TW507344B - Plating apparatus - Google Patents

Plating apparatus Download PDF

Info

Publication number
TW507344B
TW507344B TW090104480A TW90104480A TW507344B TW 507344 B TW507344 B TW 507344B TW 090104480 A TW090104480 A TW 090104480A TW 90104480 A TW90104480 A TW 90104480A TW 507344 B TW507344 B TW 507344B
Authority
TW
Taiwan
Prior art keywords
plating
tank
electroplating
bath
patent application
Prior art date
Application number
TW090104480A
Other languages
English (en)
Chinese (zh)
Inventor
Koujirou Kameyama
Original Assignee
Furukawa Electric Co Ltd
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Sanyo Electric Co filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of TW507344B publication Critical patent/TW507344B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW090104480A 2000-02-28 2001-02-27 Plating apparatus TW507344B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000052532A JP3523555B2 (ja) 2000-02-28 2000-02-28 メッキ装置

Publications (1)

Publication Number Publication Date
TW507344B true TW507344B (en) 2002-10-21

Family

ID=18574034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090104480A TW507344B (en) 2000-02-28 2001-02-27 Plating apparatus

Country Status (4)

Country Link
JP (1) JP3523555B2 (ko)
KR (1) KR100695373B1 (ko)
CN (1) CN1188907C (ko)
TW (1) TW507344B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746330B (zh) * 2020-06-30 2021-11-11 南韓商耐奧匹艾姆西股份有限公司 控制個別夾具電流的電鍍裝置
TWI769643B (zh) * 2020-06-30 2022-07-01 南韓商耐奧匹艾姆西股份有限公司 具備個別分區的電鍍裝置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3523556B2 (ja) * 2000-02-28 2004-04-26 古河電気工業株式会社 メッキ方法
CA2467037A1 (en) * 2000-03-29 2003-06-19 Sanyo Electric Co., Ltd. Manufacturing method for semiconductor device
JP3568486B2 (ja) * 2000-03-29 2004-09-22 三洋電機株式会社 半導体装置の製造方法
US7772043B2 (en) 2001-12-12 2010-08-10 Sanyo Electric Co., Ltd. Plating apparatus, plating method and manufacturing method for semiconductor device
JP3725083B2 (ja) * 2002-02-21 2005-12-07 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング メッキ設備における金属イオン供給源の有効保存を可能とする方法
CN102677113B (zh) * 2012-01-09 2014-07-16 河南科技大学 一种制备金属多层膜镀层的装置
CN112779578A (zh) * 2021-03-16 2021-05-11 昆山元天电子有限公司 一种超薄膜电镀装置
CN115775724A (zh) * 2021-09-08 2023-03-10 盛美半导体设备(上海)股份有限公司 基板处理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3330729B2 (ja) * 1994-05-06 2002-09-30 新日本製鐵株式会社 多層メッキ鋼板の製造方法、並びに多層メッキ鋼板を用いた熱拡散型合金メッキ鋼板の製造方法
JPH10229152A (ja) * 1996-12-10 1998-08-25 Furukawa Electric Co Ltd:The 電子部品用リード材、それを用いたリードおよび半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746330B (zh) * 2020-06-30 2021-11-11 南韓商耐奧匹艾姆西股份有限公司 控制個別夾具電流的電鍍裝置
TWI769643B (zh) * 2020-06-30 2022-07-01 南韓商耐奧匹艾姆西股份有限公司 具備個別分區的電鍍裝置

Also Published As

Publication number Publication date
CN1317825A (zh) 2001-10-17
JP2001234389A (ja) 2001-08-31
JP3523555B2 (ja) 2004-04-26
CN1188907C (zh) 2005-02-09
KR100695373B1 (ko) 2007-03-15
KR20010085638A (ko) 2001-09-07

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