DE19735760A1 - Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen - Google Patents
Lötverfahren für optische Materialien an Metallfassungen und gefaßte BaugruppenInfo
- Publication number
- DE19735760A1 DE19735760A1 DE19735760A DE19735760A DE19735760A1 DE 19735760 A1 DE19735760 A1 DE 19735760A1 DE 19735760 A DE19735760 A DE 19735760A DE 19735760 A DE19735760 A DE 19735760A DE 19735760 A1 DE19735760 A1 DE 19735760A1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- solder
- metal part
- assembly according
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 22
- 238000005476 soldering Methods 0.000 title claims abstract description 6
- 230000003287 optical effect Effects 0.000 title claims description 8
- 239000010410 layer Substances 0.000 claims abstract description 52
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 16
- 230000003647 oxidation Effects 0.000 claims abstract description 14
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 14
- 238000009792 diffusion process Methods 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims abstract description 9
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims abstract description 8
- 229910001634 calcium fluoride Inorganic materials 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 8
- 239000012780 transparent material Substances 0.000 claims abstract description 6
- 238000009736 wetting Methods 0.000 claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000004544 sputter deposition Methods 0.000 claims abstract description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000010409 thin film Substances 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract 3
- 229910000846 In alloy Inorganic materials 0.000 claims abstract 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract 2
- 229910000831 Steel Inorganic materials 0.000 claims abstract 2
- 229910008599 TiW Inorganic materials 0.000 claims abstract 2
- 229910052804 chromium Inorganic materials 0.000 claims abstract 2
- 239000010959 steel Substances 0.000 claims abstract 2
- 230000007704 transition Effects 0.000 claims abstract 2
- 239000012790 adhesive layer Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 239000011241 protective layer Substances 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
- C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Joining Of Glass To Other Materials (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Lens Barrels (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19735760A DE19735760A1 (de) | 1997-08-18 | 1997-08-18 | Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen |
| KR10-1998-0025570A KR100509181B1 (ko) | 1997-08-18 | 1998-06-30 | 광학 재료를 금속 판대 및 설치된 부품에 납땜하기 위한 방법 |
| DE59808135T DE59808135D1 (de) | 1997-08-18 | 1998-07-10 | Lötverfahren für optische Materialen an Metallfassungen und gefasste Baugruppen |
| EP98112829A EP0901992B1 (de) | 1997-08-18 | 1998-07-10 | Lötverfahren für optische Materialen an Metallfassungen und gefasste Baugruppen |
| TW087112858A TW579371B (en) | 1997-08-18 | 1998-08-05 | Soldering process for optical materials to metal mountings, and mounted assemblies |
| JP10222709A JPH11228192A (ja) | 1997-08-18 | 1998-08-06 | 光学材料を金属マウント部にはんだ付けする方法及び装着後の組立体 |
| US09/134,227 US6392824B1 (en) | 1997-08-18 | 1998-08-14 | Soldering process for optical materials to metal mountings, and mounted assemblies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19735760A DE19735760A1 (de) | 1997-08-18 | 1997-08-18 | Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19735760A1 true DE19735760A1 (de) | 1999-02-25 |
Family
ID=7839306
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19735760A Withdrawn DE19735760A1 (de) | 1997-08-18 | 1997-08-18 | Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen |
| DE59808135T Expired - Fee Related DE59808135D1 (de) | 1997-08-18 | 1998-07-10 | Lötverfahren für optische Materialen an Metallfassungen und gefasste Baugruppen |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE59808135T Expired - Fee Related DE59808135D1 (de) | 1997-08-18 | 1998-07-10 | Lötverfahren für optische Materialen an Metallfassungen und gefasste Baugruppen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6392824B1 (enExample) |
| EP (1) | EP0901992B1 (enExample) |
| JP (1) | JPH11228192A (enExample) |
| KR (1) | KR100509181B1 (enExample) |
| DE (2) | DE19735760A1 (enExample) |
| TW (1) | TW579371B (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005103788A1 (de) * | 2004-04-26 | 2005-11-03 | Carl Zeiss Smt Ag | Verfahren zum verbinden eines optischen elements mit einer haltestruktur |
| DE102005013187A1 (de) * | 2005-03-22 | 2006-09-28 | Carl Zeiss Smt Ag | Verfahren zum Verbinden zweier Bauteile, sowie Baugruppe |
| DE102005019716A1 (de) * | 2005-04-28 | 2006-11-02 | Carl Zeiss Smt Ag | Optisches System mit einem optischen Element |
| DE102006050653A1 (de) * | 2006-10-24 | 2008-04-30 | Carl Zeiss Smt Ag | Verfahren und Vorrichtung zum stoffschlüssigen Verbinden eines optischen Elementes mit einer Fassung |
| DE102007027679A1 (de) * | 2007-06-15 | 2009-01-02 | Coherent Gmbh | Befestigungsvorrichtung für ein optisches Element |
| US7564636B2 (en) | 2003-08-27 | 2009-07-21 | Carl Zeiss Smt Ag | Device for preventing the displacement of an optical element |
| DE102015221674B4 (de) | 2015-11-04 | 2018-06-21 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit gelöteter Dichtung |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10146863A1 (de) * | 2001-09-22 | 2003-04-10 | Zeiss Carl | Fassung für ein optisches Element in einer optischen Abbildungseinrichtung |
| DE50214375D1 (de) | 2002-02-09 | 2010-05-27 | Zeiss Carl Smt Ag | Facettenspiegel mit mehreren spiegelfacetten |
| DE10317616A1 (de) * | 2003-04-11 | 2004-10-21 | Carl Zeiss Jena Gmbh | Verfahren und Vorrichtung zur Justage und Fixierung optischer Bauelemente |
| US20050082348A1 (en) * | 2003-10-17 | 2005-04-21 | Maier Robert L. | Method for bonding glass or metal fluoride optical materials to metal |
| US8854602B2 (en) * | 2003-11-24 | 2014-10-07 | Asml Netherlands B.V. | Holding device for an optical element in an objective |
| US7545481B2 (en) * | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7265917B2 (en) * | 2003-12-23 | 2007-09-04 | Carl Zeiss Smt Ag | Replacement apparatus for an optical element |
| EP1796139A4 (en) * | 2004-08-10 | 2009-08-26 | Nikon Corp | OPTICAL LIGHTING DEVICES, EXPOSURE SYSTEM AND METHOD |
| DE102007005780A1 (de) * | 2006-08-10 | 2008-02-14 | Carl Zeiss Smt Ag | Verbundstruktur für die Mikrolithographie und optische Anordnung |
| DE102006038992A1 (de) * | 2006-08-21 | 2008-03-13 | Carl Zeiss Smt Ag | Anordnung aus zwei miteinander verbundenen Körpern |
| DE102007004185A1 (de) | 2007-01-27 | 2008-07-31 | Carl Zeiss Smt Ag | Verfahren zur Herstellung einer Lötverbindung und optische Baugruppe |
| DE102007029031A1 (de) * | 2007-06-23 | 2008-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot |
| CN104328378B (zh) * | 2014-11-04 | 2017-02-15 | 中国科学院光电技术研究所 | 一种逆向热蒸发银反射膜加介质保护膜层的制备方法 |
| CN109683218B (zh) * | 2018-01-25 | 2022-02-15 | 苏州旭创科技有限公司 | 光学元件、光学组件、光模块及其制造方法 |
| US20240360023A1 (en) * | 2023-04-28 | 2024-10-31 | Kla Corporation | Method and system for bonding high fluence optics to optomechanical assemblies |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1533542B1 (de) * | 1967-02-15 | 1970-12-17 | Inst Materialovedenija | Loetverbindung von optischem Quarzglas mit Metallen und Verfahren zu deren Herstellung |
| US3632008A (en) * | 1969-10-15 | 1972-01-04 | Tektronix Inc | Indium alloy seal and cathode-ray tube envelope employing such seal |
| FR2431900A1 (fr) * | 1978-07-25 | 1980-02-22 | Thomson Csf | Systeme de soudure d'un laser a semiconducteur sur un socle metallique |
| US4210389A (en) * | 1978-11-14 | 1980-07-01 | Mcdonnell Douglas Corporation | Bond and method of making the same |
| JPS58120578A (ja) * | 1982-01-05 | 1983-07-18 | 松下電器産業株式会社 | 無機質基材の選択性鑞付け方法 |
| DE3227898C2 (de) * | 1982-07-26 | 1986-11-20 | Siemens AG, 1000 Berlin und 8000 München | Schichtsystem für optoelektronische Anzeigen |
| US4600682A (en) * | 1984-07-06 | 1986-07-15 | Storage Technology Corporation | Optical storage structure |
| US4726507A (en) * | 1984-08-29 | 1988-02-23 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
| US4649085A (en) * | 1984-08-29 | 1987-03-10 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
| US4615951A (en) * | 1984-12-18 | 1986-10-07 | North American Philips Corporation | Metallized rare earth garnet and metal seals to same |
| US4743302A (en) * | 1986-06-06 | 1988-05-10 | Vlsi Packaging Materials, Inc. | Low melting glass composition |
| KR900003849B1 (ko) * | 1986-07-11 | 1990-06-02 | 가부시기가이샤 히다찌세이사꾸쇼 | 배선 기판과 이를 사용한 서말 프린팅 헤드 |
| GB8719498D0 (en) * | 1987-08-18 | 1987-11-18 | Ferranti Plc | Seals |
| JPH0628227B2 (ja) * | 1987-10-06 | 1994-04-13 | 株式会社日立製作所 | 半導体露光装置 |
| US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
| JP2528718B2 (ja) * | 1989-11-30 | 1996-08-28 | いすゞ自動車株式会社 | セラミックスと金属の接合方法 |
| IL106790A (en) * | 1992-09-01 | 1996-08-04 | Rosemount Inc | A capacitive pressure sensation consisting of the bracket and the process of creating it |
| US5753972A (en) * | 1993-10-08 | 1998-05-19 | Stratedge Corporation | Microelectronics package |
| US5518964A (en) * | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
| US5771562A (en) * | 1995-05-02 | 1998-06-30 | Motorola, Inc. | Passivation of organic devices |
| DE19606101A1 (de) * | 1996-02-19 | 1997-08-21 | Siemens Ag | Halbleiterkörper mit Lotmaterialschicht |
| US5858814A (en) * | 1996-07-17 | 1999-01-12 | Lucent Technologies Inc. | Hybrid chip and method therefor |
| US5953623A (en) * | 1997-04-10 | 1999-09-14 | International Business Machines Corporation | Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection |
| US5937320A (en) * | 1998-04-08 | 1999-08-10 | International Business Machines Corporation | Barrier layers for electroplated SnPb eutectic solder joints |
-
1997
- 1997-08-18 DE DE19735760A patent/DE19735760A1/de not_active Withdrawn
-
1998
- 1998-06-30 KR KR10-1998-0025570A patent/KR100509181B1/ko not_active Expired - Fee Related
- 1998-07-10 EP EP98112829A patent/EP0901992B1/de not_active Expired - Lifetime
- 1998-07-10 DE DE59808135T patent/DE59808135D1/de not_active Expired - Fee Related
- 1998-08-05 TW TW087112858A patent/TW579371B/zh not_active IP Right Cessation
- 1998-08-06 JP JP10222709A patent/JPH11228192A/ja active Pending
- 1998-08-14 US US09/134,227 patent/US6392824B1/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7564636B2 (en) | 2003-08-27 | 2009-07-21 | Carl Zeiss Smt Ag | Device for preventing the displacement of an optical element |
| WO2005103788A1 (de) * | 2004-04-26 | 2005-11-03 | Carl Zeiss Smt Ag | Verfahren zum verbinden eines optischen elements mit einer haltestruktur |
| US7400460B2 (en) | 2004-04-26 | 2008-07-15 | Carl Zeiss Smt Ag | Method for connection of an optical element to a mount structure |
| US7551375B2 (en) | 2005-03-22 | 2009-06-23 | Carl Zeiss Smt Ag | Process for connecting an optical element of a microlithographic projection exposure apparatus to a mount, and assembly |
| DE102005013187A1 (de) * | 2005-03-22 | 2006-09-28 | Carl Zeiss Smt Ag | Verfahren zum Verbinden zweier Bauteile, sowie Baugruppe |
| DE102005019716A1 (de) * | 2005-04-28 | 2006-11-02 | Carl Zeiss Smt Ag | Optisches System mit einem optischen Element |
| DE102006050653A1 (de) * | 2006-10-24 | 2008-04-30 | Carl Zeiss Smt Ag | Verfahren und Vorrichtung zum stoffschlüssigen Verbinden eines optischen Elementes mit einer Fassung |
| WO2008049574A3 (de) * | 2006-10-24 | 2008-07-03 | Zeiss Carl Smt Ag | Verfahren und vorrichtung zum verbinden eines optischen elementes mit einer fassung |
| US8705006B2 (en) | 2006-10-24 | 2014-04-22 | Carl Zeiss Smt Gmbh | Method and device for connecting an optical element to a frame |
| US9604299B2 (en) | 2006-10-24 | 2017-03-28 | Carl Zeiss Smt Gmbh | Method and device for connecting an optical element to a frame |
| DE102007027679B4 (de) * | 2007-06-15 | 2009-04-09 | Coherent Gmbh | Befestigungsvorrichtung für ein optisches Element |
| DE102007027679A1 (de) * | 2007-06-15 | 2009-01-02 | Coherent Gmbh | Befestigungsvorrichtung für ein optisches Element |
| DE102015221674B4 (de) | 2015-11-04 | 2018-06-21 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit gelöteter Dichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0901992A2 (de) | 1999-03-17 |
| DE59808135D1 (de) | 2003-06-05 |
| EP0901992B1 (de) | 2003-05-02 |
| JPH11228192A (ja) | 1999-08-24 |
| TW579371B (en) | 2004-03-11 |
| EP0901992A3 (de) | 2000-01-05 |
| KR19990023175A (ko) | 1999-03-25 |
| KR100509181B1 (ko) | 2005-12-08 |
| US6392824B1 (en) | 2002-05-21 |
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