TW559619B - Glass cutting method and apparatus - Google Patents

Glass cutting method and apparatus Download PDF

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Publication number
TW559619B
TW559619B TW091109172A TW91109172A TW559619B TW 559619 B TW559619 B TW 559619B TW 091109172 A TW091109172 A TW 091109172A TW 91109172 A TW91109172 A TW 91109172A TW 559619 B TW559619 B TW 559619B
Authority
TW
Taiwan
Prior art keywords
glass
laser beam
section
end portion
patent application
Prior art date
Application number
TW091109172A
Other languages
English (en)
Chinese (zh)
Inventor
Hyoung-Shik Kang
Soon-Kug Hong
Seok-Chang Oh
Min-Gyu Song
Kwang-Yeol Baek
Original Assignee
Lg Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronics Inc filed Critical Lg Electronics Inc
Application granted granted Critical
Publication of TW559619B publication Critical patent/TW559619B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
TW091109172A 2002-04-25 2002-04-30 Glass cutting method and apparatus TW559619B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2002-0022631A KR100495051B1 (ko) 2002-04-25 2002-04-25 유리 절단 방법 및 장치

Publications (1)

Publication Number Publication Date
TW559619B true TW559619B (en) 2003-11-01

Family

ID=32322208

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091109172A TW559619B (en) 2002-04-25 2002-04-30 Glass cutting method and apparatus

Country Status (2)

Country Link
KR (1) KR100495051B1 (ko)
TW (1) TW559619B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022141807A1 (zh) * 2020-12-29 2022-07-07 武汉华工激光工程有限责任公司 曲面厚玻璃切割及裂片方法以及系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180063936A (ko) 2016-12-02 2018-06-14 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60251138A (ja) * 1984-05-28 1985-12-11 Hoya Corp ガラスの切断方法
KR100559945B1 (ko) * 1999-01-15 2006-03-13 삼성전자주식회사 레이저를 이용한 절단 장치
KR100300418B1 (ko) * 1999-01-18 2001-09-22 김순택 비금속 재료의 절단방법 및 그 장치
KR20010049021A (ko) * 1999-11-30 2001-06-15 윤종용 유리 기판 절단 장치 및 그 방법
KR100347956B1 (ko) * 1999-12-29 2002-08-09 엘지전자주식회사 레이저빔을 이용한 유리 절단장치
KR100371011B1 (ko) * 2000-07-24 2003-02-06 로체 시스템즈(주) 비금속 재료의 절단방법 및 절단장치
KR100381165B1 (ko) * 2000-12-01 2003-04-26 엘지전자 주식회사 유리 절단 장치 및 그 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022141807A1 (zh) * 2020-12-29 2022-07-07 武汉华工激光工程有限责任公司 曲面厚玻璃切割及裂片方法以及系统

Also Published As

Publication number Publication date
KR20030084119A (ko) 2003-11-01
KR100495051B1 (ko) 2005-06-14

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MM4A Annulment or lapse of patent due to non-payment of fees