TW527263B - Tool and method for the abrasive machining of a substantially planar surface - Google Patents
Tool and method for the abrasive machining of a substantially planar surface Download PDFInfo
- Publication number
- TW527263B TW527263B TW089116678A TW89116678A TW527263B TW 527263 B TW527263 B TW 527263B TW 089116678 A TW089116678 A TW 089116678A TW 89116678 A TW89116678 A TW 89116678A TW 527263 B TW527263 B TW 527263B
- Authority
- TW
- Taiwan
- Prior art keywords
- tool
- components
- substrate
- cover layer
- grinding
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000003754 machining Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims description 17
- 238000010276 construction Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 description 5
- 235000019589 hardness Nutrition 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000009499 grossing Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000012634 fragment Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
527263 五、發明說明(1) 本發明與用以研磨加工大致平 關。尤其所用普通型工具是:碟狀 實施機械加工所需之精研輪及研磨 研磨輪施工表面之光潔環。 通常該工具係由鑄造製得並經 局部後-硬化處理以符合實際用途。 製造半導體晶圓,必須滿足嚴格的 該工具之結晶微結構之硬度及結構 小。尤其該工具之施工表面甚大時 械始能滿足該項要求。因為利用局 均勻之工具不能對工件實施均勻地 受。 本發明係提供一種方法以比較 來滿足該要求。 本發明與用以研磨加工大致平 工具具有一基體及許多元件,該等 並形成一平整覆蓋層,在表面實施 層係用作施工覆蓋層。 本發明亦與用一工具以研磨加 有關,在該工具中有許多元件係安 件形成一平整覆蓋層,在表面實施 覆蓋層係用作施工覆蓋層。 本發明具有許多特別優點:鑄 熔鑄團塊,可比較容易地加以控制 整表面之工具及方法有 工件(尤其半導體晶圓) 輪及用以整平精研輪及 機械加工及(假若適當) 尤其若該工具係用以 品質要求。舉例言之, 之變動公差範圍非常狹 ,必須藉成本高昂之機 部硬度不同及微結構不 機械加工,所以不能接 簡單且更為有利之方式 整表面之工具有關,該 元件係安裝在該基體上 機械加工期間,該平整 工大致平整表面之方法 裝在一基體上,該等元 機械加工期間,該平整 造一個元件所需之少量 ,所以即使在該等元件
527263 五、發明說明(2) 之鑄造過程 多元件質量 件之機械加 特別的優點 定而且亦可 工具,其微 内而且可精 言之’若某 而未獲選中 施工覆蓋層 與該等 使用之次數 上。如此可 ’每部機械 於達到 諸元件所形 2 5 0 〇個更佳 外形以圓環 ’尤以4至6 本發明 研磨碟狀工 加工精研輪 圖示於下列 第一圖 中所製得 之單件熔 工比較同 是:每個 依照在工 結構及硬 確地配合 一元件因 ,可將其 之性能對 元件相比 比清*兀* 避免浪費 最好備有 一預定磨 成之覆蓋 。該等元 片段、圓 個邊者更 之工具最 件(例如: 及研磨輪 諸圖式内 所示係一 之基體’其微結構及硬度均比具有許 _基體者更均勻。再者,許多個別元 質量之一個熔鑄體者更為容易。一個 元件之微結構及硬度等性能可加以測 具内之用途加以選擇。如此可製得一 度等性能可位於特別狹窄之公差範圍 到利用該工具預定達成之目的。舉例 其硬度未能介於所要求之公差範圍内 加以儲存直到執行某任務之工具所需 應於該元件者時再行使用。 ,該基體不易遭到磨損,所以可一再 件者為多。基體最好僅用在一部機械 工具更換所需之長久定位時間。所以 兩個基體,以便輪流用在該機械上。 耗程度之後,諸元件須加以更換。由 層可能包括2至4〇〇〇個元件,尤以3至 件係經設計為成形冑,該#成形體之 :或具有3至4 0 0個邊之正多邊形為佳 佳。 好半係曰成π精研輪或研磨輪以精研或 Λ明)或成為光學工具以研磨 ,=月工具之合意具體實施例分別 光潔工具之橫斷面圖,該光潔工具係
527263 五、發明說明(3) ------- 用以研磨加工兩個相互面對的精研輪或研磨輪. 圖;^二圖所示係經設計為精研輪或研磨輪之时工具橫斷面 Ϊ三2圖:示係合意使用諸元件之俯視平面圖。 一弟一圖所示光潔工具包括圓環狀基體i,並兩面 凡,。在基體!之外圓周上具有邊齒常、裝 研機或研磨機碟狀工件之載且者。 =:用以固疋精 或研磨輪加以光潔,Λ體丨/、往、/將该4機械之精研輪 或研磨機之上及下於^於或、以右干兀件2且裝在精研機 使其轉動,(假若二^研^之間(以取代一載具)且 劑正在供應時,使用田一产寶女耗作用之精研劑。當精研 基體較為有利,以阮μ = f較之基體或經設計成圓碟之 依照本發明之—立 控制之情況下精研劑流下來。 於—塑膠碟8力、固〇思具體實施例,該基體之環洞係藉助 低,所u a使°用Ί閉/該基體承受光潔操作之負荷非常 期檢定是否辱命ί超過諸元件者。該等元件應常作定 以更換 W預定磨損程度,如已達到該程度,即加 中包ΐ 之工具係經設計為精研或研磨之工具,其 體之一個^^^^圓碟幻及許多元州安裝在基 使用工I時執旦基具有一強有力之冷卻系統7以確保在 常有之覆蓋;Γ之有效散失。若所用元件甚多•,精研輪 之2m 口作用則可免除,以省去準備使用該工具 蓋層内形成伸!研::;::=:在盖精研輪工作期間覆 和乂又之溝槽結構。如此則形成可容 527263 五、發明說明(4) 納精研劑液 ,諸元件之 基體上時, 。最好諸元 與切口精研 第三至 第三圖所示 依次配置俾 係同心環且 之諸元件9 ' 互隔離,所 ,其邊角則 元件為數極 元件編號說 1 基體 2 元件 3 元件 4 基體 5 元件 6 元件 7 冷卻系 8 塑膠碟 9 元件 10 間隙 體之通道。依照本發明之一個合意具體實施例 間隙具有該等通道之功能。將諸元件安裝在該 係經適當之放置俾該等元件間形成對應之間隙 件之形狀及間隙寬度係經適當地選擇俾該結構 輪覆蓋層之表面相似。 五圖所示係基體上諸元件之合意形狀及配置。 之諸元件5,其外形呈圓環片段狀,且係相連 其覆蓋整個環狀基體。第四圖所示之諸元件6 覆蓋整個基體。第五圖所示絕大多數為正方形 實質上覆蓋了基體之表面。諸元件5、6及9相 以形成諸間隙1 0。在元件覆蓋基體邊緣之區域 加以圓化。若基體上所安裝基底表面積甚小之 多時,基體之邊緣區可免除覆蓋。 明·· 統
第7頁
Claims (1)
- 527263 六、申請專利範圍 在基體上安裝許多元件,該等元件形成一平整覆蓋層,在 實施表面加工期間,該平整覆蓋層係用作施工覆蓋層; 檢驗元件之特性,如:微結構及硬度;及 安裝在基體上之元件,必須位於該等特性之公差範圍内。 10. 如申請專利範圍第9項之方法,其中該等元件係由熔 鑄金屬製成,該基體上所安裝之元件均係具有實質上均勻 微結構及硬度者。 11. 如申請專利範圍第9或1 0項之方法,其中於磨損到達 某種程度後,將該等元件加以更換。 12. 如申請專利範圍第9或1 0項之方法,其中該基體係加 以強有力之冷卻。 13. 如申請專利範圍第9或1 0項之方法,其中該基體專供 特定機械使用。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19939258A DE19939258A1 (de) | 1999-08-19 | 1999-08-19 | Werkzeug und Verfahren zum abrasiven Bearbeiten einer im wesentlichen ebenen Fläche |
Publications (1)
Publication Number | Publication Date |
---|---|
TW527263B true TW527263B (en) | 2003-04-11 |
Family
ID=7918858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089116678A TW527263B (en) | 1999-08-19 | 2000-08-17 | Tool and method for the abrasive machining of a substantially planar surface |
Country Status (6)
Country | Link |
---|---|
US (1) | US6439987B1 (zh) |
EP (1) | EP1077111A1 (zh) |
JP (1) | JP2001088038A (zh) |
KR (1) | KR20010050057A (zh) |
DE (1) | DE19939258A1 (zh) |
TW (1) | TW527263B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3666333B2 (ja) * | 2000-01-12 | 2005-06-29 | 株式会社村田製作所 | 研磨方法ならびに電子部品および可変コンデンサ |
US8317573B2 (en) * | 2008-04-09 | 2012-11-27 | Seagate Technology Llc | Double annular abrasive element dressers |
WO2017033280A1 (ja) * | 2015-08-25 | 2017-03-02 | 株式会社クリスタル光学 | 研磨工具及び研磨工具の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1100612A (en) * | 1913-03-17 | 1914-06-16 | George Pointon | Abrading device for grinding-machines. |
DE2026903A1 (de) * | 1970-06-02 | 1971-12-16 | J Konig + Co oHG, Werkzeugfabrik, 7500 Karlsruhe | Schleifteller fur Handschleif maschinen |
DE3128880C2 (de) | 1981-07-22 | 1987-03-19 | Fa. Peter Wolters, 2370 Rendsburg | Maschine zum Läppen oder Polieren |
JPS60242975A (ja) | 1984-05-14 | 1985-12-02 | Kanebo Ltd | 平面研磨装置 |
DE4027627A1 (de) | 1990-08-31 | 1992-03-05 | Wolters Peter Fa | Arbeitsscheibe fuer laepp-, hon- und poliermaschinen |
DE4240476A1 (de) * | 1992-12-02 | 1994-06-16 | Winter & Sohn Ernst | Schleifscheibe zum spangebenden Bearbeiten von Werkstückflächen |
JPH09510405A (ja) * | 1994-09-08 | 1997-10-21 | ストルエルス アクチェ セルスカプ | 回転可能な研削/研磨ディスクの上に置くための研削/研磨用カバーシート |
JP3611404B2 (ja) * | 1996-06-21 | 2005-01-19 | 株式会社荏原製作所 | ポリッシング装置 |
US6062958A (en) * | 1997-04-04 | 2000-05-16 | Micron Technology, Inc. | Variable abrasive polishing pad for mechanical and chemical-mechanical planarization |
KR100485846B1 (ko) * | 1997-05-09 | 2005-04-28 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 모자이크 폴리싱 패드 및 그와 관련된 방법 |
US5938506A (en) | 1997-06-03 | 1999-08-17 | Speedfam-Ipec Corporation | Methods and apparatus for conditioning grinding stones |
DE59802418D1 (de) * | 1997-10-24 | 2002-01-24 | Sia Schweizer Schmirgel & Schl | Schleifkörper und Befestigungsvorrichtung |
DE19756537A1 (de) * | 1997-12-18 | 1999-07-01 | Wacker Siltronic Halbleitermat | Verfahren zum Erzielen eines möglichst linearen Verschleißverhaltens und Werkzeug mit möglichst linearem Verschleißverhalten |
US6102789A (en) * | 1998-03-27 | 2000-08-15 | Norton Company | Abrasive tools |
-
1999
- 1999-08-19 DE DE19939258A patent/DE19939258A1/de not_active Ceased
-
2000
- 2000-06-23 US US09/602,397 patent/US6439987B1/en not_active Expired - Fee Related
- 2000-07-27 EP EP00115098A patent/EP1077111A1/de not_active Withdrawn
- 2000-08-11 KR KR1020000046623A patent/KR20010050057A/ko active IP Right Grant
- 2000-08-16 JP JP2000246974A patent/JP2001088038A/ja active Pending
- 2000-08-17 TW TW089116678A patent/TW527263B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2001088038A (ja) | 2001-04-03 |
EP1077111A1 (de) | 2001-02-21 |
DE19939258A1 (de) | 2001-03-08 |
US6439987B1 (en) | 2002-08-27 |
KR20010050057A (ko) | 2001-06-15 |
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