TW564196B - Simulated laser spot enlargement - Google Patents

Simulated laser spot enlargement Download PDF

Info

Publication number
TW564196B
TW564196B TW092100478A TW92100478A TW564196B TW 564196 B TW564196 B TW 564196B TW 092100478 A TW092100478 A TW 092100478A TW 92100478 A TW92100478 A TW 92100478A TW 564196 B TW564196 B TW 564196B
Authority
TW
Taiwan
Prior art keywords
laser
positioning system
speeds
accelerations
patent application
Prior art date
Application number
TW092100478A
Other languages
English (en)
Chinese (zh)
Other versions
TW200301718A (en
Inventor
Donald R Cutler
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW200301718A publication Critical patent/TW200301718A/zh
Application granted granted Critical
Publication of TW564196B publication Critical patent/TW564196B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
TW092100478A 2002-01-11 2003-01-10 Simulated laser spot enlargement TW564196B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34861302P 2002-01-11 2002-01-11

Publications (2)

Publication Number Publication Date
TW200301718A TW200301718A (en) 2003-07-16
TW564196B true TW564196B (en) 2003-12-01

Family

ID=23368777

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092100478A TW564196B (en) 2002-01-11 2003-01-10 Simulated laser spot enlargement

Country Status (9)

Country Link
JP (1) JP4340745B2 (https=)
KR (1) KR100982677B1 (https=)
CN (1) CN1299873C (https=)
AU (1) AU2003214818A1 (https=)
CA (1) CA2469520A1 (https=)
DE (1) DE10392185T5 (https=)
GB (1) GB2397545B (https=)
TW (1) TW564196B (https=)
WO (1) WO2003059568A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004059721A1 (de) * 2004-12-11 2006-05-04 Carl Baasel Lasertechnik Gmbh & Co. Kg Bewässerungsschlauch und Verfahren zu seiner Herstellung
CN100462181C (zh) * 2006-10-30 2009-02-18 西安交通大学 飞秒激光真三维微纳加工中心
US7663269B2 (en) * 2006-12-13 2010-02-16 A-Tech Corporation High bandwidth linear actuator for steering mirror applications
DE102007012815B4 (de) * 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US20090312859A1 (en) * 2008-06-16 2009-12-17 Electro Scientific Industries, Inc. Modifying entry angles associated with circular tooling actions to improve throughput in part machining
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
DE102009044316B4 (de) 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
US8338745B2 (en) * 2009-12-07 2012-12-25 Panasonic Corporation Apparatus and methods for drilling holes with no taper or reverse taper
JP6055414B2 (ja) * 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
CN102069298A (zh) * 2010-12-20 2011-05-25 珠海市铭语自动化设备有限公司 一种板材激光切割系统及其切割加工方法
CN102566590B (zh) * 2011-03-14 2014-03-26 北京国科世纪激光技术有限公司 光学元件智能调整系统及方法
CN103100797B (zh) * 2013-01-23 2015-09-09 刘茂珍 基于自适应光学的激光微细加工设备和方法
CN104981318B (zh) * 2013-02-13 2017-03-08 住友化学株式会社 激光照射装置及光学构件贴合体的制造装置
GB2514084B (en) * 2013-02-21 2016-07-27 M-Solv Ltd Method of forming an electrode structure for capacitive touch sensor
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor
EP2969372A4 (en) * 2013-03-15 2016-11-16 Electro Scient Ind Inc COORDINATION OF THE BEAM ANGLE AND THE MOVEMENT OF A MANUFACTURING PART TO CONTROL THE INCLINATION
IT201600070259A1 (it) * 2016-07-06 2018-01-06 Adige Spa Procedimento di lavorazione laser di un materiale metallico con controllo della posizione dell'asse ottico del laser rispetto ad un flusso di gas di assistenza, nonché macchina e programma per elaboratore per l'attuazione di un tale procedimento.
CN107876981B (zh) * 2017-11-20 2019-08-20 张家港初恒激光科技有限公司 一种改进型的激光焊接加工工作站
CN109579690A (zh) * 2018-12-04 2019-04-05 天津津航技术物理研究所 一种用于快反镜稳像系统的高精度角位移检测装置
CN112122776A (zh) * 2020-09-23 2020-12-25 苏州科韵激光科技有限公司 基于高速旋转反射镜的非线性形状加工系统及方法
KR102497645B1 (ko) * 2021-06-23 2023-02-08 인하대학교 산학협력단 금형 표면 레이저 가공하는 방법
EP4137263A1 (de) * 2021-08-20 2023-02-22 Bystronic Laser AG Halterung für ein transmissives optisches element, laserbearbeitungvorrichtung mit einer solchen halterung und verfahren zum verstellen der position eines transmissiven optischen elements unter verwendung einer solchen halterung
CN113897608A (zh) * 2021-10-23 2022-01-07 河南省锅炉压力容器安全检测研究院 一种用于阀门密封面的激光表面强化加工设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54116356A (en) * 1978-03-03 1979-09-10 Hitachi Ltd Welding method by laser
FR2577052B1 (fr) * 1985-02-05 1988-09-09 Bertin & Cie Procede et dispositif de deplacement du point d'impact d'un faisceau laser sur une piece
HU217738B (hu) * 1991-01-17 2000-04-28 United Distillers Plc. Eljárás és berendezés mozgó tárgyak megjelölésére
JPH05209731A (ja) * 1992-01-31 1993-08-20 Fanuc Ltd レーザロボットの光軸調整方法
JP3060813B2 (ja) 1993-12-28 2000-07-10 トヨタ自動車株式会社 レーザ加工装置
JPH0885866A (ja) * 1994-09-16 1996-04-02 Sumitomo Metal Mining Co Ltd Ｉｔｏ焼結体の製造方法
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces

Also Published As

Publication number Publication date
WO2003059568A1 (en) 2003-07-24
GB0412827D0 (en) 2004-07-14
JP2005532908A (ja) 2005-11-04
KR100982677B1 (ko) 2010-09-17
CN1612793A (zh) 2005-05-04
DE10392185T5 (de) 2004-12-02
CN1299873C (zh) 2007-02-14
CA2469520A1 (en) 2003-07-24
GB2397545B (en) 2005-05-11
AU2003214818A1 (en) 2003-07-30
JP4340745B2 (ja) 2009-10-07
TW200301718A (en) 2003-07-16
KR20040073542A (ko) 2004-08-19
GB2397545A (en) 2004-07-28

Similar Documents

Publication Publication Date Title
TW564196B (en) Simulated laser spot enlargement
US6706998B2 (en) Simulated laser spot enlargement
JP2005532908A5 (https=)
US6407363B2 (en) Laser system and method for single press micromachining of multilayer workpieces
JP4490883B2 (ja) レーザ加工装置およびレーザ加工方法
US6720524B1 (en) Method and apparatus for laser drilling
CN103394805B (zh) 激光切割打孔装置及切割打孔方法
JP7146770B2 (ja) レーザ加工装置における光学部品の寿命を延ばすための方法及びシステム
JP2016516584A (ja) テーパ制御のためのビーム角度とワークピース移動の連係方法
CN1301178C (zh) 半导体中微结构的紫外线激光烧蚀的图案化
JP2007508946A (ja) 局所的に加熱されたターゲット材料のレーザ加工
CN116833551B (zh) 用于复合材料钻孔的GHz脉冲串激光光源系统与方法
JP5183826B2 (ja) レーザ加工方法およびレーザ加工機
JP2008279472A (ja) レーザマーキング装置
JP2008137058A (ja) レーザ加工装置及びレーザ加工方法
CN100351719C (zh) 准连续波二极管泵浦固体紫外激光系统及其使用方法
TWI869831B (zh) 用於複合材料鑽孔的GHz脈衝串雷射光源系統與方法
Pique et al. Laser Direct-Write
Bohrer Lasers in Electronics Manufacturing–Then, Now and Tomorrow
JP2022108281A (ja) 窒化皮膜形成装置及び窒化皮膜形成方法
JP2006150398A (ja) レーザ溶接装置、及びレーザ溶接方法
CN101511524A (zh) 用于在具有非恒定速度的时段期间进行激光处理的系统和方法

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent