TW567717B - Solid-state camera device and its manufacture method - Google Patents
Solid-state camera device and its manufacture method Download PDFInfo
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- TW567717B TW567717B TW091115396A TW91115396A TW567717B TW 567717 B TW567717 B TW 567717B TW 091115396 A TW091115396 A TW 091115396A TW 91115396 A TW91115396 A TW 91115396A TW 567717 B TW567717 B TW 567717B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title description 6
- 238000003384 imaging method Methods 0.000 claims abstract description 62
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 239000007787 solid Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 241000239290 Araneae Species 0.000 description 1
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- 208000031361 Hiccup Diseases 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
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- 229920005992 thermoplastic resin Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
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Abstract
Description
567717 五、發明說明（】） [發明所屬之技術領域] 本發明屬於具備有家庭用電視攝影她_ ^ μ 影凡件之固體攝影裝置及其製造方 '寺 用之固體攝 [習知之技術] 万去之技術領域。 在習知之固體攝影裝置中，一 之固體攝影元件，但是在近年來二：使用陶瓷封裝收容型 持器兼用作為固體攝影元件之保^二有以透鏡框架用之保 在該裝置中，於具有結合襯墊3:裝之固體攝影裝置。 ^，安裝具有相同之結合襯墊之=^圖型之電路基板 基板上覆蓋透鏡框架用之保持器，:攝影元件’從該電路 造自動化。 、用來使裝置小型化和製 :匕卜，在該裝置中，經由在 理杰寻之元件和電子零件，可以冤路基板之背面組裝處 積，可以使裝置更進一層的小型化小上述電路基板之面 [發明所欲解決之問題] ι化。 但是，在上述之習知之裝 路基板之背面之步驟，進牡士將處理器等組裝到電 之與固體攝影元件用之杜人掬=^需要避開電路基板表面 之區域。 °襯塾部份相當之電路基板背面 公亦即，在進行固體攝影元件 衫兀件用之結合襯墊部份相者要、、泉犄，從與上述固體攝 板進行加熱和加壓，或θ田之電路基板之背面，使用熱 4疋施力Π招立、丄 伤品要成為平面而且具有八 q /皮，所以上述之背面部 等組裝到上述之背面部份日士 =之強度。亦即，當將處理器 了 上述之背面部份會失去其平 C:\2D-C0DE\91-09\91115396.ptd 第4頁567717 V. Description of the invention (]) [Technical field to which the invention belongs] The present invention belongs to a solid-state photography device provided with a television camera for home use, and a solid-state camera used in the temple of the manufacturer [the conventional technology] Thousands of technical fields. Among the conventional solid-state imaging devices, one is a solid-state imaging device, but in recent years two: the use of a ceramic package-receiving type holder also serves as a solid-state imaging device. Second, a lens frame is used in this device. Combined with the pad 3: a solid photographic device. ^, To install a circuit board with the same bonding pad = ^ pattern. The holder for covering the lens frame on the substrate, the photographic element 'is automated from this circuit. Used to miniaturize and manufacture the device: Dagger, in this device, through the components and electronic parts found on Lijie, it can be assembled on the back of the substrate, and the device can be further miniaturized. The surface of the substrate [problem to be solved by the invention]. However, in the conventional step of mounting the back surface of a circuit board, it is necessary to assemble a processor or the like to an electric and solid-state imaging device. It is necessary to avoid the area of the surface of the circuit board. ° The back side of the circuit board with the equivalent lining part is the same as that used for the bonding pad part used for the solid photography element shirts. It is necessary to heat and press from the solid photography board, or The back surface of the circuit board of θ field must be applied with heat to apply force, and the wound product must be flat and have eight q / skin, so the above-mentioned back part is assembled to the above-mentioned back part. That is, when the processor is removed, the above-mentioned back part will lose its flat C: \ 2D-C0DE \ 91-09 \ 91115396.ptd page 4
567717 五 發明說明（2) 面ί，不能確保具有充分之強度。 因此，在習知技術中，要二 器等時，需要使電路其^ I開上述之背面部份組裝處理 固體攝影元件用之電二面積變大，或是使用2片之與 電路基板。 土反不同之電路基板，需要2片之 因此，本發明用來解決上 攝影裝置及其製造方法，問通，其目的是提供固體 就可以在固體攝影元件要使電路基板之面積變大， 等。 電路基板之背面組裝處理器 [解決問題之手段] 用以解決上述問題之申七主s “ _ 置，在读镑栢加肉目况明專利範圍第1項之固體攝影裝 收容部，、特：是1備:裝上有十固體攝影元件之電路基板之 在形成有結合襯：以:電路述美之：體攝㈣^ 安裝在與上述結合襯塾之形2 =表面，電路零件，被 封部，覆蓋在安裝有上；和平板狀之成形密 之指定區域。 31電路零件之上述電路基板之背面 依照申請專利範圍第1項之固體攝影裝置時，因 ，上，固體攝影元件之處理器等之零件組裝到電為板 之月面後’利用成形密Μ，用來形成平面部和獲 強度，所以在與形成有上述固體攝影元件和其 ： 區域相當之上述電路基板之背面，亦可以組裝上述 益寻之零件。其結果是不需要避開與形成有上述固體：影567717 V. Description of the invention (2) The above aspect cannot ensure sufficient strength. Therefore, in the conventional technology, when two devices are required, it is necessary to make the circuit as described above to assemble the back part as described above. The area of the electric device used for the solid-state imaging device is increased, or two pieces of circuit boards are used. Two different circuit substrates are needed. Therefore, the present invention is used to solve the problem of the upper photographic device and its manufacturing method. The purpose is to provide a solid material that can increase the area of the circuit substrate in a solid-state imaging element, etc. . The processor on the back of the circuit board is assembled with a processor [means for solving the problem] The application of the seventh master s "_" for solving the above-mentioned problems, the solid photographic equipment storage section of the patent scope of the first item in the reading of the British Pagama, and: Yes 1 Preparation: The circuit board with ten solid-state photographic elements is mounted with a bonding pad: to: the circuit is beautiful: body photography ^ mounted on the shape of the bonding pad 2 = surface, circuit parts, sealed When the back side of the circuit board of the above-mentioned circuit board is in accordance with the solid-state imaging device according to the scope of patent application No. 1, the processor of the solid-state imaging element is covered by the upper surface of the circuit board. After assembling the other parts to the lunar surface of the electrical board, the forming density is used to form the flat portion and obtain the strength. Therefore, it is also possible to use the rear surface of the circuit board corresponding to the solid-state imaging element and its: area. Assemble the above beneficial parts. As a result, there is no need to avoid and form the above solid: shadow
C:\2D-C0DE\91-09\91115396.ptd 第5頁 567717C: \ 2D-C0DE \ 91-09 \ 91115396.ptd Page 5 567717
元件和 處理器 大，可 用以 置是在 路零件 處理器 依照 之電路 要之處 板之表 用以 置之製 裝有固 徵是所 電路基 體攝影 裴有上 形密封 路基板 對上述 上述之 具結 等之2塾；區域相當之區域，就可以組裝上述之 二止上述電路基板之面積之增 乂果現固體攝影裝置之小型化。 ί i i ί問題之申請專利範圍第2項之固體攝影裝 :了專利範圍第1項之固體攝影裝置中使上述之電 ς ^含有用以驅動上述之固體攝影元件所需要之 々电于零件。 2專利範圍第2項之固體攝影裝置時，因為上述 二的至少包含有用以驅動上述之固體攝影元件所需 為和電子零件，所以可以獲得形成在上述電路基 背面之小型之固體攝影元件驅動單位。 =决上述問題之申請專利範圍第3項之固體攝影裝 =方法，其中之固體攝影裝置在透鏡框架内具備安 月豆攝影元件之電路基板之收容部，該製造方法之特 具備之步驟包含有：在表面形成有結合襯墊之上述 板之背面，於與上述結合襯墊之形成區域和上述固 元件之安裝區域相當之區域，安裝電路零件；將安 述電路零件之上述電路基板之背面之指定區域，成 成為平板狀，將上述之固體攝影元件安裝在上述電 之表面之上述固體攝影元件之安裝區域；利用接線 之固體攝影元件和上述之結合襯墊進行接線；和將 電路基板安裝在透鏡框架内。 依,日、?、申睛專利範圍第3項之固體攝影裝置之製造方法 時’因為在將用以驅動上述固體攝影元件之處理器等之零The components and processors are large, and can be used to place the circuit board according to the main points of the circuit of the component processor. It is used to install the system. The circuit substrate is photographed. The upper substrate is sealed to the above. If the area is equivalent, the increase in the area of the circuit board mentioned above can be achieved, resulting in the miniaturization of the solid-state imaging device. The solid-state photographic equipment in the scope of patent application No. 2 of the problem of ί i i ί: The above-mentioned solid-state imaging device in the patent scope of the patent application includes the above-mentioned electric power required for driving the above-mentioned solid-state imaging element. In the case of the solid-state imaging device according to the second item of the patent, since the above two include at least the electronic components required to drive the above-mentioned solid-state imaging element, it is possible to obtain a small-sized solid-state imaging element driving unit formed on the back surface of the circuit board. . = Solid photographic equipment of item 3 of the scope of patent application for the above-mentioned problems = method, in which the solid photographic device is provided with a housing portion of the circuit board of the An Yuedou photographic element in the lens frame, and the special steps of the manufacturing method include : On the back surface of the board with the bonding pad formed on the surface, install circuit parts in a region corresponding to the formation region of the bonding pad and the mounting area of the solid component; Designate the area as a flat plate, install the solid-state imaging element on the surface of the electric solid-state imaging element; install the wiring using the solid-state imaging element and the bonding pad; and install the circuit board on Inside the lens frame. According to the method of manufacturing a solid-state imaging device according to item 3 of the Japanese, Japanese, Japanese and Japanese patents, it is because zero
C: \2D-CODE\91 -09\91115396.ptd 第 β 頁 ' ' '----— 567717 五、發明說明（4) 件，組裝到電& I ^ # 面部和獲得；ί，’進行成形密封用來形成平 區域相當之電路基板之背面，亦可以組 上述固體H為寺之零件。其結果是不需要避開與形成有 以组| ^、f衫兀件和其結合襯墊之區域相當之區域，就可 板= ; = ;理=零件，…以防止上述電路基 置之製造方法利範圍第4項之固體攝影裝 ;Ϊ: =零件至少包含有用以驅動上述之 依照申請專= ^ 時’因為上述之電路文株Λ固體攝影裝置之製造方法 二和電子零件’所…獲得形成 單位。 月面之小型之固體攝影元件驅動 用以解決上述問顯> & 有將上述成形密封後”成形密封；和更具備 上述電路零件和上迷電路基板.分割C: \ 2D-CODE \ 91 -09 \ 91115396.ptd Page β '' '--- 567717 V. Description of the invention (4) pieces, assembled into electricity & I ^ # face and obtained; ί,' Forming and sealing are used to form the back of a circuit board with a flat area, and the solid H can be assembled as a part of the temple. As a result, it is not necessary to avoid the area corresponding to the area where the groups | ^, f-shirt elements and the bonding pads are formed, and the board can be plated;; =; Method 4: Solid-state photographic equipment; Ϊ: = The part contains at least the information required to drive the above-mentioned application according to the application ^ 'because of the above-mentioned circuit method Λ solid-state photographic device manufacturing method II and electronic parts' obtained ... Forming units. The small solid-state imaging device driver for the moon is used to solve the above problems. &Amp; There are "formed seals after the above-mentioned formed seals"; and the above-mentioned circuit components and circuit boards are provided.
第7頁 置之製造方法是在ΐ过：“利範圍第5項之固體攝影裝 之製造方法中使安F Z f利範圍第3或4項之固體攝影裝置 攝影裝置部份之上述電路t件之：驟是在多個固體 裝置部份之電路零件.^、土板之为面，安裝多個固體攝影 對安裝有_L述多㈣固^该形密封成為上述平板&之步驟是 路基板之背面ί指=影裝置部份之電路零件之上述電 567717 五、發明說明（5) 成為各個固體攝影裝置之步驟。 依照申請專利範圍第5項之固體攝影裝置之製造方法 時，將多個固體攝影裝置部份之處理器等之零件，一次的 安裝在電路基板，和進行成形密封，所以可以降低製造成 本，和減少製造步驟。 [發明之實施形態] 下面將根據附圖用來說明本發明之實施形態。 圖1是分解斜視圖，用來表示本實施形態之固體攝影裝 置之概略構造，圖2是剖面圖，用來表示組合圖1之固體攝 影裝置後之狀態，圖3是與圖1對應之分解剖面圖。 如圖1所示，本實施形態之固體攝影裝置1具備有透鏡蓋 2，透鏡3，玻璃過濾器4，透鏡框架5，框架台座6，固體 攝影元件7，電路基板8，電子零件9，DSP(數位信號處理 器）1 0，和成形密封部1 1。 透鏡蓋2是耐熱塑膠製之構件，如圖2和圖3所示，在其 上部中央形成有光圈2a。 透鏡3如圖3所示，其與透鏡蓋2嵌合之側形成平面狀， 其與固體攝影元件7面對之側之一部份，形成凸狀。圖3所 示之透鏡3之形狀為其一例，但是亦可以採用其他之各種 形狀。 玻璃過濾器4如圖1所示，成為矩形形狀之玻璃製過濾 作為透鏡支持部之透鏡框架4和框架台座5，與透鏡蓋2 同樣的，成為耐熱塑膠製之構件，被固定組裝。在下面於The manufacturing method on page 7 is based on the above-mentioned circuit t of the solid-state imaging device photographing device portion of the FZ f-liability range item 3 or 4 in the manufacturing method of the solid-state imaging device of item 5 of the profit range. The steps are in the circuit parts of multiple solid device parts. ^, The soil plate is the surface, and multiple solid photography pairs are installed with _L 述 多 ㈣ 固 ^ The shape of the seal to become the above-mentioned flat plate & steps The back of the substrate refers to the above-mentioned electrical components of the circuit parts of the shadow device. 567717 V. Description of the invention (5) The steps to become each solid-state imaging device. According to the manufacturing method of the solid-state imaging device according to item 5 of the scope of patent application, there will be many The parts of the solid-state imaging device such as the processor and the like are mounted on the circuit board at one time, and are formed and sealed, so the manufacturing cost and manufacturing steps can be reduced. [Embodiments of the invention] The following will be used to explain the drawings An embodiment of the present invention. Fig. 1 is an exploded perspective view showing a schematic structure of a solid-state imaging device according to this embodiment, and Fig. 2 is a cross-sectional view showing a state in which the solid-state imaging device of Fig. 1 is combined. Fig. 3 is an exploded cross-sectional view corresponding to Fig. 1. As shown in Fig. 1, the solid-state imaging device 1 of this embodiment is provided with a lens cover 2, a lens 3, a glass filter 4, a lens frame 5, a frame base 6, The solid-state imaging element 7, the circuit board 8, the electronic component 9, the DSP (digital signal processor) 10, and the molded seal 1 1. The lens cover 2 is a member made of heat-resistant plastic, as shown in Figs. 2 and 3, A diaphragm 2a is formed in the upper center of the lens. As shown in FIG. 3, the lens 3 has a flat shape on the side fitted with the lens cover 2, and a portion of the side facing the solid-state imaging element 7 has a convex shape. The shape of the lens 3 shown is an example, but other various shapes may be used. As shown in FIG. 1, the glass filter 4 is a rectangular glass filter made of a lens frame 4 and a frame base 5, which are lens support portions. Like the lens cover 2, it is made of heat-resistant plastic and is fixedly assembled.
