TW552655B - Arrangement and method for detecting defects on a substrate in a processing tool - Google Patents

Arrangement and method for detecting defects on a substrate in a processing tool Download PDF

Info

Publication number
TW552655B
TW552655B TW091110389A TW91110389A TW552655B TW 552655 B TW552655 B TW 552655B TW 091110389 A TW091110389 A TW 091110389A TW 91110389 A TW91110389 A TW 91110389A TW 552655 B TW552655 B TW 552655B
Authority
TW
Taiwan
Prior art keywords
substrate
optical sensor
semiconductor wafer
image
transfer area
Prior art date
Application number
TW091110389A
Other languages
English (en)
Chinese (zh)
Inventor
Torsten Seidel
Ralf Otto
Karl Schumacher
Thorsten Schedel
Eckhard Marx
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Application granted granted Critical
Publication of TW552655B publication Critical patent/TW552655B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW091110389A 2001-05-17 2002-05-17 Arrangement and method for detecting defects on a substrate in a processing tool TW552655B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01112140A EP1258915A1 (en) 2001-05-17 2001-05-17 Method of detecting defects on a semiconductor device in a processing tool and an arrangement therefore

Publications (1)

Publication Number Publication Date
TW552655B true TW552655B (en) 2003-09-11

Family

ID=8177464

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091110389A TW552655B (en) 2001-05-17 2002-05-17 Arrangement and method for detecting defects on a substrate in a processing tool

Country Status (6)

Country Link
US (1) US20040117055A1 (https=)
EP (2) EP1258915A1 (https=)
JP (1) JP3978140B2 (https=)
KR (1) KR100788055B1 (https=)
TW (1) TW552655B (https=)
WO (1) WO2002093639A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101661873A (zh) * 2008-08-28 2010-03-03 东京应化工业株式会社 基板处理系统、输送装置及涂敷装置
US8919756B2 (en) 2008-08-28 2014-12-30 Tokyo Ohka Kogyo Co., Ltd. Substrate processing system, carrying device, and coating device
US9214372B2 (en) 2008-08-28 2015-12-15 Tokyo Ohka Kogyo Co., Ltd. Substrate processing system, carrying device and coating device
TWI737207B (zh) * 2020-03-04 2021-08-21 鏵友益科技股份有限公司 半導體檢測模組

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7324193B2 (en) * 2006-03-30 2008-01-29 Tokyo Electron Limited Measuring a damaged structure formed on a wafer using optical metrology
US7576851B2 (en) * 2006-03-30 2009-08-18 Tokyo Electron Limited Creating a library for measuring a damaged structure formed on a wafer using optical metrology
US7623978B2 (en) * 2006-03-30 2009-11-24 Tokyo Electron Limited Damage assessment of a wafer using optical metrology
US7619731B2 (en) * 2006-03-30 2009-11-17 Tokyo Electron Limited Measuring a damaged structure formed on a wafer using optical metrology
US20080183331A1 (en) * 2007-01-31 2008-07-31 Jih-Hsien Yeh Semiconductor process tool
JP4324622B2 (ja) * 2007-04-18 2009-09-02 アドバンスド・マスク・インスペクション・テクノロジー株式会社 レチクル欠陥検査装置およびレチクル欠陥検査方法
US8120376B2 (en) * 2007-12-12 2012-02-21 Novellus Systems, Inc. Fault detection apparatuses and methods for fault detection of semiconductor processing tools
IL188825A0 (en) * 2008-01-16 2008-11-03 Orbotech Ltd Inspection of a substrate using multiple cameras
US7815824B2 (en) * 2008-02-26 2010-10-19 Molecular Imprints, Inc. Real time imprint process diagnostics for defects
US20100095862A1 (en) * 2008-10-22 2010-04-22 Molecular Imprints, Inc. Double Sidewall Angle Nano-Imprint Template
JP6017134B2 (ja) * 2011-12-13 2016-10-26 東京エレクトロン株式会社 生産効率化システム、生産効率化装置および生産効率化方法
US9996766B2 (en) 2015-05-01 2018-06-12 Corning Incorporated Imaging-based methods for detecting and measuring defects in extruded cellular ceramic articles
WO2016187180A1 (en) 2015-05-21 2016-11-24 Corning Incorporated Methods for inspecting cellular articles
US9791849B2 (en) 2015-05-26 2017-10-17 GlobalFoundries, Inc. Defect detection process in a semiconductor manufacturing environment
DE102016114190A1 (de) * 2016-08-01 2018-02-01 Schott Schweiz Ag Verfahren und Vorrichtung zur optischen Untersuchung transparenter Körper
US11423526B2 (en) * 2020-11-13 2022-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Optical inspection of a wafer
KR102911513B1 (ko) * 2021-08-17 2026-01-12 도쿄엘렉트론가부시키가이샤 반도체 플라즈마 공정 챔버 내의 소모성 부품의 특성을 측정하기 위한 광센서

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3558223A (en) * 1968-10-25 1971-01-26 Xerox Corp Document centering apparatus
US4641967A (en) * 1985-10-11 1987-02-10 Tencor Instruments Particle position correlator and correlation method for a surface scanner
US4881863A (en) * 1987-12-17 1989-11-21 Primary Systems Corporation Apparatus for inspecting wafers
US5124927A (en) * 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
US5274434A (en) * 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
US5949901A (en) * 1996-03-21 1999-09-07 Nichani; Sanjay Semiconductor device image inspection utilizing image subtraction and threshold imaging
US6594012B2 (en) * 1996-07-05 2003-07-15 Canon Kabushiki Kaisha Exposure apparatus
JPH10213422A (ja) * 1997-01-29 1998-08-11 Hitachi Ltd パタ−ン検査装置
US5909276A (en) * 1997-03-31 1999-06-01 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
US6002199A (en) * 1997-05-30 1999-12-14 Candescent Technologies Corporation Structure and fabrication of electron-emitting device having ladder-like emitter electrode
KR100274596B1 (ko) * 1997-06-05 2000-12-15 윤종용 반도체장치 제조용 노광설비의 스테이지 홀더 상의 파티클 감지방법과 이를 이용한 감지장치 및 그 제어방법
JP3397101B2 (ja) * 1997-10-29 2003-04-14 株式会社日立製作所 欠陥検査方法および装置
US6947587B1 (en) * 1998-04-21 2005-09-20 Hitachi, Ltd. Defect inspection method and apparatus
US6956963B2 (en) * 1998-07-08 2005-10-18 Ismeca Europe Semiconductor Sa Imaging for a machine-vision system
US6200823B1 (en) * 1999-02-09 2001-03-13 Advanced Micro Devices, Inc. Method for isolation of optical defect images
KR100312081B1 (ko) * 1999-10-04 2001-11-03 이환용 프로그램가능한 영역 스캔 비전 검사 시스템

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101661873A (zh) * 2008-08-28 2010-03-03 东京应化工业株式会社 基板处理系统、输送装置及涂敷装置
US8919756B2 (en) 2008-08-28 2014-12-30 Tokyo Ohka Kogyo Co., Ltd. Substrate processing system, carrying device, and coating device
US9214372B2 (en) 2008-08-28 2015-12-15 Tokyo Ohka Kogyo Co., Ltd. Substrate processing system, carrying device and coating device
TWI737207B (zh) * 2020-03-04 2021-08-21 鏵友益科技股份有限公司 半導體檢測模組

Also Published As

Publication number Publication date
KR20030096400A (ko) 2003-12-24
EP1390974A2 (en) 2004-02-25
WO2002093639A3 (en) 2003-03-20
JP3978140B2 (ja) 2007-09-19
KR100788055B1 (ko) 2007-12-21
EP1258915A1 (en) 2002-11-20
US20040117055A1 (en) 2004-06-17
WO2002093639A2 (en) 2002-11-21
JP2004525528A (ja) 2004-08-19

Similar Documents

Publication Publication Date Title
TW552655B (en) Arrangement and method for detecting defects on a substrate in a processing tool
US7227628B1 (en) Wafer inspection systems and methods for analyzing inspection data
TWI587082B (zh) Mask inspection device, mask evaluation method and mask evaluation system
CN101655463B (zh) 物体表面上的颗粒检测
US6292260B1 (en) System and method of optically inspecting surface structures on an object
JP6310263B2 (ja) 検査装置
CN107533016A (zh) 基板的检查方法、基板处理系统和计算机存储介质
JP2004012325A (ja) 欠陥検査方法および欠陥検査装置
JP2012251785A (ja) 検査装置および検査方法
TW201432252A (zh) 基板之缺陷檢查方法、基板之缺陷檢查裝置、程式及電腦記憶媒體
JP2004525528A5 (https=)
JP5780936B2 (ja) 検査装置
JP2014109436A (ja) 基板の欠陥検査方法、基板の欠陥検査装置、プログラム及びコンピュータ記憶媒体
JP5837649B2 (ja) 基板処理装置、異常処理部判定方法、プログラム及びコンピュータ記憶媒体
JP4448181B2 (ja) パターン検査方法、パターン検査装置及びプログラム
JP6906823B1 (ja) マスク検査方法及びマスク検査装置
JP2021025889A (ja) Ｔｄｉ（時間遅延積分）センサの感度変動の判定方法、パターン検査方法、及びパターン検査装置
JP2004151622A (ja) マスク欠陥検査装置及びマスク欠陥検査方法
JP7222671B2 (ja) パターン検査装置及びパターン検査方法
JPH0979991A (ja) パターン検査装置、欠陥検査装置およびパターン検査方法
JPH03108735A (ja) 比較検査方法および装置
KR102297038B1 (ko) 펠리클 멤브레인의 검사 데이터베이스 구축 방법 및 그 데이터베이스를 이용한 펠리클 멤브레인의 검사 방법
JPH1183752A (ja) 表面状態検査方法及び表面状態検査装置
JP2982413B2 (ja) 共通欠陥検査方法
JPH10300682A (ja) 画像比較装置

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees