TW538058B - Photosensitive solder resist composition - Google Patents

Photosensitive solder resist composition Download PDF

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Publication number
TW538058B
TW538058B TW090128173A TW90128173A TW538058B TW 538058 B TW538058 B TW 538058B TW 090128173 A TW090128173 A TW 090128173A TW 90128173 A TW90128173 A TW 90128173A TW 538058 B TW538058 B TW 538058B
Authority
TW
Taiwan
Prior art keywords
weight
parts
solder resist
resist composition
photosensitive solder
Prior art date
Application number
TW090128173A
Other languages
English (en)
Chinese (zh)
Inventor
Naoya Yabuuchi
Minoru Fujita
Osamu Namba
Keiichi Okajima
Original Assignee
Nippon Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Paint Co Ltd filed Critical Nippon Paint Co Ltd
Application granted granted Critical
Publication of TW538058B publication Critical patent/TW538058B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW090128173A 2000-11-17 2001-11-14 Photosensitive solder resist composition TW538058B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000351298 2000-11-17
JP2001335994A JP2002236363A (ja) 2000-11-17 2001-11-01 フォトソルダーレジスト組成物

Publications (1)

Publication Number Publication Date
TW538058B true TW538058B (en) 2003-06-21

Family

ID=26604195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090128173A TW538058B (en) 2000-11-17 2001-11-14 Photosensitive solder resist composition

Country Status (5)

Country Link
US (1) US6767678B2 (ja)
EP (1) EP1207424A1 (ja)
JP (1) JP2002236363A (ja)
KR (1) KR20020038533A (ja)
TW (1) TW538058B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057821A (ja) * 2001-08-13 2003-02-28 Showa Highpolymer Co Ltd 感光性樹脂および感光性樹脂組成物
CN101120029B (zh) * 2005-04-27 2010-09-29 三菱化学株式会社 固化性组合物、固化物以及使用该固化物的液晶显示装置
JP4806988B2 (ja) * 2005-07-26 2011-11-02 Ｊｎｃ株式会社 ワニス組成物
US8361696B2 (en) 2007-01-15 2013-01-29 Lg Chem, Ltd. Polymer resin compounds and photoresist composition including new polymer resin compounds
CN101256361B (zh) * 2007-02-26 2011-12-28 新应材股份有限公司 光阻剂

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5462835A (en) * 1991-09-16 1995-10-31 P T Sub Inc. Photocurable composition, flexible, photosensitive articles made therefrom, and methods of improving solvent resistance and flexibility of those articles
US6004705A (en) * 1992-07-07 1999-12-21 Toray Industries, Inc. Photosensitive ceramics green sheet
JP2877659B2 (ja) * 1993-05-10 1999-03-31 日本化薬株式会社 レジストインキ組成物及びその硬化物
US5741621A (en) * 1994-01-10 1998-04-21 E. I. Du Pont De Nemours And Company Process for using photoimageable films prepared for aqueous photoimageable liquid emulsions
JPH0829980A (ja) * 1994-07-14 1996-02-02 Japan Synthetic Rubber Co Ltd 回路基板形成用アルカリ現像型フォトレジスト組成物
JPH08160616A (ja) * 1994-12-12 1996-06-21 Toagosei Co Ltd レジスト用樹脂組成物の製造方法
JP2718007B2 (ja) * 1995-06-06 1998-02-25 太陽インキ製造株式会社 アルカリ現像可能な一液型フォトソルダーレジスト組成物及びそれを用いたプリント配線板の製造方法
JP3953625B2 (ja) * 1998-03-02 2007-08-08 太陽インキ製造株式会社 感光性組成物

Also Published As

Publication number Publication date
KR20020038533A (ko) 2002-05-23
JP2002236363A (ja) 2002-08-23
EP1207424A1 (en) 2002-05-22
US6767678B2 (en) 2004-07-27
US20020090573A1 (en) 2002-07-11

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees