TW593715B - Sputtering method - Google Patents

Sputtering method Download PDF

Info

Publication number
TW593715B
TW593715B TW091124802A TW91124802A TW593715B TW 593715 B TW593715 B TW 593715B TW 091124802 A TW091124802 A TW 091124802A TW 91124802 A TW91124802 A TW 91124802A TW 593715 B TW593715 B TW 593715B
Authority
TW
Taiwan
Prior art keywords
substrate
processing chamber
chamber
sputtering
processing
Prior art date
Application number
TW091124802A
Other languages
English (en)
Chinese (zh)
Inventor
Seisuke Sueshiro
Masato Shishikura
Hiroki Ozora
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Application granted granted Critical
Publication of TW593715B publication Critical patent/TW593715B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW091124802A 2001-10-26 2002-10-24 Sputtering method TW593715B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001328624A JP3822481B2 (ja) 2001-10-26 2001-10-26 スパッタリング方法

Publications (1)

Publication Number Publication Date
TW593715B true TW593715B (en) 2004-06-21

Family

ID=19144662

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091124802A TW593715B (en) 2001-10-26 2002-10-24 Sputtering method

Country Status (4)

Country Link
JP (1) JP3822481B2 (ko)
KR (1) KR100974846B1 (ko)
CN (1) CN1281781C (ko)
TW (1) TW593715B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI485277B (zh) * 2013-12-13 2015-05-21 Univ Minghsin Sci & Tech 多靶反應性濺鍍製程穩定控制方法
TWI495749B (zh) * 2012-12-03 2015-08-11 Corning Prec Materials Co Ltd 捲對捲濺鍍方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101097737B1 (ko) * 2009-03-31 2011-12-22 에스엔유 프리시젼 주식회사 박막 증착 장치와 박막 증착 방법 및 박막 증착 시스템
US20100279021A1 (en) 2009-05-04 2010-11-04 Samsung Mobile Display Co., Ltd. Apparatus for depositing organic material and depositing method thereof
KR101914771B1 (ko) 2016-11-24 2018-11-02 한국알박(주) 막 증착 방법
CN114525486A (zh) * 2022-02-15 2022-05-24 东莞市峰谷纳米科技有限公司 溅射镀膜设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04124270A (ja) * 1990-09-14 1992-04-24 Tdk Corp 反応性連続スパッタ方法および磁気記録媒体の製造方法
JP3901754B2 (ja) * 1995-08-22 2007-04-04 株式会社アルバック 基板保持装置、スパッタリング装置、基板交換方法、スパッタリング方法
JP3664854B2 (ja) * 1997-07-25 2005-06-29 株式会社アルバック 真空処理装置
JP3827881B2 (ja) * 1999-01-29 2006-09-27 株式会社アルバック 真空処理装置及び基板起立装置
JP2001135704A (ja) * 1999-11-09 2001-05-18 Sharp Corp 基板処理装置及び基板搬送用トレイの搬送制御方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495749B (zh) * 2012-12-03 2015-08-11 Corning Prec Materials Co Ltd 捲對捲濺鍍方法
TWI485277B (zh) * 2013-12-13 2015-05-21 Univ Minghsin Sci & Tech 多靶反應性濺鍍製程穩定控制方法

Also Published As

Publication number Publication date
JP3822481B2 (ja) 2006-09-20
KR20030035942A (ko) 2003-05-09
CN1414134A (zh) 2003-04-30
JP2003129235A (ja) 2003-05-08
CN1281781C (zh) 2006-10-25
KR100974846B1 (ko) 2010-08-11

Similar Documents

Publication Publication Date Title
JP5501688B2 (ja) 基板位置合わせ機構、それを用いた真空予備室および基板処理システム
JP3650495B2 (ja) 半導体処理装置、その基板交換機構及び基板交換方法
JP4540953B2 (ja) 基板加熱装置及びマルチチャンバー基板処理装置
TW568874B (en) Fast swap dual substrate transport for load lock
JP5506824B2 (ja) 成膜装置及び成膜方法
TW200849453A (en) Substrate processing apparatus, substrate processing method and computer readable storage medium
KR100951149B1 (ko) 기판 처리 장치, 기판 반송 방법 및 컴퓨터 프로그램을기록한 기록 매체
JPH11288995A (ja) 搬送システム及び処理装置
JP2002313886A (ja) 基板搬送装置および基板搬送方法
TW593715B (en) Sputtering method
JP4227623B2 (ja) 半導体処理装置
TW508663B (en) Substrate processing apparatus and method for manufacturing a semiconductor device
JP2008266737A (ja) トレイ搬送式インライン成膜装置
WO2011007580A1 (ja) 基板処理方法
JP4885023B2 (ja) ロードロック装置および基板の処理システム
JP2021077691A (ja) 基板処理装置及び基板収納容器保管方法
JP3554534B2 (ja) 半導体処理装置の基板支持機構及び基板交換方法、並びに半導体処理装置及び基板搬送装置
JP2002158273A (ja) 真空処理装置
JP2020004839A (ja) 半導体ワーク搬送装置
JPH1145929A (ja) プラズマ処理装置
JP3816929B2 (ja) 半導体処理装置
JPH03155619A (ja) 真空処理装置
JP4104028B2 (ja) スパッタリング装置
TW439100B (en) Vacuum film forming device
JP2000237672A (ja) 基板塗布装置

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent