TW579371B - Soldering process for optical materials to metal mountings, and mounted assemblies - Google Patents
Soldering process for optical materials to metal mountings, and mounted assemblies Download PDFInfo
- Publication number
- TW579371B TW579371B TW087112858A TW87112858A TW579371B TW 579371 B TW579371 B TW 579371B TW 087112858 A TW087112858 A TW 087112858A TW 87112858 A TW87112858 A TW 87112858A TW 579371 B TW579371 B TW 579371B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- metal
- scope
- patent application
- transparent material
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 45
- 239000002184 metal Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims description 25
- 239000000463 material Substances 0.000 title claims description 24
- 230000003287 optical effect Effects 0.000 title claims description 18
- 238000005476 soldering Methods 0.000 title abstract 2
- 230000000712 assembly Effects 0.000 title 1
- 238000000429 assembly Methods 0.000 title 1
- 239000012780 transparent material Substances 0.000 claims abstract description 24
- 230000003647 oxidation Effects 0.000 claims abstract description 21
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 21
- 238000009792 diffusion process Methods 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 230000004888 barrier function Effects 0.000 claims abstract description 12
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical group [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims abstract description 9
- 229910001634 calcium fluoride Chemical group 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 230000007704 transition Effects 0.000 claims abstract description 6
- 238000009736 wetting Methods 0.000 claims abstract 3
- 239000010410 layer Substances 0.000 claims description 84
- 238000003466 welding Methods 0.000 claims description 34
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 230000002079 cooperative effect Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000005488 sandblasting Methods 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 4
- 229910052804 chromium Inorganic materials 0.000 claims 4
- 239000011651 chromium Substances 0.000 claims 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims 2
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
- 229910000851 Alloy steel Inorganic materials 0.000 claims 1
- 102100035957 Huntingtin-interacting protein 1 Human genes 0.000 claims 1
- 108050003304 Huntingtin-interacting protein 1 Proteins 0.000 claims 1
- 229910000846 In alloy Inorganic materials 0.000 claims 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000002848 electrochemical method Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- -1 carbonized drinks Chemical compound 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229940098465 tincture Drugs 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
- C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Joining Of Glass To Other Materials (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Lens Barrels (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19735760A DE19735760A1 (de) | 1997-08-18 | 1997-08-18 | Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW579371B true TW579371B (en) | 2004-03-11 |
Family
ID=7839306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087112858A TW579371B (en) | 1997-08-18 | 1998-08-05 | Soldering process for optical materials to metal mountings, and mounted assemblies |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6392824B1 (enExample) |
| EP (1) | EP0901992B1 (enExample) |
| JP (1) | JPH11228192A (enExample) |
| KR (1) | KR100509181B1 (enExample) |
| DE (2) | DE19735760A1 (enExample) |
| TW (1) | TW579371B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10146863A1 (de) * | 2001-09-22 | 2003-04-10 | Zeiss Carl | Fassung für ein optisches Element in einer optischen Abbildungseinrichtung |
| ATE464585T1 (de) | 2002-02-09 | 2010-04-15 | Zeiss Carl Smt Ag | Facettenspiegel mit mehreren spiegelfacetten |
| DE10317616A1 (de) * | 2003-04-11 | 2004-10-21 | Carl Zeiss Jena Gmbh | Verfahren und Vorrichtung zur Justage und Fixierung optischer Bauelemente |
| DE10339362A1 (de) | 2003-08-27 | 2005-03-24 | Carl Zeiss Smt Ag | Vorrichtung zur Verhinderung des Kriechens eines optischen Elementes |
| US20050082348A1 (en) * | 2003-10-17 | 2005-04-21 | Maier Robert L. | Method for bonding glass or metal fluoride optical materials to metal |
| US7545481B2 (en) * | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4747263B2 (ja) * | 2003-11-24 | 2011-08-17 | カール・ツァイス・エスエムティー・ゲーエムベーハー | オブジェクティブにおける光学素子のための保持装置 |
| US7265917B2 (en) * | 2003-12-23 | 2007-09-04 | Carl Zeiss Smt Ag | Replacement apparatus for an optical element |
| WO2005103788A1 (de) * | 2004-04-26 | 2005-11-03 | Carl Zeiss Smt Ag | Verfahren zum verbinden eines optischen elements mit einer haltestruktur |
| EP1796139A4 (en) * | 2004-08-10 | 2009-08-26 | Nikon Corp | OPTICAL LIGHTING DEVICES, EXPOSURE SYSTEM AND METHOD |
| DE102005013187A1 (de) | 2005-03-22 | 2006-09-28 | Carl Zeiss Smt Ag | Verfahren zum Verbinden zweier Bauteile, sowie Baugruppe |
| DE102005019716A1 (de) * | 2005-04-28 | 2006-11-02 | Carl Zeiss Smt Ag | Optisches System mit einem optischen Element |
| DE102007005780A1 (de) * | 2006-08-10 | 2008-02-14 | Carl Zeiss Smt Ag | Verbundstruktur für die Mikrolithographie und optische Anordnung |
| DE102006038992A1 (de) * | 2006-08-21 | 2008-03-13 | Carl Zeiss Smt Ag | Anordnung aus zwei miteinander verbundenen Körpern |
| DE102006050653A1 (de) | 2006-10-24 | 2008-04-30 | Carl Zeiss Smt Ag | Verfahren und Vorrichtung zum stoffschlüssigen Verbinden eines optischen Elementes mit einer Fassung |
| DE102007004185A1 (de) | 2007-01-27 | 2008-07-31 | Carl Zeiss Smt Ag | Verfahren zur Herstellung einer Lötverbindung und optische Baugruppe |
| DE102007027679B4 (de) * | 2007-06-15 | 2009-04-09 | Coherent Gmbh | Befestigungsvorrichtung für ein optisches Element |
| DE102007029031A1 (de) * | 2007-06-23 | 2008-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot |
| CN104328378B (zh) * | 2014-11-04 | 2017-02-15 | 中国科学院光电技术研究所 | 一种逆向热蒸发银反射膜加介质保护膜层的制备方法 |
| DE102015221674B4 (de) | 2015-11-04 | 2018-06-21 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit gelöteter Dichtung |
| CN109683218B (zh) * | 2018-01-25 | 2022-02-15 | 苏州旭创科技有限公司 | 光学元件、光学组件、光模块及其制造方法 |
| US20240360023A1 (en) * | 2023-04-28 | 2024-10-31 | Kla Corporation | Method and system for bonding high fluence optics to optomechanical assemblies |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1533542B1 (de) * | 1967-02-15 | 1970-12-17 | Inst Materialovedenija | Loetverbindung von optischem Quarzglas mit Metallen und Verfahren zu deren Herstellung |
| US3632008A (en) * | 1969-10-15 | 1972-01-04 | Tektronix Inc | Indium alloy seal and cathode-ray tube envelope employing such seal |
| FR2431900A1 (fr) * | 1978-07-25 | 1980-02-22 | Thomson Csf | Systeme de soudure d'un laser a semiconducteur sur un socle metallique |
| US4210389A (en) * | 1978-11-14 | 1980-07-01 | Mcdonnell Douglas Corporation | Bond and method of making the same |
| JPS58120578A (ja) * | 1982-01-05 | 1983-07-18 | 松下電器産業株式会社 | 無機質基材の選択性鑞付け方法 |
| DE3227898C2 (de) * | 1982-07-26 | 1986-11-20 | Siemens AG, 1000 Berlin und 8000 München | Schichtsystem für optoelektronische Anzeigen |
| US4600682A (en) * | 1984-07-06 | 1986-07-15 | Storage Technology Corporation | Optical storage structure |
| US4726507A (en) * | 1984-08-29 | 1988-02-23 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
| US4649085A (en) * | 1984-08-29 | 1987-03-10 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
| US4615951A (en) * | 1984-12-18 | 1986-10-07 | North American Philips Corporation | Metallized rare earth garnet and metal seals to same |
| US4743302A (en) * | 1986-06-06 | 1988-05-10 | Vlsi Packaging Materials, Inc. | Low melting glass composition |
| KR900003849B1 (ko) * | 1986-07-11 | 1990-06-02 | 가부시기가이샤 히다찌세이사꾸쇼 | 배선 기판과 이를 사용한 서말 프린팅 헤드 |
| GB8719498D0 (en) * | 1987-08-18 | 1987-11-18 | Ferranti Plc | Seals |
| JPH0628227B2 (ja) * | 1987-10-06 | 1994-04-13 | 株式会社日立製作所 | 半導体露光装置 |
| US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
| JP2528718B2 (ja) * | 1989-11-30 | 1996-08-28 | いすゞ自動車株式会社 | セラミックスと金属の接合方法 |
| IL106790A (en) * | 1992-09-01 | 1996-08-04 | Rosemount Inc | A capacitive pressure sensation consisting of the bracket and the process of creating it |
| US5753972A (en) * | 1993-10-08 | 1998-05-19 | Stratedge Corporation | Microelectronics package |
| US5518964A (en) * | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
| US5771562A (en) * | 1995-05-02 | 1998-06-30 | Motorola, Inc. | Passivation of organic devices |
| DE19606101A1 (de) * | 1996-02-19 | 1997-08-21 | Siemens Ag | Halbleiterkörper mit Lotmaterialschicht |
| US5858814A (en) * | 1996-07-17 | 1999-01-12 | Lucent Technologies Inc. | Hybrid chip and method therefor |
| US5953623A (en) * | 1997-04-10 | 1999-09-14 | International Business Machines Corporation | Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection |
| US5937320A (en) * | 1998-04-08 | 1999-08-10 | International Business Machines Corporation | Barrier layers for electroplated SnPb eutectic solder joints |
-
1997
- 1997-08-18 DE DE19735760A patent/DE19735760A1/de not_active Withdrawn
-
1998
- 1998-06-30 KR KR10-1998-0025570A patent/KR100509181B1/ko not_active Expired - Fee Related
- 1998-07-10 DE DE59808135T patent/DE59808135D1/de not_active Expired - Fee Related
- 1998-07-10 EP EP98112829A patent/EP0901992B1/de not_active Expired - Lifetime
- 1998-08-05 TW TW087112858A patent/TW579371B/zh not_active IP Right Cessation
- 1998-08-06 JP JP10222709A patent/JPH11228192A/ja active Pending
- 1998-08-14 US US09/134,227 patent/US6392824B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990023175A (ko) | 1999-03-25 |
| JPH11228192A (ja) | 1999-08-24 |
| EP0901992A2 (de) | 1999-03-17 |
| DE19735760A1 (de) | 1999-02-25 |
| EP0901992A3 (de) | 2000-01-05 |
| US6392824B1 (en) | 2002-05-21 |
| DE59808135D1 (de) | 2003-06-05 |
| EP0901992B1 (de) | 2003-05-02 |
| KR100509181B1 (ko) | 2005-12-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |