TW544960B - Package structure of light emitting diode and its method - Google Patents

Abstract

The invention provides a package structure of light emitting diode and its method, which forms a package structure of light emitting diode and fluorescent power by providing a condensing lens pre-formed with a recessed cave, dropping fluorescent power colloid into the recessed cave, and placing the LED fixed on the substrate into the recessed cave. At the time of placing the LED, recessive fluorescent power colloid is squeezed out of the recessed cave. After the fluorescent power colloid is cured and shaped, a fluorescent power film encapsulating the LED is formed. The thickness and shape of the fluorescent power film are controlled by the pre-formed recessed cave. The illuminating strength distribution of each area on the surface of the LED can be incorporated to determine the thickness of the fluorescent power film required by each area. Accordingly, it is able to generate uniform color temperature after mixing the light emitted from the LED and the light produced by exciting the fluorescent power.

Description

544960 V. Description of the invention (l) [Scope of application of the invention] The present invention relates to a kind of light-emitting diode seal, and more particularly to a structure and method capable of emitting 0-2 2JJ clothing, special structure and λ of m U sentence. 、 'Gray light emitting diode packaging junction [Background of the invention] Light emitting diode (Light pm1. + Tinp · IV 蒌 -dec #-a π ght Emltting Dlode, LED) is-a kind of half ¥ 脰 ^ 光Elements, unlike traditional incandescent to luminous, photodiodes, two large "make U 糸 heat the guest. Φ Φ r page current can excite a considerable amount of light; light: ί; two in semiconductor materials When electron holes are combined Γ: ΐ: Γ The energy released by them; the specific product of light-emitting diodes: Ϊ: 1Ϊ Low color, fast response rate, shock-resistant, electrical appliances, information boards, communication to various monochromatic lights "Profit" is due to LED's energy-saving technology, and it will reduce inflammation. He Mu will hope to replace some light bulbs as a smart device. However, at present, white light LEDs are still not popular due to factors such as light emission brightness and price, so Still not popular, but long-term white LED and LED industry leap forward One area. Most of the current products of white LEDs use blue light-emitting diodes to excite phosphors to emit yellow light. After the two kinds of light are mixed, they can form white light visually. As the brightness of blue light emitting diodes gradually increases, the development of white light emitting diodes in the lighting market is full of hope. The development of high-brightness LEDs has injected vitality into the LED industry, especially the successful development of blue-green light-emitting diodes, and the efficiency of light emission has been improved day by day.

Page 4 544960 V. Description of the invention (2) The brightness has reached the current level. The brightness of blue light has become more and more ancient, and the white light LE 2 which is stimulated by the above-mentioned "Asian ascension" is also used for: Glory is increasingly spreading on solar blue light-emitting diodes. However, due to the application on the market, the light emitted by the white LED is difficult to be mixed with blue light and yellow light, or it has a yellow halo, and it is controlled to be pure white, which is about white with blue.

Temperature). For example ^ :: Uniform color temperature (C〇１〇r is the blue light-emitting diode = Yaya .... the company's patent 'drip glue: yellow fluorescent powder, so that blue = points can be stimulated === of π out. ~: This α forms white light, and finally the cone is shot by the transparent concave lens at the top; in contrast to the shape of the cone reflection cup, this design will make the thickness of the drip surface 1 thin ^ 1 ”色 # 光 粉 在 蓝光 二The resident girl at the top of the polar body's grains has a thickness on the side of the grains, so that the path of the grains is emitted; the path of the light powder to excite the yellow light is shorter, and the light excited on the side passes through the yellow light. It is also strong, so that the blue light and the white light # ^ f are uniform, which causes the white light technology emitted by the transparent concave lens at the top to appear a yellow halo on white paper. J 曰 国 I = There is a white light LED process, which is Chen. The Chinese powder proposed by Xing is mixed with a volatile solvent at an appropriate ratio, and the solution is poured on the cup to make the solution adhere to the surface of the light-emitting diode crystal grains. The crystal grains are formed after the U is finished. It is also difficult to make a uniform film by coating the light-emitting diode. Due to the fluorescent powder,

1.544960 V. Description of the invention (3) The specific gravity is much greater than that of the volatile solution and the precipitation rate of the fluorescent powder. Finally, the light-emitting diode crystal film 'easily deposits at the junction of the light-emitting diode crystal's regular reflection cup, and the side has no gravity sinking', it is also difficult to avoid the phenomenon of uneven color temperature; a bit of fluorescence The volume of the powder solution is about ten thousandths, and the precise LED that accurately controls the volume of each drop of solution emits pure white light. It is currently the LED manufacturers. [Objective and Overview of the Invention] In view of the problems of the conventional technology, the present invention prepares a light diode Body packaging structure and method. The system is a condenser lens, and a fluorescent powder glue is dripped into the cavity to combine the pole limbs. After curing, a glowing spoon coating structure is formed. Because the concavity of the condenser can control the thickness and curved shape of the surface of the light-emitting diode, the content of light-emitting powder in the coating structure, and the curved surface produced by the lens can be matched with the surface of the light-emitting diode to produce uniform light. In order to prevent the color temperature from not achieving the above-mentioned object, the light-emitting diode of the present invention has a light-emitting diode, a condenser lens with a cavity, and a light private film. The light emitting diode system is contained in a polyconcave cavity and has a proper amount of phosphor powder colloid to cover the surface to form a phosphor powder film with a solid thickness. The size is in accordance with the shape and size of the light-emitting diode. Due to the efforts of the preliminaries, the polar body f J fluorescent can control the areas of the light powder glue. The current polar body seal is filled in the light mirror and the size of the condenser lens is faster than that of the solution. The resulting phosphor powder is thin, and the crystal grains and conical phosphor layer are relatively difficult. In the process, this is the key point. The first is to shape the luminous image which is directly matched with the mass production of fluorescent powder colloid. In the cavity of the two, the cavity of the light pole and its pre-provided cavity have luminous light. When the powder colloid is coated, the intensity of each cavity is included, including the fluorescent light, and the surface shape of the body and the retained fluorescent light.

544960 V. Description of the invention (4) The thickness of the light powder colloid is shaped. In this way, the thickness and shape of the coated light-emitting powder film can be controlled; it is beneficial to light emission. In addition, in order to improve the intensity and uniformity of the emitted light, the top surface of the cavity of the condenser to which the light emitting diode light exits is formed into a curved surface; and the focus of this condenser is on the light out focusing effect. In order to match the above-mentioned light-emitting diode packaging structure, the present light-emitting diode packaging method: first, a concave mirror is formed in advance; then an appropriate fluorescent powder colloid is dropped into the cavity; and then a part of the At this time, the excess phosphor is out of the cavity, ensuring that the cavity and the light-emitting diode colloid of the light powder colloid; Finally, the phosphor colloid is solidified to form the phosphor adhesive on the surface of the diode membrane. Therefore, the thickness and shape of the coated colloidal phosphor can be completely determined by the size and shape of the cavity. In addition, the colloidal fluorescent powder used in the present invention is formed by a transparent colloid with high viscosity; the colloidal powder with high viscosity is used to slow down the sedimentation speed of the fluorescent powder. After avoiding fluorescent light, the phosphor powder is deposited and stacked on the surface of the light-emitting diode; the intensity and uniformity of the emitted light. The features and implementation of the present invention are described in detail with the illustrations below: [Description of the preferred embodiment] Please refer to FIG. 1, which is a light-emitting diode according to an embodiment of the present invention. A cavity is provided in front of and around the surrounding area in advance to provide a kind of cavity light. This cavity light powder colloid is squeezed into a space filled with the shape of the light emitting diode crystal grains to control the fluorescent powder mixed into the suspended fluorescent powder colloid to solidify Affects the best embodiment polar package

1811 Λ Page 7 544960 V. Description of the invention (5) Schematic cross-section of the structure. The light-emitting diode film 10 and the condenser lens 3 are filled with a golden powder film 20 between them. The light-emitting diode system bonded to the substrate 40 is accommodated in the cavity 31 of the light-concentrating f, and at the same time, the cavity 31 has a proper amount of phosphor powder film 20 covering the surface of the light-emitting diode 10, and is used The cavity 31 is formed in advance to control the thickness and shape of the phosphor film 20. t As shown in FIG. 1 'The condenser lens 30 of the embodiment of the present invention is a miscellaneous-transparent plastic element, which can be made by plastic injection molding, and has a cavity 31 for accommodating a light-emitting diode. 'The shape and size of n31 are matched with the shape of the photodiode' and the #degrees required for designing the glorious powder film 20 with the light intensity distribution of each area on the surface of the light-emitting diode, and the top of the concave ^ 31 The surface and the surrounding four surfaces all form a curved shape &. And, the focus of / has a focusing effect on the light exit position; = 30: the outer surface of the shape is plated with a uniform reflective film 33, in order to improve the light, the present invention will be described in more detail, and the packaging structure of the present invention will be used as an example to describe the present invention. Light emitting 1; =: = Diodes are finely dripped into the appropriate amount = The light emitting diodes 10 on the substrate 40 are placed in a concave Z technique with a fluorescent powder colloid to make excess fluorescent powder colloid Extrude the cavity 31, and: 5 powder colloids fill the space between the light emitting diode and the cavity; finally, the powder: solidified to form a phosphor film 20 that uniformly covers the light emitting diode. ; '/ The size and shape of the pre-molded cavity 31 can determine the thickness and shape of the bag :: glory powder film 20; it is beneficial to emit uniform light. Israel

544960 V. Description of the invention (6) First, in order to emit pure white light to achieve the purpose of illumination, the light-emitting diode system used in the first embodiment of the present invention is a short-wavelength diode, such as a blue light-emitting diode, and cooperates with a long wavelength. Fluorescent powder such as mixed yellow fluorescent powder. Fluorescent powder glue system is formed by mixing long-wavelength fluorescent powder or yellow fluorescent powder with high-viscosity transparent stone glue. The high-viscosity (400 cps) colloid is used to suspend the fluorescent powder to make the fluorescent powder Settling speed slowed. Before the colloid of the phosphor is cured, the phosphor deposits on the surface of the light-emitting diode, which affects the intensity and uniformity of the emitted light. In order to prevent the fluorescent powder from sinking too quickly in the colloid into which it is mixed, the viscosity of the colloid needs to be above 1000 C ps. In addition, according to the same packaging method, the present invention can further combine an I-light packaging array 50 with a plurality of condensers and a substrate 60 with a light-emitting diode array to form a light-emitting diode packaging structure array; as shown in FIG. 2 As shown, it is a schematic top view of an array of light emitting diode packaging structures. [Effect of the invention] By applying the light emitting diode packaging structure and method of the present invention, the thickness and shape of the phosphor film coated by the light emitting diode can be controlled. In the embodiment of the present invention, a monitor diode is used in combination with a yellow phosphor, so that the path of the monitor light emitted by the crystal grains through the top phosphor to excite yellow light is equivalent to the path through the side, so that the light emitted by the light emitting diode Blue light can be uniformly mixed with yellow light to form pure white light; that is, through the curved surface design of the cavity, the top surface of the phosphor film and the surrounding four surfaces are formed into a curved surface to facilitate the uniformity of the mixed outgoing light. For a comparison of the color temperature uniformity of the embodiments of the present invention with conventional techniques, please refer to Annex 1 and Annex 2. Attachment 1 is the color temperature chart of white light LE]) produced by Yueya Company. Attachment 2 is the color temperature chart of white light LEI) according to the embodiment of the present invention. By Attachment 1 544960

V. Description of the invention (7) and the information shown in Annex 2, can be straight to the field of white _ ”22 two J visually judge the embodiment of the present invention _ color ^ uniformity of the hook is relatively inferior. In comparison of light intensity uniformity Consider the illuminance distribution maps of Annex 3 and Annex 4, Annex 3, and the appendix: White α-degree knife cloth map produced by the company 3 ... The comparison results between Annex 3 and Annex 4 can be used to understand the embodiment of the present invention. White LEDs can emit relatively uniform high-brightness white light. Although the preferred embodiments of the present invention are disclosed above, they are not intended to limit the present invention, and any person skilled in the relevant arts will not depart from the spirit of the present invention. Within the scope and scope, some changes and retouching can be made, so the scope of patent protection of the present invention must be determined by the scope of the patent application attached to this specification.

544960 Brief description of the drawings. Figure 1 is a schematic cross-sectional view of a light emitting diode package structure according to an embodiment of the present invention; Figure 2 is a schematic top view of an array of light emitting diode package structures; Attachment 1 is a white light produced by Nichia Color temperature chart of LED; Attachment 2 is the color temperature chart of the white LED in the embodiment of the present invention; Attachment 3 is the illuminance distribution chart of the white LED produced by Nichia; and Attachment 4 is the illuminance distribution chart of the white LED in the embodiment of the invention . [Illustration of Symbols] 10 LED

20 Fluorescent powder film 30 Condenser 31 Recess 3 3 Reflective film 4 0 Substrate 50 Condensing package array 60 Substrate

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Claims (1)

544960 VI. Application for patent scope 1. A light emitting diode packaging structure comprising: a light emitting diode, which is fixed on a substrate surface to achieve electrical connection with the substrate; a condenser lens, the condenser lens is matched with the light emitting diode A cavity is formed in the shape and size of the polar body to accommodate the light-emitting diode in the cavity; and a phosphor powder film is coated on the surface of the light-emitting diode and fills the light-emitting diode at the same time. The space between the polar body and the cavity. Call 2. The light emitting diode packaging structure described in item 1 of the scope of patent application, wherein the shape and thickness of the phosphor film are controlled by the cavity. 3. The light emitting diode packaging structure described in item 1 of the scope of the patent application, wherein the top surface and the surrounding four sides of the cavity are curved surfaces. 4. The light-emitting diode packaging structure described in item 1 of the scope of the patent application, wherein the condenser lens forms a curved concave hole design at the focal position where the light exits to collect the emitted light. 5. The light emitting diode packaging structure described in item 1 of the scope of patent application, wherein the condenser lens is plated with a reflective layer to improve the efficiency of light usage. 6. The light emitting diode packaging structure described in item 1 of the scope of the patent application, wherein the phosphor film is formed by mixing phosphor with a high-viscosity transparent colloid. 7. The light-emitting diode packaging structure as described in item 6 of the scope of the patent application, wherein the viscosity of the transparent colloid of the local viscosity is more than 100 cps. 8. The light-emitting diode packaging structure described in item 6 of the patent application scope, wherein the high-viscosity transparent adhesive system is a silicon adhesive. 9. A light emitting diode packaging method, the steps include: Page 12 544960 6. The scope of the patent application is pre-formed with a condenser with a cavity; a fluorescent powder colloid is dropped into the cavity; a light-emitting diode bonded to a substrate is combined with the cavity; The phosphor colloid is extruded out of the cavity to ensure that the interface between the cavity and the light-emitting diode is filled with the phosphor colloid; and the phosphor colloid is cured to form a phosphor powder film to Covered on the surface of the light emitting diode. 10. The light-emitting diode packaging method according to item 9 of the scope of the patent application, wherein the shape and thickness of the phosphor film are controlled by the recess. 11. The light-emitting diode packaging method according to item 9 of the scope of the patent application, wherein the top surface and the surrounding four sides of the cavity are curved surfaces. 1 2. The light-emitting diode packaging method according to item 9 of the scope of patent application, wherein the condenser lens forms a curved concave hole design at the focal position where the light exits to collect the emitted light. 1 3. The light-emitting diode packaging method according to item 9 of the scope of the patent application, wherein the condenser lens is forged with a reflective layer to improve the efficiency of using light. 1 4. The light-emitting diode packaging structure according to item 9 of the scope of the patent application, wherein the phosphor film is cured by mixing a phosphor with a high-viscosity transparent colloid. 1 5. The light-emitting diode packaging method as described in item 9 of the scope of the patent application, wherein the viscosity of the transparent colloid with a south viscosity is more than 100 cps. 1 6. The light-emitting diode packaging method according to item 9 of the scope of the patent application, wherein the high-viscosity transparent adhesive system is a silicon adhesive. Page 13