五、發明說明（/ ) [發明所屬技術領域] 本發明爲關於磨石者，特別是，有關用來硏磨或磨光具_ 寬闊寬度之被硏磨面的物品之筒狀磨石者。 [先前之技術] 自先前，均採用具有對欲硏磨物品的親和性之環狀磨石β 此係例如記載於實公昭59-3803號公報，具有適合於繫合接 觸旋轉輪的面，以金屬線補強的橡膠製的支撐體層上設置由 多孔彈性體層及橡膠片所成彈性體保護層，更於其上設置具 硏磨表面的多數扁平的磨石片的構造。 並於此，在硏磨或磨光具有曲率半徑物品（以下，標示代表 硏磨）時，將硏磨具沿著對象物品亦即被硏磨物之表面，以不 致改變曲率的情況下予以移動，特別是具有小曲率半徑的曲 面之物品，最後加工可硏磨爲一樣之面。 又，用來進行印刷電路基板及其關連基材之硏磨及定水平 者，自先前，乃採用所謂(無端環帶（廣闊帶）或不織布輥子等。 [發观欲解決的課題] 然而，如記載於上述實公昭59-3803號公報的構成，欲有效 率地硏磨更廣闊寬度的被硏磨面，僅以該環狀磨石延伸於旋 轉軸方向作爲筒狀仍不完全，需要將作成筒狀磨石用來繫合 固定於旋轉輪所合適的構造。又，需要想辦法減低硏磨廣闊 寬度的被硏磨面時之硏磨音者，及更圓滑地進行硏磨。 又，上述無端環帶，在比較短的使用時間內磨耗了磨粒前 端，因此降低硏磨力及硏磨完成面發生變化，故進行均勻地 硏磨困難。一方面，不織布輥子，從其組織構造看，雖可得連 本紙張尺度適用中國國家標準（CNS)A4規袼（210 x 297公釐） -----1·-裝 {請先閱讀背面之注意事項再填寫本頁) n n JrJ* MW W· I ΜΗ I ΜΗ 謙 * t IP* 經濟部智慧財產局員工消費合作社印製 506881 經濟部智慧財產局員Η消費合作社印制衣 A7 B7五、發明說明（i ) 續的光製面，可是其硏磨力有問題，不合適於需要更大硏磨 力的作業。 具體Η之，以不織布輥子進行準平時，因硏磨小而欲增大 鋒利時，無論如何也要增大硏磨力。因此，不織布纖維也與 微小的凹部溶合在一起，使最合適的定水平目的變成不可 倉I 。 其他，如磨石之剛體或者接近該_體者形成輥子狀用以進 行定水平時，所謂產生顫紋（chatter mark)，又不能追隨印刷 電路基板之大起伏。 本發明有鑑於如上述之缺失，特別是，提供一種合適於以 硏磨音小及振動少，來圓滑地硏磨或磨光具有廣闊寬度的 被硏磨面物品，又對物品的親和性卓越，再者可兼用作爲平 板之準平輥子的筒狀體磨石爲目的。 [解決課題的手段] 爲了達成上述目的，本發明特徵係於可旋轉的圓筒構件之 外周設第1彈性體，藉由支撐體在該第1彈性體之外周設第 2弹性體，再於該第2彈性體之外周配設與該圓筒構件之旋 轉軸方向形成規定之角度之多數磨石片。 又，其特徵爲第2彈性體採用帶狀之彈性片，預先以多數 磨石片對於片寬度方向大致平行配設，於該帶狀彈性片上， 以螺旋狀纏繞，該帶狀彈性片在支撐體外周者。 再者，其特徵爲上述各磨石片之各個硏磨邊以遍及其全長 而大致同時不至於到達被硏磨面，其各硏磨面邊與該圓筒構 件之旋轉軸方向形成規定角度者。 (請先閱讀背面之注意事項再填寫本頁) 祕_ 裝 訂！ 等 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 506881 A7 B7 經濟部智慧財產局員Η消費合作社印製 五、發明說明（3 ) [發明之實施形態] 以下參照圖面說明本發明之實施形態。第1圖係本發明 筒狀磨石之一實施形態側視橫剖面圖。於同圖，1爲支撐全 體筒狀磨石G的大致圓筒狀之圓筒構件。以該材質而言， 例如紙管浸漬酚樹脂強化的所謂酚管等，採用輕，剛性卓越 者。又圓筒構件1之外周至少設一層彈性體2。其材質以 具彈力性的多孔質合成樹脂爲最合適。具體言之，採用海棉 狀之醋酸乙烯等之對經過時間變化強，內部氣體不漏掉，而 且輕者。 彈性體2之外周，設保護彈性體2的支撐體3。此係例如 在堅固的軟質橡膠片之外側，纒繞施予黃銅電鍍的單線或捻 線之鋼琴線等所成金屬線4,再自外側以同質之上述片夾住， 成爲黏結的構造。此金屬線4,係朝向筒狀磨石G之旋轉方 向（對同園之紙面垂直方向）纒繞爲螺旋狀，至少爲耐筒狀磨 石G之高速旋轉的離_心力破壞之捲數。 更於支撐體3之外周黏結橡膠片5。具體言之，黏接磨石 片6帶狀之橡膠片5表面，並以其面爲外側使該橡膠片5在 支撐體3之外周，朝向筒狀磨石G之旋轉軸方向纒繞成螺 旋狀成爲黏結的構造。磨石片6在第2圖放大筒狀磨石G 之一部分以剖面所示，設若干間隙（例如1〜1.8 rnn)而配設於 橡膠片5上爲理想。 又，磨石片6之高度爲8〜12腿左右，寬及深度爲10〜16腿 左右爲理想。此時，寬（後述的硏磨邊側之長度）以比深度若 干長爲佳。並由此，一方面防止自黏結磨石片6的圓筒面之 (請先閱讀背面之注奩？事項再填寫本頁) « t— ϋ ϋ 1* 訂-丨 ψ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 506881 A7 B7 五、發明說明（斗） 浮起，亦可使硏磨音不至於變大。 (請先閱讀背面之注音S事項再填寫本頁) 可是，纒繞上述金屬線4後，亦可考量直接纒繞黏結有磨 石片6的橡膠片5來黏結的方法。但是，這樣實施時，由纒 繞爲螺旋狀的彼此橡膠片5之間隙，無論如何也窺視了金屬 線4,此部分之覆蓋變成不完全，損傷變快，有導致破斷之 慮。故，覆蓋金屬線4的片，如上述需要另外考慮者。 以磨石片6而言，例如以低楊氏模數的PVA(聚乙烯醇）樹 脂混練SiC磨粒，予以採用做成瓷磚狀者。或者，採用由於 此種材質所成板狀之磨石黏結於橡膠片5之後加以切斷，用 來形成磨石片6的方法也可以。如以上的筒狀磨石G之構 成，以橡膠爲主所成支撐體3及橡膠片5,將彈性體2之彈力 直接傳給磨石片6,故磨石片6分別以獨立地沿被硏磨物之 曲面動，可進行親和性卓越的硏磨。 經濟部智慧財產局員工消費合作社印製 尙，磨石之楊氏模數，以作爲定水平用的最合適値而言，係 由潛變（creep)試驗的楊氏模數（潛變楊氏模數）爲 100〜300kg/mm 2。若此變成500kg/mm 2以上時，基板會有刮 痕（scratch)，實用上變成不可能。本實施形態，採用的磨石之 潛變楊氏模數爲85〜350kg/醒2,大致滿足了上述條件。附 帶地，一般所使用的硏磨磨石所謂樹脂結合（resinoid)磨石 及玻璃熔結（vitrified)磨石之楊氏模數，分別爲1040 〜1200kg/mm2，3000〜3500kg/mm 2,可知不合適於定水平用。 第3画以模式表示磨石片6之配置狀態園。本實施形態 之筒狀磨石G如同圖所示，以螺旋狀纏繞上述支撐體3的 帶狀橡膠片5上，主要爲配設多數之大致直方體狀的磨石片 本紙張尺度適用中國國家標準（CNS)A4規袼（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 506881 A7 B7____ 五、發明說明（f ) 6。實際上，雖然在橡膠片5上之全面配設有磨石片6,同画 乃省略圖示。但是於此，筒狀磨石G旋轉於旋轉軸X周圍， 與旋轉軸X成直角之箭頭A所示硏磨方向，考量由磨石片6 用來硏磨被硏磨物（未圖示）。 此時，於各磨石片6最初到達被硏磨物的硏磨邊6a之朝 向，對箭頭B所示旋轉軸X之軸方向例如接近平行時，硏磨 邊6a係遍及全長大致同時到達被硏磨物，硏削音，以及振動 變更大，不能進行圓滑地硏磨。於是，如同圖所示，由於適合 地設定箭頭B所示旋轉軸X之軸方向與硏磨邊6a所成角 0，用以防止硏磨音，可予進行圓滑地硏磨。 在本實施形態，由設定0爲Γ 左右，可獲得良好的硏 磨結果。附帶地，橡膠片5對支撐體3之捲繞角α以7〜16° 左右。又，支撐體3之外徑爲130醒左右，全長（亦即筒狀磨 石G之全長）爲300〜800醒左右。 第4圖係以模式表示本實施形態之筒狀磨石固定於硏磨 裝置狀態的正視縱剖面圖。如同圖所示，筒狀磨石G的周 筒構件1之內部穿通軸7。而且，由軸7穿通的2個凸緣8 使圓筒構1由兩端所夾住，將筒狀磨石G固定於軸7。再者， 軸7穿通的環9,嵌合在圓筒構件1內部中央附近，並由此在 硏磨時防止筒狀磨石G受到力而撓曲。 軸7,將其兩端附近由自基台11延伸的軸承10以旋轉自 如地軸支持。並以此狀態。連動未圖示之馬達旋轉，軸7在 旋轉軸X周圍旋轉，使筒狀磨石G亦旋轉，進行將被硏磨物硏 磨·。在本實施形態特別是如同園所示，於高速旋轉的筒狀磨 -7- 本紙張尺度適用中國國家標準（CNS)A4規袼（210 X 297公釐） -I I I I ---丨！ 裝 (請先閲讀背面之注意事項再填寫本頁) n mmmmmm tmmmm a n I n n n mmm— tmmm I - 506881 A7 B? 五、發明說明（& ) 石G與基台11之間，以通過施予配線用銅電鑛的印刷電路 基板12來進行硏磨，又去除開設在印刷電路基板12的孔周 邊手段，同時亦以準平輥子進行修正翹曲的功能。 以下，列舉於印刷電路基板的硏磨及定水平之實施例加以 說明。第5園係在基板張貼銅箔，開穿通孔過程以模示表示 的剖面圖。於同圖，21係例如由玻璃環氧所成基板，22係張 貼在基板21表面的銅箔，23係產生在銅箔22上的凹口，24 爲通孔。分別表示同圖（a)爲僅基板21之狀態，同圖（b)爲由 壓接等張貼銅箔在基板21表面的狀態（以下，叫貼銅），同圖 (c〇更於基板21開穿通孔24狀態。在通孔24周緣，由於開 孔產生有所謂毛頭27。 於此，如同圖（c)所示在基板的上述凹凸23及毛頭27,以 先前之不織布輥子及本發明之筒狀磨石（都在以下的說明不 圖示）進行去除試驗，獲得下述之結果。 1. 使用先前之不織布輥子時 (1) 不織布中之纖維質材料殘留在通孔內，基板變成不良 品p (2) 結果通孔之端部會變純（產生孔鈍）貼於通孔周圍的銅 變薄，於此部分的圖案配線產生可能斷線。 2. 使用本發明之筒狀磨石時 (1) 並未產生通孔之孔堵塞。 (2) 通孔之端部未變鈍，可進行了均勻地定水平。 第6圖係如以上用來去除凹凸及毛頭的實驗結果以模式 表示的剖面圖。分別表示同圖（a)爲使用先前之不織布輥子， 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝 —訂·！ 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 506881 A7 B7___ 五、發明說明（7 ) 及同圖（b)爲使用本發明之筒狀磨石。如同圖（a)所示，使用 先前的不織布輥子時，不織布中之纖維質材料28殘留通孔 24內，使基板21變成不良品。 又，通孔24之端部成爲變鈍（被削去）的結果，貼在通孔24 周圍的銅箔22變薄，於此部分的圖案配線產生有可能斷 線。一方面，使用本發明之筒狀磨石時，如同圖（b)所示，並未 產生通孔24之孔堵塞。又，通孔24之端部24a不變鈍，可 進行均勻地定水平。 尙，一般在印刷電路基板，除了上述通孔以外，開穿有定位 用之感測器孔。當這樣的感測器孔之端部產生變鈍，堵塞孔 時，會影響在製造線上的印刷電路基板之定位精度。在此意 義，亦不產生孔周緣變鈍或堵塞孔等用以硏磨印刷電路基板 及進行定水平爲重要者。 第7圖表示予電鍍具有通孔的貼銅基板，更將欲硏磨的過 程以模式所示之剖面圖。首先，同圖（a)係基板表面貼銅箔22, 對開穿通孔24者，表示施予銅電鍍狀態。在此銅電鍍層25 表面及通孔24周緣，具有電鍍時產生的微小凸部26。尙，上 述的通孔24周緣之毛頭27,在電鍍前已預先去除。其次，同 圖（b)表示係樹脂30埋入通孔24狀態。此係施予通孔24 側壁24b的銅電鍍層25,保護在硏磨過程時不被削去，因應 需要所進行者。 再者，分別表示同圖（e)係使用先前之不織布輥子硏磨的狀 態，同画（d)係使用本發明筒狀磨石硏磨的狀態。如同圖（c) 所示，由不織布輥子硏磨時，在通孔24之周緣以箭頭C所示 冬 本紙張尺度適用中國國家標準（CNS)A4規袼（210 X 297公釐） -I I I KKB IB n k— I tt— mmmmm B 0 I I n n 1* ϋ 訂| (請先閱讀背面之注音？事項再填寫本頁) Ψ 506881 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（g) 方向被此不織布輥子所肖！1，於此處產生凹部31。結果，施予 通孔周圍的銅電鍍層25變薄，在此部分的園案配線有產生 斷線可能性者。 又，銅電鑛層25表面之上述微小凸部26由該不織布輥子 所挖，以凹部26a留下。結果，施予通孔24周圍的銅電鍍層 25變薄，在此部分的圖案配線有產生斷線的可能性者。一 方面，同圖（d)所示，由本發明之筒狀磨石來硏磨時在通孔24 之周緣不產生凹部，又微小凸部26亦不會被挖，故可進行平 坦的硏磨。尙，被埋入通孔24的樹脂3 0,在硏磨過程後由藥 品等的溶解去除。或者，例如亦有照原樣仍埋入導電性之樹 脂時亦有。 第8圖係對具有通孔的貼銅基板進行所謂相加電鍍過程， 以模式方式表示的剖面園。首先，分別表示同圖（a)由基板21 表面的壓接等貼銅箔22狀態，同圆（b)基板21開穿通孔24 的狀態。在通孔24周緣由開穿孔產生所謂的毛頭27。 其次，同圖（c)表示施予記號29的狀態。此係銅箔22上不 需要鋼電鍍的部分施予記號者，並由此僅在基板21上所要 之地方施予銅電鍍。尙，上述的通孔24周緣之毛頭27,係在 作記號前已預先去除。又，施予記號29的銅箔部分，係於銅 電鍍後之過程去除記號29之後，由蝕刻所去除。 再者，同圖（d)係作記號後表示施予銅電鍍的狀態。如同圖 所示，除了基板21上施有記號29的部分以外形成銅電鍍 層。又，同圖（c)係於周圍（d)以點線所圍口部之放大圖，詳細 表示銅電鍍層25。如在此所示，形成於記號29間的銅電鍍 -10- (請先閱讀背面之注意事項再填寫本頁} _· 裝 訂.-----1!· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 506881 A7 B7 _ 五、發明說明（今） (請先閱讀背面之注意事項再填寫本頁) 層25上靣，由電鍍時之表面張力等的影響會產生凹部25a。 其他，亦產生上述如微小凸部的凹凸部。欲平坦化諸等則需 要定水平處理。 第9圖，係進行電鍍後的基板定水平處理過程以模式方式 表示的剖面圖。尙，在同圖施予基板21之圖中下面的記錄 係省略圖示，於此，同圖（a)係表示應該作定水平的目標者，其 —例爲對應上述凹部2 5 a產部，至點線所示面b止進行水平， 則可使銅電鍍層25平坦。此時之銅電鍍層25之厚度以a 表示。 又，分別表示周圖（b)爲使用先前之不織布輥子作爲水平 狀態，同圖（c)爲使用本發明筒狀磨石以水平的狀態。如同 圖（e)所示，由不織布輥子用來定水平時，通孔24之周緣由該 不織布輥子所削，產生變鈍部32。結果，施予通孔24周圍的 銅電鍍層25變薄，此部分（角隅c)有圖案配線產生斷線的可 能性。 經濟部智慧財產局員工消費合作社印製 又，記號29間的銅電鍍層25表面由該不織布輥子所挖， 而產生凹部33。如此，依不織布輥子的定水平，並不能使銅 電鍍層25成平坦。一方面，如同圖（e)所示，由本發明之筒狀 磨石來定水平時，通孔24之周緣不產生變鈍，又記號29間 之銅電鍍層25表示亦不會被挖，可進行平坦的定水平，電鍍 部分變成均与的厚度。 [發明之效果] 如以上所說明，依本發明特別是，提供一種合適於硏磨成 磨光具有廣闊寬度的被硏磨面物品，又對於物品的親和性卓 -11- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 506881 A7 B7____ 五、發明說明（Π)) 越，再者可兼用作爲平板之準平輥子的筒狀磨石。 (請先閱讀背面之注意事項再填寫本頁) 又，本發明之筒狀磨石，亦合適於去除施予配線用銅電鍍 的印刷電路基板之上凹凸及定水平用。 [圖式之簡單說明] 第1圖本發明筒狀磨石之一實施形態側視橫剖面圖。 第2圖本實施形態之筒狀磨石放大部分剖面圖。 第.3圖以模式方式表示磨石片之配置狀態圖。 第4圖本實施形態之筒狀磨石固定於硏磨裝置之狀態以 模態表示的正視縱剖面_。 第5圖基板銅箔，開穿通孔過程以模態表示的剖面圖。 第6圖去除基板上之凹凸及毛頭的實驗結果以模態表示 的剖面圖。 第7圖電鍍具有通孔的貼銅基板，再予硏磨的過程以模態 表示的剖面圖。 第8圖具有通孔的貼銅基板進行相加電鍍過程以模態表 示的剖面圖。 第9圖電鍍後進行基板之定水平處理過程以模態產生的 剖面圖。 [符號之說明] 經濟部智慧財產局員工消費合作社印製 1…圓筒構件 2···彈性體（第1彈性體） 3…支撐體 4…金屬線 5···橡膠片（第2彈性體） -12- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 506881 A7 ___B7五、發明說明（（I ) 6...磨石片 7··•軸 8…凸緣 9·. ，壞 10 …軸 承 11 · …基 12 …印 刷電 路 基板 21 ‘ …基 板 22. …銅 箔 23. 凹凸 24, …通 孔 25. …銅 電鍍 層 26. …微 小凸 部 27. …毛 頭 28. …纖 維質 材 料 29, an …把 號 30, …樹 脂 31， (3 3 .. .凹部 32, …變 鈍部 (請先閱讀背面之注意事項再填寫本頁) ，裝 — 訂 ---- # 經濟部智慧財產局員工消費合作社印製 -13- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）V. Description of the Invention (/) [Technical Field of the Invention] The present invention relates to grindstones, and in particular, to cylindrical grindstones for honing or polishing articles with a wide width of the honing surface. [Previous technology] Since the past, ring-shaped millstones with an affinity for articles to be honed have been used. Β This system is described in, for example, Shiko Sho 59-3803, and has a surface suitable for engaging a rotating wheel to An elastic protective layer composed of a porous elastomer layer and a rubber sheet is provided on a rubber support layer reinforced by a metal wire, and a structure of a plurality of flat grindstones having a honing surface is further provided thereon. And here, when honing or polishing an article with a radius of curvature (hereinafter, the symbol represents honing), the honing tool is moved along the surface of the object, that is, the object to be honed, so as not to change the curvature , Especially for curved surfaces with small curvature radius, the final processing can be honing to the same surface. In addition, for the honing and leveling of printed circuit boards and related substrates, so-called (endless endless belts (wide belts) or non-woven rolls, etc. have been used. [Questions to be solved] However, As described in the above-mentioned Shiko Sho 59-3803, in order to efficiently honing the honing surface with a wider width, it is not complete to use the ring-shaped grindstone to extend in the direction of the rotation axis as a cylindrical shape. A cylindrical grindstone is used to fit a suitable structure for fixing to a rotating wheel. In addition, it is necessary to find a way to reduce the honing noise when honing a wide width of the honing surface, and to perform honing more smoothly. The endless endless belt wears the front end of the abrasive grains in a relatively short period of time, so the honing force is reduced and the finish of the honing is changed, so it is difficult to uniformly hob. On the one hand, the non-woven roller is viewed from its structure. Although it is available, this paper size applies Chinese National Standard (CNS) A4 regulations (210 x 297 mm) ----- 1 · -installation {Please read the precautions on the back before filling this page) nn JrJ * MW W · I ΜΗ I ΜΗ Qian * t IP * Economy Printed by the Intellectual Property Bureau employee consumer cooperative 506881. Member of the Intellectual Property Bureau of the Ministry of Economic Affairs and the consumer cooperative prints clothing A7 B7 V. Invention Description (i) Continued light surface, but its grinding power is not suitable for the need for greater Grinding work. Specifically, when a non-woven roll is used for quasi-leveling, and the sharpness is increased due to small honing, the honing force must be increased in any case. Therefore, the non-woven fibers are also fused with the minute recesses, making the most suitable leveling purpose impossible. Others, such as when a rigid body of a grindstone or a person near the body forms a roller shape for leveling, the so-called chatter mark cannot be followed by the large fluctuations of the printed circuit board. In view of the above-mentioned shortcomings, the present invention particularly provides a honing surface article suitable for smooth honing or polishing a wide width with a small honing sound and low vibration, and has excellent affinity for the article. Moreover, it can also be used as a cylindrical grindstone for flat rollers. [Means for Solving the Problem] In order to achieve the above object, the present invention is characterized in that a first elastic body is provided on the outer periphery of a rotatable cylindrical member, a second elastic body is provided on the outer periphery of the first elastic body by a support body, and A plurality of grindstone pieces forming a predetermined angle with the rotation axis direction of the cylindrical member are arranged on the outer periphery of the second elastic body. The second elastic body is characterized in that a band-shaped elastic sheet is used, and a plurality of grinding stone sheets are arranged approximately parallel to the sheet width direction in advance. The band-shaped elastic sheet is spirally wound on the band-shaped elastic sheet. Peripheral. Furthermore, it is characterized in that each honing edge of each of the grinding stone pieces is over its entire length and does not reach the honing surface at the same time, and each honing surface edge forms a predetermined angle with the rotation axis direction of the cylindrical member . (Please read the notes on the back before filling this page) Secret _ Binding! This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 506881 A7 B7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumer Cooperatives V. Invention Description (3) [Implementation Mode of the Invention] The following reference is made to the drawings An embodiment of the present invention will be described. Fig. 1 is a side cross-sectional view of one embodiment of a cylindrical grindstone of the present invention. In the same figure, 1 is a substantially cylindrical cylindrical member that supports the entire cylindrical grinding stone G. For this material, for example, a so-called phenol tube reinforced with a phenol resin impregnated with a paper tube is used which is light and has excellent rigidity. At least one layer of an elastic body 2 is provided on the outer periphery of the cylindrical member 1. The most suitable material is an elastic porous synthetic resin. Specifically, the use of sponge-like vinyl acetate has a strong change in elapsed time, and the internal gas does not leak, and it is lighter. A support body 3 for protecting the elastic body 2 is provided on the outer periphery of the elastic body 2. This is, for example, a metal wire 4 formed of a single wire or a twisted piano wire to which brass plating is applied on the outer side of a solid soft rubber sheet, and then sandwiched by the same sheet from the outside to form a bonded structure. This metal wire 4 is wound in a spiral shape toward the rotation direction of the cylindrical grinding stone G (vertical direction to the paper surface of the same circle), at least the number of coils that can withstand the high-speed rotation of the cylindrical grinding stone G. The rubber sheet 5 is bonded to the outer periphery of the support 3. Specifically, the surface of the band-shaped rubber sheet 5 of the grindstone sheet 6 is adhered, and the rubber sheet 5 is wound around the support body 3 in a spiral direction toward the rotation axis of the cylindrical grindstone G with its surface as the outside. It becomes a sticky structure. It is preferable that the grindstone sheet 6 is arranged on the rubber sheet 5 with a plurality of gaps (for example, 1 to 1.8 rnn) as shown in a section in a part of the enlarged cylindrical grindstone G in FIG. 2. The height of the grindstone sheet 6 is about 8 to 12 legs, and the width and depth are preferably about 10 to 16 legs. At this time, the width (the length of the edging side described later) is preferably longer than the depth. Therefore, on the one hand, prevent the cylindrical surface of the self-adhesive grinding stone sheet 6 (please read the note on the back? Matters before filling out this page) «t— ϋ ϋ 1 * order-丨 ψ This paper size applies to China Standard (CNS) A4 specification (210 X 297 mm) 506881 A7 B7 V. Description of the invention (bucket) Floating, can also prevent the honing sound from becoming loud. (Please read the note S on the back before filling this page.) However, after winding the above-mentioned metal wire 4, you can also consider the method of directly winding the rubber sheet 5 with the abrasive stone 6 bonded to it. However, in such a case, the gap between the rubber pieces 5 wound in a spiral shape, the metal wire 4 is peeped anyway, the coverage of this part becomes incomplete, the damage becomes faster, and there is a possibility of breaking. Therefore, the sheet covering the metal wire 4 needs to be considered separately as described above. As for the grindstone sheet 6, for example, a SiC abrasive grain is kneaded with a PVA (polyvinyl alcohol) resin having a low Young's modulus, and is made into a tile shape. Alternatively, a method in which a plate-shaped grindstone made of such a material is bonded to the rubber sheet 5 and then cut is used to form the grindstone sheet 6. As in the above structure of the cylindrical grinding stone G, the supporting body 3 and the rubber sheet 5 made of rubber are mainly used to directly transmit the elastic force of the elastic body 2 to the grinding stone sheet 6, so the grinding stone sheet 6 is independently The curved surface of the honing object allows honing with excellent affinity. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the Young's modulus of the millstone is the most suitable for a given level. It is the Young's modulus (creeping Yang's) by creep test. Modulus) is 100 ~ 300kg / mm 2. If it becomes 500 kg / mm 2 or more, the substrate may be scratched, making it practically impossible. In this embodiment, the latent Young's modulus of the millstone used is 85 to 350 kg / wake 2, which substantially meets the above conditions. Incidentally, the Young's modulus of the so-called resinoid grinding stone and vitrified grinding stone of honing grindstones generally used are 1040 to 1200kg / mm2 and 3000 to 3500kg / mm 2, respectively. Not suitable for level use. The third drawing shows the arrangement state of the grindstone 6 in a pattern. As shown in the figure, the cylindrical grindstone G of this embodiment is wound on the band-shaped rubber sheet 5 of the support 3 in a spiral shape, and is mainly provided with a large number of substantially rectangular parallelepiped grindstone sheets. This paper is applicable to China Standard (CNS) A4 Regulations (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 506881 A7 B7____ 5. Description of Invention (f) 6. Actually, although the grindstone sheet 6 is provided on the rubber sheet 5 in its entirety, the drawing is omitted from the same drawing. However, here, the cylindrical grinding stone G is rotated around the rotation axis X, and the honing direction is shown by an arrow A at a right angle to the rotation axis X. Considering that the grinding stone 6 is used for honing the object to be honed (not shown) . At this time, when each of the grinding stone pieces 6 first reaches the direction of the honing edge 6a of the object to be honed, and the axis direction of the rotation axis X indicated by the arrow B is nearly parallel, for example, the honing edge 6a reaches the target approximately simultaneously over the entire length. Honing, honing, and vibration change greatly, and smooth honing is not possible. Therefore, as shown in the figure, since the axis direction of the rotation axis X shown by the arrow B and the honing edge 6a are appropriately set to 0 to prevent honing noise, smooth honing can be performed. In this embodiment, a good honing result can be obtained by setting 0 to about Γ. Incidentally, the winding angle α of the rubber sheet 5 to the support 3 is about 7 to 16 °. The outer diameter of the support 3 is about 130 W, and the full length (that is, the full length of the cylindrical grindstone G) is about 300 to 800 W. Fig. 4 is a front longitudinal sectional view schematically showing a state where the cylindrical grindstone of this embodiment is fixed to a honing apparatus. As shown in the figure, the shaft 7 is passed through the inside of the cylindrical member 1 of the cylindrical grindstone G. In addition, the cylindrical structure 1 is sandwiched between both ends by the two flanges 8 penetrated by the shaft 7, and the cylindrical grinding stone G is fixed to the shaft 7. Further, the ring 9 through which the shaft 7 passes is fitted near the inner center of the cylindrical member 1, thereby preventing the cylindrical grindstone G from being deformed by the force during honing. The shaft 7 is rotatably supported by bearings 10 extending from the base 11 near its both ends. And in this state. In conjunction with rotation of a motor (not shown), the shaft 7 rotates around the rotation axis X, so that the cylindrical grindstone G also rotates, and the honing object is honed. In this embodiment, especially as shown in the garden, the cylindrical mill rotates at high speed. -7- This paper size applies the Chinese National Standard (CNS) A4 Regulation (210 X 297 mm) -I I I I --- 丨! (Please read the precautions on the back before filling out this page) n mmmmmm tmmmm an I nnn mmm— tmmm I-506881 A7 B? 5. & Description of the invention (Between stone G and abutment 11) The wiring is honing using the printed circuit board 12 of the copper-electric ore, and removing the means around the holes of the printed circuit board 12, and at the same time, the function of correcting warpage is performed by a quasi-flat roller. Examples of honing and leveling the printed circuit board will be described below. The fifth circle is a cross-sectional view showing a copper foil on a substrate and a through-hole process shown in a mold. In the same figure, 21 is a substrate made of, for example, glass epoxy, 22 is a copper foil affixed to the surface of the substrate 21, 23 is a notch formed on the copper foil 22, and 24 is a through hole. (A) shows the state of only substrate 21, and (b) shows the state where copper foil is pasted on the surface of substrate 21 by crimping or the like (hereinafter, referred to as copper bonding). The through-hole 24 is opened. At the periphery of the through-hole 24, so-called burrs 27 are generated due to the openings. Here, as shown in FIG. Cylindrical grinding stones (both described below are not shown) were subjected to a removal test to obtain the following results: 1. When the previous nonwoven rolls were used (1) The fibrous material in the nonwoven remained in the through holes, and the substrate became unusable. Good product p (2) As a result, the end of the through hole becomes pure (causes the hole to be dull), and the copper attached to the surrounding of the through hole becomes thin, and the pattern wiring in this part may be broken. 2. Using the cylindrical grinding stone of the present invention (1) No blockage of the hole of the through hole occurs. (2) The end of the through hole is not dull and can be evenly leveled. Figure 6 shows the results of the experiment used to remove unevenness and burrs as above. A cross-sectional view shown in the same figure (a) is the use of the previous non-woven rolls, The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) Binding-binding ·! The Intellectual Property Bureau of the Ministry of Economic Affairs, the Consumer Cooperative, printed the intellectual property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives 506881 A7 B7___ 5. The description of the invention (7) and the same figure (b) is the use of the cylindrical grinding stone of the present invention. As shown in Figure (a), when using the previous non-woven rollers, The fibrous material 28 remains in the through-hole 24, making the substrate 21 a defective product. As a result, the end of the through-hole 24 becomes dull (removed), and the copper foil 22 attached to the periphery of the through-hole 24 becomes thinner. The pattern wiring in this part may be disconnected. On the one hand, when using the cylindrical grinding stone of the present invention, as shown in FIG. 24a is not blunt, and can be leveled uniformly. 一般 Generally, in addition to the above-mentioned through holes, printed circuit boards have sensor holes for positioning. When the ends of such sensor holes become blunt, , When the hole is blocked, it will affect the manufacturing line Positioning accuracy of the printed circuit board. In this sense, it is important not to blunt the printed circuit board or to level the hole, such as dulling the edges of the holes or blocking the holes. Figure 7 shows the copper-clad substrate with through holes pre-plated. In addition, the process to be honed is shown in a sectional view. First, as shown in the figure (a), the surface of the substrate is coated with copper foil 22, and the through hole 24 is opened, indicating that the copper plating is applied. Here, the copper plating layer 25 The surface and the peripheral edge of the through hole 24 are provided with micro-protrusions 26 during electroplating. That is, the bristles 27 at the peripheral edge of the above-mentioned through hole 24 have been removed before plating. Next, the same figure (b) shows that the resin 30 is embedded in the through The state of the hole 24. This is a copper plating layer 25 applied to the side wall 24b of the through hole 24 to protect it from being removed during the honing process. In addition, the same figure (e) shows a state of honing using a conventional non-woven roll, and the same picture (d) shows a state of honing using a cylindrical grindstone of the present invention. As shown in Figure (c), when honing by a non-woven roll, the size of the winter paper indicated by arrow C on the periphery of the through hole 24 is subject to the Chinese National Standard (CNS) A4 (210 X 297 mm) -III KKB IB nk— I tt— mmmmm B 0 II nn 1 * 订 Order | (Please read the note on the back? Matters before filling out this page) Ψ 506881 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ) The direction is shown by this non-woven roll! 1. Here, a recess 31 is generated. As a result, the copper plating layer 25 provided around the applied via hole becomes thinner, and there is a possibility that the garden wiring in this portion may be disconnected. In addition, the above-mentioned minute convex portions 26 on the surface of the copper electric ore layer 25 were dug by the non-woven rolls and left as concave portions 26a. As a result, the copper plating layer 25 around the applied through hole 24 becomes thin, and there is a possibility that the pattern wiring in this portion may be disconnected. On the one hand, as shown in the same figure (d), when the cylindrical grinding stone of the present invention is used for honing, no concave portion is generated on the periphery of the through hole 24, and the small convex portion 26 is not dug, so flat honing can be performed . Alas, the resin 30 buried in the through hole 24 is removed by dissolving the medicine or the like after the honing process. Alternatively, for example, there is also a case where a conductive resin is buried as it is. FIG. 8 is a cross-sectional view schematically showing a so-called additive plating process on a copper-clad substrate having through holes. First, the state where the copper foil 22 is pasted by pressure bonding and the like on the surface of the substrate 21 in the same figure (a), and the state where the through hole 24 is opened in the substrate 21 in the same circle (b) are shown. The so-called bristles 27 are produced at the periphery of the through-hole 24 by openings. Next, the state of the administration mark 29 is shown in the same figure (c). Those who do not need steel plating on the copper foil 22 are given a mark, and thus copper plating is applied only on the substrate 21 at a desired place. Alas, the bristles 27 on the periphery of the above-mentioned through-hole 24 have been removed before marking. The copper foil portion given the mark 29 is removed by etching after the mark 29 is removed during the copper plating process. It should be noted that (d) in the same figure indicates a state in which copper plating is applied. As shown in the figure, a copper plating layer is formed except for the portion marked with the symbol 29 on the substrate 21. The same figure (c) is an enlarged view of the mouth portion enclosed by dotted lines around the periphery (d), and the copper plating layer 25 is shown in detail. As shown here, the copper plating formed between the marks 29-10- (Please read the precautions on the back before filling this page} _ Binding. ----- 1! · This paper size applies Chinese national standards ( CNS) A4 specification (210 X 297 mm) 506881 A7 B7 _ V. Description of the invention (today) (Please read the precautions on the back before filling this page) The upper layer of layer 25 is affected by the surface tension during plating. Concave portions 25a are generated. In addition, the above-mentioned uneven portions such as minute convex portions are also generated. Leveling treatment is required for flattening. Figure 9 is a cross-sectional view schematically showing the process of leveling the substrate after plating. Alas, the lower record in the diagram of the substrate 21 given in the same figure is omitted. Here, the same figure (a) shows the target who should be set at a certain level. For example, it corresponds to the above-mentioned recess 2 5 a production department. Horizontally to the surface b shown by the dotted line, the copper electroplated layer 25 can be made flat. The thickness of the copper electroplated layer 25 at this time is represented by a. Also, the weekly diagram (b) shows the use of the previous non-woven roll as the Horizontal state, same as figure (c). As shown in Fig. (E), when the non-woven roll is used for leveling, the peripheral edge of the through hole 24 is cut by the non-woven roll to produce a dull portion 32. As a result, a copper plating layer is applied around the through hole 24 25 is thinner, and this part (corner 隅 c) has the possibility of pattern disconnection. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The surface of the copper plating layer 25 between the marks 29 is dug by the non-woven roll, and The concave portion 33 is generated. In this way, the copper plating layer 25 cannot be made flat by the level of the non-woven roll. On the one hand, as shown in FIG. The periphery does not become dull, and the copper plating layer 25 marked with 29 indicates that it will not be dug. It can be flat and leveled, and the plated part becomes uniform thickness. [Effect of the Invention] As explained above, according to the present invention In particular, to provide a honing surface article suitable for honing into a wide width, and has an affinity for the article. -11- This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ) 506881 A7 B7____ , Invention is described in ([pi)) greater, as a quasi-addition can be used along the flat plate of the roller a cylindrical grindstone. (Please read the precautions on the back before filling in this page.) The cylindrical grindstone of the present invention is also suitable for removing unevenness and leveling on printed circuit boards to which copper plating for wiring is applied. [Brief description of the drawings] Fig. 1 is a side cross-sectional view of one embodiment of a cylindrical grindstone of the present invention. Fig. 2 is an enlarged sectional view of a cylindrical grindstone of this embodiment. Fig.3 shows the arrangement state diagram of the grindstone in a pattern. Fig. 4 is a longitudinal sectional view of the cylindrical grinding stone of the present embodiment in a state of being fixed to the honing device, which is shown in a modal form. Fig. 5 is a cross-sectional view showing the copper foil of the substrate in a modal process in the process of opening through holes. Fig. 6 is a cross-sectional view showing the results of experiments for removing unevenness and burrs on a substrate in a modal manner. Fig. 7 is a cross-sectional view showing a modal process of plating a copper-clad substrate having a through hole and then honing it. Fig. 8 is a cross-sectional view showing a modality of a copper-clad substrate with through holes subjected to an additive plating process. Fig. 9 is a cross-sectional view generated in a modal state during the leveling process of the substrate after plating. [Explanation of Symbols] Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 ... Cylinder member 2 ... Elastomer (1st elastomer) 3 ... Support 4 ... Metal wire 5 ... Rubber sheet (2nd elastic Body) -12- This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 506881 A7 ___B7 V. Description of the invention ((I) 6 ... millstone 7 ·· • shaft 8 ... convex Edge 9 ..., bad 10 ... bearing 11 ... base 12 ... printed circuit board 21 '... substrate 22 .... copper foil 23. bump 24, ... through hole 25 .... copper plating layer 26 .... micro-protrusion 27 .... Hair 28.… Fibrous material 29, an… Number 30,… Resin 31, (3 3... Recess 32,… Dull (please read the precautions on the back before filling in this page), Pack — Order- --- # Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -13- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)