TW556208B - Fault-tolerant solid state memory - Google Patents
Fault-tolerant solid state memory Download PDFInfo
- Publication number
- TW556208B TW556208B TW091111533A TW91111533A TW556208B TW 556208 B TW556208 B TW 556208B TW 091111533 A TW091111533 A TW 091111533A TW 91111533 A TW91111533 A TW 91111533A TW 556208 B TW556208 B TW 556208B
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- TW
- Taiwan
- Prior art keywords
- address
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- Prior art date
Links
- 239000007787 solid Substances 0.000 title claims abstract description 5
- 230000002950 deficient Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 26
- 230000007547 defect Effects 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 8
- 230000005855 radiation Effects 0.000 description 7
- 230000002079 cooperative effect Effects 0.000 description 5
- 238000007726 management method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052778 Plutonium Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
Landscapes
- Read Only Memory (AREA)
- Semiconductor Memories (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/911,968 US6744681B2 (en) | 2001-07-24 | 2001-07-24 | Fault-tolerant solid state memory |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW556208B true TW556208B (en) | 2003-10-01 |
Family
ID=25431188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091111533A TW556208B (en) | 2001-07-24 | 2002-05-30 | Fault-tolerant solid state memory |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6744681B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1288968A3 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2003124441A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20030011601A (cg-RX-API-DMAC7.html) |
| CN (1) | CN1316505C (cg-RX-API-DMAC7.html) |
| TW (1) | TW556208B (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI383392B (zh) * | 2007-06-18 | 2013-01-21 | Micron Technology Inc | 用於在一非揮發固態記憶體及其固態記憶體裝置中程式化速率判定及控制的方法 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5673218A (en) | 1996-03-05 | 1997-09-30 | Shepard; Daniel R. | Dual-addressed rectifier storage device |
| US6956757B2 (en) * | 2000-06-22 | 2005-10-18 | Contour Semiconductor, Inc. | Low cost high density rectifier matrix memory |
| US7003713B2 (en) * | 2002-05-16 | 2006-02-21 | Broadcom Corporation | Variable Hamming error correction for a one-time-programmable-ROM |
| JP4892215B2 (ja) * | 2005-09-28 | 2012-03-07 | 富士通セミコンダクター株式会社 | 半導体記憶装置 |
| US7898882B2 (en) * | 2006-06-23 | 2011-03-01 | Synopsys, Inc. | Architecture, system and method for compressing repair data in an integrated circuit (IC) design |
| US7813157B2 (en) * | 2007-10-29 | 2010-10-12 | Contour Semiconductor, Inc. | Non-linear conductor memory |
| US20090225621A1 (en) * | 2008-03-05 | 2009-09-10 | Shepard Daniel R | Split decoder storage array and methods of forming the same |
| US20090296445A1 (en) * | 2008-06-02 | 2009-12-03 | Shepard Daniel R | Diode decoder array with non-sequential layout and methods of forming the same |
| US8325556B2 (en) * | 2008-10-07 | 2012-12-04 | Contour Semiconductor, Inc. | Sequencing decoder circuit |
| JP5297342B2 (ja) * | 2009-11-02 | 2013-09-25 | 株式会社東芝 | 不揮発性半導体記憶装置 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3689900A (en) * | 1970-08-31 | 1972-09-05 | Gen Electric | Photo-coded diode array for read only memory |
| DE2050125A1 (de) * | 1970-10-13 | 1972-04-20 | Moeller J D Optik | Verfahren zur Herstellung von elektrischen Sicherungselementen |
| US4389715A (en) * | 1980-10-06 | 1983-06-21 | Inmos Corporation | Redundancy scheme for a dynamic RAM |
| US4489402A (en) * | 1981-04-25 | 1984-12-18 | Tokyo Shibaura Denki Kabushiki Kaisha | Semiconductor memory device |
| JPS58125299A (ja) * | 1982-01-19 | 1983-07-26 | Toshiba Corp | 冗長度を有するメモリ装置 |
| US4751197A (en) * | 1984-07-18 | 1988-06-14 | Texas Instruments Incorporated | Make-link programming of semiconductor devices using laser enhanced thermal breakdown of insulator |
| US4654830A (en) * | 1984-11-27 | 1987-03-31 | Monolithic Memories, Inc. | Method and structure for disabling and replacing defective memory in a PROM |
| US4783732A (en) * | 1985-12-12 | 1988-11-08 | Itt Corporation | Two-wire/three-port RAM for cellular array processor |
| US5166901A (en) * | 1986-05-14 | 1992-11-24 | Raytheon Company | Programmable memory cell structure including a refractory metal barrier layer |
| GB8612454D0 (en) * | 1986-05-22 | 1986-07-02 | Inmos Ltd | Redundancy scheme for multi-stage apparatus |
| US4868616A (en) * | 1986-12-11 | 1989-09-19 | Energy Conversion Devices, Inc. | Amorphous electronic matrix array for liquid crystal display |
| US4988891A (en) * | 1989-05-09 | 1991-01-29 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor neural network including photosensitive coupling elements |
| US5195010A (en) * | 1990-01-23 | 1993-03-16 | Thomson, S.A. | Electrostatic discharge voltage protection circuit for a solid state instrument |
| US5241212A (en) * | 1990-05-01 | 1993-08-31 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a redundant circuit portion and a manufacturing method of the same |
| US5412593A (en) * | 1994-01-12 | 1995-05-02 | Texas Instruments Incorporated | Fuse and antifuse reprogrammable link for integrated circuits |
| US5625218A (en) * | 1994-06-17 | 1997-04-29 | Nippondenso Co., Ltd. | Semiconductor device equipped with a heat-fusible thin film resistor and production method thereof |
| US5457649A (en) * | 1994-08-26 | 1995-10-10 | Microchip Technology, Inc. | Semiconductor memory device and write-once, read-only semiconductor memory array using amorphous-silicon and method therefor |
| JPH0877776A (ja) * | 1994-09-06 | 1996-03-22 | Mitsubishi Electric Corp | 半導体記憶装置 |
| KR970001564U (ko) * | 1995-06-21 | 1997-01-21 | 자동차용 후부차체의 보강구조 | |
| US5889694A (en) * | 1996-03-05 | 1999-03-30 | Shepard; Daniel R. | Dual-addressed rectifier storage device |
| US5798974A (en) * | 1996-05-15 | 1998-08-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device realizing high speed access and low power consumption with redundant circuit |
| US5835396A (en) * | 1996-10-17 | 1998-11-10 | Zhang; Guobiao | Three-dimensional read-only memory |
| US5941997A (en) * | 1996-11-26 | 1999-08-24 | Play Incorporated | Current-based contention detection and handling system |
| KR100258975B1 (ko) * | 1996-12-10 | 2000-06-15 | 윤종용 | 반도체 메모리장치 |
| US5877798A (en) * | 1997-03-21 | 1999-03-02 | Lexmark International Inc. | Method and apparatus for automatically determining the style printhead installed in a laser printer |
| US6058052A (en) * | 1997-08-21 | 2000-05-02 | Cypress Semiconductor Corp. | Redundancy scheme providing improvements in redundant circuit access time and integrated circuit layout area |
| JP2870530B1 (ja) * | 1997-10-30 | 1999-03-17 | 日本電気株式会社 | スタックモジュール用インターポーザとスタックモジュール |
| JPH11203889A (ja) * | 1998-01-19 | 1999-07-30 | Mitsubishi Electric Corp | 半導体記憶装置 |
| NO308149B1 (no) * | 1998-06-02 | 2000-07-31 | Thin Film Electronics Asa | Skalerbar, integrert databehandlingsinnretning |
| US6021079A (en) * | 1998-05-13 | 2000-02-01 | Richard Mann | Fast, low cost method of developing code for contact programmable ROMs |
| US5956276A (en) * | 1998-09-16 | 1999-09-21 | Mosel Vitelic Corporation | Semiconductor memory having predecoder control of spare column select lines |
| US6408401B1 (en) * | 1998-11-13 | 2002-06-18 | Compaq Information Technologies Group, L.P. | Embedded RAM with self-test and self-repair with spare rows and columns |
| US6034882A (en) * | 1998-11-16 | 2000-03-07 | Matrix Semiconductor, Inc. | Vertically stacked field programmable nonvolatile memory and method of fabrication |
| US6385024B1 (en) * | 2000-03-07 | 2002-05-07 | Ss8 Networks, Inc. | System and method for monitoring current consumption from current share components |
| JP2002008370A (ja) * | 2000-06-21 | 2002-01-11 | Mitsubishi Electric Corp | 半導体記憶装置 |
-
2001
- 2001-07-24 US US09/911,968 patent/US6744681B2/en not_active Expired - Lifetime
-
2002
- 2002-05-30 TW TW091111533A patent/TW556208B/zh not_active IP Right Cessation
- 2002-07-11 JP JP2002202557A patent/JP2003124441A/ja not_active Withdrawn
- 2002-07-19 EP EP02255084A patent/EP1288968A3/en not_active Withdrawn
- 2002-07-23 KR KR1020020043157A patent/KR20030011601A/ko not_active Ceased
- 2002-07-24 CN CNB02126953XA patent/CN1316505C/zh not_active Expired - Lifetime
-
2004
- 2004-05-13 US US10/846,024 patent/US20040213059A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI383392B (zh) * | 2007-06-18 | 2013-01-21 | Micron Technology Inc | 用於在一非揮發固態記憶體及其固態記憶體裝置中程式化速率判定及控制的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003124441A (ja) | 2003-04-25 |
| EP1288968A2 (en) | 2003-03-05 |
| US20030023897A1 (en) | 2003-01-30 |
| EP1288968A3 (en) | 2004-10-27 |
| US6744681B2 (en) | 2004-06-01 |
| KR20030011601A (ko) | 2003-02-11 |
| US20040213059A1 (en) | 2004-10-28 |
| CN1316505C (zh) | 2007-05-16 |
| CN1399281A (zh) | 2003-02-26 |
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Legal Events
| Date | Code | Title | Description |
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| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |