TW567717B - Solid-state camera device and its manufacture method - Google Patents

Solid-state camera device and its manufacture method Download PDF

Info

Publication number
TW567717B
TW567717B TW091115396A TW91115396A TW567717B TW 567717 B TW567717 B TW 567717B TW 091115396 A TW091115396 A TW 091115396A TW 91115396 A TW91115396 A TW 91115396A TW 567717 B TW567717 B TW 567717B
Authority
TW
Taiwan
Prior art keywords
solid
state imaging
mentioned
circuit board
circuit
Prior art date
Application number
TW091115396A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Tsuchiya
Original Assignee
M D I Co Ltd
Takashi Tsuchiya
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M D I Co Ltd, Takashi Tsuchiya filed Critical M D I Co Ltd
Application granted granted Critical
Publication of TW567717B publication Critical patent/TW567717B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
TW091115396A 2001-07-11 2002-07-11 Solid-state camera device and its manufacture method TW567717B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001210353A JP3603056B2 (ja) 2001-07-11 2001-07-11 固体撮像装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW567717B true TW567717B (en) 2003-12-21

Family

ID=19045840

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091115396A TW567717B (en) 2001-07-11 2002-07-11 Solid-state camera device and its manufacture method

Country Status (4)

Country Link
JP (1) JP3603056B2 (ja)
KR (1) KR20030007117A (ja)
CN (1) CN1396763A (ja)
TW (1) TW567717B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005310B2 (en) 2002-08-14 2006-02-28 Renesas Technology Corporation Manufacturing method of solid-state image sensing device
JP4204368B2 (ja) 2003-03-28 2009-01-07 シャープ株式会社 光学装置用モジュール及び光学装置用モジュールの製造方法
JP4405208B2 (ja) 2003-08-25 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置の製造方法
JP2006081008A (ja) * 2004-09-10 2006-03-23 Olympus Corp 光学機器
TW201104747A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure
KR102278123B1 (ko) 2012-02-07 2021-07-15 가부시키가이샤 니콘 촬상 유닛 및 촬상 장치
US20130258474A1 (en) * 2012-04-03 2013-10-03 Cheng-Ta Chen Optoelectronic device with improved lens cap
CN107835354B (zh) * 2017-12-15 2020-12-18 信利光电股份有限公司 应用于电子设备的摄像模组及电子设备
CN107995398A (zh) * 2017-12-15 2018-05-04 信利光电股份有限公司 应用于电子设备的摄像模组及电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2843464B2 (ja) * 1992-09-01 1999-01-06 シャープ株式会社 固体撮像装置
JPH0961239A (ja) * 1995-08-29 1997-03-07 Kyocera Corp 光量検出部材およびこの光量検出部材を搭載した画像入力装置
JP3417225B2 (ja) * 1996-05-17 2003-06-16 ソニー株式会社 固体撮像装置とそれを用いたカメラ
KR19980034899U (ko) * 1996-12-11 1998-09-15 김광호 감시용 카메라

Also Published As

Publication number Publication date
JP3603056B2 (ja) 2004-12-15
CN1396763A (zh) 2003-02-12
KR20030007117A (ko) 2003-01-23
JP2003032557A (ja) 2003-01-31

Similar Documents

Publication Publication Date Title
TWI236284B (en) Camera module and manufacturing method thereof
CN105847645B (zh) 基于一体封装工艺的摄像模组及其一体基座组件及制造方法
TWI282873B (en) Lens module and assembling method thereof
TWI233680B (en) Package for mounting a solid state image sensor
US11902641B2 (en) Camera module and manufacturing method therefor, and terminal
TWI657306B (zh) 陣列攝像模組及其模塑感光組件、線路板組件和製造方法以及電子設備
TW567717B (en) Solid-state camera device and its manufacture method
JP3417225B2 (ja) 固体撮像装置とそれを用いたカメラ
US6898292B2 (en) Electret microphone
WO2001065839A1 (fr) Petit module de prise d'images
JP7122463B2 (ja) Ｔｏｆ撮像モジュールと電子機器および組立方法
TWI228804B (en) Chip package substrate having flexible printed circuit board and method for fabricating the same
TWI691749B (zh) 鏡頭模組
JP4012428B2 (ja) 撮像素子ユニット
JP4919243B2 (ja) 電気的絶縁体及び電子デバイス
JP2002280535A (ja) 固体撮像装置及びその製造方法
CN111050032B (zh) 相机模组
CN112770019A (zh) 感光组件及其制备方法和摄像模组
TWI691779B (zh) 鏡頭模組
JP2003046815A (ja) ビデオカメラ装置
TW518439B (en) Platform and optical module, manufacturing method of the same, and optical transmission device
JPH104510A (ja) カメラ
JP2005268963A (ja) 撮像モジュールとマザーボードへのその実装方法およびその製造方法
CN215773271U (zh) 感光芯片结构组件、摄像模组及电子设备
CN112995453B (zh) 深度信息摄像模组及其组装方法

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees