TW552655B - Arrangement and method for detecting defects on a substrate in a processing tool - Google Patents
Arrangement and method for detecting defects on a substrate in a processing tool Download PDFInfo
- Publication number
- TW552655B TW552655B TW091110389A TW91110389A TW552655B TW 552655 B TW552655 B TW 552655B TW 091110389 A TW091110389 A TW 091110389A TW 91110389 A TW91110389 A TW 91110389A TW 552655 B TW552655 B TW 552655B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- optical sensor
- semiconductor wafer
- image
- transfer area
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 63
- 230000007547 defect Effects 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 56
- 235000012431 wafers Nutrition 0.000 claims abstract description 56
- 230000003287 optical effect Effects 0.000 claims abstract description 54
- 238000012546 transfer Methods 0.000 claims abstract description 46
- 239000002245 particle Substances 0.000 claims abstract description 18
- 230000033001 locomotion Effects 0.000 claims abstract description 15
- 238000005286 illumination Methods 0.000 claims abstract description 4
- 238000003909 pattern recognition Methods 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000004044 response Effects 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000001459 lithography Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- 230000003292 diminished effect Effects 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005570 vertical transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01112140A EP1258915A1 (en) | 2001-05-17 | 2001-05-17 | Method of detecting defects on a semiconductor device in a processing tool and an arrangement therefore |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW552655B true TW552655B (en) | 2003-09-11 |
Family
ID=8177464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091110389A TW552655B (en) | 2001-05-17 | 2002-05-17 | Arrangement and method for detecting defects on a substrate in a processing tool |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20040117055A1 (enExample) |
| EP (2) | EP1258915A1 (enExample) |
| JP (1) | JP3978140B2 (enExample) |
| KR (1) | KR100788055B1 (enExample) |
| TW (1) | TW552655B (enExample) |
| WO (1) | WO2002093639A2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101661873A (zh) * | 2008-08-28 | 2010-03-03 | 东京应化工业株式会社 | 基板处理系统、输送装置及涂敷装置 |
| US8919756B2 (en) | 2008-08-28 | 2014-12-30 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device, and coating device |
| US9214372B2 (en) | 2008-08-28 | 2015-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device and coating device |
| TWI737207B (zh) * | 2020-03-04 | 2021-08-21 | 鏵友益科技股份有限公司 | 半導體檢測模組 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7324193B2 (en) * | 2006-03-30 | 2008-01-29 | Tokyo Electron Limited | Measuring a damaged structure formed on a wafer using optical metrology |
| US7623978B2 (en) * | 2006-03-30 | 2009-11-24 | Tokyo Electron Limited | Damage assessment of a wafer using optical metrology |
| US7619731B2 (en) * | 2006-03-30 | 2009-11-17 | Tokyo Electron Limited | Measuring a damaged structure formed on a wafer using optical metrology |
| US7576851B2 (en) * | 2006-03-30 | 2009-08-18 | Tokyo Electron Limited | Creating a library for measuring a damaged structure formed on a wafer using optical metrology |
| US20080183331A1 (en) * | 2007-01-31 | 2008-07-31 | Jih-Hsien Yeh | Semiconductor process tool |
| JP4324622B2 (ja) * | 2007-04-18 | 2009-09-02 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | レチクル欠陥検査装置およびレチクル欠陥検査方法 |
| US8120376B2 (en) * | 2007-12-12 | 2012-02-21 | Novellus Systems, Inc. | Fault detection apparatuses and methods for fault detection of semiconductor processing tools |
| IL188825A0 (en) * | 2008-01-16 | 2008-11-03 | Orbotech Ltd | Inspection of a substrate using multiple cameras |
| US7815824B2 (en) * | 2008-02-26 | 2010-10-19 | Molecular Imprints, Inc. | Real time imprint process diagnostics for defects |
| US20100095862A1 (en) * | 2008-10-22 | 2010-04-22 | Molecular Imprints, Inc. | Double Sidewall Angle Nano-Imprint Template |
| JP6017134B2 (ja) * | 2011-12-13 | 2016-10-26 | 東京エレクトロン株式会社 | 生産効率化システム、生産効率化装置および生産効率化方法 |
| US9996766B2 (en) | 2015-05-01 | 2018-06-12 | Corning Incorporated | Imaging-based methods for detecting and measuring defects in extruded cellular ceramic articles |
| MX373583B (es) | 2015-05-21 | 2020-05-11 | Corning Inc | Métodos para inspeccionar artículos celulares |
| US9791849B2 (en) | 2015-05-26 | 2017-10-17 | GlobalFoundries, Inc. | Defect detection process in a semiconductor manufacturing environment |
| DE102016114190A1 (de) * | 2016-08-01 | 2018-02-01 | Schott Schweiz Ag | Verfahren und Vorrichtung zur optischen Untersuchung transparenter Körper |
| US11423526B2 (en) * | 2020-11-13 | 2022-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical inspection of a wafer |
| KR20240051153A (ko) * | 2021-08-17 | 2024-04-19 | 도쿄엘렉트론가부시키가이샤 | 반도체 플라즈마 공정 챔버 내의 소모성 부품의 특성을 측정하기 위한 광센서 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3558223A (en) * | 1968-10-25 | 1971-01-26 | Xerox Corp | Document centering apparatus |
| US4641967A (en) * | 1985-10-11 | 1987-02-10 | Tencor Instruments | Particle position correlator and correlation method for a surface scanner |
| US4881863A (en) * | 1987-12-17 | 1989-11-21 | Primary Systems Corporation | Apparatus for inspecting wafers |
| US5124927A (en) * | 1990-03-02 | 1992-06-23 | International Business Machines Corp. | Latent-image control of lithography tools |
| US5274434A (en) * | 1990-04-02 | 1993-12-28 | Hitachi, Ltd. | Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line |
| US5949901A (en) * | 1996-03-21 | 1999-09-07 | Nichani; Sanjay | Semiconductor device image inspection utilizing image subtraction and threshold imaging |
| US6594012B2 (en) * | 1996-07-05 | 2003-07-15 | Canon Kabushiki Kaisha | Exposure apparatus |
| JPH10213422A (ja) * | 1997-01-29 | 1998-08-11 | Hitachi Ltd | パタ−ン検査装置 |
| KR100540314B1 (ko) * | 1997-03-31 | 2006-01-10 | 마이크로썸, 엘엘씨 | 광학 검사 모듈, 및 통합 처리 도구 내에서 기판 상의 입자 및 결함을 검출하기 위한 방법 |
| US6002199A (en) * | 1997-05-30 | 1999-12-14 | Candescent Technologies Corporation | Structure and fabrication of electron-emitting device having ladder-like emitter electrode |
| KR100274596B1 (ko) * | 1997-06-05 | 2000-12-15 | 윤종용 | 반도체장치 제조용 노광설비의 스테이지 홀더 상의 파티클 감지방법과 이를 이용한 감지장치 및 그 제어방법 |
| JP3397101B2 (ja) * | 1997-10-29 | 2003-04-14 | 株式会社日立製作所 | 欠陥検査方法および装置 |
| US6947587B1 (en) * | 1998-04-21 | 2005-09-20 | Hitachi, Ltd. | Defect inspection method and apparatus |
| US6956963B2 (en) * | 1998-07-08 | 2005-10-18 | Ismeca Europe Semiconductor Sa | Imaging for a machine-vision system |
| US6200823B1 (en) * | 1999-02-09 | 2001-03-13 | Advanced Micro Devices, Inc. | Method for isolation of optical defect images |
| KR100312081B1 (ko) * | 1999-10-04 | 2001-11-03 | 이환용 | 프로그램가능한 영역 스캔 비전 검사 시스템 |
-
2001
- 2001-05-17 EP EP01112140A patent/EP1258915A1/en not_active Withdrawn
-
2002
- 2002-05-10 KR KR1020037014848A patent/KR100788055B1/ko not_active Expired - Fee Related
- 2002-05-10 EP EP02735351A patent/EP1390974A2/en not_active Withdrawn
- 2002-05-10 JP JP2002590411A patent/JP3978140B2/ja not_active Expired - Fee Related
- 2002-05-10 WO PCT/EP2002/005189 patent/WO2002093639A2/en not_active Ceased
- 2002-05-17 TW TW091110389A patent/TW552655B/zh not_active IP Right Cessation
-
2003
- 2003-11-17 US US10/715,073 patent/US20040117055A1/en not_active Abandoned
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101661873A (zh) * | 2008-08-28 | 2010-03-03 | 东京应化工业株式会社 | 基板处理系统、输送装置及涂敷装置 |
| US8919756B2 (en) | 2008-08-28 | 2014-12-30 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device, and coating device |
| US9214372B2 (en) | 2008-08-28 | 2015-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device and coating device |
| TWI737207B (zh) * | 2020-03-04 | 2021-08-21 | 鏵友益科技股份有限公司 | 半導體檢測模組 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1258915A1 (en) | 2002-11-20 |
| EP1390974A2 (en) | 2004-02-25 |
| KR100788055B1 (ko) | 2007-12-21 |
| US20040117055A1 (en) | 2004-06-17 |
| JP3978140B2 (ja) | 2007-09-19 |
| KR20030096400A (ko) | 2003-12-24 |
| JP2004525528A (ja) | 2004-08-19 |
| WO2002093639A2 (en) | 2002-11-21 |
| WO2002093639A3 (en) | 2003-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |