TW548741B - Electrode for plasma processes and method for manufacture and use thereof - Google Patents

Electrode for plasma processes and method for manufacture and use thereof Download PDF

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Publication number
TW548741B
TW548741B TW090131863A TW90131863A TW548741B TW 548741 B TW548741 B TW 548741B TW 090131863 A TW090131863 A TW 090131863A TW 90131863 A TW90131863 A TW 90131863A TW 548741 B TW548741 B TW 548741B
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TW
Taiwan
Prior art keywords
electrode
plasma
gas
resistivity
patent application
Prior art date
Application number
TW090131863A
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English (en)
Chinese (zh)
Inventor
Jerome S Hubacek
Albert R Ellingboe
David Benzing
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
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Publication of TW548741B publication Critical patent/TW548741B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/3255—Material

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
TW090131863A 2000-12-29 2001-12-21 Electrode for plasma processes and method for manufacture and use thereof TW548741B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/749,916 US20020127853A1 (en) 2000-12-29 2000-12-29 Electrode for plasma processes and method for manufacture and use thereof

Publications (1)

Publication Number Publication Date
TW548741B true TW548741B (en) 2003-08-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW090131863A TW548741B (en) 2000-12-29 2001-12-21 Electrode for plasma processes and method for manufacture and use thereof

Country Status (7)

Country Link
US (2) US20020127853A1 (enExample)
EP (1) EP1346394A1 (enExample)
JP (1) JP2004524677A (enExample)
KR (1) KR20030066770A (enExample)
CN (1) CN100466152C (enExample)
TW (1) TW548741B (enExample)
WO (1) WO2002054444A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412076B (zh) * 2006-02-13 2013-10-11 藍姆研究公司 用於在介電質蝕刻中之減少的微粒污染的密封彈性體結合矽電極及其相同物
TWI667944B (zh) * 2014-07-03 2019-08-01 美商應用材料股份有限公司 具有可拆卸高電阻率氣體分配板的噴淋頭

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Publication number Priority date Publication date Assignee Title
TWI412076B (zh) * 2006-02-13 2013-10-11 藍姆研究公司 用於在介電質蝕刻中之減少的微粒污染的密封彈性體結合矽電極及其相同物
TWI667944B (zh) * 2014-07-03 2019-08-01 美商應用材料股份有限公司 具有可拆卸高電阻率氣體分配板的噴淋頭
TWI708524B (zh) * 2014-07-03 2020-10-21 美商應用材料股份有限公司 具有可拆卸高電阻率氣體分配板的噴淋頭

Also Published As

Publication number Publication date
US20020127853A1 (en) 2002-09-12
EP1346394A1 (en) 2003-09-24
CN100466152C (zh) 2009-03-04
US8845855B2 (en) 2014-09-30
CN1488161A (zh) 2004-04-07
KR20030066770A (ko) 2003-08-09
WO2002054444A1 (en) 2002-07-11
US20080026589A1 (en) 2008-01-31
JP2004524677A (ja) 2004-08-12

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