JP3603056B2 - Solid-state imaging device and method of manufacturing the same - Google Patents

Solid-state imaging device and method of manufacturing the same Download PDF

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JP3603056B2
JP3603056B2 JP2001210353A JP2001210353A JP3603056B2 JP 3603056 B2 JP3603056 B2 JP 3603056B2 JP 2001210353 A JP2001210353 A JP 2001210353A JP 2001210353 A JP2001210353 A JP 2001210353A JP 3603056 B2 JP3603056 B2 JP 3603056B2
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JP2003032557A (en
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高 土屋
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美▲キ▼科技股▲フン▼有限公司
高 土屋
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
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  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、家庭用ビデオカメラ等に用いられる固体撮像素子を備えた固体撮像装置及びその製造方法の技術分野に属するものである。
【０００２】
【従来の技術】
従来の固体撮像装置においては、セラミックパッケージ収容型の固体撮像素子を用いたものが一般的であったが、近年においては、レンズマウント用のホルダーを固体撮像素子の保護パッケージとして兼用した固体撮像装置が開発されている。
【０００３】
この装置では、ボンディングパッドと配線パターンを有する回路基板上に、同じくボンディングパッドを有する固体撮像素子を取り付け、この回路基板上からレンズマウント用のホルダーを被せることにより、装置の小型化と製造の自動化を図っている。
【０００４】
更に、この装置では、前記回路基板の裏面にプロセッサー等の素子及び電子部品を実装することにより、前記回路基板の面積を減少させ、装置のより一層の小型化を図っている。
【０００５】
【発明が解決しようとする課題】
しかしながら、前記従来の装置においては、回路基板の裏面にプロセッサー等を実装する工程において、回路基板の表面における固体撮像素子用のボンディングパッド部分に相当する回路基板の裏面の領域を避けて実装を行う必要があった。
【０００６】
これは、固体撮像素子のワイヤーボンディングを行う際には、前記固体撮像素子用のボンディングパッド部分に相当する回路基板の裏面から、ヒートプレートを用いて加熱及び加圧を行ったり、あるいは超音波を印加するために、前記裏面の部分が平面であり、かつ十分な強度を有している必要があるためである。つまり、前記裏面部分にプロセッサー等を実装してしまうと、前記裏面部分の平面度が失われ、十分な強度も確保できなくなるのである。
【０００７】
従って、従来においては、前記裏面部分を避けてプロセッサー等を実装していたために、回路基板の面積を大きくする必要があり、あるいは２枚の固体撮像素子用の回路基板とは別の回路基板を用い、２枚の回路基板が必要になっていた。
【０００８】
そこで、本発明は、前記問題を解決し、回路基板の面積を大きくすることなく、固体撮像素子用の回路基板の裏面にプロセッサー等を実装することのできる固体撮像装置及びその製造方法を提供することを課題としている。
【０００９】
【課題を解決するための手段】
請求項１記載の固体撮像装置は、前記課題を解決するために、レンズマウント内に、固体撮像素子を取り付けた回路基板の収容部を有する固体撮像装置であって、ボンディングパッドが形成された前記回路基板の表面に取り付けられた前記固体撮像素子と、前記ボンディングパッドの形成領域及び前記固体撮像素子の取り付け領域に相当する前記回路基板の裏面に取り付けられた回路部品と、前記回路部品が取り付けられた前記回路基板の裏面の所定領域を覆う平板状の成形封止部とを備えることを特徴とする。
【００１０】
請求項１記載の固体撮像装置によれば、前記固体撮像素子を駆動させるプロセッサーなどの部品を回路基板の裏面に実装後、成形封止することで、平面部が形成され、また、十分な強度が得られるので、前記固体撮像素子及びそのボンディングパッドが形成された領域に相当する前記回路基板の裏面にも前記プロセッサーなどの部品を実装することができる。その結果、前記固体撮像素子及びそのボンディングパッドが形成された領域に相当する領域を避けて前記プロセッサーなどの部品を実装する必要がないため、前記回路基板の面積の増大化を防ぎ、固体撮像装置の小型化を実現する。
【００１１】
請求項２記載の固体撮像装置は、前記課題を解決するために、請求項１記載の固体撮像装置において、前記回路部品は、少なくとも前記固体撮像素子を駆動するために必要なプロセッサー及び電子部品を含むことを特徴とする。
【００１２】
請求項２記載の固体撮像装置によれば、前記回路部品は、少なくとも前記固体撮像素子を駆動するために必要なプロセッサー及び電子部品を含むので、前記回路基板の表裏面に形成された小型の固体撮像素子駆動ユニットが得られる。
【００１３】
請求項３記載の固体撮像装置の製造方法は、前記課題を解決するために、レンズマウント内に、固体撮像素子を取り付けた回路基板の収容部を有する固体撮像装置の製造方法であって、表面にボンディングパッドが形成された前記回路基板の裏面における、前記ボンディングパッドの形成領域及び前記固体撮像素子の取り付け領域に相当する領域に、回路部品を取り付ける工程と、前記回路部品が取り付けられた前記回路基板の裏面の所定領域を、平板状に成形封止する工程と、前記回路基板の表面における前記固体撮像素子の取り付け領域に、前記固体撮像素子を取り付ける工程と、前記固体撮像素子と前記ボンディングパッドとをワイヤーボンディングにより結線する工程と、前記回路基板をレンズマウント内に取り付ける工程とを備えることを特徴とする。
【００１４】
請求項３記載の固体撮像装置の製造方法によれば、前記固体撮像素子を駆動させるプロセッサーなどの部品を回路基板の裏面に実装後、成形封止することで、平面部が形成され、また、十分な強度が得られるので、前記固体撮像素子及びそのボンディングパッドが形成された領域に相当する前記回路基板の裏面にも前記プロセッサーなどの部品を実装することができる。その結果、前記固体撮像素子及びそのボンディングパッドが形成された領域に相当する領域を避けて前記プロセッサーなどの部品を実装する必要がないため、前記回路基板の面積の増大化を防ぎ、固体撮像装置の小型化を実現する。
【００１５】
請求項４記載の固体撮像装置の製造方法は、前記課題を解決するために、請求項３記載の固体撮像装置の製造方法において、前記回路部品は、少なくとも前記固体撮像素子を駆動するために必要なプロセッサー及び電子部品を含むことを特徴とする。
【００１６】
請求項４記載の固体撮像装置の製造方法によれば、前記回路部品は、少なくとも前記固体撮像素子を駆動するために必要なプロセッサー及び電子部品を含むので、前記回路基板の表裏面に形成された小型の固体撮像素子駆動ユニットが得られる。
【００１７】
請求項５記載の固体撮像装置の製造方法は、前記課題を解決するために、請求項３または４記載の固体撮像装置の製造方法において、前記回路部品を取り付ける工程は、固体撮像装置複数個分の前記回路基板の裏面に、固体撮像装置複数個分の回路部品を取り付ける工程であり、前記平板状に成形封止する工程は、前記固体撮像装置複数個分の回路部品が取り付けられた前記回路基板の裏面の所定領域全体を成形封止する工程であり、前記成形封止後の前記回路部品及び前記回路基板を、各固体撮像装置分ごとに分割する工程を更に備えることを特徴とする。
【００１８】
請求項５記載の固体撮像装置の製造方法によれば、固体撮像装置複数個分のプロセッサーなどの部品を一度に回路基板に取り付け、かつ、成形封止するので、製造コストが低減でき、製造工程も削減できる。
【００１９】
【発明の実施の形態】
以下、本発明の実施の形態を添付図面に基づいて説明する。
【００２０】
図１は本実施形態の固体撮像装置の概略構成を示す分解斜視図、図２は図１の固体撮像装置を組み立てた状態を示す断面図、図３は図１に対応する分解断面図である。
【００２１】
図１に示すように、本実施形態の固体撮像装置１は、レンズキャップ２と、レンズ３と、ガラスフィルター４と、レンズマウント５と、マウント台座６と、固体撮像素子７と、回路基板８と、電子部品９と、ＤＳＰ（ディジタル・シグナル・プロセッサー）１０と、成形封止部１１とを備えている。
【００２２】
レンズキャップ２は、耐熱プラスチック製の部材であり、図２及び図３に示すように、その上部中央には、絞り２ａが形成されている。
【００２３】
レンズ３は、図３に示すように、レンズキャップ２との嵌合側が平面状に形成され、固体撮像素子７と対向する側の一部が凸状に形成されたレンズである。但し、図３に示すレンズ３の形状は一例であり、その他の種々の形状を採用することができる。
【００２４】
ガラスフィルター４は、図１に示すように矩形状のガラス製フィルターである。
【００２５】
レンズ支持部としてのレンズマウント４とマウント台座５は、レンズキャップ２と同様に耐熱プラスチック製の部材であり、マウント実装されている。下面には、回路基板８との位置決め手段である突起６ａが３カ所に設けられている。
【００２６】
固体撮像素子７は、図１に示すように、回路基板８のほぼ中央部に取り付けられ、ワイヤーにより、回路基板８のボンディングパッド８ａに接続される。
【００２７】
回路基板８の裏面には、抵抗、コンデンサー等の電子部品９と、ＤＳＰ１０が、ワイヤーボンディングにより実装される。そして、これらの電子部品９及びＤＳＰ１０を実装した後に、プラスチック系の熱可塑性の樹脂、あるいは耐熱ブレードの熱可塑性の樹脂を用いて成形封止を行い、成形封止部１１を形成する。成形封止部１１は、図２及び図３に示すように、良好な平面度が得られるように成形する。
【００２８】
以上が本実施形態の固体撮像装置１の概略構成である。
【００２９】
次に、本実施形態の固体撮像装置１の製造方法を、図４のフローチャートに基づいて説明する。
【００３０】
本実施形態の固体撮像装置１は、まず、回路基板８の裏面に、チップ素子等の電気部品９を実装し（ステップＳ１）、次に、ＤＳＰ１０をワイヤーボンディングにより取り付ける（ステップＳ２）。これらの電気部品９とＤＳＰ１０の取り付け位置は、図２に示すように、回路基板８の表面に設けられた固体撮像素子７用のボンディングパッドの位置に相当する位置である。そして、この状態で、成形封止を行い、成形封止部１１を形成する（ステップＳ３）。この成形封止部１１は図２に示すように良好な平面度を有するように成形される。
【００３１】
次に、回路基板８の表面に、固体撮像素子７をワイヤーボンディングにより取り付ける（ステップＳ４）。この際、上述したように、固体撮像素子７用のボンディングパッドの位置に相当する回路基板８の裏面には、ヒートプレートによる加圧及び加熱が行われ、更には超音波の印加が行われるが、上述のように、前記成形封止部１１の底面は、良好な平面度を有するように成形されるので、圧力や熱が逃げることがなく、また強度も十分なので、超音波の印加も良好に行われる。
【００３２】
次に、回路基板８にマウント台座６を取り付け、更にマウント台座６上にレンズマウント５を取り付けてレンズマウント部の製造を行う（ステップＳ５）。また、固体撮像素子７の上面位置に、ガラスフィルター４を取り付け（ステップ６）、レンズ３とレンズキャップ２の取り付けを行う（ステップＳ７）。
【００３３】
以上のように、本発明によれば、固体撮像素子７用のボンディングパッドの位置に相当する回路基板８の裏面に電子部品９及びＤＳＰ１０を取り付けた後に、これらを成形封止して平面度の保たれた成形封止部１１を形成するので、固体撮像素子７のワイヤーボンディングを良好に行うことができる。従って、固体撮像素子７用のボンディングパッドの位置を避けることなく、回路基板８の裏面に電子部品９及びＤＳＰ１０を取り付けることができるので、回路基板８の小型化が可能であり、固体撮像装置１のより一層の小型化を実現することができる。
【００３４】
なお、量産時においては、図５に示すように、ＰＣＢ基板に電子部品９及びＤＳＰ１０を複数個取り付け、全体を成形封止した後に、ダイサーにより個々のモジュール毎に分けるようにしても良い。この時、ダイサーカット溝は、図６（Ａ）に示すように、ＰＣＢ基板の表面側から形成しても良いし、あるいは図６（Ｂ）に示すように、成形封止側から設けても良い。
【００３５】
また、上述したように、マウント台座６には、位置決め用の突起６ａが設けられて、これに対応する回路基板８側には嵌合孔が形成されている。従って、上述した成形封止時には、この嵌合孔が塞がらないように、金型にてボスを立てるようにすれば良い。
【００３６】
【発明の効果】
以上説明したように、本発明によれば、一枚の回路基板の表面に固体撮像素子を取り付けると共に、その裏面には、固体撮像素子を駆動させるプロセッサー及び電子部品等を取り付け、その後に裏面側を成形封止するようにしたので、回路基板の裏面にも部品を実装することが可能となり、外形的に固体撮像装置の小型化が可能になり、作業工程を削減できる。また、回路基板の裏面に複数のプロセッサー及び電子部品等を取り付け、全体を成形封止した後に、各モジュール毎に分けることができるので、製造コストを低減することができる。
【図面の簡単な説明】
【図１】本発明の一実施形態における固体撮像装置の概略構成を示す分解斜視図である。
【図２】本発明の一実施形態における固体撮像装置を組み立てた状態の断面図である。
【図３】図１に対応する分解断面図である。
【図４】本発明の一実施形態における固体撮像装置の製造方法を示すフローチャートである。
【図５】本発明の一実施形態における固体撮像装置の他の製造方法を説明するための断面図である。
【図６】（Ａ）及び（Ｂ）は本発明の一実施形態における固体撮像装置の更に他の製造方法を説明するための断面図である。
【符号の説明】
１ 固体撮像装置
２ レンズキャップ
２ａ 絞り
３ レンズ
４ ガラスフィルター
５ レンズマウント
６ マウント台座
７ 固体撮像素子
８ 回路基板
９ 電子部品
１０ ＤＳＰ
１１ 成形封止部[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention belongs to the technical field of a solid-state imaging device including a solid-state imaging device used for a home video camera and the like and a method of manufacturing the same.
[0002]
[Prior art]
Conventional solid-state imaging devices generally use a solid-state imaging device of a ceramic package type. In recent years, however, solid-state imaging devices in which a lens mount holder is also used as a protection package for the solid-state imaging device are used. Is being developed.
[0003]
In this device, a solid-state imaging device also having a bonding pad is mounted on a circuit board having a bonding pad and a wiring pattern, and a holder for a lens mount is put on the circuit board, thereby miniaturizing the device and automating manufacturing. I am planning.
[0004]
Further, in this device, by mounting elements such as a processor and electronic components on the back surface of the circuit board, the area of the circuit board is reduced, and the size of the device is further reduced.
[0005]
[Problems to be solved by the invention]
However, in the conventional device, in a process of mounting a processor or the like on the back surface of the circuit board, the mounting is performed while avoiding a region on the back surface of the circuit board corresponding to a bonding pad portion for a solid-state imaging device on the front surface of the circuit board. Needed.
[0006]
This is because when performing wire bonding of the solid-state imaging device, heating and pressing are performed using a heat plate from the back surface of the circuit board corresponding to the bonding pad portion for the solid-state imaging device, or ultrasonic waves are applied. This is because the portion of the back surface needs to be flat and have sufficient strength to apply the voltage. That is, if a processor or the like is mounted on the back surface portion, the flatness of the back surface portion is lost, and sufficient strength cannot be secured.
[0007]
Therefore, in the related art, since the processor and the like are mounted avoiding the back surface portion, it is necessary to increase the area of the circuit board, or a circuit board different from the two circuit boards for the solid-state imaging device is used. And two circuit boards were required.
[0008]
Therefore, the present invention solves the above problems, and provides a solid-state imaging device in which a processor or the like can be mounted on the back surface of a circuit board for a solid-state imaging device without increasing the area of the circuit board, and a method of manufacturing the same. That is the task.
[0009]
[Means for Solving the Problems]
The solid-state imaging device according to claim 1, wherein in order to solve the problem, a solid-state imaging device having a housing portion for a circuit board on which a solid-state imaging element is mounted in a lens mount, wherein the bonding pad is formed. The solid-state imaging device mounted on the front surface of the circuit board, a circuit component mounted on the back surface of the circuit board corresponding to a formation region of the bonding pad and a mounting region of the solid-state imaging device, and the circuit component is mounted. And a flat molded sealing portion that covers a predetermined region on the back surface of the circuit board.
[0010]
According to the solid-state imaging device of claim 1, after mounting a component such as a processor for driving the solid-state imaging device on the back surface of the circuit board and molding and sealing, a flat portion is formed, and sufficient strength is provided. Therefore, the component such as the processor can be mounted on the back surface of the circuit board corresponding to the region where the solid-state imaging device and the bonding pad are formed. As a result, it is not necessary to mount the components such as the processor except for the region corresponding to the region where the solid-state imaging device and the bonding pad are formed, so that the area of the circuit board is prevented from increasing and the solid-state imaging device is prevented. To achieve the miniaturization.
[0011]
According to a second aspect of the present invention, there is provided a solid-state imaging device according to the first aspect, wherein the circuit component includes at least a processor and an electronic component necessary for driving the solid-state imaging device. It is characterized by including.
[0012]
According to the solid-state imaging device according to claim 2, since the circuit components include at least a processor and an electronic component necessary for driving the solid-state imaging device, a small solid-state formed on the front and back surfaces of the circuit board. An imaging device drive unit is obtained.
[0013]
A method for manufacturing a solid-state imaging device according to claim 3 is a method for manufacturing a solid-state imaging device having a housing portion for a circuit board on which a solid-state imaging device is mounted in a lens mount, in order to solve the problem. Attaching a circuit component to a region corresponding to a region where the bonding pad is formed and a region where the solid-state imaging device is attached, on the back surface of the circuit board having the bonding pad formed thereon, and the circuit to which the circuit component is attached A step of molding and sealing a predetermined area on the back surface of the substrate into a flat plate shape; a step of attaching the solid-state imaging element to an attachment area of the solid-state imaging element on the surface of the circuit board; And a step of attaching the circuit board in a lens mount by wire bonding. It is characterized in.
[0014]
According to the method for manufacturing a solid-state imaging device according to claim 3, after mounting components such as a processor for driving the solid-state imaging device on the back surface of the circuit board, molding and sealing, a flat portion is formed, Since sufficient strength can be obtained, components such as the processor can be mounted also on the back surface of the circuit board corresponding to the region where the solid-state imaging device and its bonding pad are formed. As a result, it is not necessary to mount the components such as the processor except for the region corresponding to the region where the solid-state imaging device and the bonding pad are formed, so that the area of the circuit board is prevented from increasing and the solid-state imaging device is prevented. To achieve the miniaturization.
[0015]
According to a fourth aspect of the present invention, there is provided a method of manufacturing a solid-state imaging device according to the third aspect, wherein the circuit component is required to drive at least the solid-state imaging device. It is characterized by including various processors and electronic components.
[0016]
According to the method of manufacturing a solid-state imaging device according to claim 4, since the circuit components include at least a processor and an electronic component necessary for driving the solid-state imaging device, they are formed on the front and back surfaces of the circuit board. A small solid-state imaging device drive unit can be obtained.
[0017]
According to a fifth aspect of the present invention, there is provided a method of manufacturing a solid-state imaging device according to the third or fourth aspect, wherein the step of attaching the circuit component is performed by a plurality of the solid-state imaging devices. Mounting the circuit components for a plurality of solid-state imaging devices on the back surface of the circuit board, wherein the step of molding and sealing in a flat plate shape includes mounting the circuit components for the plurality of solid-state imaging devices. A step of molding and sealing the entire predetermined region on the back surface of the substrate, and further comprising a step of dividing the circuit component and the circuit board after the molding and sealing for each solid-state imaging device.
[0018]
According to the method of manufacturing a solid-state imaging device according to the fifth aspect, components such as processors for a plurality of solid-state imaging devices are attached to the circuit board at a time and molded and sealed, so that the manufacturing cost can be reduced and the manufacturing process can be reduced. Can also be reduced.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0020]
1 is an exploded perspective view showing a schematic configuration of the solid-state imaging device according to the present embodiment, FIG. 2 is a cross-sectional view showing a state where the solid-state imaging device shown in FIG. 1 is assembled, and FIG. 3 is an exploded cross-sectional view corresponding to FIG. .
[0021]
As shown in FIG. 1, the solid-state imaging device 1 according to the present embodiment includes a lens cap 2, a lens 3, a glass filter 4, a lens mount 5, a mount base 6, a solid-state imaging device 7, and a circuit board 8. , An electronic component 9, a DSP (Digital Signal Processor) 10, and a molded sealing unit 11.
[0022]
The lens cap 2 is a member made of heat-resistant plastic, and has an aperture 2a formed at the upper center thereof as shown in FIGS.
[0023]
As illustrated in FIG. 3, the lens 3 is a lens in which the fitting side with the lens cap 2 is formed in a planar shape, and a part on the side facing the solid-state imaging device 7 is formed in a convex shape. However, the shape of the lens 3 shown in FIG. 3 is an example, and other various shapes can be adopted.
[0024]
The glass filter 4 is a rectangular glass filter as shown in FIG.
[0025]
The lens mount 4 and the mount pedestal 5 as the lens support are members made of heat-resistant plastic like the lens cap 2, and are mounted. On the lower surface, projections 6a serving as positioning means for the circuit board 8 are provided at three places.
[0026]
As shown in FIG. 1, the solid-state imaging device 7 is attached to a substantially central portion of the circuit board 8, and is connected to a bonding pad 8a of the circuit board 8 by a wire.
[0027]
Electronic components 9 such as resistors and capacitors and a DSP 10 are mounted on the back surface of the circuit board 8 by wire bonding. After the electronic components 9 and the DSP 10 are mounted, molding and sealing are performed using a plastic-based thermoplastic resin or a thermoplastic resin for a heat-resistant blade, thereby forming the molded sealing portion 11. As shown in FIGS. 2 and 3, the molded sealing portion 11 is molded so as to obtain a good flatness.
[0028]
The above is the schematic configuration of the solid-state imaging device 1 of the present embodiment.
[0029]
Next, a method for manufacturing the solid-state imaging device 1 of the present embodiment will be described with reference to the flowchart of FIG.
[0030]
In the solid-state imaging device 1 of the present embodiment, first, an electric component 9 such as a chip element is mounted on the back surface of the circuit board 8 (Step S1), and then the DSP 10 is attached by wire bonding (Step S2). The mounting positions of these electric components 9 and the DSP 10 are positions corresponding to the positions of the bonding pads for the solid-state imaging device 7 provided on the surface of the circuit board 8 as shown in FIG. Then, in this state, molding and sealing are performed to form the molding and sealing portion 11 (Step S3). This molded sealing portion 11 is molded so as to have good flatness as shown in FIG.
[0031]
Next, the solid-state imaging device 7 is attached to the surface of the circuit board 8 by wire bonding (step S4). At this time, as described above, the back surface of the circuit board 8 corresponding to the position of the bonding pad for the solid-state imaging device 7 is pressurized and heated by a heat plate, and further, ultrasonic waves are applied. As described above, since the bottom surface of the molded sealing portion 11 is molded so as to have good flatness, pressure and heat do not escape and the strength is sufficient, so that the application of ultrasonic waves is also good. Done in
[0032]
Next, the mount base 6 is mounted on the circuit board 8, and the lens mount 5 is mounted on the mount base 6 to manufacture a lens mount section (step S5). Further, the glass filter 4 is attached to the upper surface position of the solid-state imaging device 7 (Step 6), and the lens 3 and the lens cap 2 are attached (Step S7).
[0033]
As described above, according to the present invention, after the electronic components 9 and the DSP 10 are mounted on the back surface of the circuit board 8 corresponding to the positions of the bonding pads for the solid-state imaging device 7, these are molded and sealed to obtain a flatness. Since the molded sealing portion 11 is maintained, wire bonding of the solid-state imaging device 7 can be favorably performed. Therefore, the electronic components 9 and the DSP 10 can be attached to the back surface of the circuit board 8 without avoiding the positions of the bonding pads for the solid-state imaging device 7, so that the circuit board 8 can be downsized and the solid-state imaging device 1 can be mounted. Can be further downsized.
[0034]
At the time of mass production, as shown in FIG. 5, a plurality of electronic components 9 and DSPs 10 may be attached to a PCB substrate, and the whole may be molded and sealed, and then divided into individual modules by a dicer. At this time, the dicer cut groove may be formed from the front side of the PCB substrate as shown in FIG. 6A, or may be provided from the molding and sealing side as shown in FIG. 6B. good.
[0035]
Further, as described above, the mounting pedestal 6 is provided with the positioning protrusion 6a, and the fitting hole is formed on the corresponding circuit board 8 side. Therefore, at the time of the above-mentioned molding and sealing, the boss may be raised with a mold so that the fitting hole is not closed.
[0036]
【The invention's effect】
As described above, according to the present invention, a solid-state imaging device is attached to the front surface of a single circuit board, and a processor and an electronic component for driving the solid-state imaging device are attached to the back surface. Is molded and sealed, it is possible to mount components also on the back surface of the circuit board, and it is possible to reduce the size of the solid-state imaging device externally, and to reduce the number of work steps. In addition, since a plurality of processors, electronic components, and the like are attached to the back surface of the circuit board, and the entire module is molded and sealed, the module can be divided for each module, so that manufacturing costs can be reduced.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view illustrating a schematic configuration of a solid-state imaging device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a state where the solid-state imaging device according to the embodiment of the present invention is assembled.
FIG. 3 is an exploded sectional view corresponding to FIG.
FIG. 4 is a flowchart illustrating a method for manufacturing a solid-state imaging device according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view for explaining another method for manufacturing the solid-state imaging device according to the embodiment of the present invention.
FIGS. 6A and 6B are cross-sectional views illustrating still another method of manufacturing the solid-state imaging device according to the embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Solid-state imaging device 2 Lens cap 2a Aperture 3 Lens 4 Glass filter 5 Lens mount 6 Mount base 7 Solid-state imaging device 8 Circuit board 9 Electronic component 10 DSP
11 Molded sealing part

Claims (5)

レンズマウント内に、固体撮像素子を取り付けた回路基板の収容部を有する固体撮像装置であって、
ボンディングパッドが形成された前記回路基板の表面に取り付けられた前記固体撮像素子と、
前記ボンディングパッドの形成領域及び前記固体撮像素子の取り付け領域に相当する前記回路基板の裏面に取り付けられた回路部品と、
前記回路部品が取り付けられた前記回路基板の裏面の全域を覆う平板状の成形封止部と、を備え、
前記成形封止部は、前記裏面と同一の幅及び長さを有し、その四方の側端面は前記回路基板の側端面と揃えられており、前記裏面を覆う側と反対側の底面は、前記回路基板にワイヤーボンディングを行うのに十分な平面度を有して形成されている、
ことを特徴とする固体撮像装置。A solid-state imaging device having a housing for a circuit board with a solid-state imaging device mounted in a lens mount,
The solid-state imaging device attached to the surface of the circuit board on which the bonding pad is formed,
A circuit component attached to the back surface of the circuit board corresponding to the formation region of the bonding pad and the attachment region of the solid-state imaging device;
A flat molded sealing portion that covers the entire back surface of the circuit board to which the circuit component is attached ,
The molded sealing portion has the same width and length as the back surface, the four side end surfaces thereof are aligned with the side end surface of the circuit board, and the bottom surface opposite to the side covering the back surface is It is formed with sufficient flatness to perform wire bonding to the circuit board,
A solid-state imaging device characterized by the above-mentioned. 前記回路部品は、少なくとも前記固体撮像素子を駆動するために必要なプロセッサー及び電子部品を含むことを特徴とする請求項１記載の固体撮像装置。The solid-state imaging device according to claim 1, wherein the circuit component includes at least a processor and an electronic component necessary for driving the solid-state imaging device. レンズマウント内に、固体撮像素子を取り付けた回路基板の収容部を有する固体撮像装置の製造方法であって、
表面にボンディングパッドが形成された前記回路基板の裏面における、前記ボンディングパッドの形成領域及び前記固体撮像素子の取り付け領域に相当する領域に、回路部品を取り付ける工程と、
前記回路部品が取り付けられた前記回路基板の裏面の全域を、平板状に成形封止する工程と、
前記回路基板の表面における前記固体撮像素子の取り付け領域に、前記固体撮像素子を取り付ける工程と、
前記固体撮像素子と前記ボンディングパッドとをワイヤーボンディングにより結線する工程と、
前記回路基板をレンズマウント内に取り付ける工程と、を備え、
前記回路基板の裏面の全域を平板状に成形封止する工程は、前記裏面と同一の幅及び長さを有し、その四方の側端面を前記回路基板の側端面と揃え、前記裏面を覆う側と反対側の底面を、前記回路基板にワイヤーボンディングを行うのに十分な平面度を有するように、成形封止部を形成する工程である、
ことを特徴とする固体撮像装置の製造方法。A method for manufacturing a solid-state imaging device having a housing for a circuit board having a solid-state imaging device mounted in a lens mount,
A step of attaching circuit components to a region corresponding to the region where the bonding pads are formed and the region where the solid-state imaging device is attached, on the back surface of the circuit board having the bonding pads formed on the surface;
A step of molding and sealing the entire area of the back surface of the circuit board to which the circuit components are attached, in a flat plate shape
A step of attaching the solid-state imaging device to an attachment area of the solid-state imaging device on the surface of the circuit board,
Connecting the solid-state imaging device and the bonding pad by wire bonding,
Mounting the circuit board in a lens mount ,
The step of molding and sealing the entire area of the back surface of the circuit board into a flat plate shape has the same width and length as the back surface, aligns four side end surfaces thereof with the side end surfaces of the circuit board, and covers the back surface. The step of forming a molded sealing portion so that the bottom surface opposite to the side has sufficient flatness to perform wire bonding to the circuit board.
A method for manufacturing a solid-state imaging device, comprising: 前記回路部品は、少なくとも前記固体撮像素子を駆動するために必要なプロセッサー及び電子部品を含むことを特徴とする請求項３記載の固体撮像装置の製造方法。The method according to claim 3, wherein the circuit component includes at least a processor and an electronic component necessary for driving the solid-state imaging device. 前記回路部品を取り付ける工程は、固体撮像装置複数個分の前記回路基板の裏面に、固体撮像装置複数個分の回路部品を取り付ける工程であり、
前記平板状に成形封止する工程は、前記固体撮像装置複数個分の回路部品が取り付けられた前記回路基板の裏面の所定領域全体を成形封止する工程であり、
前記成形封止後の前記回路部品及び前記回路基板を、各固体撮像装置分ごとに分割する工程を更に備える、
ことを特徴とする請求項３または４記載の固体撮像装置の製造方法。The step of attaching the circuit components is a step of attaching circuit components for a plurality of solid-state imaging devices to the back surface of the circuit board for a plurality of solid-state imaging devices,
The step of molding and sealing in a flat plate shape is a step of molding and sealing the entire predetermined region on the back surface of the circuit board to which the circuit components for the plurality of solid-state imaging devices are attached,
The method further comprises a step of dividing the circuit components and the circuit board after the molding and sealing for each solid-state imaging device.
5. The method for manufacturing a solid-state imaging device according to claim 3, wherein:
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