TW591336B - Positive photoresist composition - Google Patents
Positive photoresist composition Download PDFInfo
- Publication number
- TW591336B TW591336B TW089127195A TW89127195A TW591336B TW 591336 B TW591336 B TW 591336B TW 089127195 A TW089127195 A TW 089127195A TW 89127195 A TW89127195 A TW 89127195A TW 591336 B TW591336 B TW 591336B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- alkyl group
- general formula
- substituent
- cyclic alkyl
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36330299 | 1999-12-21 | ||
JP2000010774 | 2000-01-19 | ||
JP2000010773 | 2000-01-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW591336B true TW591336B (en) | 2004-06-11 |
Family
ID=34068822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089127195A TW591336B (en) | 1999-12-21 | 2000-12-19 | Positive photoresist composition |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2001272784A (ko) |
KR (1) | KR100657230B1 (ko) |
TW (1) | TW591336B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI407262B (zh) * | 2007-11-05 | 2013-09-01 | 羅門哈斯電子材料有限公司 | 浸潤式微影組成物及製程 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003043679A (ja) * | 2001-07-31 | 2003-02-13 | Jsr Corp | 感放射線性樹脂組成物 |
JP4866606B2 (ja) * | 2005-12-28 | 2012-02-01 | 富士フイルム株式会社 | 感光性組成物及び該感光性組成物を用いたパターン形成方法 |
JP5785754B2 (ja) | 2011-03-30 | 2015-09-30 | 富士フイルム株式会社 | パターン形成方法、及び、電子デバイスの製造方法 |
JP2014006507A (ja) | 2012-06-01 | 2014-01-16 | Shin Etsu Chem Co Ltd | 光硬化性樹脂組成物、光硬化性ドライフィルム、パターン形成方法及び電気・電子部品保護用皮膜並びに電気・電子部品 |
JP6020361B2 (ja) * | 2012-06-26 | 2016-11-02 | 信越化学工業株式会社 | 高分子化合物、ポジ型レジスト材料並びにこれを用いたパターン形成方法 |
JP6025887B2 (ja) * | 2015-02-25 | 2016-11-16 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、及び、レジスト膜 |
CN111983890B (zh) * | 2020-08-28 | 2024-03-22 | 湖南启泰传感科技有限公司 | 一种光刻胶及其光刻工艺 |
-
2000
- 2000-12-19 JP JP2000385724A patent/JP2001272784A/ja active Pending
- 2000-12-19 TW TW089127195A patent/TW591336B/zh not_active IP Right Cessation
- 2000-12-21 KR KR1020000079692A patent/KR100657230B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI407262B (zh) * | 2007-11-05 | 2013-09-01 | 羅門哈斯電子材料有限公司 | 浸潤式微影組成物及製程 |
Also Published As
Publication number | Publication date |
---|---|
JP2001272784A (ja) | 2001-10-05 |
KR100657230B1 (ko) | 2006-12-14 |
KR20010082595A (ko) | 2001-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW586052B (en) | Positive photosensitive composition | |
TW583511B (en) | Positive resist composition | |
KR100597860B1 (ko) | 원자외선 노광용 포지티브 포토레지스트 조성물 | |
KR100896000B1 (ko) | 포지티브 레지스트 조성물 및 이를 사용한 패턴 형성 방법 | |
KR100516702B1 (ko) | 포지티브감광성조성물 | |
TW565746B (en) | Positive-type photoresist composition | |
TW564331B (en) | Positive-form photoresist composition | |
TWI227377B (en) | Positive-type resist composition | |
KR20020079483A (ko) | 포지티브 포토레지스트 조성물 | |
KR20030051197A (ko) | 포지티브 레지스트 조성물 | |
TW591336B (en) | Positive photoresist composition | |
TW513621B (en) | Positive photoresist composition | |
TW523639B (en) | Positive photoresist composition | |
TW594414B (en) | Positive photoresist composition | |
JP2002251011A (ja) | 遠紫外線露光用ポジ型フォトレジスト組成物 | |
KR20000076995A (ko) | 원자외선 노광용 포지티브 포토레지스트 조성물 | |
JP2001194789A (ja) | ポジ型フォトレジスト組成物 | |
JP2003233188A (ja) | ポジ型レジスト組成物 | |
JP2003233187A (ja) | ポジ型レジスト組成物 | |
JP2003122010A (ja) | ポジ型レジスト組成物 | |
JP2003302763A (ja) | ポジ型レジスト組成物 | |
JP4190141B2 (ja) | ポジ型フォトレジスト組成物 | |
KR100733851B1 (ko) | 포지티브 레지스트 조성물 | |
JP2001235869A (ja) | 遠紫外線露光用ポジ型フォトレジスト組成物 | |
JP2001330956A (ja) | ポジ型フォトレジスト組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |