of the observation coordinate 値 of the second-44- (2) 1230571 labeled image is C 2 and the y coordinate is d2 Let the X-axis component of the quantitative movement of the transfer device be L1 and the Y-axis component be L2, including the X coordinate of the true coordinate 标记 of the mark at the first observation as Lx, and y If the coordinates are Ly, it is inferred that the real coordinates of the marks Lx = Ll X c 1 / (c 2-c 1) and L y = L 2 X d 1 / (d 2-d 1) are calculated. 3. A method for estimating the marking coordinates 多层 of a multilayer printed wiring board, which is characterized in that an X-ray source and an X-ray emitted from the X-ray source of an observation device including an X-ray camera are formed on the multilayer printed wiring The marking of the conductor layer of the printed wiring board, which constitutes the requirements of the board, is to observe the image of the mark with an X-ray camera as the first step of obtaining the coordinates of the mark image by setting the coordinates of the coordinate system of the observation device; Relatively perform the second process quantitatively determined by the movement of the multilayer printed wiring board placed on the transfer device; observe the image of the mark after the second process is moved by the observation device, and obtain the second mark The third process of the coordinate 値 of the image; and the observation coordinate 値 of the image of the above-mentioned mark for the first time indicated by the coordinate system fixed to the observation device, and the relative movement of the multilayer printed wiring board Observe the observation coordinates 値 of the marked image for the second time, and move the multilayer printed wiring board as described above to estimate the view. The fourth process of the above-mentioned marked coordinate 时 at the time of the first marking -45- (3) 1230571 4. The method of inferring the marked coordinates 値 of the multilayer printed wiring board according to item 3 of the patent application scope, wherein the above The fourth project is to use the X coordinate of the observation coordinate 値 of the first labeled image indicated by the coordinate 値 of the coordinate system fixed to the observation device as c 1 and the y coordinate as d 1; When the X-coordinate of the observation coordinate 値 of the sub-labeled image is c2, and the y-coordinate is d2; and the relative X-axis component of the above-mentioned relative movement of the multilayer printed wiring board is L1, and the Y-axis component is L2; Let the X-coordinate of the above-mentioned true coordinate 値 of the above-mentioned mark at the first observation be LX, and the y-coordinate be ly, it is inferred as LX = L 1 X cl / (c 2-c 1) and Ly = L2 xd 1 / (d 2-d 1). -46-