JPH01199796A - Drilling method for inner layer reference hole of multi-layer piled plate - Google Patents

Abstract

PURPOSE:To enable drilling to be directly performed promptly sensing a reference hole position mark without applying a particular mark or work on an inner metal layer by marking a sign by paint in the vicinity of the reference hole position mark, slightly appearing in a surface of an outer metal layer, and picture processing this sign obtaining coordinates in the vicinity of the reference hole position mark. CONSTITUTION:A sign 6 is marked by paint in the vicinity of a reference hole position mark of an inner metal layer coming out in a surface of an outer metal layer 1a of a multi-layer piled plate 5. Next the sign 6, marked on the surface of the base plate 5, is detected by a CCD camera 8, and coordinates of the sign is measured. With this coordinate serving as the reference, the multi- layer laminated plate 5 is moved in a manner wherein the vicinity of the reference hole position mark is placed almost just below a centripetal device (comprising X-ray camera 9 and image receiver 10). Thereafter, the centripetal device, picture processing an image of the reference hole position mark previously formed in the inner metal layer, calculates the center of the mark, and this position is directly drilled by a drill unit 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for directly drilling inner layer reference holes in a multilayer laminate.

(Prior art) In recent years, with the demand for smaller size and higher performance of electronic devices, the use of multilayer laminates with one or more layers of conductive metal circuits inside has increased as wiring boards on which electronic components are mounted. ing.

In such multilayer laminates, it is necessary to align the positional relationship between the circuits in the inner metal layer and the circuits in the outer metal layer that are formed after lamination, so inner layer reference holes are formed. . In other words, a mark to serve as a reference point (reference hole position mark) is placed in advance on the inner layer metal NJrM of the multilayer laminate.
A reference hole is drilled at this point and used for positioning during outer layer processing. However, since this reference hole position mark is not clearly visible from the outside, it is difficult to drill the hole directly and accurately, so the following method is used to drill the hole.

■Spot boring method As shown in Figure 3, first drill the vicinity of the reference hole position mark 2 embossed on the first metal W1a of the outer layer until the mark itself on the second metal layer lb is exposed.
Then, the hole is drilled centripetally using a magnifying glass drilling machine using reflected light or image processing, or only the first metal layer 1a and the fourth metal layer 1d are counterbored using an end mill cutter. In this method, holes are made by centripeting the reference hole position mark, which can be seen by transmitting light from above or below, using a drilling machine with a magnifying glass or image processing.

■ Direct drilling method This is a method in which the reference hole position mark formed on the inner metal layer is directly centripeted using an X-ray camera or magnetic sensor, and the coordinates are measured, followed by drilling in step 11.

(Problems to be Solved by the Invention) In the spot boring method (2), it is difficult to accurately spot the surface of the reference hole position mark formed on the second metal layer, and it is difficult to accurately spot the surface of the reference hole position mark formed on the second metal layer. In many cases, there were problems with poor product yield and production efficiency. In addition, in the direct drilling method (■), in order to move the centripetal device, such as an X-ray camera or magnetic sensor, to the position of the reference hole position mark, as shown in Figure 4, the inner layer of gold is removed. A metal mark 4 that serves as a coordinate reference is provided on the outer periphery of KJIlb so that the position of the reference hole position mark 2 can be detected, but depending on the inner M circuit, it may not be possible to insert a metal mark, and this metal There was a risk that the mark could be mistaken for a nearby circuit. Furthermore, since the position of the reference hole position mark is not constant from the outer periphery of the multi-rF4 laminate, there is a problem in that sensing takes a long time if the position is determined only by adjusting the width. The present invention has been made to solve these problems, and provides a method for directly drilling holes by quickly sensing a reference hole position mark without applying any special marks or processing on the inner metal layer. The purpose is to

[Structure of the Invention] (Means for Solving the Problem) The method of the present invention includes marking the mark position on the surface of the outer metal layer of a multilayer laminate in which the reference hole position mark is formed on the inner metal layer in advance with paint. , image-process this mark to find the coordinates near the reference hole position mark, move the centripetal device or the board so that the vicinity of the reference hole position mark on the board is almost directly below the centripetal device using this NWA as a reference, and then remove the centripetal device. The feature is that the reference hole position mark on the inner metal layer is image-processed to calculate the center of the mark, and a hole is directly drilled at this position using a drill unit.

(Function) In this way, mark the area near the end mill cutter that is embossed on the surface of the outer gold X layer with paint, and place a JMF mark near the reference hole position mark! Since A is made easier to obtain, there is no need to make any special marks on the inner metal layer, and sensing can be done quickly.

(Example) Next, embodiments of the present invention will be described using the drawings.

First, as shown in FIG. 1, a mark 6 is made with oil-based or water-based paint near the reference hole position mark embossed on the surface of the outer metal layer 1a of the multilayer laminate 5 consisting of four layers. Thereafter, as shown in FIG. 2, the substrate is placed on an XY table 7, and the coordinates of the XY table 7 are set so that the mark 6 made on the surface of the substrate is within the field of view of the CCD camera 8 of approximately 100 μm square. In other words, within this range, the deviation amount of the inner layer from the outer dimension of the multilayer laminate is approximately 301 In, so if the products are from the same lot, the zero-order CC can sufficiently cover the variation in outer dimensions.
The D camera 8 detects a mark made on the substrate surface and measures the coordinates, and the X-ray camera 9 and its image receiver 11 are fixed at a position where this mark is a fixed distance J21 from the CCD camera 8.
Send the measured data to the XY table 7 so that it is below 10, and move the table. After that, X1! The image of the reference hole position mark of the multilayer laminate 5 obtained by the camera 9 and the receiver 10 is image-processed to determine the center, and the coordinates of the reference hole position mark are determined. A certain distance i from the X-ray camera 9
Move the XY table 7 to the position of the drill unit 11 fixed at a position 2.
So many! Drill a reference hole position mark on the fMW board 5.

Note that since an X-ray camera is used, an X-ray blocking cover 12 is required around the outer periphery of the device. Furthermore, in the above embodiment, XY
Although the method of moving the child table has been described, it is also possible to move the CCD camera, XIl camera, and drill unit.

By drilling the inner layer reference holes in this manner, rapid sensing can be performed without providing any special marks on the inner metal layer.

[Effects of the Invention] As explained above, according to the method of the present invention, the coordinates near the reference hole position mark can be easily determined by marking with paint near the reference hole position mark that slightly appears on the surface of the outer metal layer. There is no need to make any particular mark on the inner metal layer, and inner layer reference holes can be directly drilled by rapid sensing.

[Brief explanation of the drawing]

Figures 1 and 2 are diagrams for explaining the method of the present invention. Figure 1 is a perspective view of a multilayer laminate, Figure 2 is a configuration diagram of the equipment used, and Figure 3 is a conventional counterbore. FIG. 4 is a cross-sectional view of a multilayer laminate to explain the method, and FIG. 4 is a plan view of the inner metal layer of the multilayer laminate to explain the conventional direct drilling method. 1a, 1b, 1c, 1d...Gold X layer 2...Reference hole position mark 3...End mill cutter 4...Metal mark 5... ...Multilayer laminate 6 ...Marks made on the board surface 7 ...XY child table ...CCD camera 9 ...X-ray camera 10 ... ...Receiver 11 ...Drill unit 12 ...X-ray blocking cover

Claims (1)

[Claims] Mark the position of the mark on the surface of the outer metal layer of a multilayer laminate with a reference hole position mark formed on the inner metal layer in advance with paint, and image-process this mark to determine the coordinates near the reference hole position mark. Using these coordinates as a reference, move the centripetal device or the board so that the vicinity of the reference hole position mark on the board is almost directly below the centripetal device, and then use the centripetal device to perform image processing on the reference hole position mark on the inner metal layer to mark the mark. A method for drilling a reference hole in an inner layer of a multilayer laminate, characterized by calculating the center and directly drilling a hole at this position using a drill unit.