KR100497997B1 - 반도체 모듈 - Google Patents

반도체 모듈 Download PDF

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Publication number
KR100497997B1
KR100497997B1 KR10-2002-0034337A KR20020034337A KR100497997B1 KR 100497997 B1 KR100497997 B1 KR 100497997B1 KR 20020034337 A KR20020034337 A KR 20020034337A KR 100497997 B1 KR100497997 B1 KR 100497997B1
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KR
South Korea
Prior art keywords
substrate
semiconductor
semiconductor module
substrates
mother
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2002-0034337A
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English (en)
Korean (ko)
Other versions
KR20030035799A (ko
Inventor
마쓰우라테쓰야
카사타니야스시
이치마사타다시
Original Assignee
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미쓰비시덴키 가부시키가이샤 filed Critical 미쓰비시덴키 가부시키가이샤
Publication of KR20030035799A publication Critical patent/KR20030035799A/ko
Application granted granted Critical
Publication of KR100497997B1 publication Critical patent/KR100497997B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
KR10-2002-0034337A 2001-10-29 2002-06-19 반도체 모듈 Expired - Fee Related KR100497997B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00331261 2001-10-29
JP2001331261A JP2003133518A (ja) 2001-10-29 2001-10-29 半導体モジュール

Publications (2)

Publication Number Publication Date
KR20030035799A KR20030035799A (ko) 2003-05-09
KR100497997B1 true KR100497997B1 (ko) 2005-07-01

Family

ID=19146868

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2002-0034337A Expired - Fee Related KR100497997B1 (ko) 2001-10-29 2002-06-19 반도체 모듈

Country Status (4)

Country Link
US (1) US6717275B2 (https=)
JP (1) JP2003133518A (https=)
KR (1) KR100497997B1 (https=)
TW (1) TW550782B (https=)

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JP4072505B2 (ja) * 2003-02-28 2008-04-09 エルピーダメモリ株式会社 積層型半導体パッケージ
US7612443B1 (en) * 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
AU2003279044A1 (en) * 2003-09-30 2005-05-11 International Business Machines Corporation Flexible assembly of stacked chips
US7134194B2 (en) * 2003-11-13 2006-11-14 Delphi Technologies, Inc. Method of developing an electronic module
KR100564621B1 (ko) * 2004-04-08 2006-03-28 삼성전자주식회사 버퍼형 메모리 모듈 패키지 및 이를 포함하는 버퍼형메모리 모듈 스택 패키지
WO2006019911A1 (en) * 2004-07-26 2006-02-23 Sun Microsystems, Inc. Multi-chip module and single-chip module for chips and proximity connectors
US7425760B1 (en) * 2004-10-13 2008-09-16 Sun Microsystems, Inc. Multi-chip module structure with power delivery using flexible cables
US8072058B2 (en) * 2004-10-25 2011-12-06 Amkor Technology, Inc. Semiconductor package having a plurality input/output members
KR100590477B1 (ko) 2004-12-22 2006-06-19 삼성전자주식회사 마더보드의 가장자리를 이용한 메모리 모듈과 마더보드의접속 구조 및 이에 적합한 구조의 메모리 모듈
JP2006261566A (ja) 2005-03-18 2006-09-28 Alps Electric Co Ltd 電子部品用ホルダ及び電子部品用保持シート、これらを用いた電子モジュール、電子モジュールの積層体、電子モジュールの製造方法並びに検査方法
FR2884048A1 (fr) * 2005-04-01 2006-10-06 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
FR2884049B1 (fr) * 2005-04-01 2007-06-22 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
JP4036872B2 (ja) * 2005-05-18 2008-01-23 アルプス電気株式会社 半導体装置の製造方法
JP4735088B2 (ja) * 2005-07-08 2011-07-27 株式会社安川電機 サーボアンプモジュール
US7416552B2 (en) 2005-08-22 2008-08-26 St. Jude Medical, Atrial Fibrillation Division, Inc. Multipolar, multi-lumen, virtual-electrode catheter with at least one surface electrode and method for ablation
US7605454B2 (en) * 2006-01-11 2009-10-20 Entorian Technologies, Lp Memory card and method for devising
US7508058B2 (en) * 2006-01-11 2009-03-24 Entorian Technologies, Lp Stacked integrated circuit module
US20070158811A1 (en) * 2006-01-11 2007-07-12 James Douglas Wehrly Low profile managed memory component
US7304382B2 (en) * 2006-01-11 2007-12-04 Staktek Group L.P. Managed memory component
US7608920B2 (en) * 2006-01-11 2009-10-27 Entorian Technologies, Lp Memory card and method for devising
US7402048B2 (en) * 2006-03-30 2008-07-22 Intel Corporation Technique for blind-mating daughtercard to mainboard
US7514773B2 (en) * 2006-08-31 2009-04-07 Intel Corporation Systems and arrangements for interconnecting integrated circuit dies
SG149726A1 (en) 2007-07-24 2009-02-27 Micron Technology Inc Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
SG150396A1 (en) 2007-08-16 2009-03-30 Micron Technology Inc Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
JP5097006B2 (ja) * 2008-05-14 2012-12-12 株式会社フジクラ プリント配線基板及びその製造方法
US8314487B2 (en) * 2009-12-18 2012-11-20 Infineon Technologies Ag Flange for semiconductor die
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
KR102497583B1 (ko) 2015-10-27 2023-02-10 삼성전자주식회사 유연한 연결부를 갖는 반도체 장치 및 그 제조방법
JP6380581B1 (ja) 2017-03-08 2018-08-29 日本電気株式会社 基板、回路基板、電子部品、および電子部品組立体
KR102152101B1 (ko) * 2018-11-02 2020-09-07 진영글로벌 주식회사 차량 전장용 디바이스
TWI762058B (zh) * 2020-12-02 2022-04-21 恆勁科技股份有限公司 半導體封裝件
US12250771B2 (en) * 2022-07-21 2025-03-11 Rockwell Collins, Inc. Capacitor bank assembly

Citations (1)

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JP2001217388A (ja) * 2000-02-01 2001-08-10 Sony Corp 電子装置およびその製造方法

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JPS62260353A (ja) 1986-05-06 1987-11-12 Mitsubishi Electric Corp 半導体装置
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
EP0509065A1 (en) * 1990-08-01 1992-10-21 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
FR2694840B1 (fr) * 1992-08-13 1994-09-09 Commissariat Energie Atomique Module multi-puces à trois dimensions.
KR100209782B1 (ko) * 1994-08-30 1999-07-15 가나이 쓰도무 반도체 장치
KR0147259B1 (ko) * 1994-10-27 1998-08-01 김광호 적층형 패키지 및 그 제조방법
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies
JP3012184B2 (ja) 1996-01-12 2000-02-21 富士通株式会社 実装装置
JPH10242379A (ja) 1997-02-25 1998-09-11 Hitachi Ltd 半導体モジュール
JPH10289929A (ja) 1997-04-14 1998-10-27 Seiko Epson Corp 表面実装部品の実装方法
JP3996668B2 (ja) * 1997-05-27 2007-10-24 富士通株式会社 半導体装置用ソケット
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JPH11186454A (ja) 1997-12-22 1999-07-09 Nippon Avionics Co Ltd Ｂｇａ型集積回路部品、その製造方法およびその実装方法
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Publication number Priority date Publication date Assignee Title
JP2001217388A (ja) * 2000-02-01 2001-08-10 Sony Corp 電子装置およびその製造方法

Also Published As

Publication number Publication date
US6717275B2 (en) 2004-04-06
KR20030035799A (ko) 2003-05-09
US20030080438A1 (en) 2003-05-01
JP2003133518A (ja) 2003-05-09
TW550782B (en) 2003-09-01

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