TW511450B - Heat dissipation plate with inlay pin and its assembly components - Google Patents

Heat dissipation plate with inlay pin and its assembly components Download PDF

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Publication number
TW511450B
TW511450B TW090120335A TW90120335A TW511450B TW 511450 B TW511450 B TW 511450B TW 090120335 A TW090120335 A TW 090120335A TW 90120335 A TW90120335 A TW 90120335A TW 511450 B TW511450 B TW 511450B
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Taiwan
Prior art keywords
heat dissipation
heat sink
heat
dissipation plate
semiconductor
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Application number
TW090120335A
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English (en)
Inventor
Wen-Le Shie
Ning Huang
Hui-Pin Chen
Hua-Wen Chiang
Chuang-Ming Chang
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Orient Semiconductor Elect Ltd
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Application filed by Orient Semiconductor Elect Ltd filed Critical Orient Semiconductor Elect Ltd
Priority to TW090120335A priority Critical patent/TW511450B/zh
Priority to US09/988,094 priority patent/US6567270B2/en
Priority to DE10157299A priority patent/DE10157299A1/de
Priority to FR0115390A priority patent/FR2828765A1/fr
Priority to JP2001368493A priority patent/JP2003068956A/ja
Application granted granted Critical
Publication of TW511450B publication Critical patent/TW511450B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

511450 五、發明說明（1) 本發明係有關半導體的散熱板之結構，該散熱板覆蓋 半導體後可插入並穿過半導體載板之通孔，可使半導體散 熱功能透過延伸接觸面積的散熱板而更為增進；該散熱板 並可藉通孔來接地，過濾、雜訊，降低電感者。
在半導體集積度快速增加與運作頻率高速提升之後， 該半導體運作時所產生的高熱便需藉助散熱板來發散。一 般的半導體散熱板之結構如第一圖所示：在半導晶片1 ’與 載板1 5 ’結合後在半導體晶片1 ’頂面塗佈適量之導熱膠 1 2 ’，並將散熱板1 3 ’覆蓋住半導體晶片1 ’，使散熱板1 3 ’ 内面與半導體晶片1’頂面藉導熱膠12’接觸而傳導熱量至 空氣中發散；另一種習用的半導體散熱板係如第二圖所表 示：半導體晶片2 ’與載板2 5 ’以金線2 1 ’作電氣結合後以環 氧樹脂24’封裝起來，再於環氧樹脂24’頂面塗佈適量之導 熱膠22’，並將散熱板23’黏上環氧樹脂24’。 惟上述公知之半導體散熱板（片）設計，多數僅為對 半導體晶片行散熱之用，其使用之結構亦僅為使半導晶片 之熱量透由導熱膠傳遞到散熱板（片）上，再由空氣帶走 散熱板（片）上的熱量，達成散熱的效果，除此之外再無 任何其他功效。
而，本發明設計一具嵌梢之散熱板，使該散熱板可以 覆盖半導體晶片後插入承半導體晶片之載板的通孔内並勾 嵌住，使具有下列之功能： 1.本發明之散熱板具有控制該散熱板與半導體晶片或封裝 件之間距的能力：因該散熱板嵌於載板上，可對半導體
第7頁 511450 五、發明說明（2) 晶片提供 及半導體 2 ·本發明之 載半導體 地層線路 3 ·本發明之 本發明之 有效濾除 4 ·本發明之 板穿過載 結合，以 電路層腳 裝體。 一固定 晶片或 散熱板 曰 u 日日片之 導通， 封裝件 封裝件 雜訊及 封裝件 板後之 增加本 墊銲接 之壓力 封裝件 具有接 載板通 如此可 具有濾 具有接 降低電 具有增 凸出頭 封裝件 之強固 控制力 緊密的 地功能 孔内， 使該散 除雜訊 地線路 感，獲 強結合 端可與 載板下 度及散 ’从確 接著。 :該散 而該通 熱板具 及降低 ，故可 得一更 度之設 另一印 方之錫 熱性， 保散熱片，導熱膠 熱板之卡 孔可與載 備接地功 電感之作 在本封裝 可靠之電 計：本發 刷基板上 球與印刷 形成'更 梢插入承 板内之接 能。 用：由於 件導電後 路信號。 明之散熱 的腳墊相 基板上的 可靠之封 5·本發明可簡化散熱板與負載有半導體晶片載板之製程： 本發明的散熱板與載板間之結合結構為嵌入卡接式，不 再需要塗佈接著劑即可與載板相接合，使得製程更為方 便0 為使本發明所達成之上述目的及優點所應用之技術手 段’茲配合圖式，並列舉較佳實施例說明如后。 本發明為一具嵌梢之散熱板及其封裝件，請參照第三 A圖所示，其散熱板丨5之結構主要為一蓋板式殼狀物，可 覆蓋住一個以上之半導體晶片11，其特徵為在散熱板15之 外圍具有一凸伸之卡梢1 5 1，該卡梢1 5 1頭端1 5 3設有一開 口 1 5 2，並在外徑設一頸部1 5 3者。
511450
、、本發明之具嵌梢之散熱板封裝件其主要組成構件為_ 上述之散熱板15及一個以上之與載板14接合妥之半導體晶 而在該載板14上設有適當之通孔142 ;載板14内層 I作有適當之接地層線路與通孔142相接通者，其接合製 程主要係將半導體晶片〗丨頂面塗上導熱膠丨3後，將散熱板 之卡梢151對正載板14上之通孔142位置插入，使該卡梢 151土之頭端穿過載板14，而頸部154卡在載板14之通孔142 内者’請參照第三Α圖〜第三Β圖。 因本散熱板15主要為鋁、鋼等高導熱材料製品，半導 ，s曰片1 1運作時所產生之高熱可經由導熱膠丨3傳遞至散熱 iH #發散至空氣之中；而另一散熱途逕為經由通孔 142到接地層線路141 ;又因本封裝件！具有接地線路，亦 可提供過濾電流雜訊及降低電感之功能。 另，由於本散熱板15係以卡嵌式與載板14結合，故可 壓力控制能力’使散熱板15與半導體晶片η 保持一適當間距，可增加本封裝件丨之散熱能力的可靠 又本發明之封裝件1亦可與另一表層具有 刷基板2相接合：由本封裝件i底層之錫球143 = 印層基板2上之腳墊22銲接，另本封裝件！底層之 板、 卡梢151頭端153亦可與印刷基板2上之腳塾22銲接，”以板辦 15 加整個封裝結構之穩固性及散熱性。 曰 專利之申請產新穎性、 依法提起發明專利之申 緣上可知，本發明已具備發明 功效性及產業上之利用性要件，爰
第9頁 511450 五、發明說明（4) 請。 雖然本發明以一較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此項技藝者，在不脫離本發明之精 神和範圍内，當可作各種更動與潤飾，因此本發明之保護 範圍應同時參酌後附之申請專利範圍所界定者。
第10頁 511450 圖式簡單說明 圖式之簡單說明 第一圖係習知之半導體散熱板之結構示意圖。 第二圖係另一習知之半導體散熱板之結構示意圖。 第三A圖〜第三B圖係本發明之散熱板與半導體載板結合示 意圖。 第四圖係本發明之封裝件與印刷電路板PCB示意圖。 圖式令之參照號數 習知部分 Γ .半導體晶片 11， 金屬凸塊 12, •導 熱 膠 13, •散 執 板 14, •接 著 膠 15, •載 板 .半導體 晶 片 21， •金 線 22, •導 執 4 膠 23, •散 孰 板 24, •環 氧 樹脂 25, •載 板 本發明部分 1.封裝件
第11頁 511450 圖式簡單說明 11.半導體晶片 1 2 .金屬凸塊 13. 導熱膠 14. 載板 1 4 1.接地層線路 1 4 2 .通孔 1 4 3.錫球 1 5.散熱板
1 5 1.卡梢 1 5 2 ·開口 1 5 3.頭端 1 5 4.頸部 2.印刷基板 2 1.電路 22.腳墊
第12頁

Claims (1)

  1. 511450 六、申請專利範圍 1. 一種具嵌梢之散熱板，其散熱板之結構主要為一蓋板式 殼狀物，可覆蓋住一個以上之半導體晶片，其特徵為在散 熱板之外圍具有一凸伸之卡梢，該卡梢頭端設有一開口， 並在外徑設一頸部者。 2 · —種具嵌梢之散熱板之封裝件，其主要組成構件為一如 申請專利範圍第1項所述之散熱板及一個以上之與載板接 合妥之半導體晶片，而在該載板上設有適當之通孔；其接 合製程主要係將半導體晶片頂面塗上導熱膠後，將散熱板 之卡梢對正載板上之通孔位置插入，使該卡梢之頭端穿過 載板，而頸部卡在載板之通孔内者。 3 ·如申請專利範圍第2項所述之具嵌梢之散熱板之封裝 件，其中載板内層製作有適當之接地層線路與通孔相接通 者。 4.如申請專利範圍第2項所述之具嵌梢之散熱板之封裝 件，並與另一表層具有電路、腳墊之印刷基板相接合，其 中封裝件底層之散熱板卡梢頭端與印刷基板上之腳墊銲接 者0
    第13頁
TW090120335A 2001-08-16 2001-08-16 Heat dissipation plate with inlay pin and its assembly components TW511450B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW090120335A TW511450B (en) 2001-08-16 2001-08-16 Heat dissipation plate with inlay pin and its assembly components
US09/988,094 US6567270B2 (en) 2001-08-16 2001-11-19 Semiconductor chip package with cooling arrangement
DE10157299A DE10157299A1 (de) 2001-08-16 2001-11-22 Halbleiterchipgehäuse mit Kühlvorrichtung
FR0115390A FR2828765A1 (fr) 2001-08-16 2001-11-28 Porte-puce de semiconducteur a systeme de refroidissement et radiateur adapte
JP2001368493A JP2003068956A (ja) 2001-08-16 2001-12-03 放熱板及びその封入件

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Application Number Priority Date Filing Date Title
TW090120335A TW511450B (en) 2001-08-16 2001-08-16 Heat dissipation plate with inlay pin and its assembly components

Publications (1)

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TW511450B true TW511450B (en) 2002-11-21

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US (1) US6567270B2 (zh)
JP (1) JP2003068956A (zh)
DE (1) DE10157299A1 (zh)
FR (1) FR2828765A1 (zh)
TW (1) TW511450B (zh)

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CN103429056A (zh) * 2013-07-26 2013-12-04 昆山维金五金制品有限公司 一种散热片
CN104041202A (zh) * 2011-12-06 2014-09-10 黑拉许克联合股份有限公司 电子模块
CN105280593A (zh) * 2014-05-29 2016-01-27 英飞凌科技股份有限公司 用于半导体器件封装件的可连接封装延伸件
WO2021017556A1 (zh) * 2019-07-26 2021-02-04 广东美的制冷设备有限公司 电路板、变频空调控制板及空调器

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JP2011082345A (ja) * 2009-10-07 2011-04-21 Panasonic Corp 半導体装置
US9385095B2 (en) 2010-02-26 2016-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. 3D semiconductor package interposer with die cavity
EP2608258A1 (en) * 2011-12-20 2013-06-26 STMicroelectronics (Grenoble 2) SAS A package
JP6088143B2 (ja) * 2012-02-06 2017-03-01 Ｋｙｂ株式会社 バスバー
CN104810328B (zh) * 2014-01-28 2018-07-06 台达电子企业管理（上海）有限公司 封装外壳及具有该封装外壳的功率模块
US10026671B2 (en) * 2014-02-14 2018-07-17 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design for semiconductor packages and method of forming same
US9935090B2 (en) 2014-02-14 2018-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design for semiconductor packages and method of forming same
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FR2828765A1 (fr) 2003-02-21
JP2003068956A (ja) 2003-03-07

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