TW519725B - Via first dual damascene process for copper metallization - Google Patents

Via first dual damascene process for copper metallization Download PDF

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Publication number
TW519725B
TW519725B TW090116395A TW90116395A TW519725B TW 519725 B TW519725 B TW 519725B TW 090116395 A TW090116395 A TW 090116395A TW 90116395 A TW90116395 A TW 90116395A TW 519725 B TW519725 B TW 519725B
Authority
TW
Taiwan
Prior art keywords
insulating layer
layer
channel
channels
copper
Prior art date
Application number
TW090116395A
Other languages
English (en)
Chinese (zh)
Inventor
Gabriela Brase
Uwe Paul Schroeder
Karen Lynne Holloway
Original Assignee
Infineon Technologies Corp
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Corp, Ibm filed Critical Infineon Technologies Corp
Application granted granted Critical
Publication of TW519725B publication Critical patent/TW519725B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/084—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts for dual-damascene structures
    • H10W20/085—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts for dual-damascene structures involving intermediate temporary filling with material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435—Cross-sectional shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H10W20/4421—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being copper

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW090116395A 2000-06-30 2001-07-02 Via first dual damascene process for copper metallization TW519725B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60854000A 2000-06-30 2000-06-30

Publications (1)

Publication Number Publication Date
TW519725B true TW519725B (en) 2003-02-01

Family

ID=24436949

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090116395A TW519725B (en) 2000-06-30 2001-07-02 Via first dual damascene process for copper metallization

Country Status (4)

Country Link
JP (1) JP2004503089A (https=)
KR (1) KR100474605B1 (https=)
TW (1) TW519725B (https=)
WO (1) WO2002003457A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102454363B1 (ko) 2020-08-24 2022-10-14 주식회사 세움피엔에프 운동기구의 수평 이동 장치
KR102491980B1 (ko) 2021-01-05 2023-01-27 최순복 필라테스용 레더바렐
CN113394184B (zh) * 2021-06-09 2022-06-17 武汉新芯集成电路制造有限公司 半导体器件及其制造方法
US11876047B2 (en) 2021-09-14 2024-01-16 International Business Machines Corporation Decoupled interconnect structures

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904565A (en) * 1997-07-17 1999-05-18 Sharp Microelectronics Technology, Inc. Low resistance contact between integrated circuit metal levels and method for same
US6057239A (en) * 1997-12-17 2000-05-02 Advanced Micro Devices, Inc. Dual damascene process using sacrificial spin-on materials
US6127258A (en) * 1998-06-25 2000-10-03 Motorola Inc. Method for forming a semiconductor device
US6380096B2 (en) * 1998-07-09 2002-04-30 Applied Materials, Inc. In-situ integrated oxide etch process particularly useful for copper dual damascene
US6245662B1 (en) * 1998-07-23 2001-06-12 Applied Materials, Inc. Method of producing an interconnect structure for an integrated circuit
JP2000150644A (ja) * 1998-11-10 2000-05-30 Mitsubishi Electric Corp 半導体デバイスの製造方法
EP1192656A1 (en) * 1999-06-30 2002-04-03 Intel Corporation Method of protecting an underlying wiring layer during dual damascene processing

Also Published As

Publication number Publication date
JP2004503089A (ja) 2004-01-29
KR20030020324A (ko) 2003-03-08
WO2002003457A2 (en) 2002-01-10
WO2002003457A3 (en) 2002-06-06
KR100474605B1 (ko) 2005-03-10

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