JP5224890B2 - Light emitting device and method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a light emitting device with small chromaticity variation and high reliability, and a method for manufacturing the light emitting device.

  A light-emitting device that converts the wavelength of light from a semiconductor light-emitting element such as a light-emitting diode with a fluorescent material consumes less power, is smaller, and has a longer life than an incandescent bulb. Further, by selecting a fluorescent material, a light emitting device having a color according to the purpose of use is obtained. Therefore, this type of light-emitting device is used in various electrical equipment, for example, a light source for backlights such as a liquid crystal display, a mobile phone, and a portable information terminal, a display device used for indoor and outdoor advertisements, interior lighting, and portable devices. It is used for lighting, indicators for various portable devices, lighting switches, light sources for OA (office automation) devices, and the like.

  The light emitting device includes a light emitting diode, a base portion on which the light emitting diode is mounted, and a sealing portion in which the light emitting diode is sealed with a sealing resin in which a fluorescent material is dispersed.

  When the light-emitting device is used as a light source for lighting fixtures, backlights, etc. (hereinafter referred to as lighting fixtures, etc.), the current light-emitting device has insufficient light emission intensity. The device is installed.

  By the way, in a lighting fixture or the like, it is necessary to suppress variations in luminance and chromaticity on the light emitting surface as much as possible. Therefore, when a plurality of light emitting devices are used as a light source of a lighting fixture, the brightness and chromaticity of each light emitting device are managed so as to fall within a certain range. Specifically, the amount of the fluorescent material contained in the light emitting device is set to be a constant amount without variation among individuals, and the fluorescent material is uniformly dispersed in the sealing portion of each light emitting device. Managed.

  However, since bubbles are generated in the sealing resin in forming the sealing portion, it is difficult to uniformly disperse the fluorescent material in the sealing portion. In other words, the portion where bubbles exist in the sealing portion has a smaller amount of sealing resin than the other portions, and the density of the fluorescent material in the portion is smaller than the other portions. The spots of the fluorescent material are generated in the part. As a result, luminance spots and chromaticity spots are generated on the light emitting surface.

  In addition, since the bubbles scatter light, the presence of the bubbles itself causes luminance spots and chromaticity spots on the light emitting surface. In other words, where there is a difference in refractive index between the bubble and the sealing resin, the light from the light-emitting diode is reflected, refracted and scattered by the surface of the bubble, so the brightness and chromaticity of the part where the bubble exists are around it. There was a difference compared to

  In addition, since the amount of bubbles generated varies among individual light emitting devices, luminance variation and chromaticity variation occur between the individual light emitting devices.

  Furthermore, the bubbles not only generate luminance spots and chromaticity spots, but also cause a decrease in reliability. Specifically, bubbles present on the bonding surface between the sealing resin and the base substrate peel off the sealing resin from the base substrate, and bubbles existing near the wire connecting the light emitting element and the electrode It was a cause of disconnection.

  Therefore, in order to solve such problems, Patent Documents 1 and 2 propose a light emitting device structure and a manufacturing method in which bubbles are not included in the sealing resin in the light emitting device.

  Patent Document 1 shows a technique related to a lighting device, and Patent Document 2 shows a technique related to a glass-coated light emitting diode. Each technique will be briefly described below.

  FIG. 8 is a schematic cross-sectional view showing the structure of a conventional lighting device.

  The lighting device 100 shown in FIG. 8 includes a transparent case 101 having a storage recess 110, a printed wiring board 102 stored in the storage recess 110, a light emitting element 103 mounted on the printed wiring board 102, and the printed wiring board 102. And a sealing portion 104 that seals the light-emitting element 103. The sealing portion 104 is formed by filling the storage recess 110 with a liquid sealing resin and placing the printed wiring board 102 thereon, followed by thermosetting. However, when the printed wiring board 102 is disposed on the sealing resin, bubbles may be mixed in. Therefore, the printed wiring board 102 is provided with a vent hole 120 for exhausting air bubbles mixed in the sealing resin to the opening side of the housing recess 110. Further, in the vent hole 120, the opening 120b on the surface side 102a on which the light emitting element 103 is mounted is provided with a counterbore 123 so that a portion into which bubbles enter is a wide opening, and the bubbles generated in the sealing resin The structure is easy to be guided to the vent hole 120. According to such a configuration, the bubbles generated when the housing recess 110 is filled with the sealing resin can be guided to the outside of the printed wiring board 102, so that the bubbles in the sealing portion 104 can be reduced. .

  However, even in the case of the illumination device 100 having such a structure, the bubbles may not pass through the vent hole 120, and the bubbles may remain. Moreover, since it is necessary to form the ventilation hole 120 in the printed wiring board 102, there also existed a problem that a manufacturing man-hour increased.

  Patent Document 2 discloses means for reducing bubbles in glass in a glass-coated light emitting diode (not shown).

  The glass-coated light-emitting diode has a structure in which the light-emitting diode is sealed with glass in which a fluorescent material is dispersed. The glass-coated light emitting diode is formed as follows. First, glass powder and fluorescent material powder are mixed to form a mixed powder. Next, the mixed powder and a glass lump as a base material are put in a glass melting container, and the glass melting container is heated to 900 ° C. to melt these glasses (glass lump and mixed powder). Subsequently, the phosphor-dispersed glass piece obtained by melting is placed on the light emitting diode, and then heated and softened to seal the light emitting diode and complete the glass-coated light emitting diode.

  According to such a method for manufacturing a glass-coated light-emitting diode, the material of the sealing portion that seals the light-emitting diode is not formed only by glass powder and fluorescent material powder, but a glass lump is used in part. Bubbles generated in the glass can be reduced.

  However, this manufacturing method is a method using a glass lump that does not contain bubbles as the material of the sealing portion, and there is a problem that it can only be applied to a device that is sealed with a remeltable material such as glass. there were. In particular, this method cannot be applied to a light-emitting device using an irreversible thermosetting resin as a material for the sealing portion.

Even when a glass lump is used as the material for the sealing portion, it is necessary to use a member that can withstand the temperature at which the glass is softened as another member that constitutes the light-emitting device. There was a demerit that there was. For example, this manufacturing method cannot be applied to the manufacture of a resin package light emitting device. Further, since the plating state of gold plating or silver plating deteriorates due to heating, it is difficult to apply this manufacturing method to the manufacture of a light emitting device using a member plated with gold plating or silver plating. Moreover, although the fluorescent material powder is melted together with the glass powder, there is a possibility that the fluorescent material may be deactivated by heating during the melting. Furthermore, in this manufacturing method, before the light emitting element is sealed with glass, a heating process of heating the mixed powder and the glass lump with a glass melting container is required, which increases the number of manufacturing steps.
JP 2007-80528 A JP 2007-123410 A

  As described above, a technique for preventing bubbles from being contained in the sealing portion has been proposed. However, as described above, there is a problem that cannot be solved by the technique according to Patent Document 1 or 2.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a light emitting device with small chromaticity variation, low cost, and high reliability, and a method for manufacturing the light emitting device. To do.

  The light-emitting device according to the present invention is connected to the base portion provided with the first external connection electrode and the second external connection electrode, and the first electrode and the second external connection electrode connected to the first external connection electrode. The light emitting portion provided with the second electrode and a sealing portion formed by covering the light emitting portion with a sealing resin in which an antifoaming agent for eliminating bubbles is dispersed are provided.

  According to the light emitting device of the present invention, the bubbles in the sealing portion are reduced by the antifoaming agent dispersed in the sealing resin, so that the spots of the fluorescent material and the light scattering due to the presence of the bubbles are reduced. Therefore, chromaticity spots and luminance spots can be reduced. In addition, since variation in the amount of bubbles in each light emitting device is reduced, chromaticity variation and luminance variation can be reduced. In addition, since bubbles in the sealing portion are reduced, peeling of the sealing portion from the substrate due to the bubbles and occurrence of wire breakage can be reduced, so that the reliability of the light-emitting device can be improved.

  In the light emitting device according to the present invention, the antifoaming agent may be a particle group composed of resin particles and / or inorganic substance particles.

  Particle groups composed of resin particles and / or inorganic substance particles are insoluble in the sealing resin, and the properties of the sealing resin do not change, so light emission is maintained while maintaining the sealing properties of the sealing resin. It is possible to reduce the chromaticity variation of the device and improve the reliability.

  In the light emitting device according to the present invention, the defoamer particles may have a diameter of 0.1 μm to 20 μm.

  With such a configuration, air bubbles of 0.1 μm or more that cause wire breakage or peeling of the sealing resin can be surely eliminated, and by reducing particles smaller than 0.1 μm with respect to the total amount of antifoaming agent Since the proportion of the antifoaming agent that effectively eliminates the bubbles can be increased, the defoaming rate (the defoaming rate relative to the defoaming agent concentration per unit volume) can be improved. Further, it is possible to prevent an increase in light scattering, a decrease in light emission intensity, and a decrease in directivity caused by the presence of an antifoaming agent having a diameter exceeding 20 μm.

  In the light-emitting device according to the present invention, the particle size distribution of the antifoaming agent may have a plurality of peaks.

  There is a correlation between the particle size of the antifoaming agent and the size of the bubbles that disappear, and it is assumed that the particle size distribution of the antifoaming agent has multiple peaks, and by broadening the particle size distribution, a wide range of bubbles in size Can be extinguished. In addition, by broadening the particle size distribution, even if there is a variation in the particle size of the fluorescent material, these fluorescent materials can be uniformly dispersed in the sealing resin. Spots can be reduced.

  In the light emitting device according to the present invention, the antifoaming agent may be made of a material similar to the base resin of the sealing resin.

  With this configuration, since there can be almost no difference in refractive index between the antifoaming agent and the base resin, the light transmittance in the sealing portion can be improved, and the light extraction efficiency from the light emitting portion can be improved. Can be increased. In addition, by making the antifoaming agent and the base resin similar, it is possible to equalize the linear expansion coefficient of the antifoaming agent and the base resin, thus preventing the antifoaming agent and the base resin from peeling off due to heat cycle. The reliability of the product can be improved, and the optical characteristics of the light emitting device can be stabilized over a long period of time.

  In the light emitting device according to the present invention, the antifoaming agent may have a refractive index equivalent to a refractive index of the base resin of the sealing resin.

  With this configuration, since the refractive index of the antifoaming agent is the same as the refractive index of the base resin, the light transmittance can be improved. In particular, when an inorganic substance particle is used as an antifoaming agent, when the antifoaming agent and the base resin cannot be made of the same material, it is possible to select an antifoaming agent equivalent to the refractive index of the base resin. This is an effective means for improving the permeability.

  Moreover, the light-emitting device which concerns on this invention WHEREIN: The linear expansion coefficient of the said defoamer may be equivalent to the linear expansion coefficient of the base resin of the said sealing resin.

  Since the linear expansion coefficient of the antifoaming agent and the linear expansion coefficient of the sealing resin are made equal by this configuration, peeling at the interface between the antifoaming agent and the sealing resin can be prevented. The reliability of the device can be improved. In particular, when the antifoaming agent and the base resin cannot be made of the same material, selecting an antifoaming agent equivalent to the linear expansion coefficient of the base resin is important at the interface between the antifoaming agent and the sealing resin. This is effective in preventing peeling of the film.

  In the light emitting device according to the present invention, the resin particles include epoxy resin particles, acrylic resin particles, imide resin particles, phenol resin particles, silicone resin particles, norbornene resin particles, polymethylpentene resin particles, and amorphous nylon resin. It may be characterized by comprising at least one kind of particles selected from particles, polystyrene resin particles, polyarylate resin particles, polycarbonate resin particles, epoxy-modified silicone resin particles, and organic-modified silicone resin particles.

  With this configuration, it is possible to select from various resin particles as an antifoaming agent, and it is also possible to use a combination of a plurality of types of resin particles, so that an appropriate sealing portion according to the characteristics or application of the light emitting device is obtained. I can.

  In the light-emitting device according to the present invention, the inorganic substance particles are composed of at least one kind of particles selected from silica particles, quartz particles, glass particles, calcium carbonate particles, barium sulfate particles, and aluminum hydroxide particles. May be a feature.

  With this configuration, as an antifoaming agent, it can be selected from various inorganic substance particles, and a plurality of types of inorganic substance particles can be used in combination. It can be.

  In the light emitting device according to the present invention, the sealing resin may be further characterized in that a fluorescent material excited by light from the light emitting portion is further dispersed.

  With this configuration, the light of the light emitting unit can be wavelength-converted by the fluorescent material. Further, by dispersing a plurality of types of fluorescent materials in the sealing resin, a light emitting device having a desired light emission color can be obtained.

  In the light emitting device according to the present invention, the fluorescent material may be made of fluorescent particles.

  With this configuration, the fluorescent particles are not dissolved in the sealing resin, and the characteristics of the sealing resin do not change. Therefore, the wavelength of light from the light emitting unit is maintained while maintaining the sealing characteristics of the sealing resin. Can be converted.

  In the light emitting device according to the present invention, the diameter of the fluorescent particles may be equal to or larger than the diameter of the particles of the antifoaming agent.

  With this configuration, the surface area can be increased by making the diameter of the fluorescent particles larger than the diameter of the particles of the antifoaming agent, so that collision with other particles can be increased. Can be dispersed throughout.

  In the light-emitting device according to the present invention, the light-emitting portion may include a plurality of light-emitting elements. According to this configuration, the light emission intensity of the light emitting device can be improved.

  In the light emitting device according to the present invention, a portion of the base portion where the light emitting portion is disposed may be a concave portion. According to this configuration, light emitted in the lateral direction from the light emitting unit can be reflected by the side surface of the recess, so that the amount of radiation forward of the light emitting unit can be increased.

  Further, in the light emitting device according to the present invention, the base portion is made of glass, phenol resin, polyester resin, epoxy resin, polyimide resin, fluororesin, aluminum oxide, mullite, aluminum nitride, silicon oxide, silicon nitride, silicon carbide, or It may be formed from any material of zirconium oxide. By appropriately selecting an appropriate base portion from the base portions made of these materials, the light emitting device can be adapted to the application.

  In the method for manufacturing a light emitting device according to the present invention, a light emitting part is provided in a base part provided with a first external connection electrode and a second external connection electrode, and the first electrode of the light emitting part is connected to the first external connection electrode. And the second electrode of the light emitting part is connected to the second external connection electrode, and the light emitting part is molded with a sealing resin to form a sealing part. As the stopping resin, a resin in which an antifoaming agent for eliminating bubbles generated in the sealing resin is dispersed is used.

  According to the method for manufacturing a light-emitting device according to the present invention, the bubbles in the sealing resin can be eliminated by the antifoaming agent, and thus a light-emitting device having a sealing portion free from bubbles can be manufactured. That is, it is possible to manufacture a light-emitting device that has less chromaticity spots, luminance spots, chromaticity variations, and luminance variations and does not cause peeling of the sealing portion or wire breakage.

  In addition, since the light emitting device can be manufactured by the same manufacturing process as before except for the step of dispersing the antifoaming agent in the base resin, it can be manufactured using conventional equipment without the need for new capital investment. Since there is no process performed under special manufacturing conditions such as high-temperature melting, the same members as conventional light-emitting devices can be used, so low cost, low chromaticity irregularities, luminance irregularities, chromaticity variations, and luminance variations are reliable. Can produce a light emitting device having a high value.

  Moreover, the manufacturing method of the light-emitting device according to the present invention may include a mixing step of forming the sealing resin by mixing the antifoaming agent with a base resin.

  According to this configuration, instead of using a resin in which an antifoaming agent is dispersed in advance, the antifoaming agent is mixed with the base resin in the manufacturing process, so that the type and ratio of the antifoaming agent can be easily changed. If the bubble generation rate of the sealing part changes, it is possible to reduce the bubble generation by feeding back to the manufacturing process and easily adjusting the amount, type and ratio of the antifoaming agent. Can be improved.

  Further, in the method for manufacturing a light emitting device according to the present invention, the base portion is provided with a plurality of the light emitting portions, and the first electrode of each light emitting portion is connected to each first external connection electrode and the second electrode of each light emitting portion. Are connected to each second external connection electrode, and after these light emitting portions are molded with the sealing resin, the light emitting portions may be separated into individual pieces.

  According to this configuration, since a plurality of light emitting units are provided in the base unit and then separated into individual pieces for each light emitting unit, and a plurality of light emitting devices are manufactured from one base unit, production efficiency can be improved. .

  According to the light emitting device of the present invention, the bubbles in the sealing portion are reduced by the antifoaming agent dispersed in the sealing resin, so that the spots of the fluorescent material and the light scattering due to the presence of the bubbles are reduced. Therefore, chromaticity spots and luminance spots can be reduced. In addition, since variation in the amount of bubbles in each light emitting device is reduced, chromaticity variation and luminance variation can be reduced. In addition, since bubbles in the sealing portion are reduced, peeling of the sealing portion from the substrate due to the bubbles and occurrence of wire breakage can be reduced, so that the reliability of the light-emitting device can be improved.

  According to the method for manufacturing a light-emitting device according to the present invention, the bubbles in the sealing resin can be eliminated by the antifoaming agent, and thus a light-emitting device having a sealing portion free from bubbles can be manufactured. That is, it is possible to manufacture a light-emitting device that has less chromaticity spots, luminance spots, chromaticity variations, and luminance variations and does not cause peeling of the sealing portion or wire breakage.

  Hereinafter, embodiments of a light emitting device according to the present invention will be described with reference to the drawings.

<About light emitting devices>
FIG. 1 is a schematic cross-sectional view of the light-emitting device of Example 1, and FIG. 2 is a schematic cross-sectional view of the light-emitting device of Example 2.

  The light emitting device 1 includes a substrate (base portion) 2, a light emitting element (light emitting portion) 3 mounted on the substrate 2, and a sealing portion 4 that seals the light emitting element 3. The antifoaming agent 5 and the fluorescent material 6 are dispersed. The outer shape of the light emitting device 1 is a rectangular parallelepiped with a small thickness as a whole, and the surface of the sealing portion 4 is formed substantially parallel to the surface of the substrate 2 and the side surface of the sealing portion 4 is a substrate. The side surfaces of the sealing portion 4 and the substrate 2 are formed to be the same flat surface. As a dimension of the light emitting device 1, for example, a dimension having a thickness of 0.6 mm, a width of 1.6 mm, and a length of 2.0 mm is given as an example.

  As the substrate 2 of the light emitting device 1, an aluminum nitride substrate having a high light reflectivity with respect to visible light, a thermal conductivity substantially equal to that of aluminum, and an insulating property is used. The thickness of the substrate 2 is set to 0.3 mm to 0.4 mm in order to facilitate cutting in a cutting process described later. Note that an insulating substrate other than the aluminum nitride substrate may be used according to the reliability and characteristics required by the use of the light emitting device 1. For example, resin substrates made of phenol resin, polyester resin, epoxy resin, polyimide resin, fluororesin, etc., glass, aluminum oxide, mullite, aluminum nitride, silicon oxide, silicon nitride, silicon carbide, zirconium oxide, etc. An inorganic material-based substrate to be formed or a composite substrate in which an inorganic material and a polymer material are laminated, such as a glass epoxy substrate, may be used. By appropriately selecting an appropriate substrate 2 from these substrates 2, the light-emitting device 1 can be made suitable for use and cost. Instead of the flat substrate 2, a bowl-shaped case may be used.

  A wiring pattern 10 is formed on the surface 2 a of the substrate 2. The light emitting element 3 is mounted on the land 10a as the wiring pattern 10, and the back electrode (second electrode) of the light emitting element 3 and the land 10a are bonded by a conductive adhesive. The surface electrode (first electrode) of the light emitting element 3 is connected to another wiring pattern (a wiring pattern independent of the land 10a; hereinafter referred to as a connection wiring pattern 10b) by the wire 12.

  A second external connection electrode 13 and a first external connection electrode 14 are formed on the back surface 2 b of the substrate 2. The second external connection electrode 13 is connected to the land 10a through a through conductor (through hole) 15a. The first external connection electrode 14 is connected to the connection wiring pattern 10b through the through conductor 15b.

  As the light emitting element 3, a blue light emitting diode having a main light emission peak in a blue wavelength region having a wavelength of 400 nm or more and 530 nm or less is used. The light emitting element 3 may be any device that emits light that excites the fluorescent material 6, and for example, a blue-violet laser diode may be used.

  The sealing portion 4 is formed by sealing the light emitting element 3 with a sealing resin 8 (see FIG. 6 or 7). In this embodiment, the sealing portion 4 is formed so that the entire surface 2 a of the substrate 2 is covered with the sealing resin 8 together with the light emitting element 3. The sealing resin 8 is formed by dispersing the antifoaming agent 5 and the fluorescent material 6 in the base resin. As the base resin, for example, a thermosetting liquid silicone resin or an epoxy resin is used.

  The defoamer 5 destabilizes bubbles generated in the sealing resin 8 and leads to bubble breakage. There is a light diffusing agent to be dispersed in the sealing resin 8, but the antifoaming agent 5 is different from the light diffusing agent. That is, the light diffusing agent is a spherical particle that diffuses light and has a small refractive index and a particle diameter of 20 μm to 100 μm. On the other hand, the antifoaming agent 5 is not limited to a spherical shape, and the particle diameter is also a light diffusing agent. The smaller one is used.

  The antifoaming agent 5 is not composed of a soluble material such as a surfactant, but is present in the form of particles that are not dissolved in the sealing resin 8, such as resin particles, inorganic substance particles, or these. The mixed particle group is preferably used. That is, the resin particles, the inorganic substance particles, or the mixed particle group thereof are particles that are not dissolved in the sealing resin 8 and the characteristics of the sealing resin 8 do not change. While maintaining the sealing characteristics, the chromaticity variation of the light emitting device 1 can be reduced and the reliability can be improved.

  Specifically, when the base resin of the sealing resin 8 is a liquid silicone resin, silicone resin particles having an average particle diameter of 5 μm are used as the antifoaming agent 5. In particular, the range of the particle diameter of the silicone resin particles is preferably 0.1 μm to 20 μm in diameter.

  According to this configuration, air bubbles of 0.1 μm or more that cause disconnection of the wire 12 or peeling of the sealing resin 8 can be surely eliminated, and smaller than 0.1 μm with respect to the total amount of the antifoaming agent 5. Since the proportion of the antifoaming agent 5 that effectively eliminates the bubbles can be increased by reducing the particles, the defoaming rate (the defoaming rate relative to the defoaming agent concentration per unit volume) can be improved. In addition, it is possible to prevent an increase in light scattering, a decrease in emission intensity, and a decrease in directivity that may occur due to the presence of the antifoaming agent 5 having a diameter exceeding 20 μm.

  Moreover, you may mix and use several types of particle | grains from which a particle size differs as the antifoamer 5, like the light-emitting device 1 of Example 2 shown in FIG. For example, when the base resin of the sealing resin 8 is an epoxy resin, three types of epoxy resin particles having an average particle diameter (diameter average) of 2 μm, 5 μm, and 12 μm are used as the antifoaming agent 5.

  According to such a configuration, there is a correlation between the particle size of the antifoaming agent 5 and the diameter of the bubbles that disappear, and it is assumed that the particle size distribution of the antifoaming agent 5 has a plurality of peaks and broadens the particle size distribution. By doing so, bubbles in a wide range in size can be eliminated. Further, by setting the particle size distribution to be broad, even if there is a variation in the particle size of the fluorescent material 6, these fluorescent material 6 can be uniformly dispersed in the sealing resin 8. Spots and chromaticity spots can be reduced.

  The antifoaming agent 5 is preferably made of the same material as the base resin of the sealing resin 8 such that epoxy resin particles are used when the base resin is an epoxy resin. With this configuration, there can be almost no difference in refractive index between the antifoaming agent 5 and the base resin, so that the light transmittance in the sealing portion 4 can be improved, and the light from the light emitting element 3 can be improved. The extraction efficiency can be increased. Moreover, since the linear expansion coefficient of the defoamer 5 and the base resin can be made equal by using the same resin as the defoamer and the base resin, the defoamer 5 and the base resin are peeled off by heat cycle. Can be prevented, the reliability of the product can be improved, and light dispersion due to peeling does not occur. Therefore, the light dispersion characteristics of the light-emitting device 1 can be stabilized over a long period of time.

  When the antifoaming agent 5 and the base resin of the sealing resin 8 cannot be made of the same material, the refractive index of the antifoaming agent 5 may be a value equivalent to the refractive index of the base resin of the sealing resin 8. preferable. With this configuration, the refractive index of the antifoaming agent 5 is the same as the refractive index of the base resin, so that the light transmittance can be improved. In particular, in the case where inorganic substance particles are used as the antifoaming agent 5 to be dispersed in the sealing resin 8, such as when the antifoaming agent 5 and the base resin cannot be made of similar materials, the extinction equivalent to the refractive index of the base resin Selecting the foam 5 is an effective means for improving the light transmission.

  Moreover, it is preferable that the linear expansion coefficient of the antifoaming agent 5 is equal to the linear expansion coefficient of the base resin of the sealing resin 8. With this configuration, since the linear expansion coefficient of the antifoaming agent 5 and the linear expansion coefficient of the sealing resin 8 are made equal, peeling at the interface between the antifoaming agent 5 and the sealing resin 8 can be prevented. Therefore, the reliability of the light emitting device 1 can be improved. In particular, when the antifoaming agent 5 made of a material different from that of the base resin is used, the selection of the antifoaming agent 5 having the same linear expansion coefficient as the base resin is a boundary between the antifoaming agent 5 and the sealing resin 8. This is effective in preventing peeling on the surface.

  The antifoaming agent 5 is not limited to silicone resin particles or epoxy resin particles, and other resin particles may be used. For example, acrylic resin particles, imide resin particles, phenol resin particles, silicone resin particles, norbornene resin particles, polymethylpentene resin particles, amorphous nylon resin particles (amorphous polyamide resin particles), polystyrene resin particles, polyarylate Resin particles, polycarbonate resin particles, epoxy-modified silicone resin particles, organic-modified silicone resin particles and the like may be used, and mixed particles containing at least one kind selected from these particles may be used as the antifoaming agent 5. . With this configuration, the antifoaming agent 5 can be selected from various resin particles, and a plurality of types of resin particles can be used in combination. Therefore, an appropriate sealing portion according to the characteristics or application of the light emitting device 1 4 can be used.

  Moreover, the antifoamer 5 is not limited to what is formed from an organic material, You may use what was formed from the inorganic substance. For example, silica particles, quartz particles, glass particles, calcium carbonate particles, barium sulfate particles, aluminum hydroxide particles, or mixed particles containing at least one of these particles may be used as the antifoaming agent 5. Since these inorganic substances have a specific refractive index and antifoaming property, by using any of these or a combination thereof as the defoaming agent 5 of the light emitting device 1, it is appropriate depending on the characteristics or application of the light emitting device 1. The sealing part 4 can be obtained. In particular, the inorganic substance particle is an effective substance as the antifoaming agent 5 because it is considered to have an irregular shape and a large number of granules having sharp corners and high efficiency of eliminating bubbles. Moreover, when it is desired to increase the concentration of the antifoaming agent 5 at the bottom of the sealing portion 4, the object can be achieved by applying inorganic substance particles having a specific gravity higher than that of the base resin. For example, in the light emitting device (see FIG. 5) in which the light emitting element 3 is disposed in the recess 7, the specific gravity is higher than that of the sealing resin 8 when the concentration of the antifoaming agent 5 in the recess 7 where air bubbles are easily generated is increased. Inorganic material particles can be selected.

  The fluorescent material 6 absorbs light from the light emitting element 3 and excites it to emit fluorescence, that is, converts the wavelength. By selecting the fluorescent material 6, the light emitting device 1 can have a desired light emission color. Although there are various materials as the fluorescent material 6, it is preferable to use inorganic fluorescent particles. Since such fluorescent particles are not dissolved in the sealing resin 8, the characteristics of the sealing resin 8 do not change. Therefore, the wavelength of light from the light emitting element 3 can be converted while maintaining the sealing characteristics of the sealing resin 8. In addition, when the light from the light emitting element 3 is directly emitted to the outside, the light emitting device 1 is configured without dispersing the fluorescent material 6 in the sealing portion 4.

  The particle diameter (diameter) of the fluorescent material 6 is preferably larger than that of the antifoaming agent 5. Thereby, since the surface area of the fluorescent material 6 becomes relatively large, collision with other particles can be increased, and therefore, the fluorescent material 6 can be dispersed throughout the sealing resin 8 without being settled. That is, since the specific gravity of the fluorescent material 6 is higher than that of the sealing resin 8, the fluorescent material 6 sometimes settles until the sealing resin 8 is thermally cured. Since the collision with the antifoaming agent 5 can be increased by making it larger than the particle diameter of the agent 5, this sedimentation can be prevented. Further, from the viewpoint of preventing sedimentation of the fluorescent material 6 and uniformly dispersing in the sealing resin 8, the defoamer 5 dispersed in the sealing resin 8 has the same specific gravity as the sealing resin 8. It is more preferable to use a certain one. According to such a configuration, the defoamer 5 can be uniformly dispersed in the sealing resin 8 because the specific gravity is equal to that of the sealing resin 8, and the diameter is larger than the particle size of the antifoaming agent 5. The fluorescent material 6 is prevented from settling by collision with the uniformly dispersed antifoaming agent 5, and as a result, the fluorescent material 6 can be uniformly dispersed in the sealing resin 8.

As the fluorescent material 6, for example, a yellow fluorescent material having a high average particle diameter of 5 μm such as BOSE (europium activated silicate fluorescent material, (Ba · Sr) ₂ SiO ₄ : Eu) is used. The yellow fluorescent material absorbs blue light emitted from the light emitting element 3 and emits yellow fluorescence having an emission peak in a wavelength region of 550 nm to 600 nm. By including such a fluorescent material 6, the blue light from the light emitting element 3 and the yellow light from the yellow fluorescent material can be emitted simultaneously, so that the emission color can be white.

Further, as the fluorescent material 6, two types of fluorescent materials 6 emitting different wavelengths may be used. For example, β sialon (europium activated fluorescent material, (Si · Al) ₆ (O · N) ₈ : Eu) having an average particle size of 12 μm is used as the green fluorescent material, and the average particle size is used as the red fluorescent material. 7 μm cozun (europium activated pure nitride fluorescent material, (Sr · Ca) AlSiN ₃ : Eu) is used. The green fluorescent material absorbs blue light from the light emitting element 3 and emits green fluorescence having an emission peak in a wavelength region of 490 nm or more and 750 nm or less, and the red fluorescent material absorbs blue light from the light emitting element 3. And red fluorescence having an emission peak in the wavelength region of 600 nm to 750 nm. By using such two kinds of fluorescent materials 6, it is possible to simultaneously emit blue light emitted from the light emitting element 3, green light from the green fluorescent material, and red light from the red fluorescent material, The emission color can be white.

  Here, the chromaticity variation of the light emitting device 1 will be described.

  FIG. 3 is a chromaticity distribution diagram showing chromaticity distributions of a conventional product and an actual product. FIG. 4 is a table showing variations in chromaticity between the conventional product and the actual product.

  FIG. 3 shows 299 chromaticities measured for the conventional product (conventional light-emitting device) in which the antifoaming agent 5 is not dispersed and 414 measured for the practical product (the light-emitting device 1 of the present invention). Chromaticity is shown. As a conventional product, a liquid silicone resin (base resin) in which a sealing portion 4 is formed by a sealing resin in which a yellow fluorescent material BOSE (fluorescent material) having an average particle diameter of 5 μm is dispersed is used. As an actual product, sealing is performed with a sealing resin 8 in which silicone particles (antifoaming agent) having an average particle diameter of 5 μm and yellow fluorescent material BOSE (fluorescent material) having an average particle diameter of 5 μm are dispersed in a liquid silicone resin (base resin). What formed the part 4 is used. In the table shown in FIG. 4, MAX represents the maximum value of chromaticity, MIN represents the minimum value of chromaticity, AVE represents the average value, and STD represents the standard deviation value of chromaticity.

  3 and 4, it can be seen that the chromaticity variation of the implemented product is significantly reduced as compared with the conventional product.

  Further, when the color temperature (Tc) is obtained from the chromaticity diagram and the black body locus (not shown), the color temperature variation is calculated as ± 974K for the conventional product and ± 115K for the actual product. . That is, it can be seen that the dispersion of the antifoaming agent 5 also greatly reduces the variation in the color temperature. That is, FIGS. 3 and 4 show that dispersion of the antifoaming agent 5 in the sealing resin 8 reduces chromaticity variation.

  That is, by dispersing the antifoaming agent 5 in the sealing resin 8, it is possible to uniformly eliminate bubbles that are generated nonuniformly among the individual light emitting devices. As a result, the variation in the amount of bubbles of the individual light emitting devices is reduced, and the variation in the spots of fluorescent material and the amount of scattered light caused by the variation in the amount of bubbles is reduced. The variation in chromaticity and the variation in color temperature caused by the above are reduced.

  According to the above configuration, in the light emitting device 1, the bubbles of the sealing portion 4 are reduced by the antifoaming agent 5 dispersed in the sealing resin 8, and therefore the spots and light of the fluorescent material 6 due to the presence of the bubbles are reduced. Therefore, chromaticity spots and luminance spots can be reduced. In addition, since variation in the amount of bubbles in each light emitting device 1 is reduced, chromaticity variation and luminance variation can be reduced. Moreover, since the bubble of the sealing part 4 reduces, since peeling of the sealing part 4 and the board | substrate 2 by a bubble and generation | occurrence | production of the disconnection of the wire 12 can be reduced, the reliability of the light-emitting device 1 is improved. be able to.

  In addition, since the light emitting device 1 has no chromaticity variation or luminance variation among the individual light emitting devices 1, it can be applied to a lighting device that requires uniformity of chromaticity on the light emitting surface. And if the light emitting device 1 is used as a light source for illumination, it can be set as the illuminating device without chromaticity dispersion | variation and a brightness spot on a light emission surface.

  Next, another example of the light emitting device 1 will be described.

  FIG. 5 is a schematic cross-sectional view of the light-emitting device of Example 3.

  The light-emitting device 1 of this example is similar to the light-emitting device 1 of Example 1 described above. The substrate (base part) 2, the light-emitting element (light-emitting part) 3 mounted on the substrate 2, and the light-emitting element 3 are sealed. The antifoaming agent 5 and the fluorescent material 6 are dispersed in the sealing portion 4, but the difference from the first embodiment is formed on the substrate 2. The light-emitting element 3 is mounted on the bottom surface of the recess 7 (the portion recessed from the surface 2a of the substrate 2 by a drill or the like). That is, with such a structure, the light emitted from the light emitting element 3 in the lateral direction by the concave portion 7 can be reflected by the side surface of the concave portion 7 to increase the amount of radiation forward of the light emitting element 3.

  As the substrate 2, an aluminum oxide substrate 2 that is easy to drill and has high visible light reflectance is used. The thickness of the substrate 2 is set to 0.4 mm to 0.5 mm in order to facilitate cutting in a cutting process described later. Note that other materials may be used for the substrate 2 in accordance with the use, reliability, or characteristics of the light emitting device 1.

  The recess 7 is formed by penetrating the substrate 2 in the thickness direction until reaching the second external connection electrode 13 disposed on the back surface 2b of the substrate 2. That is, the light emitting element 3 is directly mounted on the second external connection electrode 13 disposed on the back surface 2 b of the substrate 2, and the back electrode (second electrode) of the light emitting element 3 is directly connected to the second external connection electrode 13. It is structured. The surface electrode (first electrode) of the light emitting element 3 is connected to the connection wiring pattern 10 b by the wire 12.

  As the light emitting element 3, a blue light emitting diode is used as in the first embodiment.

  The sealing portion 4 is formed so as to seal the light emitting element 3 with the sealing resin 8 while filling the concave portion 7 so that the entire surface 2 a of the substrate 2 is covered.

  As the sealing resin 8, for example, a resin in which silica particles (antifoaming agent) are dispersed in a liquid silicone resin (base resin) is used. Silica particles having an average particle diameter of 5 μm and non-spherical shapes are used. By using such an antifoaming agent 5, air bubbles can be reliably eliminated. In the present embodiment, silica particles having a specific gravity higher than that of the liquid silicone are selected so that the density of the antifoaming agent 5 is increased in the recesses 7.

In addition, two kinds of fluorescent materials 6 are dispersed in the sealing resin 8. BOSE (Europium-activated silicate phosphor, (Ba · Sr) ₂ SiO ₄ : Eu) having an average particle size of 5 μm as a yellow fluorescent material and Kazun (Pure nitride with europium) having an average particle size of 8 μm as a red fluorescent material A fluorescent material (Sr · Ca) AlSiN ₃ : Eu) is dispersed. The yellow fluorescent material absorbs blue light emitted from the light emitting element 3 and emits yellow fluorescence having an emission peak in a wavelength region of 550 nm to 600 nm, and the red fluorescent material emits blue light emitted from the light emitting element 3. It absorbs light and emits red fluorescence having an emission peak in a wavelength region of 600 nm to 750 nm. By including such two kinds of fluorescent materials 6, the blue light emitted from the light emitting element 3, the yellow light from the yellow fluorescent material, and the red light from the red fluorescent material are simultaneously emitted. Can be white.

  According to the above configuration, the light emitting device 1 reduces the bubbles in the sealing portion 4 by the antifoaming agent 5 dispersed in the sealing resin 8. Since scattering is reduced, chromaticity spots and luminance spots can be reduced. In addition, since variation in the amount of bubbles generated in each light emitting device 1 is reduced, chromaticity variation and luminance variation can be reduced.

  Moreover, even if it is the light emitting device 1 which has the structure where the recessed part 7 is provided and the bubble is easy to generate | occur | produce like the light emitting device 1 of a present Example, the bubble which generate | occur | produces in the recessed part 7 can be extinguished reliably. . That is, the incidence rate of bubbles in the narrow concave portion 7 is higher than that in the flat portion of the substrate 2, but the antifoaming agent 5 is uniformly dispersed in the sealing resin 8. The generated bubbles are surely eliminated with the same probability as the bubbles generated in the flat portion. Therefore, even in the light emitting device 1 having a narrow space such as the recess 7, bubbles in the sealing portion 4 can be reduced.

  Furthermore, if the antifoaming agent 5 is configured to disperse the antifoaming agent 5 having a specific gravity slightly higher than that of the sealing resin 8, the antifoaming agent 5 is allowed to sink and more reliably in a narrow space such as the recess 7. Since the antifoaming agent 5 can be wrapped around, the bubbles generated in the narrow space can be surely eliminated. In addition, when both the antifoaming agent 5 and the fluorescent material 6 are selected to have a specific gravity higher than that of the sealing resin 8, the antifoaming agent 5 and the fluorescent material 6 are sunk in the recesses 7, and these are disposed around the light emitting element 3. Since the bubbles around the light emitting element 3 can be eliminated and the antifoaming agent 5 and the fluorescent material 6 can be uniformly and densely dispersed, the wavelength of light can be efficiently converted. .

  In Examples 1 to 3, an example in which one light-emitting element 3 is mounted on the substrate 2 is described, but the light-emitting device 1 is not limited to such a configuration. For example, the light emitting unit may be composed of a plurality of light emitting elements 3. The light emission intensity of the light emitting device 1 can be improved.

  Moreover, although the light emitting device 1 that generates white light by excitation of the fluorescent material 6 has been described, the present invention is not limited to the one containing the fluorescent material 6. That is, the present invention is also applied to a light emitting device that does not include the fluorescent material 6. For example, the present invention can be applied to a red light emitting device formed by sealing a red LED with a sealing resin. In this case, by dispersing the antifoaming agent in the sealing resin, the bubbles in the sealing portion can be eliminated, so that a red light-emitting device with small luminance unevenness and high reliability can be obtained.

<About manufacturing method>
The manufacturing method of the light-emitting device 1 is demonstrated based on FIG.

  FIG. 6 is a schematic perspective view showing a processed state in each step of one manufacturing method of the light emitting device.

  First, as illustrated in FIG. 6A, the through conductors 15 a and 15 b are formed on the substrate 2. Further, lands 10a and connection wiring patterns 10b connected to the respective through conductors 15a and 15b are formed on the front surface 2a of the substrate 2, and second electrodes connected to the respective through conductors 15a and 15b on the back surface 2b of the substrate 2. The external connection electrode 13 and the first external connection electrode 14 are formed.

  Next, the light-emitting element 3 is mounted on the land 10a, and the back electrode (second electrode) of the light-emitting element 3 and the land 10a are bonded with a conductive adhesive. Subsequently, the surface electrode (first electrode) of the light emitting element 3 and the connection wiring pattern 10 b are connected by the wire 12. Thereby, the back electrode of the light emitting element 3 is connected to the second external connection electrode 13 through the through conductor 15a, and the surface electrode of the light emitting element 3 is connected to the first external connection electrode 14 through the through conductor 15b. The

  On the other hand, the liquid sealing resin 8 is formed by adding the fluorescent material 6 and silicone resin particles (antifoaming agent) to the liquid silicone resin as the base resin and stirring and defoaming under reduced pressure using a stirring and defoaming machine. Is done. The mixing ratio is, for example, 60: 100: 62 (weight ratio) for the silicone resin particles, the liquid silicone resin, and the fluorescent material 6.

  In the stirring step, bubbles are generated by mixing the sealing resin 8, but bubbles are broken by the antifoaming agent 5 during the mixing, so that the generation of bubbles itself is suppressed. Further, since the process is performed under reduced pressure, the bubbles are released from the sealing resin 8 and almost disappear.

  Subsequently, the substrate 2 on which the light emitting element 3 is mounted is placed on the stage of a heating press, and the sealing resin 8 is poured into the surface 2a of the substrate 2 by an injector as shown in FIG. 6B. It is.

  Further, as shown in FIG. 6C, in order to form the sealing portion 4 having a predetermined height, a set of two spacer jigs 21, 21 are opposed to the front, rear, left, and right around the substrate 2. (The illustration of the front and rear spacer jigs is omitted in the figure), and a flat upper mold 22 is placed on the surface of the sealing resin 8. Then, the sealing resin 8 and the substrate 2 are pressed. When the sealing resin 8 is pressed, bubbles in the sealing resin 8 are broken by the silicone resin particles. In order to prevent the sealing resin 8 from spilling from the substrate 2, the spacer jig 21 may be arranged before the sealing resin 8 is poured in FIG. 6B. Further, the upper mold 22 for pressing the sealing resin 8 is not limited to a flat one as shown in FIG. 6C, and may be any one that can pressurize the sealing resin 8. . For example, when a convex lens is provided on the upper portion of the sealing portion 4, an upper mold 22 provided with a concave portion corresponding to the convex lens is used.

  Next, as shown in FIG. 6D, the sealing resin 8 is cured by heating in the pressed state, and the sealing portion 4 is formed.

  Further, as shown in FIGS. 6E and 6F, the substrate 2 and the sealing portion 4 are cut so as to be divided into structural units, whereby individual light emitting devices 1 are obtained.

  According to the method for manufacturing the light emitting device 1, since the bubbles in the sealing resin 8 can be eliminated by the antifoaming agent 5, the light emitting device 1 having the sealing portion 4 having no bubbles can be manufactured. it can. That is, it is possible to manufacture the light emitting device 1 in which chromaticity spots, luminance spots, chromaticity variations, and luminance variations are small, and the sealing portion 4 is not peeled off or the wires are not disconnected.

  Moreover, since the light emitting device 1 can be manufactured by a manufacturing process similar to the conventional method other than the step of dispersing the antifoaming agent 5 in the base resin, it can be manufactured using conventional facilities without the need for new capital investment. In addition, since the same member as the conventional light emitting device 1 can be used without a process performed under special manufacturing conditions such as high temperature melting, the chromaticity unevenness, luminance unevenness, chromaticity variation, and luminance variation are small at low cost. The light emitting device 1 with high reliability can be manufactured.

  Moreover, since the antifoaming agent 5 is mixed with the base resin in the manufacturing process instead of using a resin in which the antifoaming agent 5 is dispersed in advance, the type and ratio of the antifoaming agent 5 can be easily changed. If the bubble generation rate of the sealing part 4 is changed, it is possible to reduce the bubble generation by feeding back to the manufacturing process and easily adjusting the amount, type, and ratio of the antifoaming agent 5. Can be improved.

  In addition, since a plurality of light emitting elements 3 are provided on the substrate 2 and then separated into individual pieces for each light emitting element, and a plurality of light emitting devices 1 are manufactured from one substrate 2, production efficiency can be improved.

  Next, another manufacturing method of the light emitting device 1 will be described with reference to FIG.

  FIG. 7 is a schematic perspective view showing a processed state in each step of another manufacturing method of the light emitting device.

  First, as shown in FIG. 7A, the through conductors 15a, 15b,. Further, lands 10a and connection wiring patterns 10b connected to the respective through conductors 15a and 15b are formed on the surface 2a of the substrate 2, and a second external connected to the respective through conductors 15a and 15b on the back surface 2b of the substrate 2. A connection electrode 13 and a first external connection electrode 14 are formed.

  Next, the light-emitting element 3 is mounted on the land 10a, and the back electrode (second electrode) of the light-emitting element 3 and the land 10a are bonded with a conductive adhesive. Subsequently, the surface electrode (first electrode) of the light emitting element 3 and the connection wiring pattern 10 b are connected by the wire 12. Thereby, the back electrode of the light emitting element 3 is connected to the second external connection electrode 13 through the through conductor 15a, and the surface electrode of the light emitting element 3 is connected to the first external connection electrode 14 through the through conductor 15b. The

  On the other hand, the fluorescent material 6 and the silicone resin particles are added to the liquid silicone resin as the base resin, and the liquid sealing resin 8 is formed by stirring and defoaming under reduced pressure using a stirring and defoaming machine. Here, the mixing ratio is 50: 100: 36 (weight ratio) for the epoxy resin particles, the liquid epoxy resin, and the fluorescent material 6 (total of two types).

  Next, as shown in FIG. 7B, a mask 31 in which openings 31a corresponding to the individual light emitting elements 3 are formed is aligned and arranged on the substrate 2 on which the light emitting elements 3 are mounted. Is done. Then, the sealing resin 8 is discharged to the outer edge of the mask 31 by a discharger.

  Subsequently, as shown in FIG. 7C, the squeegee 32 is tilted in the traveling direction and slid with respect to the substrate 2 in order to fill the opening 31 a with the sealing resin 8. At this time, in the first sliding of the squeegee 32, the inclination (angle formed by the surface perpendicular to the substrate 2 and the squeegee 32) is reduced, and in the forward path immediately after that, the inclination is increased and the sliding is performed. Thereafter, the squeegee 32 is reciprocated several times with the same inclination (increased inclination). According to such an operation, the upper surface of the opening 31a can be filled by the first sliding of the squeegee 32, and the sealing resin 8 filled in the opening 31a by the subsequent operation of the squeegee 32 is opened. The sealing resin 8 can be reliably filled without spilling outside the portion 31a. Further, since the inclination is increased except for the operation of the first squeegee 32, the entrainment of air can be reduced, so that almost all new bubbles other than the bubbles generated by the first squeegee operation are generated. In addition, the surface of the sealing resin 8 can be flattened. Further, since the sealing resin 8 can be flowed by reciprocating the squeegee 32 several times, the bubbles contained in the sealing resin 8 can be eliminated.

  Next, in FIG. 7D, the sealing resin 4 is cured by heating to form the sealing portion 4. Thereafter, the mask 31 is removed.

  Then, as shown in FIG. 7E, the substrate 2 and the sealing portion 4 are cut so as to be divided for each structural unit, whereby individual light emitting devices 1 are obtained.

  According to the manufacturing method of the light emitting device 1 described above, the same effects as the manufacturing method of the light emitting device 1 described above (the manufacturing method of the light emitting device 1 described based on FIG. 6) can be obtained.

  In addition, although the two examples were given as a manufacturing method of the light-emitting device 1, the manufacturing method of the light-emitting device 1 which concerns on this invention is not applied only to a manufacturing method to these, It is applied also to another manufacturing method. sell. That is, as long as the process of forming the sealing part 4 with the sealing resin 8 containing the antifoaming agent 5 is included, it can be applied to any method for manufacturing a light emitting device.

1 is a schematic cross-sectional view of a light-emitting device of Example 1. FIG. 6 is a schematic cross-sectional view of a light-emitting device of Example 2. FIG. It is a chromaticity distribution diagram showing the chromaticity distribution of a conventional product and an implementation product. It is the table | surface which showed the chromaticity dispersion | variation of a conventional product and an implementation product. 6 is a schematic cross-sectional view of a light-emitting device of Example 3. FIG. It is the schematic perspective view which showed the processing state in each process of one manufacturing method of a light-emitting device. It is the schematic perspective view which showed the processing state in each process of the other manufacturing method of a light-emitting device. It is the schematic sectional drawing which showed the structure of the conventional illuminating device.

Explanation of symbols

1 Light-emitting device 2 Substrate (base part)
3 Light emitting element (light emitting part)
DESCRIPTION OF SYMBOLS 4 Sealing part 5 Antifoaming agent 6 Fluorescent material 7 Recessed part 8 Sealing resin 10 Wiring pattern 10a Land 10b Wiring pattern for connection 12 Wire 13 2nd external connection electrode 14 1st external connection electrode 15 Through-conductor

Claims (13)

A base portion provided with a first external connection electrode and a second external connection electrode;
A light emitting unit provided with a first electrode connected to the first external connection electrode and a second electrode connected to the second external connection electrode;
A sealing part formed by covering the light emitting part with a sealing resin in which an antifoaming agent for eliminating bubbles is dispersed;
With
The antifoaming agent is a particle group composed of resin particles that are insoluble in the sealing resin ,
The diameter of the particles of the antifoaming agent is 0.1 μm to 20 μm,
The sealing resin is obtained by further dispersing fluorescent particles excited by light from the light emitting part . The light-emitting device according to claim 1 .
The particle size distribution of the antifoaming agent has a plurality of peaks. The light-emitting device according to claim 1 or 2 ,
The light emitting device, wherein the resin particles are made of the same material as the base resin of the sealing resin. The light emitting device according to any one of claims 1 to 3 ,
A light emitting device characterized in that a refractive index of the antifoaming agent is equal to a refractive index of a base resin of the sealing resin. The light emitting device according to any one of claims 1 to 4 ,
The linear expansion coefficient of the said defoamer is equivalent to the linear expansion coefficient of the base resin of the said sealing resin, The light emitting device characterized by the above-mentioned. The light emitting device according to any one of claims 1 to 5 ,
The resin particles are epoxy resin particles, acrylic resin particles, imide resin particles, phenol resin particles, silicone resin particles, norbornene resin particles, polymethylpentene resin particles, amorphous nylon resin particles, polystyrene resin particles, polyarylate resin particles. A light emitting device comprising at least one kind of particles selected from polycarbonate resin particles, epoxy-modified silicone resin particles, and organic-modified silicone resin particles. The light emitting device according to any one of claims 1 to 6 ,
The diameter of the said fluorescent particle is more than the diameter of the particle | grains of the said antifoamer, The light-emitting device characterized by the above-mentioned. The light emitting device according to any one of claims 1 to 7 ,
The light emitting device includes a plurality of light emitting elements. The light emitting device according to any one of claims 1 to 8 ,
A light emitting device, wherein a portion of the base portion where the light emitting portion is disposed is a concave portion. The light emitting device according to any one of claims 1 to 9 ,
The base portion is made of any material of glass, phenol resin, polyester resin, epoxy resin, polyimide resin, fluororesin, aluminum oxide, mullite, aluminum nitride, silicon oxide, silicon nitride, silicon carbide, or zirconium oxide. A light-emitting device formed. A light emitting portion is provided in a base portion provided with the first external connection electrode and the second external connection electrode, the first electrode of the light emitting portion is connected to the first external connection electrode, and the second electrode of the light emitting portion is connected to the first electrode. In the manufacturing method of the light emitting device manufactured by connecting to the second external connection electrode and molding the light emitting part with a sealing resin to form the sealing part,
As the sealing resin, using a resin in which an antifoaming agent that eliminates bubbles generated in the sealing resin is dispersed,
Wherein the defoaming agent, Ri particles der made of resin particles is non-soluble in the encapsulating resin,
The diameter of the particles of the antifoaming agent is 0.1 μm to 20 μm,
The method for manufacturing a light-emitting device, wherein the sealing resin is obtained by further dispersing fluorescent particles excited by light from the light-emitting portion . In the manufacturing method of the light emitting device according to claim 11 ,
The manufacturing method of the light-emitting device characterized by including the mixing process which forms the said sealing resin by mixing the said antifoamer with base resin. In the manufacturing method of the light emitting device of Claim 11 or 12 ,
A plurality of the light emitting portions are provided on the base portion, the first electrode of each light emitting portion is connected to each first external connection electrode, the second electrode of each light emitting portion is connected to each second external connection electrode, and the sealing is performed. A method of manufacturing a light emitting device, wherein the light emitting part is molded with a stop resin and then separated into individual pieces for each light emitting part.

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