TWD241472S - 半導體製造裝置用隔熱環之部分 - Google Patents

半導體製造裝置用隔熱環之部分

Info

Publication number
TWD241472S
TWD241472S TW113303622F TW113303622F TWD241472S TW D241472 S TWD241472 S TW D241472S TW 113303622 F TW113303622 F TW 113303622F TW 113303622 F TW113303622 F TW 113303622F TW D241472 S TWD241472 S TW D241472S
Authority
TW
Taiwan
Prior art keywords
design
furnace
semiconductor manufacturing
heat shield
shield ring
Prior art date
Application number
TW113303622F
Other languages
English (en)
Chinese (zh)
Inventor
谷口大騎
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD241472S publication Critical patent/TWD241472S/zh

Links

TW113303622F 2024-01-18 2024-07-16 半導體製造裝置用隔熱環之部分 TWD241472S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024-000787 2024-01-05
JP2024000787F JP1774869S (enExample) 2024-01-18 2024-01-18

Publications (1)

Publication Number Publication Date
TWD241472S true TWD241472S (zh) 2025-11-11

Family

ID=91672251

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113303622F TWD241472S (zh) 2024-01-18 2024-07-16 半導體製造裝置用隔熱環之部分

Country Status (3)

Country Link
US (1) USD1134253S1 (enExample)
JP (1) JP1774869S (enExample)
TW (1) TWD241472S (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD225633S (zh) 2021-06-28 2023-06-01 日商國際電氣股份有限公司 半導體製造裝置用隔熱組件外罩

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USD266070S (en) * 1980-03-31 1982-09-07 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
USD266077S (en) * 1980-03-31 1982-09-07 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
USD266074S (en) * 1981-03-31 1982-09-07 Showa Aluminum Kabushiki Kaisha Heat releasing plate for mounting semiconductor components
JPH0613361A (ja) * 1992-06-26 1994-01-21 Tokyo Electron Ltd 処理装置
USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
EP0884769A1 (en) * 1996-02-29 1998-12-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafer
USD429224S (en) * 1997-01-31 2000-08-08 Tokyo Electron Limited Quartz fin heat retaining tube
USD425871S (en) * 1997-01-31 2000-05-30 Tokyo Electron Limited Quartz fin heat retaining tube
USD405428S (en) * 1997-01-31 1999-02-09 Tokyo Electron Ltd. Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD404016S (en) * 1997-01-31 1999-01-12 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD426521S (en) * 1997-01-31 2000-06-13 Tokyo Electron Limited Quartz fin heat retaining tube
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
US6035100A (en) * 1997-05-16 2000-03-07 Applied Materials, Inc. Reflector cover for a semiconductor processing chamber
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
EP1380412A4 (en) * 2001-03-08 2005-03-30 Shinetsu Handotai Kk HEAT-FINISHING MATERIAL AND MATERIAL-USING HEATING DEVICE
JP4506125B2 (ja) * 2003-07-16 2010-07-21 信越半導体株式会社 熱処理用縦型ボート及びその製造方法
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers
KR100621777B1 (ko) * 2005-05-04 2006-09-15 삼성전자주식회사 기판 열처리 장치
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USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616393S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US10283637B2 (en) * 2016-07-18 2019-05-07 Taiwan Semiconductor Manufacturing Co, Ltd. Individually-tunable heat reflectors in an EPI-growth system
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
US10861727B2 (en) * 2018-03-13 2020-12-08 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
JP1700778S (ja) 2021-03-15 2021-11-29 基板処理装置用遮蔽具
JP1733769S (enExample) * 2022-08-10 2023-01-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD225633S (zh) 2021-06-28 2023-06-01 日商國際電氣股份有限公司 半導體製造裝置用隔熱組件外罩

Also Published As

Publication number Publication date
USD1134253S1 (en) 2026-07-14
JP1774869S (enExample) 2024-07-05

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