TWI226078B - Wafer holding apparatus - Google Patents

Wafer holding apparatus Download PDF

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Publication number
TWI226078B
TWI226078B TW091115371A TW91115371A TWI226078B TW I226078 B TWI226078 B TW I226078B TW 091115371 A TW091115371 A TW 091115371A TW 91115371 A TW91115371 A TW 91115371A TW I226078 B TWI226078 B TW I226078B
Authority
TW
Taiwan
Prior art keywords
dovetail
holding device
joint
key
lock
Prior art date
Application number
TW091115371A
Other languages
English (en)
Chinese (zh)
Inventor
Thomas Payne
Jitendra S Goela
Lee E Burns
Michael A Pickering
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Application granted granted Critical
Publication of TWI226078B publication Critical patent/TWI226078B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW091115371A 2001-07-16 2002-07-11 Wafer holding apparatus TWI226078B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30576401P 2001-07-16 2001-07-16

Publications (1)

Publication Number Publication Date
TWI226078B true TWI226078B (en) 2005-01-01

Family

ID=23182234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091115371A TWI226078B (en) 2001-07-16 2002-07-11 Wafer holding apparatus

Country Status (5)

Country Link
US (1) US6811040B2 (cg-RX-API-DMAC7.html)
EP (1) EP1289002A3 (cg-RX-API-DMAC7.html)
JP (1) JP4283504B2 (cg-RX-API-DMAC7.html)
KR (1) KR100880410B1 (cg-RX-API-DMAC7.html)
TW (1) TWI226078B (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8419001B2 (en) 2006-10-13 2013-04-16 Sumco Corporation Method and jig for holding silicon wafer
CN110666992A (zh) * 2019-08-27 2020-01-10 北京灵禾科技发展有限公司 一种长晶舟及制备工艺
CN112687597A (zh) * 2020-12-25 2021-04-20 集美大学 一种高温基片退火架

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TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
KR101495901B1 (ko) * 2013-07-03 2015-02-26 주식회사 월덱스 세라믹소재의 보트 결합 구조 및 그 접합 방법
JP1537630S (cg-RX-API-DMAC7.html) * 2014-11-20 2015-11-09
JP1537312S (cg-RX-API-DMAC7.html) * 2014-11-20 2015-11-09
JP1537313S (cg-RX-API-DMAC7.html) * 2014-11-20 2015-11-09
JP6322159B2 (ja) * 2015-06-10 2018-05-09 クアーズテック株式会社 ウエハボート及びその製造方法
KR101772180B1 (ko) * 2016-02-02 2017-08-29 (주)앤피에스 기판 지지 장치 및 이를 포함하는 기판 처리 장치
JP1563649S (cg-RX-API-DMAC7.html) * 2016-02-12 2016-11-21
JP6770461B2 (ja) * 2017-02-21 2020-10-14 クアーズテック株式会社 縦型ウエハボート
JP7030604B2 (ja) * 2018-04-19 2022-03-07 三菱電機株式会社 ウエハボートおよびその製造方法
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
KR102552458B1 (ko) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
JP7364275B1 (ja) 2022-06-07 2023-10-18 株式会社フェローテックホールディングス ウェハボート
JP1741513S (cg-RX-API-DMAC7.html) * 2022-09-14 2023-04-11
JP1741512S (cg-RX-API-DMAC7.html) * 2022-09-14 2023-04-11

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8419001B2 (en) 2006-10-13 2013-04-16 Sumco Corporation Method and jig for holding silicon wafer
CN110666992A (zh) * 2019-08-27 2020-01-10 北京灵禾科技发展有限公司 一种长晶舟及制备工艺
CN112687597A (zh) * 2020-12-25 2021-04-20 集美大学 一种高温基片退火架

Also Published As

Publication number Publication date
EP1289002A3 (en) 2007-01-24
US20030024888A1 (en) 2003-02-06
KR20030007136A (ko) 2003-01-23
JP2003179124A (ja) 2003-06-27
EP1289002A2 (en) 2003-03-05
US6811040B2 (en) 2004-11-02
JP4283504B2 (ja) 2009-06-24
KR100880410B1 (ko) 2009-01-23

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