TW550714B - Bonding material, semiconductor device, method of manufacturing semiconductor device, circuit board and electronic device - Google Patents

Bonding material, semiconductor device, method of manufacturing semiconductor device, circuit board and electronic device Download PDF

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Publication number
TW550714B
TW550714B TW089102447A TW89102447A TW550714B TW 550714 B TW550714 B TW 550714B TW 089102447 A TW089102447 A TW 089102447A TW 89102447 A TW89102447 A TW 89102447A TW 550714 B TW550714 B TW 550714B
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TW
Taiwan
Prior art keywords
resin
layer
semiconductor device
semiconductor wafer
bonding member
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Application number
TW089102447A
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English (en)
Chinese (zh)
Inventor
Nobuaki Hashimoto
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Seiko Epson Corp
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Publication of TW550714B publication Critical patent/TW550714B/zh

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    • H—ELECTRICITY
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
TW089102447A 1999-02-18 2000-02-14 Bonding material, semiconductor device, method of manufacturing semiconductor device, circuit board and electronic device TW550714B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3962599 1999-02-18

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TW550714B true TW550714B (en) 2003-09-01

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Country Link
JP (1) JP4029255B2 (fr)
KR (1) KR100514425B1 (fr)
TW (1) TW550714B (fr)
WO (1) WO2000049652A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI714905B (zh) * 2018-11-08 2021-01-01 瑞昱半導體股份有限公司 電路裝置與電路設計及組裝方法
CN114374101A (zh) * 2022-01-12 2022-04-19 业成科技（成都）有限公司 连接结构和形成连接结构的方法

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FR2863767B1 (fr) * 2003-12-12 2006-06-09 Commissariat Energie Atomique Support memoire irreversible a deformation plastique et procede de realisation d'un tel support
JP2006100752A (ja) * 2004-09-30 2006-04-13 Sanyo Electric Co Ltd 回路装置およびその製造方法
KR102492533B1 (ko) 2017-09-21 2023-01-30 삼성전자주식회사 지지 기판, 이를 이용한 반도체 패키지의 제조방법 및 이를 이용한 전자 장치의 제조 방법
CN114023704B (zh) * 2022-01-05 2022-04-01 长鑫存储技术有限公司 非导电膜及其形成方法、芯片封装结构及方法

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Publication number Priority date Publication date Assignee Title
JPH0513119A (ja) * 1991-07-04 1993-01-22 Sharp Corp 電子部品接続用テープコネクタ
JP2930186B2 (ja) * 1996-03-28 1999-08-03 松下電器産業株式会社 半導体装置の実装方法および半導体装置の実装体
JPH1013002A (ja) * 1996-06-20 1998-01-16 Matsushita Electric Ind Co Ltd 半導体素子の実装方法
JPH1084014A (ja) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JPH10199930A (ja) * 1996-12-28 1998-07-31 Casio Comput Co Ltd 電子部品の接続構造および接続方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI714905B (zh) * 2018-11-08 2021-01-01 瑞昱半導體股份有限公司 電路裝置與電路設計及組裝方法
CN114374101A (zh) * 2022-01-12 2022-04-19 业成科技（成都）有限公司 连接结构和形成连接结构的方法

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KR100514425B1 (ko) 2005-09-14
WO2000049652A1 (fr) 2000-08-24
WO2000049652A8 (fr) 2000-10-26
JP4029255B2 (ja) 2008-01-09
KR20010042822A (ko) 2001-05-25

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