TW506881B - Cylindrical grindstone - Google Patents

Cylindrical grindstone Download PDF

Info

Publication number
TW506881B
TW506881B TW089122068A TW89122068A TW506881B TW 506881 B TW506881 B TW 506881B TW 089122068 A TW089122068 A TW 089122068A TW 89122068 A TW89122068 A TW 89122068A TW 506881 B TW506881 B TW 506881B
Authority
TW
Taiwan
Prior art keywords
cylindrical
honing
grindstone
patent application
scope
Prior art date
Application number
TW089122068A
Other languages
English (en)
Chinese (zh)
Inventor
Katsuhiro Kawasaki
Mitsukazu Kawasaki
Original Assignee
Tkx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tkx Corp filed Critical Tkx Corp
Application granted granted Critical
Publication of TW506881B publication Critical patent/TW506881B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/001—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
    • B24D3/002—Flexible supporting members, e.g. paper, woven, plastic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW089122068A 2000-03-03 2000-10-20 Cylindrical grindstone TW506881B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000063297 2000-03-03
JP2000231488A JP3445229B2 (ja) 2000-03-03 2000-07-31 筒状砥石

Publications (1)

Publication Number Publication Date
TW506881B true TW506881B (en) 2002-10-21

Family

ID=26587005

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089122068A TW506881B (en) 2000-03-03 2000-10-20 Cylindrical grindstone

Country Status (4)

Country Link
JP (1) JP3445229B2 (ko)
KR (2) KR100444835B1 (ko)
CN (1) CN1261281C (ko)
TW (1) TW506881B (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10353308A1 (de) * 2003-11-10 2005-06-09 Gebr. Schmid Gmbh & Co. Schleifwalze mit Bezug
JP2005230988A (ja) * 2004-02-20 2005-09-02 Sankyo Rikagaku Co Ltd 回転砥石
ITMI20050483A1 (it) * 2005-03-23 2006-09-24 Olimpia 80 Srl Ruota lamellare in particolare ruota lemallare per impianti di satinatura tubi e motodo per produrla
KR100802213B1 (ko) * 2006-05-02 2008-02-11 손종철 초경질 소결체와 탄성재를 이용한 성형공구 및 그 제조방법
JP2008221430A (ja) * 2007-03-14 2008-09-25 Noritake Co Ltd 円筒状樹脂砥石およびその製造方法
KR100932382B1 (ko) * 2009-09-22 2009-12-16 주식회사 와이제이씨 원통형 연마브러쉬
CN102554738A (zh) * 2010-12-07 2012-07-11 达航工业股份有限公司 研磨刷轮的制造方法
CN102240991A (zh) * 2011-06-29 2011-11-16 常州市大明纸管机械有限公司 金刚砂弹性砂抛光辊
CN103707206B (zh) * 2013-02-24 2016-03-30 长沙理工大学 一种复合材料纤维微刃的螺旋砂轮
CN104476421B (zh) * 2014-11-21 2017-08-11 南京三超新材料股份有限公司 一种固着金刚石抛光轮
CN106181795B (zh) * 2015-04-29 2020-09-11 薛民开 一种能磨削不规则弧形刀具的磨石带
CN104816258A (zh) * 2015-05-29 2015-08-05 广州金谷钻石工具有限公司 一种钢塑覆合钻石磨边砂轮
CN105881168A (zh) * 2016-04-11 2016-08-24 钱淦 一种石材和瓷砖的表面磨抛加工方法及装置
CN105881187A (zh) * 2016-04-11 2016-08-24 钱淦 一种高效滚筒
CN105751087B (zh) * 2016-05-05 2019-04-05 珠海市巨海科技有限公司 陶瓷金属结合剂磨具及其制造方法
US20190283205A1 (en) * 2016-10-31 2019-09-19 Nitta Haas Incorporated Polishing roll
CN107081652A (zh) * 2017-06-30 2017-08-22 马鞍山方圆动力科技有限公司 一种叶轮去毛刺装置
CN110405643B (zh) * 2019-06-17 2020-09-29 深圳市浩泰兴机电有限公司 一种发泡陶瓷磨刷及其制备方法
AT522810B1 (de) * 2019-07-16 2023-02-15 Tyrolit Schleifmittelwerke Swarovski Kg Schleifsegment für eine Schleifwalze
CN111644926B (zh) * 2020-05-19 2022-01-14 太原日德泰兴精密不锈钢股份有限公司 一种超薄带钢的高效打磨方法
CN112247716A (zh) * 2020-08-27 2021-01-22 南京涵铭置智能科技有限公司 一种端盖去毛刺清洗机以及清洗方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593803Y2 (ja) * 1981-06-04 1984-02-02 東邦窯業株式会社 リング状砥石

Also Published As

Publication number Publication date
KR100444837B1 (ko) 2004-08-21
JP2001315064A (ja) 2001-11-13
CN1261281C (zh) 2006-06-28
JP3445229B2 (ja) 2003-09-08
CN1311081A (zh) 2001-09-05
KR20040036891A (ko) 2004-05-03
KR100444835B1 (ko) 2004-08-18
KR20010087151A (ko) 2001-09-15

Similar Documents

Publication Publication Date Title
TW506881B (en) Cylindrical grindstone
TW379389B (en) A method to polish semiconductor wafers
WO2003038882A1 (fr) Procede et patin de polissage de plaquette
CN105189045B (zh) 工件的研磨装置
CN110052955A (zh) 载体的制造方法及晶圆的双面研磨方法
JP2004079009A5 (ko)
US20030032378A1 (en) Polishing surface constituting member and polishing apparatus using the polishing surface constituting member
JP3966815B2 (ja) 研削装置
JP4682449B2 (ja) 化学的機械的研磨方法及び化学的機械的研磨装置
JPH09102122A (ja) 記録媒体用基板
TW509922B (en) Method for the production of glass substrates for magnetic recording mediums
JP2005005315A (ja) ウエーハの研磨方法
CN107073676B (zh) 研磨垫
JP2005224892A (ja) 研磨方法
JP2000042910A (ja) 研磨用被加工物保持具
JPH11285963A (ja) ウェーハ研磨用研磨布若しくは研磨定盤からなる研磨体及び該研磨体を用いたウェーハ研磨方法
JP2008023625A (ja) 被加工物保持材
TW202327803A (zh) 模板組件、研磨頭及晶圓的研磨方法
JP3498902B2 (ja) 半導体ウエハの平坦化装置
JP2004338028A (ja) 研削用砥石及びこの研削用砥石を備える研削装置
TW456167B (en) Leveling roller for a printed circuit board
JP2004195593A (ja) フラップ式研磨ロール
JPH10202490A (ja) 樹脂フィルムラミネートロールの研磨方法
JP5992258B2 (ja) 被研磨物保持材
JP5254883B2 (ja) 発泡体の製造方法

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent