WO2021017556A1 - 电路板、变频空调控制板及空调器 - Google Patents

电路板、变频空调控制板及空调器 Download PDF

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Publication number
WO2021017556A1
WO2021017556A1 PCT/CN2020/087836 CN2020087836W WO2021017556A1 WO 2021017556 A1 WO2021017556 A1 WO 2021017556A1 CN 2020087836 W CN2020087836 W CN 2020087836W WO 2021017556 A1 WO2021017556 A1 WO 2021017556A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
hole
fixing
board
air conditioner
Prior art date
Application number
PCT/CN2020/087836
Other languages
English (en)
French (fr)
Inventor
周伟坚
Original Assignee
广东美的制冷设备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201910687202.0A external-priority patent/CN112303880A/zh
Priority claimed from CN201921207498.3U external-priority patent/CN210241946U/zh
Priority claimed from CN201922204035.8U external-priority patent/CN211184407U/zh
Application filed by 广东美的制冷设备有限公司 filed Critical 广东美的制冷设备有限公司
Publication of WO2021017556A1 publication Critical patent/WO2021017556A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This application relates to the technical field of air conditioners, in particular to a circuit board, an inverter air conditioner control board and an air conditioner.
  • the fan control of the outdoor unit of the full DC inverter air conditioner adopts an external drive control method.
  • the inverter drive module is installed on the main control board of the outdoor unit.
  • the mainstream inverter power modules in the industry adopt the plug-in production and assembly process. Fastening screws connect the variable frequency power module and the radiator into a component.
  • the variable frequency power module and the radiator are previously conducted and dissipated by thermal grease, and finally installed on the outdoor main control PCB board by manual plug-in method, and then the assembly is completed by wave soldering.
  • the process of this assembly method basically needs to be completed manually, resulting in low assembly efficiency of the variable frequency power module.
  • the main purpose of this application is to propose a circuit board to solve the technical problem of how to improve the assembly efficiency of the frequency conversion module.
  • the circuit board proposed in this application is applied to an inverter air conditioner control board.
  • the inverter air conditioner control board includes an inverter module, a radiator abutting on the inverter module, and a card board connected to the radiator,
  • the circuit board is provided with a mounting area for mounting the frequency conversion module; the circuit board is also provided with a fixing hole at at least one end of the mounting area for the card board to be fixedly matched
  • the hole wall of the fixing hole is provided with a first welding layer for welding and fixing the clamping plate.
  • the first solder layer is a copper sink layer.
  • the number of the fixing holes is two, and the two fixing holes are separately provided at both ends in the length direction of the mounting area.
  • the distance between the two fixing holes is not less than 26mm and does not exceed 28mm.
  • the length of the fixing hole is not less than 5 mm and not exceeding 6 mm; and/or the width of the fixing hole is not less than 2.5 mm and not exceeding 3.5 mm.
  • the first welding layer is provided on the hole wall of the fixing hole close to the card plate; or, the first welding layer is provided on all the hole walls of the fixing hole.
  • a hole wall of the fixing hole close to the mounting area is provided with a protruding protrusion for the snap fit of the card hole on the card board.
  • the circuit board is further provided with a flux through hole, the flux through hole is opened between the mounting area and the fixing hole, and the hole wall of the flux through hole is provided with The second welding layer is used for welding and fixing the card board.
  • the number of solder flux vias is 3 or 4.
  • the board surface of the circuit board is provided with a third soldering layer on the edges of the soldering through hole and the fixing hole for welding and fixing the card board.
  • the present application also proposes an inverter air conditioner control board, including: an inverter module; a radiator, the radiator abuts against the inverter module; a card board, one end of the card board is connected to the radiator; and a circuit
  • the circuit board is provided with a mounting area for mounting the frequency conversion module; the circuit board is also provided with a fixing hole located at at least one end of the mounting area for the card board Fixed fit; the hole wall of the fixing hole is provided with a first welding layer for welding and fixing the card board; the frequency conversion module is mounted on the mounting area of the circuit board, and the other end of the card board It is fixedly matched with the fixing hole and welded and fixed with the first welding layer.
  • the thickness of the card board is not less than 3 mm and not more than 5 mm.
  • the surface of the card board is provided with a soldering layer.
  • the distance between the hole wall of the fixing hole close to the mounting area and the card board is not less than 0.2 mm and not more than 0.4 mm.
  • This application also proposes an inverter air conditioner control board, which includes: a circuit board with a clamping structure; a frequency conversion module, where the frequency conversion module is mounted on the circuit board; a heat sink, the heat sink is Connect the side of the frequency conversion module away from the circuit board; a fixing piece, which is connected to the radiator and is engaged with the clamping structure.
  • the clamping structure includes a clamping hole opened in the circuit board, and the fixing member includes a clamping portion adapted to the clamping hole; or, the clamping structure includes a convex For the buckle of the circuit board, the fixing member includes a buckle adapted to the buckle.
  • the heat sink is formed with a card slot
  • the fixing member includes a card board adapted to the card slot
  • the clamping structure includes a clamping hole opened on the circuit board, the number of the clamping hole is two and they are located at two ends of the frequency conversion module, and the fixing member includes a fixing bar, The fixing bar is fixed to the radiator, and both ends of the fixing bar extend toward the locking hole and form a hook adapted to the locking hole.
  • the fixing member and the heat sink are integrally formed.
  • This application also proposes an air conditioner, including the above-mentioned inverter air conditioner control board.
  • the circuit board of the present application connects one end of the card board with the heat sink and the other end is pre-clamped and fixed to the circuit board, and then the first welding layer of the fixing hole is welded and fixed to the card board, thereby reducing the connection between the frequency conversion module and the heat sink
  • the structure as a result, enables the frequency conversion module to form a suction surface for suction by the suction nozzle of surface mount technology and mount it on the mounting area of the circuit board to realize the automatic placement of the frequency conversion module and improve the assembly efficiency;
  • the first welding layer is arranged on the hole wall of the fixing hole, which can improve the soldering effect of the circuit board surface during welding, so as to improve the connection strength between the circuit board and the card board, thereby improving the stability of the inverter air conditioner control board.
  • FIG. 1 is a schematic structural diagram of an embodiment of a circuit board of this application
  • FIG. 2 is a schematic diagram of projection of an embodiment of the circuit board of the present application.
  • Figure 3 is a rear projection view of an embodiment of the inverter air conditioner control panel of the application.
  • Fig. 4 is a schematic structural diagram of an embodiment of an inverter air conditioner control board according to the application.
  • Fig. 5 is a schematic structural diagram of another embodiment of an inverter air conditioner control board according to this application.
  • Fig. 6 is a schematic end view of another embodiment of the inverter air conditioner control panel of the application.
  • FIG. 7 is a schematic structural diagram of an embodiment of a fixing member in this application.
  • FIG. 8 is a schematic structural diagram of another embodiment of an inverter air conditioner control board according to the application.
  • FIG. 9 is a schematic structural diagram of another embodiment of the fixing member in this application.
  • the inverter air conditioner control board includes an inverter module 20, a radiator 30 abutting on the inverter module 20, and a card board connected to the radiator 30 40.
  • the circuit board 10 is provided with a mounting area 13 for mounting the frequency conversion module 20; the circuit board 10 is also provided with The fixing hole 11 at at least one end of the mounting area 13 is used for the clamping board 40 to be fixed and matched; the hole wall of the fixing hole 11 is provided with a first welding layer for welding and fixing the clamping board 40.
  • the inverter air conditioner control board is used to install on the outdoor unit of the air conditioner.
  • the circuit board 10 is used to install the frequency conversion module 20 and other electronic components.
  • the fixing hole 11 can be a circular hole or a square hole; the number of the fixing hole 11 can be one, or two or more. No restrictions.
  • the frequency conversion module 20 is used to realize the frequency conversion operation of the air conditioner.
  • the frequency conversion module 20 is arranged in an integrated block shape, installed on the circuit board 10 and electrically connected to the circuit board 10.
  • the circuit board 10 is provided with a mounting area 13 for mounting the frequency conversion module 20; the frequency conversion module 20 can be mounted on the circuit board 10 by surface mounting technology and fixed by welding.
  • the radiator 30 is used for cooling and dissipating the temperature of the inverter module 20.
  • the radiator 30 can be an aluminum finned radiator 30.
  • the radiator 30 abuts on the side of the inverter module 20 away from the circuit board 10 to increase the contact with the inverter module 20 Area, thereby increasing the heat dissipation area of the frequency conversion module 20.
  • the card board 40 and the heat sink 30 can be integrated, or they can be connected after being produced separately, as long as one end of the card board 40 is connected to the heat sink 30.
  • the shape of the card plate 40 is not limited, and it only needs to be fixedly matched with the fixing hole 11.
  • the fixing cooperation of the card board 40 and the fixing hole 11 makes the heat sink 30 and the circuit board 10 fixedly connected. Since the frequency conversion module 20 and the circuit board 10 are also relatively fixed, the heat sink 30 can be firmly connected to the frequency conversion module 20. Since the frequency conversion module 20 and the circuit board 10 are fixed by welding, and the heat sink 30 and the circuit board 10 are fixed by clamping, the relative fixing of the frequency conversion module 20 and the heat sink 30 is realized; that is, the frequency conversion module 20 does not need to be provided with the heat sink 30
  • the fixed structure maintains the flatness of the surface of the frequency conversion module 20, so that it can be sucked by the suction nozzle of the surface mounting technology to realize the automatic placement of the frequency conversion module 20 on the circuit board 10, and then fix it by automatic welding.
  • the assembly efficiency of the frequency conversion module 20 is improved.
  • the frequency conversion module 20 and the radiator 30 are connected and fixed by the clamping and fixing of the card board 40 instead of manual tightening screws, which can prevent the frequency conversion module 20 from being damaged due to improper operation and reduce the damage rate; at the same time, the frequency conversion module is mounted through automation equipment 20. It can also avoid the risk that the human body touches the semiconductor device of the frequency conversion module 20 and causes the introduction of high voltage static electricity to cause the frequency conversion module 20 to fail, so as to improve the reliability of the inverter air conditioner control panel.
  • the card board 40 and the hole wall of the fixing hole 11 can be welded and fixed by wave soldering technology to improve the fixing strength of the card board 40 and the circuit board 10.
  • the first soldering layer can be a copper material layer or a silver material layer, which is not limited here.
  • the first soldering layer can increase the fullness of the solder joints of the circuit board 10 to improve the tinning effect of the circuit board 10.
  • the clamping board 40 is welded and fixed to the first soldering layer, thereby further improving the fixing effect of the circuit board 10 and the clamping board 40.
  • the first welding layer can be provided on the hole wall of the fixing hole 11 close to the card board 40, or on all the hole walls of the fixing hole 11.
  • the first welding layer is provided on all the hole walls of the fixing hole 11 so as to Use mature technology to concentrate processing.
  • the first soldering layer may be a copper sinking layer, which may be formed by a copper sinking process.
  • the copper sinking process technology is mature, the processing cost is low, and the efficiency is high; in addition, the copper material can improve the welding strength. On the basis, the cost is lower than that of precious metal materials to further reduce the production cost of inverter air conditioner control panels.
  • the circuit board of this application connects one end of the card board 40 to the heat sink 30 and the other end to the circuit board 10 for pre-clamping and fixing, and then the first welding layer of the fixing hole 11 is welded and fixed to the card board 40, thereby reducing the frequency conversion module
  • the connection structure between 20 and the radiator 30 thus enables the frequency conversion module 20 to form a suction surface for suction by the suction nozzle of the surface mount technology, and is mounted on the mounting area 13 of the circuit 10 to realize the connection of the frequency conversion module 20 Automatic placement to improve assembly efficiency; in addition, a first soldering layer is provided on the wall of the fixing hole 11, which can improve the soldering effect of the surface of the circuit board 10 during welding, so as to improve the connection strength of the circuit board 10 and the card board 40 , Thereby improving the stability of the inverter air conditioner control panel.
  • the number of the fixing holes 11 is two, and the two fixing holes 11 are separately provided at the two ends of the mounting area 13 in the length direction.
  • the number of the card plates 40 is two, and the two card plates 40 are respectively connected to the two ends of the heat sink 30, and fixedly cooperate with the two fixing holes 11, thus, the heat sink 30 and the circuit board 10 can be increased.
  • the fixed position and fixed area to improve the fixed strength.
  • the distance between the two fixing holes 11 is not less than 26 mm and does not exceed 28 mm.
  • the mounting area 13 is located between the two fixing holes 11, and the distance between the two fixing holes 11 can be 27 mm to meet most specifications of the frequency conversion module 20 and reserve sufficient installation area for the frequency conversion module 20.
  • the size and length of the frequency conversion module 20 may be 20 mm, so that a certain distance is formed between the frequency conversion module 20 and the two fixing holes 11, and the two ends of the heat sink 30 protrude from both ends of the frequency conversion module 20 to increase the frequency conversion module 20 and heat dissipation.
  • the contact area of the device 30 fully dissipates heat.
  • the distance between the frequency conversion module 20 and the fixing hole 11 provides a accommodating space for the protruding part of the radiator 30, so that the upper end of the card board 40 can be connected to the radiator 30, and the lower end is fixedly matched with the fixing hole 11, which simplifies the card board 40's structural shape.
  • the directional indication is only used to explain that it is in a specific posture ( As shown in the figure), the relative positional relationship and movement conditions of the components under the following, if the specific posture changes, the directional indication will also change accordingly.
  • the length of the fixing hole 11 is not less than 5 mm and not exceeding 6 mm; and/or the width of the fixing hole 11 is not less than 2.5 mm and not exceeding 3.5 mm.
  • the cross-section of the fixing hole 11 can be rectangular, the length of the cross-section of the fixing hole 11 can be 5.5 mm, and the width can be 3 mm, which facilitates the fixing of the card plate 40 and the fixing hole 11, It also avoids that the fixing holes 11 occupy too much board surface, so as to improve the board surface utilization of the circuit board 10.
  • the fixing hole 11 is provided with a protruding protrusion 111 on the hole wall close to the mounting area 13 for the card hole 41 on the card board 40 Snap fit.
  • the fixing hole 11 can be a square hole. The fixing hole 11 is close to the hole wall of the mounting area 13 that is away from the hole wall of the mounting area 13, and the two ends of the protrusion 111 can be connected to the surface of the circuit board 10. They are flush to improve the connection strength with the circuit board 10.
  • the card hole 41 is opened at one end of the card plate 40 that fits with the fixing hole 11, and the card hole 41 is engaged with the card protrusion 111, that is, the side wall of the card protrusion 111 and the end wall away from the frequency conversion module 20 and the hole wall limit of the card hole 41 Position abutment, so as to realize the clamping and fixing of the card board 40 and the fixing hole 11.
  • the first welding layer is not only provided on the hole wall of the fixing hole 11 but also on the side wall of the protrusion 111.
  • the card plate 40 can be inclined in the direction away from the card protrusion 111 at the part of the card hole 41 away from the frequency conversion module 20 to form a guiding inclined surface. When the card plate 40 enters the fixing hole 11, the card protrusion 111 slides to the card hole 41 along the guiding inclined surface. As a result, the engagement between the locking hole 41 and the locking protrusion 111 is simpler and more convenient.
  • the circuit board 10 is further provided with a soldering through hole 12, and the soldering through hole 12 is opened between the mounting area 13 and the fixing hole 11.
  • the hole wall of the soldering through hole 12 is provided with a second welding layer for welding and fixing the clamping plate 40.
  • the soldering via hole 12 penetrates both sides of the circuit board 10, and the material of the second soldering layer is the same as that of the first soldering layer, and can be formed by a copper immersion process.
  • the second soldering layer is used to combine the solder with the hole wall of the soldering through hole 12 during the soldering process.
  • the solder will overflow the soldering through hole 12 and flow along the surface of the circuit board 10 to be combined with the card board 40, thereby helping The through hole 12, the surface of the circuit board 10, and the card board 40 are effectively connected to increase the connection strength between the card board 40 and the circuit board 10, and further improve the stability of the inverter air conditioner control board.
  • the soldering through hole 12 is opened between the fixing hole 11 and the frequency conversion module 20 to be closer to the card board 40, so that the path for the solder to flow is shorter, effectively saving solder and reducing processing costs; in addition, the circuit board 10 can be effectively used
  • the position of the board surface improves the area utilization rate of the circuit board 10.
  • the number of the soldering vias 12 is 3 or 4.
  • the number of soldering vias 12 is too small, the effect of enhancing the connection strength between the card board 40 and the circuit board 10 is not obvious; if the number of soldering vias 12 is too large, the circuit board 10
  • the structural strength of the corresponding part is reduced, which reduces the stability of the inverter air conditioner control board; therefore, setting the number of flux through holes 12 to 3 or 4 can significantly enhance the connection strength between the card board 40 and the circuit board 10 , Improve the stability of the inverter air conditioner control panel.
  • the board surface of the circuit board 10 is provided with a third welding layer on the edge of the soldering through hole 12 and the fixing hole 11 for welding and fixing the card board 40.
  • the third soldering layer may be a copper foil layer, which is used to effectively combine the solder with the surface of the circuit board 10, thereby improving the connection strength between the card board 40 and the circuit board 10.
  • the present application also proposes an inverter air conditioner control board.
  • the inverter air conditioner control board includes a circuit board 10.
  • the circuit board 10 For the specific structure of the circuit board 10, refer to the above-mentioned embodiment. All the technical solutions of all the embodiments, therefore, at least have all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, and will not be repeated here.
  • the inverter air conditioner control board also includes: a frequency conversion module 20; a radiator 30, the radiator 30 abuts against the frequency conversion module 20; a card board 40, one end of the card board 40 is connected to the radiator 30;
  • the module 20 is mounted on the mounting area 13 of the circuit board 10, and the other end of the card board 40 is fixedly matched with the fixing hole 11, and is welded and fixed with the first welding layer.
  • the thickness of the card board 40 is not less than 3 mm and not more than 5 mm. In this embodiment, if the thickness of the card plate 40 is less than 3 mm, the structural strength of the card plate 40 will be reduced, resulting in the card plate 40 being easily broken; if the thickness of the card plate 40 is greater than 5 mm, the elasticity of the card plate 40 will be reduced. , Resulting in increased difficulty in matching the card plate 40 with the card hole 41; therefore, the thickness of the card plate 40 can be set to 4 mm, so as to ensure the structural strength and improve the flexibility, thereby improving the convenience of assembly.
  • the surface of the card board 40 is provided with a soldering layer, which may be a tin-plated layer, to make the card board 40 and the solder more firmly bond, so as to further enhance the card board 40 and the circuit board 10 Connection strength.
  • a soldering layer which may be a tin-plated layer
  • the distance between the hole wall of the fixing hole 11 close to the mounting area 13 and the card board 40 is not less than 0.2 mm and not more than 0.4 mm.
  • the hole wall of the fixing hole 11 protruding with the locking projection 111 forms a gap with the plate surface of the card plate 40. During the welding process, the solder enters the gap to prevent The card board 40 and the card hole 41 are firmly connected.
  • the spacing can be set to 0.3mm to reduce the difficulty of assembly while improving the welding strength.
  • the inverter air conditioner control board includes a circuit board 10 on which a card connection structure is provided;
  • a frequency conversion module 20 which is mounted on the circuit board 10;
  • the fixing member 50 is connected to the radiator 30 and is engaged with the clamping structure.
  • the inverter air conditioner control board is used to install on the outdoor unit of the air conditioner.
  • the circuit board 10 is used for mounting the frequency conversion module 20 and other electronic components.
  • the clamping structure may be a recessed structure or a raised structure, which is not limited here.
  • the frequency conversion module 20 is used to realize the frequency conversion operation of the air conditioner.
  • the frequency conversion module 20 is arranged in an integrated block shape, installed on the circuit board 10 and electrically connected to the circuit board 10.
  • the frequency conversion module 20 can be mounted on the circuit board 10 by surface mount technology and fixed by welding.
  • the radiator 30 is used for cooling and dissipating the temperature of the inverter module 20.
  • the radiator 30 can be an aluminum finned radiator 30.
  • the radiator 30 abuts on the side of the inverter module 20 away from the circuit board 10 to increase the contact with the inverter module 20 Area, thereby increasing the heat dissipation area of the frequency conversion module 20.
  • the fixing member 50 and the radiator 30 may be integrally arranged, or they may be connected after being produced separately, as long as the fixing member 50 is connected to the radiator 30. There is no restriction on the form of the fixing member 50, and it only needs to satisfy the snap fit with the snap structure.
  • the clamping cooperation of the fixing member 50 and the clamping structure makes the radiator 30 and the circuit board 10 fixedly connected. Since the frequency conversion module 20 and the circuit board 10 are also relatively fixed, the radiator 30 can be firmly connected to the frequency conversion module 20.
  • the relative fixing of the frequency conversion module 20 and the radiator 30 is realized; that is, the frequency conversion module 20
  • the flatness of the surface of the frequency conversion module 20 is maintained, which can be sucked by the suction nozzle of the surface mount technology to realize the automatic placement of the frequency conversion module 20 on the circuit board 10, and then pass Automatic welding and fixing, thereby improving the assembly efficiency of the frequency conversion module 20.
  • the frequency conversion module 20 and the radiator 30 are connected and fixed by the clamping and fixing of the fixing member 50 instead of manual tightening screws, which can prevent the frequency conversion module 20 from being damaged due to improper operation and reduce the damage rate.
  • mounting the inverter module 20 through automated equipment can also prevent the risk of the inverter module 20 becoming invalid due to the introduction of high voltage static electricity caused by the human body touching the semiconductor device of the inverter module 20, so as to improve the reliability of the inverter air conditioner control panel.
  • the inverter air conditioner control board of the present application connects the fixing member 50 to the radiator 30 and snaps to the circuit board 10, so that the radiator 30 and the circuit board 10 are fixedly connected by snap connection, which reduces the frequency conversion module 20 and the radiator.
  • the connection structure of 30, thus, enables the frequency conversion module 20 to form a suction surface for suction by the suction nozzle of the surface mount technology, realizes the automatic placement of the frequency conversion module 20, and improves the assembly efficiency; in addition, the automatic placement of the frequency conversion module 20 Compared with manual operation, it can reduce the product damage rate caused by excessive force or static electricity, so as to reduce production costs.
  • the clamping structure includes a clamping hole 111 opened in the circuit board 10, and the fixing member 50 includes a clamping portion 51 that is adapted to the clamping hole 111;
  • the clamping structure includes a buckle protruding from the circuit board 10, and the fixing member 50 includes a clamping hole 111 that is adapted to the buckle.
  • the clamping structure is a clamping hole 111 formed on the circuit board 10, and the clamping hole 111 formed on the circuit board 10 is simpler than the processing method of setting a buckle, so that the production cost is lower.
  • the two long sides of the frequency conversion module 20 are provided with pins, and the clamping holes 111 are opened at both ends of the frequency conversion module 20.
  • the number of the fixing members 50 is two and corresponds to the two clamping holes 111 respectively, thereby shortening the extension of the fixing member 50
  • the length makes the overall assembly structure of the heat sink 30, the circuit board 10 and the frequency conversion module 20 more compact, and the assembly strength is higher.
  • the clamping portion 51 includes an elastic arm 411 and a clamping protrusion 412 provided at the end of the elastic arm 411.
  • the elastic arm 411 extends toward the locking hole 111, and the elastic deformation of the elastic arm 411 makes the locking protrusion 412 slidable to fit with the locking hole 111, thereby making the mating process of the locking portion 51 and the locking hole 111 smoother .
  • the number of the elastic arms 411 is two, a deformation gap 413 is formed between the two elastic arms 411, and the locking protrusions 412 are provided on the two elastic arms. 411 on the opposite side.
  • the elastic arm 411 deforms toward the deformation gap 413 during the mating process of the locking projection 412 and the locking hole 111, and recovers after the locking projection 412 is fitted in place, so that The mating process of the clamping part 51 and the clamping hole 111 is more smooth, and the mating strength of the clamping part 51 and the clamping hole 111 can be improved by the cooperation of the two elastic arms 411 and the clamping hole 111.
  • the hole wall of the locking hole 111 is provided with a locking rib
  • the locking portion 51 includes a buckle. The buckle extends into the locking hole 111 and engages with the locking rib, thereby improving the strength of the fit.
  • the heat sink 30 is formed with a slot 31, and the fixing member 50 includes a card board 42 that is adapted to the slot 31.
  • the fixing member 50 includes a card board 42 that is adapted to the slot 31.
  • one end of the card board 42 is connected to one end of the card connecting portion 51, and can be integrated.
  • the form of the slot 31 on the radiator 30 is not limited. It can be formed by the structure of the radiator 30 itself, or can be formed by concave or protruding on the radiator 30. It only needs to satisfy the requirement that the card plate 42 cooperates with the slot 31 to achieve heat dissipation.
  • the fixing of the device 30 is sufficient.
  • the clamping board 42 and the radiator 30 are clamped and fixed, and then the radiator 30 is integrally overlapped with the mounted inverter module 20.
  • the clamping portion 51 and the clamping hole 111 is clamped and fixed, so that the radiator 30 and the frequency conversion module 20 are relatively fixed.
  • the heat sink 30 includes a base plate 32 abutting the frequency conversion module 20, and at least two heat sinks 33 protruding from the base plate 32, and the card board 42 is connected to The buckle is in a bent configuration, and the card plate 42 abuts against the base plate 32 and is clamped between the two heat sinks 33.
  • the heat sink 30 is an aluminum finned heat sink 30, and the base plate 32 abuts against the frequency conversion module 20 to transfer the heat of the frequency conversion module 20 to the heat sink 30.
  • the heat sink 33 is protrudingly provided on the side of the base plate 32 away from the inverter module 20 to transfer the heat of the base plate 32 to the air; the number of heat sinks 33 is multiple, and the multiple heat sinks 33 extend along the length of the base plate 32, and It is arranged at intervals along the width direction of the substrate 32 to increase the heat dissipation area and improve the heat dissipation efficiency.
  • the plurality of radiating fins 33 include a first radiating fin 33 and a second radiating fin 33 near the middle of the base plate 32.
  • the clamping plate 42 abuts on the base plate 32 and is clamped between the first radiating fin 33 and the second radiating fin 33.
  • the clamping method can be interference fit.
  • the card board 42 and the card connecting portion 51 are arranged in a bend, one side of the card board 42 protrudes from the side of the base plate 32, and the card connecting portion 51 is connected to the protruding side of the card board 42 and faces
  • the clamping hole 111 extends, so as to realize the clamping and fixing with the circuit board 10.
  • the opposite sides of the two radiating fins 33 are protrudingly provided with limiting ribs 331, and the limiting ribs 331, the base plate 32 and the radiating fin 33 enclose the clamping groove 31.
  • the limiting ribs 331 extend along the length of the base plate 32, and both sides of the card plate 42 are clamped between the limiting ribs 331 and the base plate 32, so that the card plate 42 and the heat sink 30 cooperate more closely. stable.
  • upwardly warped elastic pieces 421 are formed on both sides of the card board 42.
  • the upturned here refers to the end of the elastic piece 421 protruding from The side of the card plate 42 facing away from the base plate 32 does not refer to the absolute extension direction of the elastic sheet 421.
  • the number of the elastic pieces 421 can be two and they are arranged at intervals along the side of the card plate 42, so that the mating strength of the card plate 42 and the heat sink 30 can be further improved.
  • the clamping structure includes a clamping hole 111 opened in the circuit board 10, the number of the clamping hole 111 is two and they are respectively located at two of the frequency conversion module 20.
  • the fixing member 50 includes a fixing strip 43, the fixing strip 43 is fixed to the heat sink 30, and both ends of the fixing strip 43 extend toward the locking hole 111 and are formed to fit with the locking hole 111 ⁇ 431.
  • the fixing strip 43 extends along the length of the substrate 32, the substrate 32 is provided with a fixing groove extending along the length, and the fixing strip 43 is embedded in the fixing groove. The two ends of the fixing bar 43 protrude from the two ends of the heat sink 30.
  • the number of the clamping holes 111 is two and they are located at both ends of the frequency conversion module 20.
  • the two ends of the fixing strip 43 extend toward the clamping hole 111 and form a hook 431 that is adapted to the clamping hole 111 to realize the clamping connection with the clamping hole 111 Cooperate.
  • the middle portion of the fixing strip 43 is concavely folded toward the circuit board 10.
  • the middle part of the fixing bar 43 is concavely folded toward the base plate 32, so that a gap is formed between the connecting portion between the middle and the end of the fixing bar 43 and the base plate 32.
  • the connection The portion deforms toward the gap, so that the connecting portion can form potential energy to restore deformation, so as to increase the mating strength of the hook 431 and the hole 111.
  • the material of the fixing member 50 includes beryllium copper.
  • Beryllium copper is a high-grade elastic material with the best performance among copper alloys. It has high strength, elasticity, hardness, fatigue strength, low elastic hysteresis, corrosion resistance, wear resistance, cold resistance, high conductivity, non-magnetic, and no sparks due to impact. A series of excellent physical, chemical and mechanical properties.
  • the fixing member 50 is made of beryllium copper, which can prevent the fixing member 50 from cracking at the bend, and after the fixing member 50 is clamped and fixed to the circuit board 10, it can be additionally fixed by welding, and the beryllium copper material can improve the welding fixing effect, thereby Improve the overall stability of the inverter air conditioner control panel.
  • the inverter air conditioner control board further includes a heat conducting sheet arranged between the inverter module 20 and the radiator 30.
  • the thermal conductive sheet can be a soft thermal conductive silicone sheet.
  • the thermal conductive sheet is arranged between the contact surface of the frequency conversion module 20 and the heat sink 30. It can be squeezed and deformed to fill the gap of the contact surface and squeeze air out of the contact surface to ensure the heat sink 30 is in full contact with the frequency conversion module 20 to increase the heat dissipation area of the frequency conversion module 20 and further improve the heat dissipation efficiency.
  • This application also proposes an air conditioner, which includes an air conditioner indoor unit, an air conditioner outdoor unit, and an inverter air conditioner control board.
  • the specific structure of the inverter air conditioner control board refers to the above-mentioned embodiments. Because the air conditioner adopts all the above-mentioned embodiments All the technical solutions, therefore, at least have all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, and will not be repeated here.
  • the air conditioner may be a split type air conditioner, and the inverter air conditioner control board may be installed in the air conditioner outdoor unit of the split type air conditioner.

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Abstract

一种电路板（10）、变频空调控制板及空调器，变频空调控制板包括变频模块（20）、抵接于变频模块（20）的散热器（30）以及连接于散热器（30）的卡板（40），电路板（10）上设有贴装区（13），用以供变频模块（20）贴装；电路板上（10）还开设有位于贴装区（13）至少一端的固定孔（11），用以供卡板（40）固定配合；固定孔（11）的孔壁设有第一焊接层，用以供卡板（40）焊接固定。

Description

电路板、变频空调控制板及空调器
本申请要求于2019年7月26日申请的、申请号为201910687202.0、名称为“变频空调控制板和空调器”，2019年7月26日申请的、申请号为201921207498.3、名称为“变频空调控制板和空调器”，2019年12月09日申请的、申请号为201922204035.8、名称为“电路板、变频空调控制板及空调器”的三个中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及空调技术领域，特别涉及一种电路板、变频空调控制板及空调器。
背景技术
目前全直流变频空调器室外机风机控制采用驱动外置的控制方式，变频驱动模块安装在室外机主控板上，且目前行业主流的变频功率模块都是采用插件式的生产装配工艺，通过采用紧固螺钉把变频功率模块与散热器连接成组件，变频功率模块与散热器之前通过导热硅脂进行传导散热，最终通过手工插件的方式安装在室外主控PCB板上再过波峰焊完成装配。但这种装配方式的工序基本需要依靠人工完成，导致变频功率模块的装配效率低。
发明概述
技术问题
问题的解决方案
技术解决方案
本申请的主要目的是提出一种电路板，旨在解决如何提高变频模块装配效率的技术问题。
为实现上述目的，本申请提出的电路板，应用于变频空调控制板，所述变频空调控制板包括变频模块、抵接于所述变频模块的散热器以及连接于所述散热器的卡板，所述电路板上设有贴装区，用以供所述变频模块贴装；所述电路板上还开设有位于所述贴装区至少一端的固定孔，用以供所述卡板固定配合；所述固定孔的孔壁设有第一焊接层，用以供所述卡板焊接固定。
在一实施例中，所述第一焊接层为沉铜层。
在一实施例中，所述固定孔的数量为两个，两所述固定孔分设于所述贴装区长度方向上的两端。
在一实施例中，两所述固定孔的间距不小于26mm，且不超出28mm。
在一实施例中，所述固定孔的长度不小于5mm，且不超出6mm；和/或，所述固定孔的宽度不小于2.5mm，且不超出3.5mm。
在一实施例中，所述第一焊接层设于所述固定孔的靠近所述卡板的孔壁；或，所述第一焊接层设于所述固定孔的全部孔壁。
在一实施例中，所述固定孔靠近所述贴装区的孔壁凸设有卡凸，用以供所述卡板上的卡孔卡接配合。
在一实施例中，所述电路板还开设有助焊过孔，所述助焊过孔开设于所述贴装区与所述固定孔之间，所述助焊过孔的孔壁设有第二焊接层，用以供所述卡板焊接固定。
在一实施例中，所述助焊过孔的数量为3个或4个。
在一实施例中，所述电路板的板面在所述助焊过孔与所述固定孔的边沿设有第三焊接层，用以供所述卡板焊接固定。
本申请还提出一种变频空调控制板，包括：变频模块；散热器，所述散热器抵接于所述变频模块；卡板，所述卡板一端连接于所述散热器；以及一种电路板，所述电路板上设有贴装区，用以供所述变频模块贴装；所述电路板上还开设有位于所述贴装区至少一端的固定孔，用以供所述卡板固定配合；所述固定孔的孔壁设有第一焊接层，用以供所述卡板焊接固定；所述变频模块贴装于所述电路板的贴装区，所述卡板的另一端与所述固定孔固定配合，并与所述第一焊接层焊接固定。
在一实施例中，所述卡板的厚度不小于3mm，且不超出5mm。
在一实施例中，所述卡板表面设有助焊层。
在一实施例中，所述固定孔靠近所述贴装区的孔壁与所述卡板的间距不小于0.2mm，且不超出0.4mm。
本申请还提出一种变频空调控制板，包括：电路板，所述电路板上设有卡接结 构；变频模块，所述变频模块贴装于所述电路板；散热器，所述散热器抵接所述变频模块背离所述电路板的一面；固定件，所述固定件连接所述散热器并与所述卡接结构卡接配合。
在一实施例中，所述卡接结构包括开设于所述电路板的卡孔，所述固定件包括与所述卡孔适配的卡接部；或，所述卡接结构包括凸设于所述电路板的卡扣，所述固定件包括与所述卡扣适配的卡孔。
在一实施例中，所述散热器形成有卡槽，所述固定件包括与所述卡槽适配的卡板。
在一实施例中，所述卡接结构包括开设于所述电路板的卡孔，所述卡孔的数量为两个并分别位于所述变频模块的两端，所述固定件包括固定条，所述固定条固定于所述散热器，所述固定条的两端朝向所述卡孔延伸并形成与所述卡孔适配的卡勾。
在一实施例中，所述固定件与所述散热器呈一体成型设置。
本申请还提出一种空调器，包括如上所述的变频空调控制板。
本申请电路板通过使卡板一端与散热器连接，另一端与电路板预卡接固定后，再将固定孔的第一焊接层与卡板焊接固定，从而减少了变频模块与散热器的连接结构，由此，使得变频模块能形成吸附面，以供表面贴装技术的吸嘴吸取，并贴装于电路板的贴装区，实现对变频模块的自动贴装，提高装配效率；此外，在固定孔的孔壁设置第一焊接层，能提高电路板的板面焊接时的上锡效果，以提高电路板与卡板的连接强度，从而提高变频空调控制板的稳定性。
发明的有益效果
对附图的简要说明
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请电路板一实施例的结构示意图；
图2为本申请电路板一实施例的投影示意图；
图3为本申请变频空调控制板一实施例的背面投影图；
图4为本申请变频空调控制板一实施例的结构示意图；
图5为本申请变频空调控制板另一实施例的结构示意图；
图6为本申请变频空调控制板另一实施例的端面示意图；
图7为本申请中固定件一实施例的结构示意图；
图8为本申请变频空调控制板又一实施例的结构示意图；
图9为本申请中固定件另一实施例的结构示意图。
附图标号说明：
[Table 1]
标号 名称 标号 名称 标号 名称
10 电路板 11 固定孔 20 变频模块
30 散热器 40 卡板 111 卡凸
41 卡孔 12 助焊过孔 13 贴装区
50 固定件 111 卡孔 51 卡接部
411 弹臂 412 卡凸 413 变形间隙
31 卡槽 42 卡板 32 基板
33 散热片 331 限位筋 421 弹片
43 固定条 431 卡勾    
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
发明实施例
本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种电路板10，应用于变频空调控制板，所述变频空调控制板包括变频模块20、抵接于所述变频模块20的散热器30以及连接于所述散热器30的卡板40。
在本申请实施例中，如图1至图4所示，所述电路板10上设有贴装区13，用以供所述变频模块20贴装；所述电路板10上还开设有位于所述贴装区13至少一端的固定孔11，用以供所述卡板40固定配合；所述固定孔11的孔壁设有第一焊接层，用以供所述卡板40焊接固定。
在本实施例中，变频空调控制板用以安装于空调器的室外机上。电路板10用以供变频模块20及其它电子元件安装，固定孔11可为圆形孔，也可为方形孔；固定孔11的数量可为一个，也可为两个或多个，在此不做限制。变频模块20用以实现空调的变频运行，变频模块20呈集成的块状设置，安装于电路板10并与电路板10电连接。电路板10上设有贴装区13，用以供变频模块20贴装；变频模块20可通过表面贴装技术贴装于电路板10上，并通过焊接固定。散热器30用以供变频模块20降温散热，散热器30可为铝制翅片式散热器30，散热器30抵接于变频模块20背离电路板10的一面，以增加与变频模块20的接触面积，从而增加变频模块20的散热面积。卡板40与散热器30可以是一体设置，也可以是分别生产后连接，只需满足卡板40一端连接散热器30即可。卡板40的形状不做限制，只需满足与固定孔11固定配合即可。
卡板40与固定孔11的固定配合使得散热器30与电路板10固定连接，由于变频模块20与电路板10也相对固定，从而散热器30可稳固地搭接于变频模块20。由于变频模块20与电路板10通过焊接固定，而散热器30与电路板10通过卡接固定，从而实现了变频模块20与散热器30的相对固定；即变频模块20上无需设置与散热器30固定的结构，保持了变频模块20表面的平整性，从而可供表面贴装技术的吸嘴吸取，以实现将变频模块20自动贴装至电路板10上，再通过自动焊接固定，由此，提高了变频模块20的装配效率。此外，通过卡板40的卡接固定来代 替人工紧固螺钉将变频模块20与散热器30连接固定，可避免操作不当导致变频模块20损坏，降低损坏率；同时，通过自动化设备贴装变频模块20，还能避免人体触摸变频模块20的半导体器件导致引入高压静电造成变频模块20失效的风险，以提高变频空调控制板的可靠性。
卡板40与固定孔11的孔壁能通过波峰焊技术焊接固定，以提高卡板40与电路板10的固定强度。第一焊接层可为铜材料层，也可为银材料层，在此不做限制。第一焊接层能提升电路板10的焊点饱满度，以提高电路板10的上锡效果，卡板40与第一焊接层焊接固定，从而进一步提高电路板10与卡板40的固定效果。第一焊接层可设于固定孔11靠近卡板40的孔壁，也可设于固定孔11的全部孔壁，在实际应用中，第一焊接层设于固定孔11的全部孔壁，以便使用成熟的工艺集中加工处理。具体地，第一焊接层可为沉铜层，沉铜层可通过沉铜工艺处理形成，沉铜工艺技术成熟，处理成本较低，且效率较高；此外，铜材料在能提高焊接强度的基础上，相比贵金属材料的成本更低，以进一步降低变频空调控制板的生产成本。
本申请电路板通过使卡板40一端与散热器30连接，另一端与电路板10预卡接固定后，再将固定孔11的第一焊接层与卡板40焊接固定，从而减少了变频模块20与散热器30的连接结构，由此，使得变频模块20能形成吸附面，以供表面贴装技术的吸嘴吸取，并贴装于电路10的贴装区13，实现对变频模块20的自动贴装，提高装配效率；此外，在固定孔11的孔壁设置第一焊接层，能提高电路板10的板面焊接时的上锡效果，以提高电路板10与卡板40的连接强度，从而提高变频空调控制板的稳定性。
需要说明，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。
在实际应用中，如图1和图2所示，所述固定孔11的数量为两个，两所述固定孔11分设于所述贴装区13长度方向上的两端。在本实施例中，卡板40的数量为两个，两卡板40分别连接于散热器30的两端，并与两固定孔11固定配合，由此， 可增加散热器30与电路板10的固定位置和固定面积，以提高固定强度。
在一实施例中，两所述固定孔11的间距不小于26mm，且不超出28mm。在本实施例中，贴装区13位于两固定孔11之间，两固定孔11的间距可为27mm，以满足大部分规格的变频模块20，为变频模块20预留了足够的安装面积。具体地，变频模块20的尺寸长度可为20mm，以使变频模块20与两固定孔11之间形成一定间距，散热器30两端凸出于变频模块20两端，以增加变频模块20与散热器30的接触面积，充分散热。变频模块20与固定孔11之间的间距为散热器30的凸出部分提供了容置空间，从而卡板40的上端可连接于散热器30，下端与固定孔11固定配合，简化了卡板40的结构形状。
需要说明，若本申请实施例中有涉及方向性指示(诸如上、下、左、右、前、后......)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在实际应用中，所述固定孔11的长度不小于5mm，且不超出6mm；和/或，所述固定孔11的宽度不小于2.5mm，且不超出3.5mm。在本实施例中，固定孔11的横截面可呈矩形设置，固定孔11横截面的长度可为5.5mm，宽度可为3mm，由此，既方便卡板40与固定孔11的固定配合，又避免固定孔11占用过多的板面，以提高电路板10的板面利用率。
需要说明，全文中出现的“和/或”的含义为，包括三个并列的方案，以“A和/或B为例”，包括A方案，或B方案，或A和B同时满足的方案。
在一实施例中，如图1和图2所示，所述固定孔11靠近所述贴装区13的孔壁凸设有卡凸111，用以供所述卡板40上的卡孔41卡接配合。在本实施例中，固定孔11可呈方形孔设置，固定孔11靠近贴装区13的孔壁即背离贴装区13的孔壁，卡凸111的两端可与电路板10的板面平齐，以提高与电路板10的连接强度。卡孔41开设于卡板40与固定孔11配合的一端，卡孔41与卡凸111卡接配合，即卡凸111的侧壁和背离变频模块20的端壁与卡孔41的孔壁限位抵接，从而实现卡板40与固定孔11的卡接固定。第一焊接层不仅设于固定孔11的孔壁，还设于卡凸111的侧壁。卡板40在卡孔41远离变频模块20的部分可朝远离卡凸111的方向倾斜设置， 以形成导向斜面，卡板40进入固定孔11时，卡凸111沿导向斜面滑向卡孔41，从而使卡孔41与卡凸111的配合更加简单方便。
在实际应用中，如图3所示，所述电路板10还开设有助焊过孔12，所述助焊过孔12开设于所述贴装区13与所述固定孔11之间，所述助焊过孔12的孔壁设有第二焊接层，用以供所述卡板40焊接固定。在本实施例中，助焊过孔12贯通电路板10的两板面，第二焊接层的材料与第一焊接层相同，可通过沉铜工艺处理形成。第二焊接层用以在焊接过程中使焊锡与助焊过孔12的孔壁结合，焊锡会溢出助焊过孔12并沿电路板10的板面流动至与卡板40结合，从而将助焊过孔12、电路板10板面及卡板40有效连接，以增加卡板40与电路板10的连接强度，进一步提高变频空调控制板的稳定性。助焊过孔12开设于固定孔11与变频模块20之间，以更邻近卡板40，从而焊锡需要流动的路径更短，有效节省焊锡，降低加工成本；此外，还能有效利用电路板10的板面位置，提高电路板10的面积利用率。
在一实施例中，如图3所示，所述助焊过孔12的数量为3个或4个。在本实施例中，若助焊过孔12的数量过少，则对增强卡板40与电路板10连接强度的效果不明显；若助焊过孔12数量过多，则会导致电路板10对应部分的结构强度降低，降低了变频空调控制板的稳定性；因此，将助焊过孔12的数量设置为3个或4个，可在显著增强卡板40与电路板10连接强度的同时，提高变频空调控制板的稳定性。具体地，所述电路板10的板面在所述助焊过孔12与所述固定孔11的边沿设有第三焊接层，用以供所述卡板40焊接固定。在本实施例中，第三焊接层可为铜箔层，用以有效结合焊锡与电路板10的板面，从而提高卡板40与电路板10的连接强度。
如图4所示，本申请还提出一种变频空调控制板，该变频空调控制板包括一种电路板10，该电路板10的具体结构参照上述实施例，由于本变频空调控制板采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。变频空调控制板还包括：变频模块20；散热器30，所述散热器30抵接于所述变频模块20；卡板40，所述卡板40一端连接于所述散热器30；所述变频模块20贴装于所述电路板10的贴装区13，所述 卡板40的另一端与所述固定孔11固定配合，并与所述第一焊接层焊接固定。
在一实施例中，所述卡板40的厚度不小于3mm，且不超出5mm。在本实施例中，若卡板40的厚度小于3mm，则会降低卡板40的结构强度，导致卡板40容易折损；若卡板40的厚度大于5mm，则会降低卡板40的弹性，导致卡板40与卡孔41配合的难度增大；因此，卡板40的厚度可设为4mm，以在保证结构强度的同时，提高弹性，从而提高装配的便利性。在实际应用中，所述卡板40表面设有助焊层，助焊层可为镀锡层，用以使卡板40与焊锡更牢固地结合，以进一步增强卡板40与电路板10的连接强度。
具体地，所述固定孔11靠近所述贴装区13的孔壁与所述卡板40的间距不小于0.2mm，且不超出0.4mm。在本实施例中，卡孔41与卡凸111配合后，固定孔11凸设有卡凸111的孔壁与卡板40的板面形成间隙，在焊接过程中，焊锡进入该间隙，以将卡板40与卡孔41牢固连接。若该间距大于0.4mm，则会导致焊锡无法填满该间隙，造成焊接强度低；若该间距小于0.2mm，则会导致卡凸111与卡孔41配合的过程中，卡板40与固定孔11的孔壁接触摩擦，提高了装配难度；因此，该间距可设为0.3mm，以在降低装配难度的同时，提高焊接强度。
如图5-9所示，本申请还提出一种变频空调控制板，该变频空调控制板包括：电路板10，所述电路板10上设有卡接结构；
变频模块20，所述变频模块20贴装于所述电路板10；
散热器30，所述散热器30抵接所述变频模块20背离所述电路板10的一面；
固定件50，所述固定件50连接所述散热器30并与所述卡接结构卡接配合。
在本实施例中，变频空调控制板用以安装于空调器的室外机上。电路板10用以供变频模块20及其他电子元件安装，卡接结构可以是凹陷结构，也可以是凸起结构，在此不做限制。变频模块20用以实现空调器的变频运行，变频模块20呈集成的块状设置，安装于电路板10并与电路板10电连接。变频模块20可通过表面贴装技术贴装于电路板10上，并通过焊接固定。散热器30用以供变频模块20降温散热，散热器30可为铝制翅片式散热器30，散热器30抵接于变频模块20背离电路板10的一面，以增加与变频模块20的接触面积，从而增加变频模块20的散热面积。固定件50与散热器30可以是一体设置，也可以是分别生产后连接， 只需满足固定件50连接散热器30即可。固定件50的形式不做限制，只需满足与卡接结构卡接配合即可。固定件50与卡接结构的卡接配合使得散热器30与电路板10固定连接，由于变频模块20与电路板10也相对固定，从而散热器30可稳固地搭接于变频模块20。由于变频模块20与电路板10通过焊接固定，而散热器30与电路板10通过卡接结构和固定件50卡接固定，从而实现了变频模块20与散热器30的相对固定；即变频模块20上无需设置与散热器30固定的结构，保持了变频模块20表面的平整性，从而可供表面贴装技术的吸嘴吸取，以实现将变频模块20自动贴装至电路板10上，再通过自动焊接固定，由此，提高了变频模块20的装配效率。此外，通过固定件50的卡接固定来代替人工紧固螺钉将变频模块20与散热器30连接固定，可避免因操作不当导致变频模块20损坏，降低损坏率。同时，通过自动化设备贴装变频模块20，还能避免人体触摸变频模块20的半导体器件导致引入高压静电造成变频模块20失效的风险，以提高变频空调控制板的可靠性。
本申请变频空调控制板通过使固定件50与散热器30连接，并与电路板10卡接，从而使散热器30与电路板10通过卡接的方式固定连接，减少了变频模块20与散热器30的连接结构，由此，使得变频模块20能形成吸附面，以供表面贴装技术的吸嘴吸取，实现对变频模块20的自动贴装，提高装配效率；此外，变频模块20的自动贴装相比人工操作能降低因用力过度或静电导致的产品损坏率，以降低生产成本。
进一步地，如图5和图6所示，所述卡接结构包括开设于所述电路板10的卡孔111，所述固定件50包括与所述卡孔111适配的卡接部51；或，所述卡接结构包括凸设于所述电路板10的卡扣，所述固定件50包括与所述卡扣适配的卡孔111。在本实施例中，卡接结构为开设于电路板10的卡孔111，在电路板10上开设卡孔111相比设置卡扣的加工方式更简单，从而生产成本更低。变频模块20的两长侧边设有引脚，卡孔111开设于变频模块20的两端，固定件50的数量为两个并分别与两卡孔111对应，从而可缩短固定件50的延伸长度，使得散热器30、电路板10及变频模块20的整体装配结构更紧凑，装配强度更高。
具体地，如图6和图7所示，所述卡接部51包括弹臂411以及设于所述弹臂411末 端的卡凸412。在本实施例中，弹臂411朝向卡孔111延伸，通过弹臂411的弹性变形使得卡凸412可滑动至与卡孔111配合，从而使得卡接部51与卡孔111的配合过程更加顺利。在实际应用中，如图6和图7所示，所述弹臂411的数量为两个，两所述弹臂411之间形成变形间隙413，所述卡凸412设于两所述弹臂411相背的一侧。在本实施例中，卡凸412进入卡孔111的过程中，弹臂411在卡凸412与卡孔111的配合过程中朝向变形间隙413变形，并在卡凸412配合到位后恢复，从而使得卡接部51与卡孔111的配合过程更加顺利，且通过两弹臂411与卡孔111的配合，可提高卡接部51与卡孔111的配合强度。
在另一实施例中，卡孔111的孔壁设有卡接筋，卡接部51包括扣位，扣位伸入卡孔111后与卡接筋卡接配合，从而可提高配合强度。
在一实施例中，如图5至图8所示，所述散热器30形成有卡槽31，所述固定件50包括与所述卡槽31适配的卡板42。结合上述实施例，卡板42的一端与卡接部51的一端连接，可为一体化设置。散热器30上卡槽31的形式不做限制，可由散热器30自身结构形成，也可由散热器30上凹设或凸设形成，只需满足卡板42通过与卡槽31的配合实现于散热器30的固定即可。在装配散热器30时，先将卡板42与散热器30卡接固定，再将散热器30整体搭接于贴装好的变频模块20，在搭接过程中，卡接部51与卡孔111卡接固定，从而实现散热器30与变频模块20的相对固定。
具体地，如图5和图6所示，所述散热器30包括抵接所述变频模块20的基板32，以及凸设于所述基板32的至少两散热片33，所述卡板42与所述卡扣呈弯折设置，所述卡板42抵接于所述基板32且卡接于两所述散热片33之间。在本实施例中，散热器30为铝制式翅片散热器30，基板32抵接于变频模块20，以将变频模块20的热量传递至散热器30。散热片33凸设于基板32背离变频模块20的一面，用以将基板32的热量传递至空气中；散热片33的数量为多个，多个散热片33沿基板32的长度方向延伸，并沿基板32的宽度方向间隔设置，以增加散热面积，提高散热效率。多个散热片33中包括靠近基板32中部的第一散热片33和第二散热片33，卡板42抵接于基板32并卡接于第一散热片33和第二散热片33之间，卡接方式可为过盈配合。结合上述实施例，卡板42与卡接部51呈弯折设置，卡板42的一 侧边凸出于基板32的侧边，卡接部51连接于卡板42凸出的侧边并朝向卡孔111延伸，从而实现与电路板10的卡接固定。
在实际应用中，如图6所示，两所述散热片33的相对侧凸设有限位筋331，所述限位筋331、基板32及散热片33围合形成所述卡槽31。在本实施例中，限位筋331沿基板32的长度方向延伸，卡板42的两侧边卡接于限位筋331与基板32之间，以使卡板42与散热器30的配合更加稳固。为进一步稳固卡板42与散热器30的配合，如图7所示，卡板42的两侧边形成上翘的弹片421，需要说明，这里的上翘指的是弹片421的末端凸出于卡板42背离基板32的一面，而不是指弹片421的绝对延伸方向。弹片421的数量可为两个并沿卡板42的侧边间隔设置，从而可进一步提高卡板42与散热器30的配合强度。
在一实施例中，如图9所示，所述卡接结构包括开设于所述电路板10的卡孔111，所述卡孔111的数量为两个并分别位于所述变频模块20的两端，所述固定件50包括固定条43，所述固定条43固定于所述散热器30，所述固定条43的两端朝向所述卡孔111延伸并形成与所述卡孔111适配的卡勾431。在本实施例中，结合上述基板32及散热片33的实施例，固定条43沿基板32的长度方向延伸，基板32开设有沿长度方向延伸的固定槽，固定条43嵌设于固定槽，固定条43的两端凸出于散热器30的两端。卡孔111的数量为两个并位于变频模块20的两端，固定条43的两端朝向卡孔111延伸并形成与卡孔111适配的卡勾431，以实现与卡孔111的卡接配合。
具体地，如图9所示，所述固定条43的中部呈朝向所述电路板10凹折设置。在本实施例中，固定条43中部朝向基板32凹折，从而固定条43中部与端部之间的连接部与基板32之间形成间隙，卡勾431与卡孔111配合的过程中，连接部朝向该间隙变形，从而连接部可形成恢复变形的势能，以增加卡勾431与卡孔111的配合强度。
在一实施例中，所述固定件50的制造材料包括铍铜。铍铜是铜合金中性能最好的高级有弹性材料，有很高的强度、弹性、硬度、疲劳强度、弹性滞后小、耐蚀、耐磨、耐寒、高导电、无磁性、冲击不产生火花等一系列优良的物理、化学和力学性能。采用铍铜制成固定件50，可避免固定件50在弯折处开裂，且固 定件50与电路板10卡接固定后，可另外通过焊接固定，而铍铜材料能提高焊接固定效果，从而提高变频空调控制板的整体稳定性。
在实际应用中，所述变频空调控制板还包括设于所述变频模块20与所述散热器30之间的导热片。导热片可为软性导热硅胶片，导热片设于变频模块20与散热器30的接触面之间，可通过被挤压变形填充接触面的间隙，将空气挤出接触面，从而保证散热器30与变频模块20充分接触，提高对变频模块20的散热面积，进一步提高散热效率。
本申请还提出一种空调器，该空调器包括空调室内机、空调室外机和变频空调控制板，该变频空调控制板的具体结构参照上述实施例，由于本空调器采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。其中，空调器可为分体式空调器，变频空调控制板可安装于分体式空调器的空调室外机。
以上所述仅为本申请的可选实施例，并非因此限制本申请的专利范围，凡是在本申请的构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (20)

  1. 一种电路板，应用于变频空调控制板，所述变频空调控制板包括变频模块、抵接于所述变频模块的散热器以及连接于所述散热器的卡板，其中，所述电路板上设有贴装区，用以供所述变频模块贴装；所述电路板上还开设有位于所述贴装区至少一端的固定孔，用以供所述卡板固定配合；所述固定孔的孔壁设有第一焊接层，用以供所述卡板焊接固定。
  2. 如权利要求1所述的电路板，其中，所述第一焊接层为沉铜层。
  3. 如权利要求1所述的电路板，其中，所述固定孔的数量为两个，两所述固定孔分设于所述贴装区长度方向上的两端。
  4. 如权利要求3所述的电路板，其中，两所述固定孔的间距不小于26mm，且不超出28mm。
  5. 如权利要求1所述的电路板，其中，所述固定孔的长度不小于5mm，且不超出6mm；和/或，所述固定孔的宽度不小于2.5mm，且不超出3.5mm。
  6. 如权利要求1所述的电路板，其中，所述第一焊接层设于所述固定孔的靠近所述卡板的孔壁；或，所述第一焊接层设于所述固定孔的全部孔壁。
  7. 如权利要求6所述的电路板，其中，所述固定孔靠近所述贴装区的孔壁凸设有卡凸，用以供所述卡板上的卡孔卡接配合。
  8. 如权利要求1至7任一项所述的电路板，其中，所述电路板还开设有助焊过孔，所述助焊过孔开设于所述贴装区与所述固定孔之间，所述助焊过孔的孔壁设有第二焊接层，用以供所述卡板焊接固定。
  9. 如权利要求8所述的电路板，其中，所述助焊过孔的数量为3个或4个。
  10. 如权利要求8所述的电路板，其中，所述电路板的板面在所述助焊过孔与所述固定孔的边沿设有第三焊接层，用以供所述卡板焊接 固定。
  11. 一种变频空调控制板，包括：
    变频模块；
    散热器，所述散热器抵接于所述变频模块；
    卡板，所述卡板一端连接于所述散热器；以及，
    如权利要求1至10任一项所述的电路板，所述变频模块贴装于所述电路板的贴装区，所述卡板的另一端与所述固定孔固定配合，并与所述第一焊接层焊接固定。
  12. 如权利要求11所述的变频空调控制板，其中，所述卡板的厚度不小于3mm，且不超出5mm。
  13. 如权利要求11所述的变频空调控制板，其中，所述卡板表面设有助焊层。
  14. 如权利要求11所述的变频空调控制板，其中，所述固定孔靠近所述贴装区的孔壁与所述卡板的间距不小于0.2mm，且不超出0.4mm。
  15. 一种变频空调控制板，包括：
    电路板，所述电路板上设有卡接结构；
    变频模块，所述变频模块贴装于所述电路板；
    散热器，所述散热器抵接所述变频模块背离所述电路板的一面；
    固定件，所述固定件连接所述散热器并与所述卡接结构卡接配合。
  16. 如权利要求15所述的变频空调控制板，其中，所述卡接结构包括开设于所述电路板的卡孔，所述固定件包括与所述卡孔适配的卡接部；
    或，所述卡接结构包括凸设于所述电路板的卡扣，所述固定件包括与所述卡扣适配的卡孔。
  17. 如权利要求15所述的变频空调控制板，其中，所述散热器形成有卡槽，所述固定件包括与所述卡槽适配的卡板。
  18. 如权利要求15所述的变频空调控制板，其中，所述卡接结构包括开设于所述电路板的卡孔，所述卡孔的数量为两个并分别位于所述变频模块的两端，所述固定件包括固定条，所述固定条固定于所述散热器，所述固定条的两端朝向所述卡孔延伸并形成与所述卡孔适配的卡勾。
  19. 如权利要求15所述的变频空调控制板，其中，所述固定件与所述散热器呈一体成型设置。
  20. 一种空调器，包括如权利要求11至14任一项或15至19中任一项所述的变频空调控制板。
PCT/CN2020/087836 2019-07-26 2020-04-29 电路板、变频空调控制板及空调器 WO2021017556A1 (zh)

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CN201921207498.3U CN210241946U (zh) 2019-07-26 2019-07-26 变频空调控制板和空调器
CN201921207498.3 2019-07-26
CN201922204035.8U CN211184407U (zh) 2019-12-09 2019-12-09 电路板、变频空调控制板及空调器
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JP2002280775A (ja) * 2001-03-19 2002-09-27 Funai Electric Co Ltd 放熱板の取付構造
TW511450B (en) * 2001-08-16 2002-11-21 Orient Semiconductor Elect Ltd Heat dissipation plate with inlay pin and its assembly components
JP2007250990A (ja) * 2006-03-17 2007-09-27 Fujikura Ltd リジッドプリント配線板及びリジッドプリント配線板を用いた電気接続箱
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