CN112997305A - 芯片封装结构、电子设备 - Google Patents
芯片封装结构、电子设备 Download PDFInfo
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- CN112997305A CN112997305A CN201980074859.8A CN201980074859A CN112997305A CN 112997305 A CN112997305 A CN 112997305A CN 201980074859 A CN201980074859 A CN 201980074859A CN 112997305 A CN112997305 A CN 112997305A
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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Abstract
一种芯片封装结构(01)、电子设备,涉及芯片封装结构(01),用于解决较大尺寸的封装基板封装过程中发生翘曲的问题。芯片封装结构(01)包括第一封装基板(11)、半导体器件(20)、多个第一连接件(41)、多个第二连接件(42)。其中,第一封装基板(11)具有相对设置的上、下表面。半导体器件(20)位于第一封装基板(11)的上表面,且与第一封装基板(11)电连接。转接组件(30)与PCB电连接,该转接组件(30)位于第一封装基板(11)的下表面,且包括至少一个第二封装基板(12)。多个第一连接件(41)排布于第一封装基板(11)的下表面,用于将第一封装基板(11)与转接组件(30)电连接。
Description
PCT国内申请,说明书已公开。
Claims (16)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2019/072224 WO2020147084A1 (zh) | 2019-01-17 | 2019-01-17 | 芯片封装结构、电子设备 |
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CN112997305A true CN112997305A (zh) | 2021-06-18 |
CN112997305B CN112997305B (zh) | 2022-12-27 |
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CN201980074859.8A Active CN112997305B (zh) | 2019-01-17 | 2019-01-17 | 芯片封装结构、电子设备 |
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CN (1) | CN112997305B (zh) |
WO (1) | WO2020147084A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114630494A (zh) * | 2022-05-12 | 2022-06-14 | 之江实验室 | 晶圆集成系统与顶部pcb板的互连结构及其制造方法 |
CN115600542A (zh) * | 2022-11-28 | 2023-01-13 | 飞腾信息技术有限公司(Cn) | 一种芯片封装结构及其设计方法和相关设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1641875A (zh) * | 2004-01-09 | 2005-07-20 | 日月光半导体制造股份有限公司 | 多芯片封装体 |
CN103258806A (zh) * | 2013-05-08 | 2013-08-21 | 日月光半导体制造股份有限公司 | 具桥接结构的半导体封装构造及其制造方法 |
CN104620376A (zh) * | 2012-09-10 | 2015-05-13 | 华为技术有限公司 | 用于2.5d中介板的设备和方法 |
CN108269797A (zh) * | 2016-12-30 | 2018-07-10 | 三星电子株式会社 | 电子装置封装 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI496270B (zh) * | 2013-03-12 | 2015-08-11 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
CN107104096A (zh) * | 2017-05-19 | 2017-08-29 | 华为技术有限公司 | 芯片封装结构及电路结构 |
-
2019
- 2019-01-17 CN CN201980074859.8A patent/CN112997305B/zh active Active
- 2019-01-17 WO PCT/CN2019/072224 patent/WO2020147084A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1641875A (zh) * | 2004-01-09 | 2005-07-20 | 日月光半导体制造股份有限公司 | 多芯片封装体 |
CN104620376A (zh) * | 2012-09-10 | 2015-05-13 | 华为技术有限公司 | 用于2.5d中介板的设备和方法 |
CN103258806A (zh) * | 2013-05-08 | 2013-08-21 | 日月光半导体制造股份有限公司 | 具桥接结构的半导体封装构造及其制造方法 |
CN108269797A (zh) * | 2016-12-30 | 2018-07-10 | 三星电子株式会社 | 电子装置封装 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114630494A (zh) * | 2022-05-12 | 2022-06-14 | 之江实验室 | 晶圆集成系统与顶部pcb板的互连结构及其制造方法 |
CN114630494B (zh) * | 2022-05-12 | 2022-08-09 | 之江实验室 | 晶圆集成系统与顶部pcb板的互连结构及其制造方法 |
CN115600542A (zh) * | 2022-11-28 | 2023-01-13 | 飞腾信息技术有限公司(Cn) | 一种芯片封装结构及其设计方法和相关设备 |
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CN112997305B (zh) | 2022-12-27 |
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