CN100414701C - Light-emitting system, light-emitting device, and forming method therefor - Google Patents
Light-emitting system, light-emitting device, and forming method therefor Download PDFInfo
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- CN100414701C CN100414701C CNB200610087001XA CN200610087001A CN100414701C CN 100414701 C CN100414701 C CN 100414701C CN B200610087001X A CNB200610087001X A CN B200610087001XA CN 200610087001 A CN200610087001 A CN 200610087001A CN 100414701 C CN100414701 C CN 100414701C
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Abstract
The present invention provides a luminous system, a luminous device and a formation method of the luminous device. The luminous system comprises a plurality of luminous units and a framework for connecting the luminous units, wherein each luminous unit comprises a baseplate, one or more than one wafer, an annular structure and a protective layer, wherein the wafer is arranged on the baseplate, the annular structure is arranged on the baseplate, surrounds the one or more than one wafer, and is used for adjusting the direction of light rays emitted from the wafer. The protective layer at least covers the one or more than one wafer, and the protective layer is not higher than the annular structure. The luminous system, the luminous device and the formation method of the luminous device can collect the light rays emitted from the side wall of the wafer and even has a function of the avoidance of the generation of heat quantity coemption.
Description
Technical field
The invention relates to a kind of luminescent system, light-emitting device and forming method thereof, and be particularly to a kind of luminescent system with light-emitting diode, light-emitting device and forming method thereof.
Background technology
Light-emitting diode (Light Emitting Diode, be called for short LED) have advantages such as high brightness, volume are little, in light weight, cracky, low power consumption and life-span be not long because of it, so be widely used in the various demonstration product, its principle of luminosity is as follows: apply a voltage on diode, the electronics that orders about in the diode combines with the hole, and this is that form with light discharges in conjunction with the energy that produced; In addition, still can add fluorophor in this structure, to adjust emission wavelength (color) and intensity.
The wherein appearance of white light emitting diode, the application with light-emitting diode extends to lighting field especially; With in white light emitting diode and the illumination at present the incandescent lamp bulb of normal use and fluorescent lamp relatively, advantage such as light-emitting diode has lower calorific value, low power consumption, the life-span is long, reaction speed is fast, volume is little is so be the emphasis that industry developed.
The mode of making white light emitting diode at present mainly contains two classes, one is monocrystalline type lumination of light emitting diode mode, promptly utilize the single LED crystal particle fluorescent material of all kinds of arranging in pairs or groups to blend together white light, the method of using mainly is that the light that utilizes blue light-emitting diode crystal grain and gold-tinted fluorescent material to be sent is mixed into white light at present, and the light that utilizes ultraviolet light-emitting diodes crystal grain, blue light fluorescent powder, green light fluorescent powder and red light fluorescent powder to be sent is mixed into white light; One is polymorphic lumination of light emitting diode mode, promptly utilize a plurality of LED crystal particle fluorescent material of all kinds of arranging in pairs or groups to blend together white light, the method for using mainly is that the light that utilizes blue light-emitting diode, green light LED and red light-emitting diode to send is mixed into white light at present; But the employed a plurality of light-emitting diodes of polymorphic lumination of light emitting diode mode, its driving voltage, luminous intensity, temperature characterisitic are neither identical with life-span length, and these characteristics all need mutual coupling in application, the difficulty of design is heightened, so institute's production cost is also higher relatively, develop towards monocrystalline type light-emitting diode direction so be inclined at present.
Yet, using the light-emitting device of light-emitting diode at present because the phenomenon of sidepiece light leak might take place, therefore blue light for example has the problem of colour cast, and that radiating efficiency also has is to be hoisted.
Summary of the invention
In view of this, the invention provides a kind of light-emitting device or luminescence unit, comprising: a substrate; At least one wafer places on the substrate; One loop configuration (enclosedstructure) places on the substrate and around wafer, wherein loop configuration is used to adjust the direction from the wafer emitted light; And a protective layer, cover this fluorescent material granulosa at least, and the height of this protective layer is not higher than this loop configuration.
Light-emitting device of the present invention, this protective layer are a planarization layer.
Light-emitting device of the present invention, this protective layer more cover this wafer and extend to this loop configuration madial wall.
Light-emitting device of the present invention, the height of this protective layer be this loop configuration height 2/3,1/2 or between the two.
Light-emitting device of the present invention, this loop configuration comprise a plastic cement body, and a reflective material layer, are formed at this plastic cement body surface.
Light-emitting device of the present invention, this loop configuration is made by the metal material with reflective surface.
Light-emitting device of the present invention, the madial wall of this loop configuration are a flat surfaces or arc surface, and section is a trapezoidal or triangle.
Light-emitting device of the present invention more comprises lens, and it covers this substrate, wafer, protective layer and loop configuration.
Light-emitting device of the present invention more comprises a packed layer between these lens and this protective layer, and its refractive index with this protective layer is identical.
Light-emitting device of the present invention, this fluorescent material granulosa comprises a plurality of phosphor particles, and at least a portion is to condense into piece and do not contain sticker.
Light-emitting device of the present invention, the part of this protective layer are that the surface seepage from this fluorescent material granulosa enters a set degree of depth.
Light-emitting device of the present invention, protective layer also may extend to the loop configuration sidewall to increase adhesive force.
Light-emitting device of the present invention because loop configuration can be used to adjust the direction of wafer emitted light, for example covers, reflects, collects or focus on, and therefore can solve the leakage blue light phenomenon of wafer sidepiece, and improve the problem of light colour cast.
Loop configuration generally can be plastic material and makes, and reflectorized materials such as one deck chromium, nickel, silver, zinc fluoride or magnesium sulfide then can be selected to electroplate in the surface.
In addition, because loop configuration and wafer are arranged on one side, if therefore select the preferable material of heat dissipation characteristics, for example metal material is made, and then can improve radiating efficiency.
In another preferred embodiment, light-emitting device can comprise more that one places the radiating seat of substrate below, can reach the effect of dual heat radiation with loop configuration, and wherein this radiating seat can be made up of metal material.
The present invention provides a kind of luminescent system in addition, comprising: a plurality of luminescence units; And a framework (frame), be used to connect those luminescence units, wherein each luminescence unit comprises: a substrate; One or more wafer places the substrate top; One loop configuration places on the substrate and around this one or more wafer, wherein loop configuration is used to adjust the direction of wafer emitted light; And a protective layer, cover this one or more wafer at least, and the height of protective layer is not higher than loop configuration.
Luminescent system of the present invention, the zone that this loop configuration surrounded are to be square, rectangle, circle or polygon, and the arrangement mode of those luminescence units comprises arranged in series, is arranged in parallel, concentric circles is arranged or scroll-type is arranged.
Luminescent system of the present invention comprises between each substrate of those luminescence units that an external series gap is to avoid heat history.
Luminescent system of the present invention, this fluorescent material granulosa comprises a plurality of phosphor particles, and at least a portion is to condense into piece and do not contain sticker.
Luminescent system of the present invention, the part of this protective layer are that the surface seepage from this fluorescent material granulosa enters a set degree of depth.
The present invention also provides a kind of manufacture method of light-emitting device, comprising: a substrate is provided, and wherein the substrate top has at least one wafer; One loop configuration is provided, places on this substrate and around wafer; Many phosphor particles are mixed with a liquid that does not contain sticker form mixed liquor; Substrate is in the above-mentioned mixed liquor so that phosphor particles falls on the substrate; And remove liquid and take out this substrate, wherein those phosphor particles are lumpd into a fluorescent material granulosa and are attached at least on the interior wafer of above-mentioned loop configuration; And form a protective layer to cover this wafer.
The manufacture method of light-emitting device of the present invention, the method that removes this liquid comprises: use one first to remove step, be positioned at the outer mixed liquor of this loop configuration to remove, stay the mixed liquor that is positioned at this loop configuration; And use one second to remove step, and remove the liquid of the mixed liquor that is positioned at this loop configuration, make those phosphor particles lump into a fluorescent material granulosa and be attached on above-mentioned the loop configuration interior wafer and substrate.
The manufacture method of light-emitting device of the present invention, this fluorescent material granulosa comprises a plurality of phosphor particles, and at least a portion is to condense into piece and do not contain sticker.
The manufacture method of light-emitting device of the present invention, the part of this protective layer are that the surface seepage from this fluorescent material granulosa enters a set degree of depth.
Wherein, among the present invention; described protective layer is a planarization layer; it highly then can select not to be higher than loop configuration; protective layer gets final product a little more than this fluorescent material granulosa in principle; for example at 2/3rds, 1/2nd or therebetween height of lower height such as loop configuration; so that the certain protection ability to be provided; can avoid simultaneously protective layer thickness blocked up and influence luminous efficiency and reduction radiating effect; but the present invention is not limited to this, and its height only need be enough to cover wafers and get final product to avoid scratch luminescent powder granulosa.
Generally speaking, the material of protective layer can be selected soft macromolecular material, so, can offset the thermal stress that wafer is produced when luminous by its elasticity, thereby protection wafer and the plain conductor that is connected.The part of protective layer also might the autofluorescence powder particle layer surface seepage enter a set degree of depth and increase its surface adhesion force, present embodiment then is example with silica gel.
In addition; can on above-mentioned light-emitting device or luminescence unit, selectivity cover lens; for example be to make by epoxy resin or polyethylene (PE) plastic material, the refractive index identical materials of then alternative filling and protective layer, for example silica gel between lens and protective layer.
In this specification, so-called " loop configuration " is general reference one enclosed construction.In the present invention, though enumerate rectangle, square or the circular zone that loop configuration surrounded as an illustration, be not in order to limit scope of the present invention; In other embodiments, the zone that this loop configuration surrounded also can be other arbitrary shape, for example cooperates the space of module backlight to make suitable strip loop configuration.
Loop configuration used according to the invention except can assembling the light that is sent from those wafer sidewalls, more has and avoids heat to hoard the function that (heat sink) produces.That is to say, by the various arrangement modes of loop configuration, for example be arranged in parallel, arranged in series or concentric circles arrange, and those wafers is placed in the different loop configuration, hoard with the heat of avoiding the wafer centralized configuration to be caused.Especially, each luminescence unit is independent separately, that is to say that each luminescence unit is not to be linked by substrate to each other, but cutting substrate forms external series gap, to avoid heat history, links to constitute a luminescent system individually by framework again.And in another embodiment, the then recycling radiating seat that is disposed at indivedual luminescence unit substrates below dispels the heat, and reaches the effect of so-called " two-fold heat radiation ".
In addition, according to loop configuration used in the present invention, also improved the problem of the general precipitation method.That is to say, after falling to substrate, phosphor particles can be separated into inside and outside two districts by loop configuration, therefore can be easy to remove mixed liquor at outskirt, and have only the mixed liquor of part to stay the loop configuration inner region, because the mixed liquor of this part is far fewer than original mixed liquor, therefore, sees through drying mode and can form the fluorescent material granulosa faster and be attached on the wafer in the loop configuration, thus, also promoted processing procedure efficient.
Description of drawings
Figure 1A is the light-emitting device that illustrates first embodiment of the invention;
Figure 1B to Fig. 1 E is the variation of radiating seat that illustrates the light-emitting device of first embodiment of the invention;
Fig. 2 A is the vertical view that illustrates Figure 1A;
Fig. 2 B is the vertical view that illustrates the wafer array of Figure 1A;
Fig. 3 is the variation that illustrates the loop configuration shown in Figure 1A;
Fig. 4 is the luminescent system that illustrates second embodiment of the invention;
Fig. 5 is the luminescent system that illustrates third embodiment of the invention;
Fig. 6 is the luminescent system that illustrates fourth embodiment of the invention;
Fig. 7 is the luminescent system that illustrates fifth embodiment of the invention;
Fig. 8 is the luminescent system that illustrates sixth embodiment of the invention.
Embodiment
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, cited below particularlyly go out preferred embodiment, and cooperate appended graphicly, be described in detail below:
In the following example of the present invention, main combination that the arrangement mode of luminescent system, loop configuration, the light-emitting device with loop configuration and radiating seat be described respectively and loop configuration be in the application of the precipitation method, but these a little embodiment only are used to the present invention is described in order to limit scope of the present invention.
First embodiment
Figure 1A is light-emitting device with loop configuration or the luminescence unit that illustrates the present invention's first preferred embodiment.Fig. 2 A is the vertical view that illustrates Figure 1A.Fig. 2 B is the vertical view that illustrates the wafer array of Figure 1A.Fig. 3 is the variation that illustrates the loop configuration shown in Figure 1A.
Shown in Figure 1A, light-emitting device or luminescence unit 100 comprise a radiating seat 112, generally are to be made of metal.One places the substrate 102 of radiating seat 112 tops and places single wafer or a plurality of wafer of substrate 102 tops, is to be example with wafer array 104 at this.And the luminescent powder granulosa that places wafer array 104 tops, for example be fluorescent material granulosa 106.In a preferred embodiment, light-emitting device can be selected to reach a loop configuration 110 that places on the substrate 102 in order to cover the protective layer 108 of fluorescent material granulosa 106.In addition, in this example, loop configuration 110 can be attached on the substrate 102 by insulating cement; And loop configuration 110 is an enclosed construction.And in this embodiment and embodiment described later, wafer array 104, fluorescent material granulosa 106 and protective layer 108 all are positioned at loop configuration 110.In this embodiment, luminescence unit 100 can constitute a luminescent system, and the zone that loop configuration 110 surrounded is for square, shown in Fig. 2 A.Please with particular reference to Fig. 2 B, the configuration of the wafer array 104 of fluorescent material granulosa 106 belows is as shown in the figure, and it is centered on by loop configuration 110.
In a preferred embodiment, protective layer 108 also may extend to loop configuration 110 sidewalls to increase adhesive force.
Generally speaking; the material of protective layer can be selected soft macromolecular material; so; can offset the thermal stress that wafer is produced when luminous by its elasticity; thereby protection wafer and the plain conductor that is connected; in addition, the surface seepage that the part of protective layer might autofluorescence powder particle layer 106 enters a set degree of depth and increases its surface adhesion force, and wherein present embodiment is to be example with silica gel.
In another preferred embodiment, because loop configuration 110 can be used to adjust the direction from wafer 104 emitted lights, for example cover, reflect, collect or focus on, therefore can solve the leakage blue light phenomenon of wafer 104 sidepieces, and improve the problem of light colour cast.
Wherein, because loop configuration 110 is arranged on one side with wafer 104, if therefore select the preferable material of heat dissipation characteristics, for example polishing forms the metal material with reflective surface, then can improve radiating efficiency.
In addition; can on above-mentioned light-emitting device or luminescence unit, selectivity cover lens 200; for example be to make with covered substrate 102, wafer 104, protective layer 108 and loop configuration 110 by glass, epoxy resin or PE plastics; the refractive index identical materials of then alternative filling and protective layer is as packed layer 150, for example silica gel between lens 200 and protective layer 108.
In another embodiment, the madial wall of loop configuration 110 and substrate 102 surfaces form angle θ, and 0 °＜θ＜90 °, but ° preferable with θ=45; The material of loop configuration 110 is a metal, for example is stainless steel material; And loop configuration 110 surfaces can select one deck plated film to increase reflecting effect.Wherein, in a preferred embodiment; protective layer 108 is planarization layers; it highly then can select not to be higher than loop configuration 110; protective layer gets final product a little more than the fluorescent material granulosa in principle; for example; the height that selection is lower than loop configuration is as 2/3rds, 1/2nd or therebetween height; so that the certain protection ability to be provided; can avoid simultaneously protective layer 108 thickness blocked up and influence luminous efficiency and reduction radiating effect; but the present invention is not limited to this, and its height only need be enough to cover wafers 104 and get final product to avoid scratch fluorescent material granulosa 106.
Especially in this example, do not contain glue between the phosphor particles in the fluorescent material granulosa 106, therefore can increase luminous efficiency.Wherein, the number of wafers of wafer array 104 is to determine according to needing, and for example can be single or many; In this example, this wafer is to be light-emitting diode.Wherein, substrate 102 is for copper covers substrate, but also can use aluminium to cover substrate or aluminum oxide substrate.Wherein, being shaped as of radiating seat 112 is trapezoidal, but also rectangle or spill and other be beneficial to the shape of heat radiation, shown in Figure 1B to Fig. 1 E; The material of radiating seat 112 such as metal etc. are preferable with the material of tool high thermal conductivity coefficient.
In addition, in other example, the shape in the zone that loop configuration 110 is surrounded also can be done suitable change according to needs, for example is rectangle, circle or other shape etc.; And the shapes of loop configuration 110 itself also can be done any change, and for example its section shape can be trapezoidal, triangle or arc etc., and as shown in Figure 3, and the loop configuration madial wall also can be flat surfaces or arc surface.In other embodiments, the zone that this loop configuration surrounded also can be other arbitrary shape, for example cooperates the space of module backlight to make suitable strip loop configuration.
Found through experiments in addition, make respectively that height 0.2mm and 0.3mm, section are 45 degree equilateral triangles and diameter is all 1.6 centimeters loop configuration with stainless steel, and collocation is when being provided with 16 LED wafers (TaiWan, China is extensively transferred company's 514 model 14mil wafers) that covered by the fluorescent material granulosa respectively on circuit substrate, the light-emitting device that discovery is centered on by the loop configuration of height 0.3mm, its brightness ratio has more the 1-3 lumen by the loop configuration of 0.2mm height around the person, does not then have difference in the brightness that covers the epoxy resin lenses front and back.
Second embodiment
Fig. 4 is the luminescent system that illustrates second embodiment of the invention.
