TWD242108S - 半導體製造裝置用發熱體 - Google Patents

半導體製造裝置用發熱體

Info

Publication number
TWD242108S
TWD242108S TW113300447F TW113300447F TWD242108S TW D242108 S TWD242108 S TW D242108S TW 113300447 F TW113300447 F TW 113300447F TW 113300447 F TW113300447 F TW 113300447F TW D242108 S TWD242108 S TW D242108S
Authority
TW
Taiwan
Prior art keywords
heating element
semiconductor manufacturing
manufacturing device
design
ring
Prior art date
Application number
TW113300447F
Other languages
English (en)
Chinese (zh)
Inventor
谷口大騎
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD242108S publication Critical patent/TWD242108S/zh

Links

TW113300447F 2023-08-31 2024-01-29 半導體製造裝置用發熱體 TWD242108S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-017720 2023-08-31
JP2023017720F JP1760971S (Direct) 2023-08-31 2023-08-31

Publications (1)

Publication Number Publication Date
TWD242108S true TWD242108S (zh) 2025-12-21

Family

ID=89452006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113300447F TWD242108S (zh) 2023-08-31 2024-01-29 半導體製造裝置用發熱體

Country Status (3)

Country Link
US (1) USD1079661S1 (Direct)
JP (1) JP1760971S (Direct)
TW (1) TWD242108S (Direct)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD194249S (zh) 2018-03-06 2018-11-21 大晟科技股份有限公司 晶圓固定環

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169684A (en) * 1989-03-20 1992-12-08 Toyoko Kagaku Co., Ltd. Wafer supporting jig and a decompressed gas phase growth method using such a jig
USD515675S1 (en) * 2001-12-27 2006-02-21 Flow International Corporation Element for a superpressure static fluid seal
US7900579B2 (en) * 2007-09-26 2011-03-08 Tokyo Electron Limited Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
USD599827S1 (en) * 2008-05-07 2009-09-08 Komatsu Ltd. Fan shroud for construction machinery
USD638522S1 (en) * 2010-07-20 2011-05-24 Wārtsilā Japan Ltd. Seal ring for stern tube
JP2014063820A (ja) 2012-09-20 2014-04-10 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
US8807571B2 (en) * 2012-09-28 2014-08-19 Air Products And Chemicals, Inc. Wear-compensating sealing ring assembly
USD728757S1 (en) * 2013-01-04 2015-05-05 Michael Graham Gasket
KR101317942B1 (ko) * 2013-03-13 2013-10-16 (주)테키스트 반도체 제조용 척의 에지링 냉각모듈
USD783922S1 (en) * 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
JP6417052B2 (ja) * 2015-09-30 2018-10-31 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及びプログラム
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
JP1598017S (Direct) * 2017-07-21 2018-02-19
JP1598984S (Direct) * 2017-07-31 2018-03-05
USD871561S1 (en) * 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
JP1612685S (Direct) * 2018-02-08 2018-09-03
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD917825S1 (en) * 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
USD974910S1 (en) * 2020-02-04 2023-01-10 Wilson Sporting Goods Co. Tennis ball container overcap
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
JP1740585S (ja) 2022-10-26 2023-03-31 リングスペーサー

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD194249S (zh) 2018-03-06 2018-11-21 大晟科技股份有限公司 晶圓固定環

Also Published As

Publication number Publication date
USD1079661S1 (en) 2025-06-17
JP1760971S (Direct) 2024-01-10

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