C:\2D-CODE\91-O9\91115396.ptd 第8頁 567717 五、發明說明（6) 3個位置設有突起部“作 固體攝影元件7如圖i _電路基板8之定位裝置。 中央部，利用線連接°到=I被安裝在電路基板8之大致 在電路基板8之背面利田4基板8之結合襯墊8a。 電子零件Θ，和DSP10。另#妾線安裝有電阻，電容器等之 DSP10之後，使用塑膠 ，在安裝該等之電子零件9和 熱可塑性之樹脂，進行’成：可塑性之樹脂，《耐熱板之 心成形密封部^用來形成成形密封部 面度之方式進行成形H2和圖3所不’以可以獲得良好之平 、上疋本貝轭形悲之固體攝影裝置丨之概略構造。 =將根據圖4之流程圖，用來說明 攝影裝置1之製造方法。 〜< u版 本實施形態之固體攝影裝置丨，首先在電路基板8之背面 組裝晶片7L件等之電子零件9(步驟S1)，其次，利用接線 ^來安裝DSP10(步驟S2)。該等之電子零件9和DSP10之安 裝位置如圖2所示，相當於被設在電路基板8之表面之固體 攝影元件7用之結合襯墊之位置。然後，在此種狀態進行 成形密封，用來形成成形密封部1 1 (步驟S3)。該成形密封 部1 1如圖2所示，以具有良好之平面度之方式成形。 其次，在電路基板8之表面，利用接線安裝固體攝影元 件7 (步驟S4 )。這時，如上述之方式，在與固體攝影元件7 用之結合襯墊之位置相當之電路基板8之背面，利用熱板 進行加壓和加熱，然後更進行超音波之施加，如上述之方 式，因為上述之成形密封部11之底面，以具有良好之平面 C:\2D-CODE\91-09\91115396.ptd 第9頁 567717 五、發明說明（7) J j方？成形，所以M力或熱不會分散，另外， 二p⑨’所以超音波之施加亦可以良好的進行:、、有 上安::读ί f路基板8安裝框架台座6，然後在框架台座 哭4f 攝影元件7之上面位置，安裝破螭過清 ^ ^ Λ ，然後進行透鏡3和透鏡蓋2之安裝（步驟s 7 〜 依照上述方式夕士又欠οα 士 , 蛛S 7) 〇 . 式之本發明時，在與固體攝影元件7用 < 姓 = 襯塾之位置相當之電路基板 DSP 1 〇後，對哕笙、仓一上、/〜 又衣电于零件9和 士 ^ ^ Λ 寺進仃成形密封，用來形成保有平面戶之 i n彳11 ’所以固㈣影元件7之接線可以良“進 b ^不需要避開固體攝影元件7用之結合襯墊之位 、以在電路基板8之背面安裝電子零件9和DSP10，可 以使電路基板8小型化，彳以實現固體攝 層之小型化。 且1 <又逆 畔ΐ i卜’在大量生產日寺’亦可以如圖5所示，在PCB基板安 ^ 了之電子f件9和DSP10，在對全體進行成形密封之 後’利用切割器分割成為各個模組。這時，切割器切割溝 可以如圖6(A)所示的從pcB基板之表面側形成，亦可以如 圖6(B)所示的從成形密封側設置。C: \ 2D-CODE \ 91-O9 \ 91115396.ptd Page 8 567717 V. Description of the invention (6) Three positions are provided with protrusions "for solid-state imaging element 7 as shown in Figure i _ positioning device of circuit board 8. Center The connection pad 8a is connected to the circuit board 8 on the circuit board 8 on the back of the circuit board 8. The pads 8a of the Litian 4 board 8 are mounted on it. The electronic components Θ, and DSP 10. The other # 妾 wires are mounted with resistors, capacitors, etc. After DSP10, plastic is used to mount the electronic parts 9 and the thermoplastic resin, and the molding is performed: the plastic resin, "Heart of the heat-resistant plate forming the sealing part ^ is used to form the surface of the forming sealing part. H2 and Fig. 3 are not used to obtain a good structure of the solid-state photographic device of the flat yoke-shaped yoke shape. = The manufacturing method of the photographing device 1 will be explained according to the flowchart of Fig. 4. ~ < The solid-state imaging device in the u version embodiment, first, electronic components 9 such as wafers 7L are assembled on the back surface of the circuit board 8 (step S1), and secondly, the DSP 10 is installed using wiring ^ (step S2). The installation positions of parts 9 and DSP10 are as follows As shown in FIG. 2, it corresponds to the position of the bonding pad for the solid-state imaging element 7 provided on the surface of the circuit board 8. Then, in this state, the seal is formed to form the seal portion 11 (step S3). As shown in Fig. 2, the molded sealing portion 11 is formed so as to have a good flatness. Next, a solid-state imaging element 7 is mounted on the surface of the circuit board 8 by wiring (step S4). At this time, as described above, On the back of the circuit board 8 corresponding to the position of the bonding pad used for the solid-state imaging element 7, press and heat with a hot plate, and then apply ultrasound, as described above, because the above-mentioned sealed portion 11 is formed. The bottom surface has a good plane C: \ 2D-CODE \ 91-09 \ 91115396.ptd Page 9 567717 V. Description of the invention (7) J j square? Shaped, so M force or heat will not disperse, in addition, Two p⑨ ', so the application of ultrasound can also be carried out well: ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 基板, 基板, ^ ^ Λ and then lens 3 and lens cover 2 installation (step s 7 ～ in accordance with the above-mentioned method, 士 α, α, spider S 7) 〇. In the invention of the formula, it is equivalent to the position of the solid-state imaging element 7 < surname = lining after the circuit board DSP 1 billion of hiccup Sheng on a cartridge, / ~ and electrically to coat parts 9 and disabilities into the Ding ^ ^ Λ temple shaped seal for forming a plane to maintain the user in the left foot 11 'so that the solid film (iv) The connection of the element 7 can be improved. ^ It is not necessary to avoid the position of the bonding pad used for the solid-state imaging element 7 to mount the electronic components 9 and the DSP 10 on the back surface of the circuit substrate 8. The circuit substrate 8 can be miniaturized. Achieve miniaturization of solid-state imaging layers. Moreover, 1 < and then the reverse side i Bu 'in mass production of Risi' can also be shown in Figure 5, the electronic board 9 and DSP10 are installed on the PCB substrate, and the whole is formed and sealed 'using a cutter Split into modules. At this time, the cutter cutting groove may be formed from the surface side of the pcB substrate as shown in FIG. 6 (A), or may be provided from the forming and sealing side as shown in FIG. 6 (B).
另外’如上述之方式，在框架台座6設置定位用之突起 部6a ’與其對應的在電路基板8側形成嵌合孔。因此，在 上述之成形密封時，可以以不會阻塞該嵌合孔之方式，在 金屬模型設立支柱。 [發明之效果]In addition, as described above, the frame base 6 is provided with a positioning protrusion 6a for positioning, and a corresponding fitting hole is formed on the circuit board 8 side. Therefore, in the above-mentioned forming seal, it is possible to set up a pillar in the metal mold in such a manner that the fitting hole is not blocked. [Effect of the invention]
C:\2D-CODE\91-O9\91115396.ptd 第10頁 567717 五、發明說明（8) 依照以上所說明之本發明時，在一片之電路基板之表面 安裝固體攝影元件，和在其背面安裝用以驅動固體攝影元 件之處理器和電子零件等，然後對背面側進行成形密封， 所以在電路基板之背面亦可以組裝零件，在外形上可以使· 固體攝影裝置小型化，可以減少作業步驟。另外，因為可 以在電路基板之背面安裝多個之處理器和電子零件等，在 對全體進行成形密封後，分割成為各個模組，所以可以減 少製造成本。 [元件編號之說明] 1 固 體 攝 影 裝 置 2 透 鏡 蓋 2a 光 圈 3 透 鏡 4 玻 璃 過 濾 器 5 透 鏡 框 架 6 框 架 台 座 7 固 體 攝 影 元 件 8 電 路 基 板 9 電 子 零 件 10 DSP 11 成 形 密 封 部C: \ 2D-CODE \ 91-O9 \ 91115396.ptd Page 10 567717 V. Description of the invention (8) In accordance with the invention described above, a solid-state imaging element is mounted on the surface of a circuit board, and on the back Install the processor and electronic parts that drive the solid-state imaging element, and then seal the back side, so parts can be assembled on the back of the circuit board. The solid-state imaging device can be miniaturized in appearance and can reduce the number of work steps. . In addition, since a plurality of processors, electronic parts, and the like can be mounted on the back surface of the circuit board, and the whole can be formed and sealed, and then divided into individual modules, the manufacturing cost can be reduced. [Explanation of the component number] 1 solid-state photographing device 2 lens cover 2a aperture 3 lens 4 glass filter 5 lens frame 6 frame stand 7 solid photo element 8 circuit board 9 electronic component 10 DSP 11 sealed
C:\2D-CODH\91-O9\91115396.ptd 第11頁 567717 圖式簡單說明 圖1是分解斜視圖，用來表示本發明之一實施形態之固 體攝影裝置之概略構造。 圖2是本發明之一實施形態之固體攝影裝置之組合後之 狀態之剖面圖。 圖3是與圖1對應之分解剖面圖。 圖4是流程圖，用來表示本發明之一實施形態之固體攝 影裝置之製造方法。 圖5是剖面圖，用來說明本發明之一實施形態之固體攝 影裝置之另一製造方法。 圖6 (A )和（B)是剖面圖，用來說明本發明之一實施形態 之固體攝影裝置之更另一製造方法。C: \ 2D-CODH \ 91-O9 \ 91115396.ptd Page 11 567717 Brief Description of Drawings Fig. 1 is an exploded perspective view showing a schematic structure of a solid-state imaging device according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing a state in which a solid-state imaging device according to an embodiment of the present invention is combined. FIG. 3 is an exploded sectional view corresponding to FIG. 1. Fig. 4 is a flowchart showing a method for manufacturing a solid-state imaging device according to an embodiment of the present invention. Fig. 5 is a sectional view for explaining another method of manufacturing a solid-state imaging device according to an embodiment of the present invention. 6 (A) and 6 (B) are sectional views for explaining still another method of manufacturing a solid-state imaging device according to an embodiment of the present invention.
C:\2D-CODE\91-09\91115396.ptd 第12頁C: \ 2D-CODE \ 91-09 \ 91115396.ptd Page 12
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001210353A JP3603056B2 (en) | 2001-07-11 | 2001-07-11 | Solid-state imaging device and method of manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW567717B true TW567717B (en) | 2003-12-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091115396A TW567717B (en) | 2001-07-11 | 2002-07-11 | Solid-state camera device and its manufacture method |
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| Country | Link |
|---|---|
| JP (1) | JP3603056B2 (en) |
| KR (1) | KR20030007117A (en) |
| CN (1) | CN1396763A (en) |
| TW (1) | TW567717B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7005310B2 (en) | 2002-08-14 | 2006-02-28 | Renesas Technology Corporation | Manufacturing method of solid-state image sensing device |
| JP4204368B2 (en) | 2003-03-28 | 2009-01-07 | シャープ株式会社 | Optical device module and method of manufacturing optical device module |
| JP4405208B2 (en) | 2003-08-25 | 2010-01-27 | 株式会社ルネサステクノロジ | Method for manufacturing solid-state imaging device |
| JP2006081008A (en) * | 2004-09-10 | 2006-03-23 | Olympus Corp | Optical device |
| TW201104747A (en) * | 2009-07-29 | 2011-02-01 | Kingpak Tech Inc | Image sensor package structure |
| JP6176118B2 (en) | 2012-02-07 | 2017-08-09 | 株式会社ニコン | Imaging unit and imaging apparatus |
| US20130258474A1 (en) * | 2012-04-03 | 2013-10-03 | Cheng-Ta Chen | Optoelectronic device with improved lens cap |
| CN107835354B (en) * | 2017-12-15 | 2020-12-18 | 信利光电股份有限公司 | Be applied to electronic equipment's module of making a video recording and electronic equipment |
| CN107995398A (en) * | 2017-12-15 | 2018-05-04 | 信利光电股份有限公司 | Camera module and electronic equipment applied to electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2843464B2 (en) * | 1992-09-01 | 1999-01-06 | シャープ株式会社 | Solid-state imaging device |
| JPH0961239A (en) * | 1995-08-29 | 1997-03-07 | Kyocera Corp | Light-quantity detecting member and image input device mounting this member |
| JP3417225B2 (en) * | 1996-05-17 | 2003-06-16 | ソニー株式会社 | Solid-state imaging device and camera using it |
| KR19980034899U (en) * | 1996-12-11 | 1998-09-15 | 김광호 | Surveillance camera |
-
2001
- 2001-07-11 JP JP2001210353A patent/JP3603056B2/en not_active Expired - Fee Related
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2002
- 2002-07-11 KR KR1020020040251A patent/KR20030007117A/en not_active Application Discontinuation
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| CN1396763A (en) | 2003-02-12 |
| JP2003032557A (en) | 2003-01-31 |
| JP3603056B2 (en) | 2004-12-15 |
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