TW550229B - Transport facility - Google Patents

Transport facility Download PDF

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Publication number
TW550229B
TW550229B TW091122539A TW91122539A TW550229B TW 550229 B TW550229 B TW 550229B TW 091122539 A TW091122539 A TW 091122539A TW 91122539 A TW91122539 A TW 91122539A TW 550229 B TW550229 B TW 550229B
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Taiwan
Prior art keywords
container
aforementioned
lifting
scope
blocking
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TW091122539A
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English (en)
Inventor
Yukio Iizuka
Original Assignee
Daifuku Kk
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B66HOISTING; LIFTING; HAULING
    • B66CCRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C1/00Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles
    • B66C1/10Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles by mechanical means
    • B66C1/22Rigid members, e.g. L-shaped members, with parts engaging the under surface of the loads; Crane hooks
    • B66C1/28Duplicate, e.g. pivoted, members engaging the loads from two sides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733Overhead conveying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/14Wafer cassette transporting

Description

550229 A7 _______B7 五、發明説明(1 ) 發明所屬技術領域 本發明與具備用以升降物品之升降裝置及用以移動 前述升降裝置之移動體之搬送設備有關。 更具體而言,所搬送之搬送容器包含有:形成有用以 收納物品之開口部且於上部設有懸吊支撐用支撐部之容器 本體;及用以關閉該容器本體之開口部使成為密閉狀態之 蓋體,當如述蓋體關閉前述開口部時前述容器本體之内部 空間即呈密閉狀態。本發明係有關於,在支撑該搬送容器 之支撐部於懸吊支撐之狀態下,備有用以升降被搬送容器 之升降裝置及用以移動前述升降裝置之移動體之搬送設 備。 習知技藝 上述構造之搬送設備,例如,能夠將容易受到塵埃之 不良影響的半導體基板之類物品收納於搬送容器使不受塵 埃影響的狀態下搬送之。該設備係用於,針對半導體基板 等製造上進行各種製造處理之複數處理裝置,依次,將搬 迗容器搬送以對物品進行特定處理之製造設備上。而於該 製造設備,被搬送容器以載置狀態置於前述處理裝置之物 品搬出入處所之載置面。搬送容器被搬送時,係懸吊支撐 形成於容器本體上部之支撐部,升降該搬送容器,必要時, 於水平方向搬送。 於該等搬送設備,向來,搬送容器被搬送時,從搬送 開始至搬送結束,均處於懸吊支標形成於容器本體上部之 支撐部之狀態(參照例如特開平9 — 77455號公報)。 550229 A7 五、發明説明(2 ) 於上述習知之構造,在搬送途中,例如,有時搬送容 器會上下振動。但,由於搬送容器處於,以握持部懸吊支 撐形成於其上部之支撐部之狀態,如上述之搬送所引起的 上下振動,使收納於容器本體内部的物品的重量產生動的 作用。恐因此使得搬送容器彎曲變形以致容器本體之内部 空間之容積變大而外部空氣從蓋體與容器本體之封止部份 I入容器本體之内部空間。收納半導體基板等物品之搬送 容器多由會成樹脂材料所構成,如係該等合成樹脂材料, 則隨著搬送所帶來之上下振動,因容器本體變形,使得容 器本體之内部空間之容積變大以致外部空氣侵入,恐遭受 物品品質低下等不良影響。 本發明之說明 本發明係著眼於該等問題點而產生者,其目的在於提 供,可於搬送過程中不使外部空氣侵入搬送容器之内部空 間之搬送設備。 二 根據+發明,則搬送容器被搬送時,擋接裝置係切換 於保持狀態。藉此,擋接裝置承受懸吊支撐於升降裝置之 搬送容器之底面部,並承接保持搬送容器之重量。因 降裝置對於支撐部之支撐力得以減輕或成為零。於是,2 如,即使搬送途中帶來搬送容器之上下振動,容器本體2 變形可被抑制或使之無變形,並且不使外部空氣進入☆抑 | 本體之内部空間。 谷器 發明實施例 以下·,根據圖面說明本發明之搬送設備。 川丨» _圈————— 本紙張尺度適财關家標準(CNS) Μ規格⑵0X297公釐)〜~~__
? (請先閲讀背面之注意事項再填寫本頁) 訂丨 550229 A7 _______ B7 五、發明説明(3 ) 第1圖顯示製造半導體基板之製造用設備之一部份。 该设備係設置於經清淨化塵埃極少之室内空間。該設備設 有,在半導體基板之製造中途對半製品等物品進行特定處 理之複數物品處理裝置A,及對該等物品處理裝置之容器 接收處Η搬送上述物品之搬送設備B。前述物品處理裝置a 呈現沿著搬送設備B之物品搬送方向(參照箭頭)排列的狀 態而複數配置。如圖示,一列物品處理裝置A與另一列物 品處理裝置A相對排列。因公知故不詳述,該等複數物品 處理裝置A依次進行半導體基板製造上的化學的複數種類 之處理。 其次,參照第1圖及第2圖說明前述搬送設備b之構 造。處理對象物品之半導體基板丨係按設定之片數,收納於 搬送容器2。搬送容器2則被搬送至複數物品處理裝置八之 個別容器接收處Η。複數物品處理裝置A之各容器接收處11 没有容器接收用設置台3。於該搬送設備,搬送容器2係置 於容器接收用設置台3上。 前述搬送容器2,由合成樹脂材料所形成,如第3圖所 不’係由備有為收納半導體基板1而於 侧部開口 4之容器本體2a,及以密閉狀態關閉該開口部4之蓋體几所 構成。容器本體2a之上部形成有凸緣5,作為藉後述之握持 部所懸吊之支撐部。該搬送容器2,當蓋體2b關閉前述開口 部4時容器本體2a之内部空間為密閉狀態,外部髒空氣不會 從空隙侵入。 其次,說明搬送該等搬送容器2之設備。如第*圖所 本紙張尺度適用中國國家標準(CNS) A4規格Ul〇><297公爱) 6 ..... 訂 i ------- (請先閲讀背面之注意事項再填寫本頁) 550229 A7 ----—-gz____ __ 五、發明説明(4 ) 不,搬送車8沿著利用托架6而固定於天花板之引導執道7 運行。忒搬送車8係移動體之一例,備有配置於引導執道7 内側空間之運行車體8A,及連結於該運行車體8八位於引導 執道7之下方之搬送作用部8B。該運行車體8a,受產生運 仃推力使其沿著引導執道7運行之線型馬達(Linear M〇t〇r) 之驅動。而搬送作用部8B係藉由配置於前與後的連結棒 9、10而連結於該運行車體8A。由第7圖所示之引導執道7 之截面即可理解,引導軌道7係整體延伸於上下方向,具有 隔開之左忐一對腳部。該左右腳部之間即形成内方空間 部。在腳部下端,形成有運行導引面14以支撐備於搬送車8 之運行輪13。在腳部另形成有抵接振動規制輪15之振動規 制導引面16。 前述運行車體8A藉由線型馬達LM而獲得搬送車8之 運行推力。該線型馬達LM如第7圖所示,係由裝備於引導 執道7之内方空間部之磁石u,以及裝備於搬送車8而接近 並對著該磁石11之初級限圈12所構成。此外,圖中標號17 係裝備於引導執道7側之供電線,標號18係裝備於搬送車8 侧之受電線圈。藉通電交流電流使供電線17產生磁場,藉 該磁場使受電線圈18產生搬送車8側之需要電力,構成無接 觸狀態之供電。 其次,前述搬送作用部8B備有藉前後之連結棒9、1〇 而連結於運行車體8A之框體19。握持前述凸緣5而以懸吊 支撐狀態對搬送容器2作升降操作並加以搬送之升降操作 部20即受框體19所支撐。搬送作用部8B更備有擋接保持部 7 — I I I (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公楚) 550229 A7 五、發明説明(5 ) 21以作為切換自如之擋接裝置,在保持狀態,即承受並支 樓由升降操作部20所懸吊支撐之搬送容器2之底面部2c以 承接該搬送容器2之重量;及退避狀態,即退離搬送容器2 之底面部2c ;之間切換自如。 詳述之則,升降操作部2〇備有可對運行車體8A升降操 作自如的升降體23,更備有握持部22,可於受該升降體23 支撐而可握持搬送容器2之凸緣5之作用狀態,以及解除握 持之解除狀態,之間切換自如。該升降體23,由設於框體 19之升降操作機構24所支撐並可於上下方向升降操作自 如。該等升降操作部20及升降操作機構24形成了升降裝 置。該升降操作機構24,如第ό圖、第7圖所示,設有藉由 圓笱驅動用馬達Ml而繞著上下方向軸心之周圍旋轉的轉 筒25。該轉筒25可同時捲取及放出4支纜線26。藉由正反 轉動該轉筒25,可升降操作由該4支纜線26所懸吊支撐之 前述升降體23並維持略水平姿勢。升降操作機構24並不一 定要有轉筒25,亦可利用以個別馬達捲取各別纜線26之構 造。 如第5圖及第7圖所示,前述握持部22可切換於,握持 姿勢,即握持動作用馬達M2透過連桿機構27將一對握持具 28往互相接近的方向擺動以握持凸緣5的姿勢;及解除姿 勢,即一對握持具28往互相遠離的方向擺動以解除握持的 姿勢;之間。甚且,該握持部22係繞著縱軸心周圍旋轉自 I 如地設於升降體23,可藉由旋轉用馬達“3繞著縱軸心周圍 旋轉操作。 —--------- 本紙張尺度適用中國國家標準(CNS) A4規格(2WX297公釐)~ ~g ":~ -
、可— (請先閲讀背面之注意事項再填寫本頁) 550229 A7 B7 五、發明説明(6 ) 前述擋接保持部21備有,在車體移動方向的前側與後 側,從前述框體19往下方側延設之一對縱框29、29。該等 縱框29、29之下端部各設有一對擋接構件30、30。各擋接 構件30、30均可切換於,突出姿勢,即擋接由前述升降操 作部20舉起之搬送容器2之底面部2c之姿勢;及退避姿勢, 即容許升降操作部20對搬送容器2之升降操作而退離升降 路徑之姿勢;之間。 該擋接構件30、30,如第8圖、第9圖所示,其一端側, 以埋入形成於前述各縱框之凹部3 1之狀態受縱向支撐軸32 支撐而可繞著上下軸心周圍自由轉動。藉由付變速機電動 馬達M4及未圖示之連桿機構令該支撐軸32轉動,自由端即 可於突出在搬送容器2之升降路徑側之突出姿勢,與退入前 述凹部3 1内之退避姿勢之間切換。前述各擋接構件30,因 一端埋入形成於各縱框29之凹部31,其上下方向之變位受 到凹部3 1之上下内面之規制。因此,懸臂狀突出之自由端 即使落有搬送容器2之重量亦能承受。 第7圖所示之元件33係控制器,根據設施側之上位控 制裝置之指令,及不詳述之附設於搬送車8之感測器類之檢 測資料,進行對搬送車8之運行控制及對搬送作用部8B之 控制。. 其次說明,於該等構造之搬送設備,將搬送容器2從 搬送開始處(一個容器接收處H)搬送至搬送目標處(其他容 器接收處H)之搬送動作。又,擋接保持部21及升降操作部 20之動作係由前述控制器33所控制。如第4圖所示,首先, 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 9 ----------------餐-----------------tr--------------- (請先閲讀背面之注意事項再填寫本頁) M0229 五、發明説明 2送車8移動至搬送開始處對應之位置,於該處使升降操 二^下降,以握持部22握持載置於容器接以Η之搬送 M2之凸緣5再將該搬送容器2舉高至接近搬送車π。這 時’升降操作部20將搬送容器2上升至最高位置二,當 搬送車8往搬送目標處開始運行時,將前述播接保持部Η 從前述退㈣態切換成前述簡狀態。具體”,前述一 對擋接構件30均切換成突出姿勢1後,將升降摔作部加 下降一 ^4。將升降操作部2G下降—設定量,則搬送容 益2之底面部2。即由前述各擋接構件3〇所承接,凸請成 稍微浮上握持部22之狀態,而升降操作部2崎凸緣5之支撑 力變成零(Zer〇)。將前述一對擋接構件3〇均切換成突出姿勢 時’搬送容器2係上升至最高位置,前述各擋接構件3〇則位 於比搬送容器2之底面部2。低一點點之下方側,可容易地切 換成突出姿勢。 如此這般在搬送容器2之重量由各擋接構件3〇承受的 狀態下,搬送車8沿著引導轨道7移動運行,當不致有因搬 送車8移動中之振動以致搬送容器2變形而讓外部空氣侵入 内部之虞。 前述搬送車8到達搬送目標處之對應位置時,即停止 搬送車8之·運行,然後,在握持部22握持凸緣5之狀態下, 令升降操作部20上升使得搬送容器2上升一設定量。在搬送 容器2之底面部2c浮上各擔接構件3〇的狀態下,將各擋接構 件30從保持狀態切換成退避姿勢。然後,在握持部22握持 住凸緣5的狀態下將升降操作部20降下,將搬送容器2載置 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 10 (請先閲讀背面之注意事項再填寫本頁) 訂| ,豢- 550229 A7 _____B7 _ 五、發明説明(8 ) 於容器接收處Η ,再解除握持部22之握持狀態以結束搬送 作業。 其他實施例 以下,列舉其他實施例。 (1) 上述貫施例中,前述擋接保持部21從前述退避狀態 切換成前述保持狀態之切換動作,係於搬送容器2被舉高到 搬送車8附近之後搬送車8剛開始向搬送目標處運行時才實 打的動作。不拘限於此構造,亦可構成當搬送容器2被高舉 至搬送車8附近時立即切換。又,上述實施例中,前述擋接 保持部21從前述保持狀態切換成前述退避狀態之切換動 作,係於搬送車8到達搬送目標處對應之位置,運行停止之 後才實行。不拘限於此構造,亦可於運行停止跟前的運行 中實行。 (2) 上述實施例中,前述擋接保持部21切換成前述保持 狀態後’構成前述升降操作部2〇對前述凸緣5之支撐力為 零,惟不拘限於此支撐力為零之構造,而亦可構成,減輕 刖述升降操作部20對前述凸緣5之支撐力於,比升降操作部 20支撐搬送容器2全部重量時之支撐力還小的值。 (3) 上述實施例中,前述擋接裝置之構造係設於連結於 運行車體8Α之框體19,惟不限於此構造,亦可構成前述擋 接裝置21係没於上述實施例升降操作部2〇之升降體23。例 如,第10圖所示,由上述實施例相同構造之升降操作機構 24作升降操作之升降體23,設有藉由例如電動馬達與連桿 機構等所組成之驅動機構而可繞著水平軸心之周圍自由擺 本紙張尺度翻中關家標準(CNS) Α4規格(210X297公釐)"-~Π~I—
— (請先閲讀背面之注意事項再填寫本頁) •、^τ— 550229 A7 B7 五、發明説明(9 ) 動操作之一對擺動式擋接構件40,當握持部22握持而稍微 上舉時,立即切換擋接構件40於保持狀態,則因該保持動 作使得搬送容器2稍微被往上舉起,相對於握持部22該凸緣 5即稍微往上浮起(參照第10圖(A))。然後,在該擋接構件 40保持之杈態下,一邊將搬送容器2往上拉,一邊移動運行 車體8A。如此一來,不但是運行車體8A移動之時,搬送容 器2之上舉操作時亦不虞外部髒空氣侵入容器内部。 (4) 上述實施例例示,在前述握持部即一對握持具往互 相接近的方向擺動以握持住凸緣的握持姿勢,及一對握持 具往互相遠離的方向擺動以解除握持的解除姿勢之間切換 的構造,惟不限於此構造,亦可構造成例如,對凸緣有卡 止作用的握持具,可繞著上下軸心之周圍轉動操作而在握 持住凸緣岛握持姿勢及解除握持的解除姿勢之間切換,此 外,利用水平方向之移動以達到切換目的之構造等,能夠 以各種構造加以實施。又,擋接裝置之具體構造亦相同, 不限於上述實施例般繞著上下軸心擺動所為之切換構造, 繞著水平軸心使其往互相接近或遠離的方向擺動之構造, 而可實施藉水平方向移動所為之切換之構造等各種構造。 (5) 上述實施例中,移動體係沿著引導軌道運行之運行 車體8A,惟不限於此構造,亦可利用沿著引導執道運行卻 完全沒有車輪的線型車。更可以各種形態加以實施,如多 關節型搬送自動設備等。 (6) 上述實施例之說明中揭露以無接觸狀態對運行車 體8A供電之構造。但不限於此,亦可利用設於運行車體之 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 12 —-----------費—------------1---------------MW (請先閲讀背面之注意事項再填寫本頁) 550229 五、發明説明(ίο V體與供電用軌道之 外,亦可在台車咬晋當 于供電之接觸式供電。此 又電池、電容器等蓄電裝置,完全不進 仃無接觸或接觸供電。 黨I% — 忒者,亦可設置蓄電裝置,按場合 :=無接觸或接觸供電。例如,無接觸或接觸供電等 t法從外部供電時,即可藉蓄電裝置供電。 【圖式簡單說明】 第1圖係搬送設備之平面圖。 弟2圖係搬送設備之立體圖。 第3圖係顯示搬送容器之圖。 第4圖係搬送狀態之侧面圖。 第5圖係搬送車構造之側面圖。 第6圖係升降操作機構之平面圖。 第7圖係搬送車構造之縱斷正面圖。 第8圖係擋接保持部構造之平面圖。 第9圖(A)、(B)係搬送狀態之正面圖。 第10圖(A)、(B)係其他實施例之擋接裝置之圖示。 