As shown in Figure 4, the luminescent system 400 of present embodiment is characterised in that the luminescence unit 100 and that has shown in a plurality of Figure 1A is used to connect the framework (frame) 410 of those luminescence units 100, and all the other are all similar with first embodiment.That is to say that the luminescence unit 100 shown in a plurality of Figure 1A constitutes the light-emitting device 400 of present embodiment.Wherein, luminescence unit 100 has a suitable clearance distance d each other, and this gap is that the brightness of sending according to each luminescence unit 100 is determined with the heat that produces apart from d.Wherein, the quantity of those luminescence units 100 is to determine according to needs; And the configuration of those luminescence units 100 can have various variations.Wherein, framework 410 is made of metal material.
Therefore according to the employed loop configuration 110 of embodiments of the invention, except can assembling the light that is sent from those wafer sidewalls, more have and avoid heat to hoard the function that (heatsink) produces.That is to say, by the various arrangement modes of loop configuration, for example be arranged in parallel, arranged in series or concentric circles arrange, and those wafers is placed in the different loop configuration, the heat that can avoid the wafer centralized configuration to be caused is hoarded.Especially in a luminescent system 400, each luminescence unit 100 is independent separately, that is to say that each luminescence unit 100 is not to be linked by the full wafer substrate to each other, but cutting substrate forms external series gap d, do not link to constitute luminescent system by 410 of frameworks again, so can avoid heat history and reach the good result that thermal source disperses.
The 3rd embodiment
Fig. 5 is the luminescent system that illustrates third embodiment of the invention.
Shown in 5 figure, in the present embodiment, the shape in the zone that is surrounded except loop configuration 510 is the rectangle, and all the other are all similar with first embodiment, do not repeat them here.According to purposes, can be directly with an independent luminescence unit 500 as luminescent system; A plurality of luminescence unit 500 arranged in series can also be formed the luminescent system of a linear.
The 4th embodiment
Fig. 6 is the luminescent system that illustrates fourth embodiment of the invention.
Shown in 6 figure, in the present embodiment, except luminescence unit 500 for being arranged in parallel, all the other are all similar with the 3rd embodiment, do not repeat them here.Wherein, a plurality of luminescence units 500 are arranged in parallel and form a luminescent system 600, and luminescence unit 500 clearance distance d each other is that the brightness of sending according to each luminescence unit 500 is determined with the heat that produces.
The 5th embodiment
Fig. 7 is the luminescent system that illustrates fifth embodiment of the invention.
Shown in 7 figure, in the present embodiment, the shape in the zone that is surrounded except loop configuration 710 is that all the other are all similar with first embodiment, do not repeat them here outside the polygon (for example, octagon).In the present embodiment, be directly with an independent luminescence unit 700 as luminescent system.In other embodiments, the shape in the zone that surrounded of loop configuration 710 also can be circular.
The 6th embodiment
Fig. 8 is the luminescent system that illustrates sixth embodiment of the invention.
Shown in 8 figure, in the present embodiment, except luminescence unit 700 is that all the other were all similar with the 5th embodiment, do not repeat them here scroll-type (vortex) was arranged.Wherein, a plurality of luminescence units 700 are arranged with scroll-type (vortex) and are formed a luminescent system 800, and luminescence unit 700 clearance distance d each other is that the brightness of sending according to each luminescence unit 700 is determined with the heat that produces.In other embodiments, the shape in the zone that loop configuration surrounded of luminescence unit 700 also can be circular, and luminescence unit 700 is concentric circles arrangement (figure shows).
It should be noted that wafer all is disposed in the loop configuration in first to six embodiment, and number of wafers is to determine with needing according to purposes.In addition, above the light-emitting device of first to six embodiment, also can use encapsulating material to be encapsulated, but preferable not to be encapsulated as.
The 7th embodiment
Present embodiment provides a kind of manufacturing method for LED, below though to lift " precipitation method " be example, incorporate applicant's Chinese patent application numbers 200510008606.0 and Application No. 11/059554 into as reference of the present invention at this, but manufacture method of the present invention is not as limit.
See also Figure 1A, the manufacturing process of present embodiment comprises the following steps, but its sequence of steps can need be adjusted and not as limit according to processing procedure.
At first, provide a substrate 102, wherein have at least one wafer 104 on the substrate 102, for example make a LED wafer array and cover on the substrate in a bronze medal.Secondly, provide a loop configuration 110, place on this substrate 102 and around wafer 104, for example use viscose glue with the plastic cement loop configuration 110 that fixedly has the chromium plating reflective surface on substrate 102.
Many phosphor particles are mixed with a liquid that does not contain sticker form mixed liquor, and substrate 102 is in the above-mentioned mixed liquor so that phosphor particles falls on the substrate 102.And in the preferred embodiment, can select to insert earlier aforesaid substrate 102 in a container, many phosphor particles are mixed with a liquid that does not contain sticker form mixed liquor and import in this container, and then allow phosphor particles natural subsidence in the above-mentioned mixed liquor on substrate 102.
Then, remove liquid and take out substrate 102, wherein those phosphor particles are to lump into a fluorescent material granulosa 106 and be attached at least on the wafer 104 in the above-mentioned loop configuration 110, and form a protective layer 108 to cover this fluorescent material granulosa 106 at least.
And according to the employed loop configuration 110 of embodiments of the invention, be the efficient that can improve the general precipitation method.That is to say, after falling to substrate 102, phosphor particles can be separated into inside and outside two districts by loop configuration 110, and after tentatively removing mixed liquor, the mixed liquor that has only part is stayed the inner region of loop configuration 110, because the mixed liquor of this part is far fewer than original a large amount of mixed liquor, therefore, see through drying mode and can remove remaining liq faster and form fluorescent material granulosa 106 and be attached on the wafer in the loop configuration 110, can promote processing procedure efficient thus.
Below be elaborated at a preferred embodiment of above-mentioned processing procedure.At first the proportion of phosphor particles is to select greater than this liquid and preferable insoluble or be insoluble in this liquid, and phosphor particles must have stability and chemically reactive not in this liquid; Then utilize instruments such as stirrer (stir bar) or ultrasonic waves oscillator or instrument that phosphor particles is evenly mixed with liquid, to form a dispersion liquid.Phosphor particles can be made up of fluorescent material, and this fluorescent material can be sulphide fluorescent material or unsulfided fluorescent material; Wherein the sulphide fluorescent material surface still can coat layer protective layer, as the organic polymer protective layer, to intercept external environment such as aqueous vapor and oxygen etc. to the influence of sulphide fluorescent material, makes sulphide fluorescent material keep stable state; But not sulphide fluorescent material can be yttrium-aluminium-garnet (yttrium aluminumgarnet, abbreviation YAG) fluorescent material, terbium aluminium garnet (terbium aluminumgarnet, be called for short TAG) the common fluorescent material that is used for light-emitting diode such as fluorescent material, or any other available luminescent powder.
Secondly the substrate 102 that a top is had a loop configuration 110 places above-mentioned dispersion liquid to leave standstill a period of time, and the liquid level of this dispersion liquid must be higher than substrate surface, and at least than more than the high 10 μ m of substrate surface.Then utilize the gravity factor of nature that the phosphor particles in the mixed liquor directly is deposited on the substrate again,, otherwise can't carry out the deposit behavior so the proportion of phosphor particles must be greater than this liquid; The particle diameter of phosphor particles is generally 0.1～100 μ m, because this manufacture method is to utilize gravity to make phosphor particles directly be deposited on the substrate, so if the particle diameter of phosphor particles is too small, deposition time can be long, production capacity is reduced, in addition, if the particle diameter of phosphor particles is too big, may cause the too poor result of the last formed fluorescent material granulosa uniformity; In addition, for the thickness that makes deposition time and last formed fluorescent material granulosa in certain standard, the concentration that this luminescent powder accounts for liquid is about 0.001～1g/ml, be preferably 0.01～0.15g/ml, if excessive concentration, can make luminescent powder generation waste or make last formed fluorescent material granulosa blocked up,, then can make the long and last formed fluorescent material granulosa of deposition time thin excessively if concentration is low excessively.In this deposition process, loop configuration can be divided into the phosphor particles of sedimentation inside and outside two districts.Wherein, before this deposit processing procedure, the substrate surface in the loop configuration has been formed with crystal array, for example is light emitting diode matrix.
At last the liquid in the said system is tentatively removed, as utilize and mode such as extract and banish liquid removal, only stay on the substrate of partially mixed liquid in loop configuration, continue utilize the flash baking mode to form the fluorescent material granulosa and be attached on the wafer or loop configuration in substrate on.Above-mentioned mode with liquid removal is as the criterion can the fluorescent material granulosa not produced perturbation action, otherwise can't form desirable fluorescent material granulosa, and wherein the temperature of this baking step is set, be to select greater than making the temperature that evaporates, produce rotten temperature less than destruction that makes substrate such as crystal or luminescent powder, for example be about 40～300 degree Celsius, wherein if bake out temperature is too low, then can make drying time long or can't dry, this can cause production capacity to descend; If bake out temperature is too high, it is rotten that substrate or luminescent powder are produced, and produces the bad fluorescent material granulosa of quality and yield is descended, and also can make the dispersion liquid of luminescent powder can't be obtained desirable fluorescent material granulosa by stirring because of the boiling phenomenon of fierceness.This baking step is will be with the liquid removal in the luminescent powder, and when liquid removal, the space between luminescent powder will be reduced, and makes each other driving fit more by the Van der Waals force between luminescent powder, and forms closely incrust luminescent powder layer.In addition, this baking step can comprise first baking step and second baking step, in first baking step, use lower temperature that liquid is slowly volatilized, the preferable boiling point of this temperature less than employed liquid, make the surface of fluorescent material granulosa produce hole with the quick volatilization of avoiding liquid, after treating a period of time, carry out the baking step of higher temperatures again, so that the liquid in the luminous powdery film volatilizees fully, this bake out temperature is preferable in addition selects less than 300 degree Celsius, and wherein the setting of this temperature is rotten in order to avoid substrate or luminescent powder to produce, and is not to be defined as 300 degree.
In addition, still can on fluorescent material granulosa 106, form a protective layer 108 again, so that this fluorescent material granulosa is formed better protection; This protective layer 108 can be high-molecular organic material, and mode such as can be coated with is formed on the fluorescent material granulosa, also may extend to the loop configuration inboard to increase adhesive force.
In above-mentioned manufacture method, employed liquid is preferably insoluble with luminescent powder, indissoluble, stable and do not chemically react.Wherein this liquid can be water, alcohols, ketone or ethers, as alcohols can be ethanol, ketone is that acetone, ethers can be ether.
Though the present invention by the preferred embodiment explanation as above, this preferred embodiment is not in order to limit the present invention.Those skilled in the art without departing from the spirit and scope of the present invention, should have the ability this preferred embodiment is made various changes and replenished, so protection scope of the present invention is as the criterion with the scope of claims.
Being simply described as follows of symbol in the accompanying drawing:
D: spacing
100: light-emitting device
102: substrate
104: the wafer array
106: the fluorescent material granulosa
108: protective layer
150: packed layer
200: lens
110,510,710: loop configuration
112: radiating seat
400,500,600,700,800: luminescent system
410,610,715: framework
Claims (22)
1. a light-emitting device is characterized in that, described light-emitting device comprises:
One substrate;
At least one wafer places on this substrate, and this wafer surface comprises a fluorescent material granulosa;
One loop configuration places on this substrate and around this wafer, wherein this loop configuration is used to adjust the direction of this wafer emitted light; And
One protective layer cover this fluorescent material granulosa at least, and the height of this protective layer is not higher than this loop configuration.
2. light-emitting device according to claim 1 is characterized in that, this protective layer is a planarization layer.
3. light-emitting device according to claim 2 is characterized in that, this protective layer more covers this wafer and extends to this loop configuration madial wall.
4. light-emitting device according to claim 3 is characterized in that, the height of this protective layer be this loop configuration height 2/3,1/2 or between the two.
5. light-emitting device according to claim 1 is characterized in that, this loop configuration is in order to cover, reflect, to collect or to focus on the light that this wafer sends.
6. light-emitting device according to claim 1 is characterized in that, this loop configuration comprises a plastic cement body, and a reflective material layer, is formed at this plastic cement body surface.
7. light-emitting device according to claim 6 is characterized in that, this reflective material layer is an electrodeposited coating.
8. light-emitting device according to claim 1 is characterized in that this loop configuration is made by the metal material with reflective surface.
9. light-emitting device according to claim 1 is characterized in that, the madial wall of this loop configuration is a flat surfaces or arc surface, and section is a trapezoidal or triangle.
10. light-emitting device according to claim 1 is characterized in that, more comprises lens, and it covers this substrate, wafer, protective layer and loop configuration.
11. light-emitting device according to claim 10 is characterized in that, more comprises a packed layer between these lens and this protective layer, its refractive index with this protective layer is identical.
12. light-emitting device according to claim 1 is characterized in that, this fluorescent material granulosa comprises a plurality of phosphor particles, and at least a portion is to condense into piece and do not contain sticker.
13. light-emitting device according to claim 1 is characterized in that, the part of this protective layer is that the surface seepage from this fluorescent material granulosa enters a set degree of depth.
14. a luminescent system is characterized in that, described luminescent system comprises:
A plurality of luminescence units; And a framework, be used to connect this luminescence unit, wherein each luminescence unit comprises:
One substrate;
At least one wafer places this substrate top, and this wafer surface comprises a fluorescent material granulosa;
One loop configuration places on this substrate and around this wafer, wherein this loop configuration is used to adjust the direction of this wafer emitted light; And
One protective layer cover this fluorescent material granulosa at least, and the height of this protective layer is not higher than this loop configuration.
15. luminescent system according to claim 14, it is characterized in that, the zone that this loop configuration surrounded is to be square, rectangle, circle or polygon, and the arrangement mode of this luminescence unit comprises arranged in series, is arranged in parallel, concentric circles is arranged or scroll-type is arranged.
16. luminescent system according to claim 14 is characterized in that, comprises between each substrate of this luminescence unit that an external series gap is to avoid heat history.
17. luminescent system according to claim 14 is characterized in that, this fluorescent material granulosa comprises a plurality of phosphor particles, and at least a portion is to condense into piece and do not contain sticker.
18. luminescent system according to claim 14 is characterized in that, the part of this protective layer is that the surface seepage from this fluorescent material granulosa enters a set degree of depth.
19. the manufacture method of a light-emitting device is characterized in that, the manufacture method of described light-emitting device comprises:
One substrate is provided, and wherein this substrate top has at least one wafer;
One loop configuration is provided, places on this substrate and around this wafer;
Many phosphor particles are mixed with a liquid that does not contain sticker form mixed liquor;
This substrate is in the above-mentioned mixed liquor so that phosphor particles falls on this substrate;
Removing this liquid makes this phosphor particles lump into a fluorescent material granulosa and be attached at least on the wafer in the above-mentioned loop configuration; And
Form a protective layer to cover this fluorescent material granulosa.
20. the manufacture method of light-emitting device according to claim 19 is characterized in that, the method that removes this liquid comprises:
Use one first to remove step, be positioned at the outer mixed liquor of this loop configuration, stay the mixed liquor that is positioned at this loop configuration to remove; And
Use one second to remove step, remove the liquid of the mixed liquor that is positioned at this loop configuration, make this phosphor particles lump into a fluorescent material granulosa and be attached on the wafer and substrate in the above-mentioned loop configuration.
21. the manufacture method of light-emitting device according to claim 20 is characterized in that, this fluorescent material granulosa comprises a plurality of phosphor particles, and at least a portion is to condense into piece and do not contain sticker.
22. the manufacture method of light-emitting device according to claim 20 is characterized in that, the part of this protective layer is that the surface seepage from this fluorescent material granulosa enters a set degree of depth.
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| CNB200610087001XA CN100414701C (en) | 2006-06-08 | 2006-06-08 | Light-emitting system, light-emitting device, and forming method therefor |
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| CNB200610087001XA CN100414701C (en) | 2006-06-08 | 2006-06-08 | Light-emitting system, light-emitting device, and forming method therefor |
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| CN100414701C true CN100414701C (en) | 2008-08-27 |
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| CN101645477B (en) * | 2008-08-07 | 2012-03-07 | 宏齐科技股份有限公司 | Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof |
| CN103022326B (en) * | 2012-12-26 | 2015-05-13 | 常州银河世纪微电子有限公司 | Intensive packaging method of LEDs |
| CN107565003B (en) * | 2017-07-31 | 2019-04-30 | 深圳市华星光电技术有限公司 | Quantum dot LED encapsulation structure |
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| EP1246265A2 (en) * | 2001-03-30 | 2002-10-02 | Sumitomo Electric Industries, Ltd. | Light emitting device |
| JP2003124521A (en) * | 2001-10-09 | 2003-04-25 | Rohm Co Ltd | Semiconductor light emitting device with case |
| CN1670076A (en) * | 2001-01-24 | 2005-09-21 | 日亚化学工业株式会社 | Optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| CN1679178A (en) * | 2002-09-02 | 2005-10-05 | 帝希欧有限公社 | White light emitting diode and its method of making |
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| CN1670076A (en) * | 2001-01-24 | 2005-09-21 | 日亚化学工业株式会社 | Optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| EP1246265A2 (en) * | 2001-03-30 | 2002-10-02 | Sumitomo Electric Industries, Ltd. | Light emitting device |
| JP2003124521A (en) * | 2001-10-09 | 2003-04-25 | Rohm Co Ltd | Semiconductor light emitting device with case |
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