TW550782B - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
TW550782B
TW550782B TW091114599A TW91114599A TW550782B TW 550782 B TW550782 B TW 550782B TW 091114599 A TW091114599 A TW 091114599A TW 91114599 A TW91114599 A TW 91114599A TW 550782 B TW550782 B TW 550782B
Authority
TW
Taiwan
Prior art keywords
substrate
semiconductor
semiconductor module
substrates
main substrate
Prior art date
Application number
TW091114599A
Other languages
English (en)
Chinese (zh)
Inventor
Tetsuya Matsuura
Yasushi Kasatani
Tadashi Ichimasa
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW550782B publication Critical patent/TW550782B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
TW091114599A 2001-10-29 2002-07-02 Semiconductor module TW550782B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001331261A JP2003133518A (ja) 2001-10-29 2001-10-29 半導体モジュール

Publications (1)

Publication Number Publication Date
TW550782B true TW550782B (en) 2003-09-01

Family

ID=19146868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091114599A TW550782B (en) 2001-10-29 2002-07-02 Semiconductor module

Country Status (4)

Country Link
US (1) US6717275B2 (https=)
JP (1) JP2003133518A (https=)
KR (1) KR100497997B1 (https=)
TW (1) TW550782B (https=)

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JP4072505B2 (ja) * 2003-02-28 2008-04-09 エルピーダメモリ株式会社 積層型半導体パッケージ
US7612443B1 (en) * 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
AU2003279044A1 (en) * 2003-09-30 2005-05-11 International Business Machines Corporation Flexible assembly of stacked chips
US7134194B2 (en) * 2003-11-13 2006-11-14 Delphi Technologies, Inc. Method of developing an electronic module
KR100564621B1 (ko) * 2004-04-08 2006-03-28 삼성전자주식회사 버퍼형 메모리 모듈 패키지 및 이를 포함하는 버퍼형메모리 모듈 스택 패키지
WO2006019911A1 (en) * 2004-07-26 2006-02-23 Sun Microsystems, Inc. Multi-chip module and single-chip module for chips and proximity connectors
US7425760B1 (en) * 2004-10-13 2008-09-16 Sun Microsystems, Inc. Multi-chip module structure with power delivery using flexible cables
US8072058B2 (en) * 2004-10-25 2011-12-06 Amkor Technology, Inc. Semiconductor package having a plurality input/output members
KR100590477B1 (ko) 2004-12-22 2006-06-19 삼성전자주식회사 마더보드의 가장자리를 이용한 메모리 모듈과 마더보드의접속 구조 및 이에 적합한 구조의 메모리 모듈
JP2006261566A (ja) 2005-03-18 2006-09-28 Alps Electric Co Ltd 電子部品用ホルダ及び電子部品用保持シート、これらを用いた電子モジュール、電子モジュールの積層体、電子モジュールの製造方法並びに検査方法
FR2884048A1 (fr) * 2005-04-01 2006-10-06 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
FR2884049B1 (fr) * 2005-04-01 2007-06-22 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
JP4036872B2 (ja) * 2005-05-18 2008-01-23 アルプス電気株式会社 半導体装置の製造方法
JP4735088B2 (ja) * 2005-07-08 2011-07-27 株式会社安川電機 サーボアンプモジュール
US7416552B2 (en) 2005-08-22 2008-08-26 St. Jude Medical, Atrial Fibrillation Division, Inc. Multipolar, multi-lumen, virtual-electrode catheter with at least one surface electrode and method for ablation
US7605454B2 (en) * 2006-01-11 2009-10-20 Entorian Technologies, Lp Memory card and method for devising
US7508058B2 (en) * 2006-01-11 2009-03-24 Entorian Technologies, Lp Stacked integrated circuit module
US20070158811A1 (en) * 2006-01-11 2007-07-12 James Douglas Wehrly Low profile managed memory component
US7304382B2 (en) * 2006-01-11 2007-12-04 Staktek Group L.P. Managed memory component
US7608920B2 (en) * 2006-01-11 2009-10-27 Entorian Technologies, Lp Memory card and method for devising
US7402048B2 (en) * 2006-03-30 2008-07-22 Intel Corporation Technique for blind-mating daughtercard to mainboard
US7514773B2 (en) * 2006-08-31 2009-04-07 Intel Corporation Systems and arrangements for interconnecting integrated circuit dies
SG149726A1 (en) 2007-07-24 2009-02-27 Micron Technology Inc Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
SG150396A1 (en) 2007-08-16 2009-03-30 Micron Technology Inc Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
JP5097006B2 (ja) * 2008-05-14 2012-12-12 株式会社フジクラ プリント配線基板及びその製造方法
US8314487B2 (en) * 2009-12-18 2012-11-20 Infineon Technologies Ag Flange for semiconductor die
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
KR102497583B1 (ko) 2015-10-27 2023-02-10 삼성전자주식회사 유연한 연결부를 갖는 반도체 장치 및 그 제조방법
JP6380581B1 (ja) 2017-03-08 2018-08-29 日本電気株式会社 基板、回路基板、電子部品、および電子部品組立体
KR102152101B1 (ko) * 2018-11-02 2020-09-07 진영글로벌 주식회사 차량 전장용 디바이스
TWI762058B (zh) * 2020-12-02 2022-04-21 恆勁科技股份有限公司 半導體封裝件
US12250771B2 (en) * 2022-07-21 2025-03-11 Rockwell Collins, Inc. Capacitor bank assembly

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62260353A (ja) 1986-05-06 1987-11-12 Mitsubishi Electric Corp 半導体装置
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
EP0509065A1 (en) * 1990-08-01 1992-10-21 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
FR2694840B1 (fr) * 1992-08-13 1994-09-09 Commissariat Energie Atomique Module multi-puces à trois dimensions.
KR100209782B1 (ko) * 1994-08-30 1999-07-15 가나이 쓰도무 반도체 장치
KR0147259B1 (ko) * 1994-10-27 1998-08-01 김광호 적층형 패키지 및 그 제조방법
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies
JP3012184B2 (ja) 1996-01-12 2000-02-21 富士通株式会社 実装装置
JPH10242379A (ja) 1997-02-25 1998-09-11 Hitachi Ltd 半導体モジュール
JPH10289929A (ja) 1997-04-14 1998-10-27 Seiko Epson Corp 表面実装部品の実装方法
JP3996668B2 (ja) * 1997-05-27 2007-10-24 富士通株式会社 半導体装置用ソケット
US5910885A (en) * 1997-12-03 1999-06-08 White Electronic Designs Corporation Electronic stack module
JPH11186454A (ja) 1997-12-22 1999-07-09 Nippon Avionics Co Ltd Ｂｇａ型集積回路部品、その製造方法およびその実装方法
US6207474B1 (en) * 1998-03-09 2001-03-27 Micron Technology, Inc. Method of forming a stack of packaged memory die and resulting apparatus
US6153929A (en) * 1998-08-21 2000-11-28 Micron Technology, Inc. Low profile multi-IC package connector
JP2001035960A (ja) 1999-07-21 2001-02-09 Mitsubishi Electric Corp 半導体装置および製造方法
JP2001217388A (ja) * 2000-02-01 2001-08-10 Sony Corp 電子装置およびその製造方法
JP2002305284A (ja) * 2001-02-05 2002-10-18 Mitsubishi Electric Corp 半導体装置積層構造体

Also Published As

Publication number Publication date
US6717275B2 (en) 2004-04-06
KR100497997B1 (ko) 2005-07-01
KR20030035799A (ko) 2003-05-09
US20030080438A1 (en) 2003-05-01
JP2003133518A (ja) 2003-05-09

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MM4A Annulment or lapse of patent due to non-payment of fees