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) .............:參…!…........tr---------------擊 (請先閲411背面之注意事項再填寫本頁) 550229 A7 B7 五、發明説明(η ) 元件標號對照 A…物品處理裝置 8B…搬送作用部 B···搬送設備 9…連結棒 Η…容器接收處 10…連結棒 LM…線型馬達 11···磁石 Ml···圓筒·驅動用馬達 12…初級限圈 M2···握持動作用馬達 13…運行輪 M3···旋轉用馬達 14…運行導引面 M4···付變速機電動馬達 15…振動規制輪 1···半導體.基板 16…振動規制導引面 2···搬送容器 17…供電線 2a…容器本體 18···受電線圈 2b…蓋體 19…框體 2c…底面部 20…升降裝置 3···容器接收用設置台 20…升降操作部 4…開口部 21…擂接裝置 5…支撐部 21…擋接保持部 5…凸緣 22…握持部 6…托架 23…升降體 7···引導執道 24…升降裝置 8…搬送車 24…升降操作機構 8A…移動體 25…轉筒 8A…運行車體 26…纜線 (請先閱讀背面之注意事項再填寫本頁) 訂| 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 14 550229 A7 B7 五、發明説明(12 27…連桿機構 28…握持具 29…縱框 30…擋接構件 31···凹部 3 2…支撐軸 33…控制器 40…擋接構件 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 15

Claims (1)

  1. 550229 A B c D 六、申請專利範圍 1· 一種搬送設備,係以搬送容器(2)為搬送對象,而該搬 送容器(2)包含:容器本體(2a),係形成有收納物品用 之開口部(4)且上部設有懸吊支撐用支撐部(5)者;及蓋 體(2b),係用以將該容器本體(2a)之開口部⑷關閉成 密閉狀態者,且該搬送容器構成為當前述蓋體(2b)關 閉前述開口部(4)時前述容器本體(2勾之内部空間即成 為密閉狀態,另,該搬送設備包含有用以在懸吊前述 支撐部(5)之狀態下升降前述搬送容器(2)之升降裝置 (20、24);及用以移動前述升降裝置(2〇、24)之移動體 (8A), 又,該搬送設備更包含可切換於保持狀態及退避 狀態之間的擋接裝置(21),該保持狀態係指藉由擋接 則述搬送谷恭之底面部(2c)而可承受前述搬送容器(2) 之重量之狀態,而該退避狀態係指退離前述搬送容器 之底面部(2c)之狀態,藉此,當前述擋接裝置(21)切換 成前述保持狀態時,能夠讓前述升降裝置(2〇、2句對 前述支撐部(5)之支撐力得以減輕或成為零。 2·如申請專利範圍第1項之搬送設備,其中前述移動體 (8A)為沿著引導軌道⑺移動之運行車體(8A)。 3·如申?青專利範圍第2項之搬送設備,其中前述升降裝 置(20、24)包含有可對前述運行車體(8 a)升降之升降 體(23);及設於前述升降體(23)用以抓住前述支撐部(5) 之握持部(22)。 4.如申請專利範圍第2或3項之搬送設備,其中前述擋接 本紙張尺度適用中國國家標準(CNS) A4規格〔210X297公楚)------- -16 -
    550229 A B c D 六、申請專利範圍 裝置(21)固定於前述運行車體(8A)。 5. 如申請專利範圍第4項之搬送設備,其中前述擋接裝 置(21)包含有一對固定於前述運行車體(8A)之鋼體縱 框(29);及設於該縱框(29)之下端附近且具有可於突出 狀態及退避狀態之間移位之自由端之擋接構件(30)。 6. 如申請專利範圍第5項之搬送設備,其中前述擋接構 件(30)可繞著實質上縱方向軸(32)之周圍搖擺。 7. 如申請專利範圍第4項之搬送設備,其中前述搬送設 備包含有控制器(33),前述控制器(33)在將前述擋接裝 置(21)切換成前述保持狀態之後,藉由降下前述升降 體(23)而由前述擋接裝置(21)支撐至少一部份前述搬 送容器(2)之重量,使得對於前述支撐部(5)之支撐力得 以減i或成為零。 8. 如申請專利範圍第3項之搬送設備,其中前述擋接裝 置(21)係設於前述升降體(23)。 9. 如申請專利範圍第1項之搬送設備,其中前述搬送容 器(2)為合成樹脂製品。 本紙張尺度適用中國國家標準(CNS) A4規格(21 OX297公釐)
    17
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