TW561808B - Method of copper plating small hole - Google Patents
Method of copper plating small hole Download PDFInfo
- Publication number
- TW561808B TW561808B TW091123729A TW91123729A TW561808B TW 561808 B TW561808 B TW 561808B TW 091123729 A TW091123729 A TW 091123729A TW 91123729 A TW91123729 A TW 91123729A TW 561808 B TW561808 B TW 561808B
- Authority
- TW
- Taiwan
- Prior art keywords
- small hole
- plating
- copper
- mouth
- copper plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001317878 | 2001-10-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW561808B true TW561808B (en) | 2003-11-11 |
Family
ID=19135677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091123729A TW561808B (en) | 2001-10-16 | 2002-10-15 | Method of copper plating small hole |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040011654A1 (zh) |
JP (1) | JP4148895B2 (zh) |
KR (1) | KR20040045390A (zh) |
CN (1) | CN1283848C (zh) |
TW (1) | TW561808B (zh) |
WO (1) | WO2003033775A1 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040074775A1 (en) * | 2002-10-21 | 2004-04-22 | Herdman Roderick Dennis | Pulse reverse electrolysis of acidic copper electroplating solutions |
DE102004045451B4 (de) * | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
SE0403047D0 (sv) * | 2004-12-14 | 2004-12-14 | Polymer Kompositer I Goeteborg | Pulse-plating method and apparatus |
KR100632552B1 (ko) * | 2004-12-30 | 2006-10-11 | 삼성전기주식회사 | 내부 비아홀의 필 도금 구조 및 그 제조 방법 |
US20060226014A1 (en) * | 2005-04-11 | 2006-10-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and process for improved uniformity of electrochemical plating films produced in semiconductor device processing |
JP4764718B2 (ja) | 2005-12-28 | 2011-09-07 | 新光電気工業株式会社 | スルーホールの充填方法 |
JP5246103B2 (ja) | 2008-10-16 | 2013-07-24 | 大日本印刷株式会社 | 貫通電極基板の製造方法 |
JP5428280B2 (ja) * | 2008-10-16 | 2014-02-26 | 大日本印刷株式会社 | 貫通電極基板及び貫通電極基板を用いた半導体装置 |
JP6161863B2 (ja) * | 2010-12-28 | 2017-07-12 | 株式会社荏原製作所 | 電気めっき方法 |
JP5981455B2 (ja) | 2011-01-26 | 2016-08-31 | エンソン インコーポレイテッド | マイクロ電子工業におけるビアホール充填方法 |
CN102443828B (zh) * | 2011-09-23 | 2014-11-19 | 上海华力微电子有限公司 | 一种在半导体硅片的通孔中进行电镀铜的方法 |
TWI454422B (zh) * | 2012-04-12 | 2014-10-01 | Nat Univ Tsing Hua | 具高密度雙晶的奈米銅導線製造方法 |
CN104109886A (zh) * | 2013-04-22 | 2014-10-22 | 广东致卓精密金属科技有限公司 | 一种超填孔镀铜工艺 |
US10154598B2 (en) | 2014-10-13 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Filling through-holes |
JP2017199854A (ja) | 2016-04-28 | 2017-11-02 | Tdk株式会社 | 貫通配線基板 |
JP7087760B2 (ja) * | 2018-07-18 | 2022-06-21 | 住友金属鉱山株式会社 | 銅張積層板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4517059A (en) * | 1981-07-31 | 1985-05-14 | The Boeing Company | Automated alternating polarity direct current pulse electrolytic processing of metals |
JPH0356696A (ja) * | 1989-07-24 | 1991-03-12 | Canon Inc | 湿式電解処理装置 |
JPH07336017A (ja) * | 1994-06-08 | 1995-12-22 | Hitachi Ltd | 電流反転電解法による薄膜回路製造方法ならびにそれを用いた薄膜回路基板、薄膜多層回路基板および電子回路装置 |
US5486280A (en) * | 1994-10-20 | 1996-01-23 | Martin Marietta Energy Systems, Inc. | Process for applying control variables having fractal structures |
DE19545231A1 (de) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
JPH1143797A (ja) * | 1997-07-25 | 1999-02-16 | Hideo Honma | ビアフィリング方法 |
US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
DE69929967T2 (de) * | 1998-04-21 | 2007-05-24 | Applied Materials, Inc., Santa Clara | Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten |
JP4132273B2 (ja) * | 1998-08-25 | 2008-08-13 | 日本リーロナール有限会社 | 充填されたブラインドビアホールを有するビルドアッププリント配線板の製造方法 |
MY128333A (en) * | 1998-09-14 | 2007-01-31 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
JP3594894B2 (ja) * | 2000-02-01 | 2004-12-02 | 新光電気工業株式会社 | ビアフィリングめっき方法 |
JP4339980B2 (ja) * | 2000-03-14 | 2009-10-07 | 沖プリンテッドサーキット株式会社 | 電解メッキ装置 |
-
2002
- 2002-10-09 WO PCT/JP2002/010483 patent/WO2003033775A1/ja active Application Filing
- 2002-10-09 CN CNB028031326A patent/CN1283848C/zh not_active Expired - Fee Related
- 2002-10-09 JP JP2003536491A patent/JP4148895B2/ja not_active Expired - Fee Related
- 2002-10-09 US US10/416,304 patent/US20040011654A1/en not_active Abandoned
- 2002-10-09 KR KR10-2003-7006763A patent/KR20040045390A/ko not_active Application Discontinuation
- 2002-10-15 TW TW091123729A patent/TW561808B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2003033775A1 (fr) | 2003-04-24 |
KR20040045390A (ko) | 2004-06-01 |
JPWO2003033775A1 (ja) | 2005-02-03 |
JP4148895B2 (ja) | 2008-09-10 |
CN1476492A (zh) | 2004-02-18 |
CN1283848C (zh) | 2006-11-08 |
US20040011654A1 (en) | 2004-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI268966B (en) | Electrolytic copper plating method | |
TW561808B (en) | Method of copper plating small hole | |
EP2010698B1 (en) | Process for electrolytically plating copper | |
ES2726013T3 (es) | Soluciones electrolíticas de ácido sulfónico de pureza elevada | |
TW200516176A (en) | Electroplating compositions and methods for electroplating | |
JP4932370B2 (ja) | 電解めっき方法、プリント配線板及び半導体ウェハー | |
CN113802158B (zh) | 一种电镀液及其应用、镀铜工艺及镀件 | |
US4469569A (en) | Cyanide-free copper plating process | |
JP4857317B2 (ja) | スルーホールの充填方法 | |
CN109972180A (zh) | 2,2'-二硫代二吡啶的新用途及采用其的电镀填孔添加剂及采用该添加剂的电镀方法 | |
ES2531163T3 (es) | Procedimiento y electrolito para la deposición galvánica de bronces | |
KR102381835B1 (ko) | 전해 구리 도금용 양극 및 그것을 이용한 전해 구리 도금 장치 | |
JP2009062577A (ja) | ニッケルめっき浴 | |
JP6031319B2 (ja) | 電解銅めっき液及び電解銅めっき方法 | |
CN100362141C (zh) | 丙三醇无氰光亮镀铜液 | |
JPS644091A (en) | Plating | |
WO2002029875A3 (en) | Plating system with remote secondary anode for semiconductor manufacturing | |
SE446197B (sv) | Forfarande for framstellning av metallkomplexlosningar, lempad att anvendas vid stromlos metallavskiljning | |
US9399618B2 (en) | High purity electrolytic sulfonic acid solutions | |
JP2006283169A (ja) | 酸性電気銅めっき液、及び含硫黄有機化合物の電解消耗量の少ない電気銅めっき方法 | |
JPS63186889A (ja) | 高速連続光沢ニツケルめつき方法 | |
JP2010138429A (ja) | 不溶性陽極を用いた電解銅めっき方法 | |
CN105018987A (zh) | 一种钇-镍-铁合金电镀液及其电镀方法 | |
Kline | Alkaline Non-Cyanide Copper Plating | |
CN105463527A (zh) | 一种镍-铁-锌合金电镀液及其电镀方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |