TW511450B - Heat dissipation plate with inlay pin and its assembly components - Google Patents

Heat dissipation plate with inlay pin and its assembly components Download PDF

Info

Publication number
TW511450B
TW511450B TW090120335A TW90120335A TW511450B TW 511450 B TW511450 B TW 511450B TW 090120335 A TW090120335 A TW 090120335A TW 90120335 A TW90120335 A TW 90120335A TW 511450 B TW511450 B TW 511450B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
heat sink
heat
dissipation plate
semiconductor
Prior art date
Application number
TW090120335A
Other languages
English (en)
Chinese (zh)
Inventor
Wen-Le Shie
Ning Huang
Hui-Pin Chen
Hua-Wen Chiang
Chuang-Ming Chang
Original Assignee
Orient Semiconductor Elect Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orient Semiconductor Elect Ltd filed Critical Orient Semiconductor Elect Ltd
Priority to TW090120335A priority Critical patent/TW511450B/zh
Priority to US09/988,094 priority patent/US6567270B2/en
Priority to DE10157299A priority patent/DE10157299A1/de
Priority to FR0115390A priority patent/FR2828765A1/fr
Priority to JP2001368493A priority patent/JP2003068956A/ja
Application granted granted Critical
Publication of TW511450B publication Critical patent/TW511450B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW090120335A 2001-08-16 2001-08-16 Heat dissipation plate with inlay pin and its assembly components TW511450B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW090120335A TW511450B (en) 2001-08-16 2001-08-16 Heat dissipation plate with inlay pin and its assembly components
US09/988,094 US6567270B2 (en) 2001-08-16 2001-11-19 Semiconductor chip package with cooling arrangement
DE10157299A DE10157299A1 (de) 2001-08-16 2001-11-22 Halbleiterchipgehäuse mit Kühlvorrichtung
FR0115390A FR2828765A1 (fr) 2001-08-16 2001-11-28 Porte-puce de semiconducteur a systeme de refroidissement et radiateur adapte
JP2001368493A JP2003068956A (ja) 2001-08-16 2001-12-03 放熱板及びその封入件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090120335A TW511450B (en) 2001-08-16 2001-08-16 Heat dissipation plate with inlay pin and its assembly components

Publications (1)

Publication Number Publication Date
TW511450B true TW511450B (en) 2002-11-21

Family

ID=21679100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090120335A TW511450B (en) 2001-08-16 2001-08-16 Heat dissipation plate with inlay pin and its assembly components

Country Status (5)

Country Link
US (1) US6567270B2 (de)
JP (1) JP2003068956A (de)
DE (1) DE10157299A1 (de)
FR (1) FR2828765A1 (de)
TW (1) TW511450B (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103429056A (zh) * 2013-07-26 2013-12-04 昆山维金五金制品有限公司 一种散热片
CN104041202A (zh) * 2011-12-06 2014-09-10 黑拉许克联合股份有限公司 电子模块
CN105280593A (zh) * 2014-05-29 2016-01-27 英飞凌科技股份有限公司 用于半导体器件封装件的可连接封装延伸件
WO2021017556A1 (zh) * 2019-07-26 2021-02-04 广东美的制冷设备有限公司 电路板、变频空调控制板及空调器

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
PL364153A1 (en) * 2003-12-19 2005-06-27 Advanced Digital Broadcast Ltd. Cooling system for the pcb board containing at least one heat generating electronic component
TWI251917B (en) * 2004-09-02 2006-03-21 Advanced Semiconductor Eng Chip package for fixing heat spreader and method for packaging the same
KR100924547B1 (ko) 2007-11-09 2009-11-02 주식회사 하이닉스반도체 반도체 패키지 모듈
JP2011082345A (ja) * 2009-10-07 2011-04-21 Panasonic Corp 半導体装置
US9385095B2 (en) 2010-02-26 2016-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. 3D semiconductor package interposer with die cavity
EP2608258A1 (de) * 2011-12-20 2013-06-26 STMicroelectronics (Grenoble 2) SAS Verpackung
JP6088143B2 (ja) * 2012-02-06 2017-03-01 Ｋｙｂ株式会社 バスバー
CN104810328B (zh) 2014-01-28 2018-07-06 台达电子企业管理（上海）有限公司 封装外壳及具有该封装外壳的功率模块
US9935090B2 (en) 2014-02-14 2018-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design for semiconductor packages and method of forming same
US10026671B2 (en) * 2014-02-14 2018-07-17 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design for semiconductor packages and method of forming same
US9768090B2 (en) 2014-02-14 2017-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design for semiconductor packages and method of forming same
US10056267B2 (en) * 2014-02-14 2018-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design for semiconductor packages and method of forming same
US9653443B2 (en) 2014-02-14 2017-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal performance structure for semiconductor packages and method of forming same
US9564416B2 (en) 2015-02-13 2017-02-07 Taiwan Semiconductor Manufacturing Company, Ltd. Package structures and methods of forming the same
EP3378293B1 (de) 2015-11-20 2023-06-07 Laird Technologies, Inc. Schilde auf plattenebene mit integriertem kühlkörper
WO2018063171A1 (en) * 2016-09-28 2018-04-05 Intel Corporation Thermal conductivity for integrated circuit packaging
CN107743023A (zh) * 2017-11-13 2018-02-27 戴承萍 一种谐振器结构和包括这种谐振器结构的滤波器
CN109273415B (zh) * 2018-08-05 2020-03-10 温州职业技术学院 一种晶体管封装结构
US11224134B2 (en) * 2019-11-14 2022-01-11 Eaton Intelligent Power Limited Electronic apparatus, circuit assembly, and associated method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132875A (en) * 1990-10-29 1992-07-21 Compaq Computer Corporation Removable protective heat sink for electronic components
US5241451A (en) * 1992-09-01 1993-08-31 The Whitaker Corporation Modular electronic assemblies using compressible electrical connectors
FR2729045B1 (fr) * 1994-12-29 1997-01-24 Bull Sa Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes
JPH1056278A (ja) * 1996-08-12 1998-02-24 Taiyo Yuden Co Ltd 高電力型半導体素子の実装構造
US5730210A (en) * 1997-02-24 1998-03-24 Silicon Integrated Systems Corporation Heat sink having an assembling device
US5883782A (en) * 1997-03-05 1999-03-16 Intel Corporation Apparatus for attaching a heat sink to a PCB mounted semiconductor package
JP3012867B2 (ja) * 1998-01-22 2000-02-28 インターナショナル・ビジネス・マシーンズ・コーポレイション コンピュ―タ用ヒ―トシンク装置
US6075699A (en) * 1999-01-29 2000-06-13 Chip Coolers, Inc. Heat sink assembly with snap-in legs
US6191360B1 (en) * 1999-04-26 2001-02-20 Advanced Semiconductor Engineering, Inc. Thermally enhanced BGA package
US6219239B1 (en) * 1999-05-26 2001-04-17 Hewlett-Packard Company EMI reduction device and assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104041202A (zh) * 2011-12-06 2014-09-10 黑拉许克联合股份有限公司 电子模块
CN104041202B (zh) * 2011-12-06 2018-11-13 黑拉许克联合股份有限公司 电子模块
CN103429056A (zh) * 2013-07-26 2013-12-04 昆山维金五金制品有限公司 一种散热片
CN105280593A (zh) * 2014-05-29 2016-01-27 英飞凌科技股份有限公司 用于半导体器件封装件的可连接封装延伸件
US9892991B2 (en) 2014-05-29 2018-02-13 Infineon Technologies Ag Connectable package extender for semiconductor device package
WO2021017556A1 (zh) * 2019-07-26 2021-02-04 广东美的制冷设备有限公司 电路板、变频空调控制板及空调器

Also Published As

Publication number Publication date
DE10157299A1 (de) 2003-02-27
FR2828765A1 (fr) 2003-02-21
US20030035270A1 (en) 2003-02-20
US6567270B2 (en) 2003-05-20
JP2003068956A (ja) 2003-03-07

Similar Documents

Publication Publication Date Title
TW511450B (en) Heat dissipation plate with inlay pin and its assembly components
TWI333270B (en) Flip chip contact (fcc) power package
TWI255532B (en) Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same
TWI235469B (en) Thermally enhanced semiconductor package with EMI shielding
TW436997B (en) Ball grid array semiconductor package and method for making the same
TWI529878B (zh) 集成電路封裝件及其裝配方法
KR101643332B1 (ko) 초음파 웰딩을 이용한 클립 본딩 반도체 칩 패키지 및 그 제조 방법
US9105601B2 (en) Power module package
US7176563B2 (en) Electronically grounded heat spreader
JP2006261519A (ja) 半導体装置及びその製造方法
JPH0777258B2 (ja) 半導体装置
CN1420557A (zh) 具嵌梢的散热板及其封装件
JP3922809B2 (ja) 半導体装置
US7768107B2 (en) Semiconductor component including semiconductor chip and method for producing the same
JPH0357251A (ja) 半導体装置
TWI351745B (en) Semiconductor package and heat slug thereof
KR950006441Y1 (ko) 고 발열용 반도체 패키지
CN210925987U (zh) 一种电脑芯片的封装结构
TWI746391B (zh) 積體電路封裝系統
JP2004047955A (ja) 半導体装置
TWI449149B (zh) 具金屬元件之封裝結構
TWI297539B (en) Thermally enhanced tape carrier package
KR940011796B1 (ko) 반도체장치
TW533518B (en) Substrate for carrying chip and semiconductor package having the same
JPH07326643A (ja) ボンディングヘッド構造

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees