KR100509181B1 - 광학 재료를 금속 판대 및 설치된 부품에 납땜하기 위한 방법 - Google Patents

광학 재료를 금속 판대 및 설치된 부품에 납땜하기 위한 방법 Download PDF

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Publication number
KR100509181B1
KR100509181B1 KR10-1998-0025570A KR19980025570A KR100509181B1 KR 100509181 B1 KR100509181 B1 KR 100509181B1 KR 19980025570 A KR19980025570 A KR 19980025570A KR 100509181 B1 KR100509181 B1 KR 100509181B1
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KR
South Korea
Prior art keywords
layer
solder
metal
component according
permeable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR10-1998-0025570A
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English (en)
Korean (ko)
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KR19990023175A (ko
Inventor
후베르트 홀더러
요하네스 데일레
울리히 디텐마이어
Original Assignee
칼 짜이스 에스엠테 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 칼 짜이스 에스엠테 아게 filed Critical 칼 짜이스 에스엠테 아게
Publication of KR19990023175A publication Critical patent/KR19990023175A/ko
Application granted granted Critical
Publication of KR100509181B1 publication Critical patent/KR100509181B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Lens Barrels (AREA)
KR10-1998-0025570A 1997-08-18 1998-06-30 광학 재료를 금속 판대 및 설치된 부품에 납땜하기 위한 방법 Expired - Fee Related KR100509181B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19735760.1 1997-08-18
DE19735760A DE19735760A1 (de) 1997-08-18 1997-08-18 Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen

Publications (2)

Publication Number Publication Date
KR19990023175A KR19990023175A (ko) 1999-03-25
KR100509181B1 true KR100509181B1 (ko) 2005-12-08

Family

ID=7839306

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1998-0025570A Expired - Fee Related KR100509181B1 (ko) 1997-08-18 1998-06-30 광학 재료를 금속 판대 및 설치된 부품에 납땜하기 위한 방법

Country Status (6)

Country Link
US (1) US6392824B1 (enExample)
EP (1) EP0901992B1 (enExample)
JP (1) JPH11228192A (enExample)
KR (1) KR100509181B1 (enExample)
DE (2) DE19735760A1 (enExample)
TW (1) TW579371B (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10146863A1 (de) * 2001-09-22 2003-04-10 Zeiss Carl Fassung für ein optisches Element in einer optischen Abbildungseinrichtung
DE50214375D1 (de) 2002-02-09 2010-05-27 Zeiss Carl Smt Ag Facettenspiegel mit mehreren spiegelfacetten
DE10317616A1 (de) * 2003-04-11 2004-10-21 Carl Zeiss Jena Gmbh Verfahren und Vorrichtung zur Justage und Fixierung optischer Bauelemente
DE10339362A1 (de) 2003-08-27 2005-03-24 Carl Zeiss Smt Ag Vorrichtung zur Verhinderung des Kriechens eines optischen Elementes
US20050082348A1 (en) * 2003-10-17 2005-04-21 Maier Robert L. Method for bonding glass or metal fluoride optical materials to metal
US8854602B2 (en) * 2003-11-24 2014-10-07 Asml Netherlands B.V. Holding device for an optical element in an objective
US7545481B2 (en) * 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7265917B2 (en) * 2003-12-23 2007-09-04 Carl Zeiss Smt Ag Replacement apparatus for an optical element
WO2005103788A1 (de) * 2004-04-26 2005-11-03 Carl Zeiss Smt Ag Verfahren zum verbinden eines optischen elements mit einer haltestruktur
EP1796139A4 (en) * 2004-08-10 2009-08-26 Nikon Corp OPTICAL LIGHTING DEVICES, EXPOSURE SYSTEM AND METHOD
DE102005013187A1 (de) 2005-03-22 2006-09-28 Carl Zeiss Smt Ag Verfahren zum Verbinden zweier Bauteile, sowie Baugruppe
DE102005019716A1 (de) * 2005-04-28 2006-11-02 Carl Zeiss Smt Ag Optisches System mit einem optischen Element
DE102007005780A1 (de) * 2006-08-10 2008-02-14 Carl Zeiss Smt Ag Verbundstruktur für die Mikrolithographie und optische Anordnung
DE102006038992A1 (de) * 2006-08-21 2008-03-13 Carl Zeiss Smt Ag Anordnung aus zwei miteinander verbundenen Körpern
DE102006050653A1 (de) 2006-10-24 2008-04-30 Carl Zeiss Smt Ag Verfahren und Vorrichtung zum stoffschlüssigen Verbinden eines optischen Elementes mit einer Fassung
DE102007004185A1 (de) 2007-01-27 2008-07-31 Carl Zeiss Smt Ag Verfahren zur Herstellung einer Lötverbindung und optische Baugruppe
DE102007027679B4 (de) * 2007-06-15 2009-04-09 Coherent Gmbh Befestigungsvorrichtung für ein optisches Element
DE102007029031A1 (de) * 2007-06-23 2008-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot
CN104328378B (zh) * 2014-11-04 2017-02-15 中国科学院光电技术研究所 一种逆向热蒸发银反射膜加介质保护膜层的制备方法
DE102015221674B4 (de) 2015-11-04 2018-06-21 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage mit gelöteter Dichtung
CN109683218B (zh) * 2018-01-25 2022-02-15 苏州旭创科技有限公司 光学元件、光学组件、光模块及其制造方法
US20240360023A1 (en) * 2023-04-28 2024-10-31 Kla Corporation Method and system for bonding high fluence optics to optomechanical assemblies

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DE1533542B1 (de) * 1967-02-15 1970-12-17 Inst Materialovedenija Loetverbindung von optischem Quarzglas mit Metallen und Verfahren zu deren Herstellung
US3632008A (en) * 1969-10-15 1972-01-04 Tektronix Inc Indium alloy seal and cathode-ray tube envelope employing such seal
FR2431900A1 (fr) * 1978-07-25 1980-02-22 Thomson Csf Systeme de soudure d'un laser a semiconducteur sur un socle metallique
US4210389A (en) * 1978-11-14 1980-07-01 Mcdonnell Douglas Corporation Bond and method of making the same
JPS58120578A (ja) * 1982-01-05 1983-07-18 松下電器産業株式会社 無機質基材の選択性鑞付け方法
DE3227898C2 (de) * 1982-07-26 1986-11-20 Siemens AG, 1000 Berlin und 8000 München Schichtsystem für optoelektronische Anzeigen
US4600682A (en) * 1984-07-06 1986-07-15 Storage Technology Corporation Optical storage structure
US4726507A (en) * 1984-08-29 1988-02-23 The United States Of America As Represented By The Secretary Of The Air Force Cryogenic glass-to-metal seal
US4649085A (en) * 1984-08-29 1987-03-10 The United States Of America As Represented By The Secretary Of The Air Force Cryogenic glass-to-metal seal
US4615951A (en) * 1984-12-18 1986-10-07 North American Philips Corporation Metallized rare earth garnet and metal seals to same
US4743302A (en) * 1986-06-06 1988-05-10 Vlsi Packaging Materials, Inc. Low melting glass composition
KR900003849B1 (ko) * 1986-07-11 1990-06-02 가부시기가이샤 히다찌세이사꾸쇼 배선 기판과 이를 사용한 서말 프린팅 헤드
GB8719498D0 (en) * 1987-08-18 1987-11-18 Ferranti Plc Seals
JPH0628227B2 (ja) * 1987-10-06 1994-04-13 株式会社日立製作所 半導体露光装置
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
JP2528718B2 (ja) * 1989-11-30 1996-08-28 いすゞ自動車株式会社 セラミックスと金属の接合方法
IL106790A (en) * 1992-09-01 1996-08-04 Rosemount Inc A capacitive pressure sensation consisting of the bracket and the process of creating it
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US5518964A (en) * 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US5771562A (en) * 1995-05-02 1998-06-30 Motorola, Inc. Passivation of organic devices
DE19606101A1 (de) * 1996-02-19 1997-08-21 Siemens Ag Halbleiterkörper mit Lotmaterialschicht
US5858814A (en) * 1996-07-17 1999-01-12 Lucent Technologies Inc. Hybrid chip and method therefor
US5953623A (en) * 1997-04-10 1999-09-14 International Business Machines Corporation Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection
US5937320A (en) * 1998-04-08 1999-08-10 International Business Machines Corporation Barrier layers for electroplated SnPb eutectic solder joints

Also Published As

Publication number Publication date
EP0901992A2 (de) 1999-03-17
DE59808135D1 (de) 2003-06-05
EP0901992B1 (de) 2003-05-02
JPH11228192A (ja) 1999-08-24
TW579371B (en) 2004-03-11
EP0901992A3 (de) 2000-01-05
KR19990023175A (ko) 1999-03-25
DE19735760A1 (de) 1999-02-25
US6392824B1 (en) 2002-05-21

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