A7 五、 經濟部智慧財產局員工消費合作社印製 發明說明（1) 本發明係有關印刷基板、其相關基材之研削及可容易 進行整平之整平用輥（整平用之砥石車或砥石輥）。 (請先閱讀背面之項再填寫本頁) 習知之印刷基板之研削、整平（levelIing ;平坦化）， 係使用無尾皮帶（寬皮帶）、不織布輥(r〇Uer)進行。皮帶最 大的缺點是短期間内研粒前端磨耗，因此除研削力低落之 外’還會對研削完成面產生變化，很難獲得均一之製品。 另一方面，不織布觀就其構造（組織）而言，雖可獲得連續 之元成面’但研削力有問題’不適合需要更大研削力之作 業。此外’進行整平時研削力較小（為使利道變好），當增 大研削廢時’在很小的凹凸面之凹部會有不織布進入，無 法達成真正整平之目的。此外，如艰石之剛體（相近之剛 體輥）無法跟隨震動擦痕、基板之大旋轉。 本發明係克服上述之習知技術缺點，維持相期研削力 之整平（levlling ;平坦化）輥（r〇Uer ;輥），可提供平坦而一 定之完成面、提供整平輥。 本發明者們為滿足上述課題，經過熱烈討論結果，想 出了以以下方法解決問題。 本發明係一種印刷基板用整平輥，其係以熱可塑性掛 脂作為結合材，結合成形砥粒，將四角形之複數個砥石片 ’配列接著於支撐部材圈之外周面所形成之印刷基板用整 平輥，其特徵為：各砥石片之一方之侧面，對於輥之外周 方向傾斜地配置，鄰接一方之侧面之侧面，對於輥之旋轉 軸方向傾斜地配置，且砥石片於輥外周面配列成螺旋狀或 不規則狀》 良紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公釐） -4 - A7 B7 五、發明說明（2) 以下利用圖面說明。 、 帛1圖係本發明之整平親之一例，為說明而圖示其報 :之一部份之透視圖。第丨圖中，i為砥石片，2為砥石片之 間之間隙，1之砥石片打開支撐構件圈（支撐部材層）3上之 某間隙，配列、接著成螺旋（spirai)狀。第i圖中，砥石片 之垂直方向侧面對於輥之外周方负傾斜（與外周方向不，呈 平行）地配置，鄰接於該侧面之水平方向之側面，對於輥 之旋轉軸方向傾斜地（與旋轉轴方向不呈平行）配置。支撐 :構件層3為吸收震動設置於彈性材層4之上，彈性材層4設 置於支撐其之支撐構件5之上支撐彈性材層4。支樓構件 5之内侧有旋轉軸，兩者間被固定之緣，觸接於印刷基板 面，經由旋轉轴之旋轉整平輥移動基板面，進行基板面之 整平。 第2圖（第2A〜2C圖）係說明本發明整平觀之構造之模 式圖。第2A圖係將輥維持水平時之由輥面側所看之正面 圊，第2B圖係由輥之頂部通過镜中心部至輪底部之切斷 線所切斷之截面圖’第2C圖係親說明棍中紙石.片1與支樓 · .， 構件層3之接合部份之說明圖。第2A圖之左半部份被部份 地省略，第2B圖之下半部份被省略 如第2A圖所示，砥石片1空出間隙2呈螺旋狀地配列 ，如第2B、2C圖所示’.空出間隙2接著於支撐構件層3上 〇疏石片之大小最好為10~12mm，間隙最/好為u〜3.0mm °抵石片之垂直方向之側面對於輥之外周方向傾斜地（擁 有第2 A圖之角度〇:)配置’鄰接之水平方向之侧面對輥之 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） .......My: % : j I---I------- -裝！一 — ί-訂---！1·線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 * 4 5 6 16 7 A7 ---------—. B7 五、發明說明（3 ) 旋轉軸方向傾斜地（擁有第2圖之角度配置。角度β最 好為7〜16。，角度0最好為路石片係為吸收震動 之作為砥粒之結合劑，使用熱可塑，民廣脂之物，其係熱可 塑性樹脂中彈性較大者，例如作為崎石時砥石最好飄移彈 性率為85~350kg/mm2，特別是最好飄..移彈性率為1〇〇〜 300kg/nnn2之樹脂，例如聚乙烯醇。飄移彈性率艮依據塑 膠之彎曲飄移試驗方法（JIS κ 7丨16._·.〗987.)之測定結果算出 下式。 . .....A7 V. Description of Inventions Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (1) The present invention is related to the grinding of printed substrates and related substrates, and rollers for leveling that can be easily adjusted Vermiculite roller). (Please read the items on the back before filling this page) The conventional grinding and leveling (leveling) of printed circuit boards are performed using a tailless belt (wide belt) and a non-woven roll (r0Uer). The biggest disadvantage of the belt is that the grinding tip wears out in a short period of time, so in addition to the low grinding power, it will also change the finished grinding surface, making it difficult to obtain a uniform product. On the other hand, in terms of the structure (organization) of the non-woven fabric, although continuous elements can be obtained, 'the grinding power is problematic' is not suitable for jobs that require greater grinding power. In addition, ‘the leveling force is small during leveling (for better profitability), and when increasing the level of grinding waste’, non-woven fabric may enter the concave portion of the small uneven surface, which cannot achieve the purpose of real leveling. In addition, rigid bodies (such as similar rigid body rollers) cannot follow vibration scratches and large rotation of the substrate. The present invention overcomes the shortcomings of the conventional techniques described above and maintains a phased (levlling; flattening) roller (r0Uer; roller) to maintain the phase grinding force, which can provide a flat and certain finishing surface and a leveling roller. In order to meet the above-mentioned problems, the present inventors have come to an enthusiastic discussion, and have come up with the following methods to solve the problem. The invention relates to a flattening roller for a printed circuit board, which is a printed circuit board formed by using thermoplastic hanging grease as a binding material, combining shaped granules, and arranging a plurality of quadrangular vermiculite pieces' on the outer periphery of a circle of a support member. The leveling roller is characterized in that one side of each vermiculite sheet is arranged obliquely to the outer peripheral direction of the roll, and the side face of the side adjacent to one side is arranged obliquely to the direction of the rotation axis of the roll, and the vermiculite pieces are arranged in a spiral on the outer peripheral surface of the roll. The shape or irregularity is good. The good paper size is applicable to the Chinese national standard (CNS > A4 specification (210 X 297 mm) -4-A7 B7. V. Description of the invention (2) The following description uses drawings. Figure 1 shows the invention An example of the leveling pro, for illustration purposes, a part of the perspective view. In the figure, i is a vermiculite piece, 2 is the gap between the vermiculite pieces, and 1 of the vermiculite pieces opens the support member circle. (Supporting material layer) A gap on 3 is arranged and connected in a spiral shape. In Fig. I, the vertical side of the vermiculite sheet is negatively inclined to the outer periphery of the roller (not parallel to the outer peripheral direction). Configuration, the side surface adjacent to the side in the horizontal direction, is arranged obliquely (not parallel to the direction of the rotation axis) to the rotation axis direction of the roller. Support: The component layer 3 is arranged on the elastic material layer 4 to absorb vibration, and the elastic material layer 4 is provided on the supporting member 5 supporting the elastic material layer 4. The inside of the supporting member 5 has a rotation shaft, and the fixed edge between the two contacts the surface of the printed substrate and rotates the leveling roller through the rotation shaft. The substrate surface is moved to level the substrate surface. Figure 2 (Figures 2A to 2C) is a schematic diagram illustrating the structure of the leveling concept of the present invention. Figure 2A is viewed from the roller surface side when the roller is maintained horizontally. The front view, Figure 2B is a cross-sectional view cut from the top of the roller through the cut-off line from the center of the mirror to the bottom of the wheel. Figure 2C is a personal illustration of the paper and stone in the stick. The explanatory diagram of the joint part of layer 3. The left half of Fig. 2A is partially omitted, and the lower half of Fig. 2B is omitted. As shown in Fig. 2A, the vermiculite sheet 1 leaves the gap 2 spirally. Arranged as shown in Figures 2B and 2C. 'The gap 2 is vacated and then the support member layer 3 The size of the sparse stone piece is preferably 10 ~ 12mm, and the gap is most preferably u ~ 3.0mm. The side of the vertical direction of the abutting piece is inclined to the outer peripheral direction of the roller (having the angle 0 in Figure 2A). The paper size of the side-to-roller in the horizontal direction applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) .... My:%: j I --- I ------ --Installation! I — -Order ---! 1 · Line (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs * 4 5 6 16 7 A7 ---- -----—. B7 V. Description of the invention (3) The direction of the rotation axis is inclined (having the angular configuration shown in Figure 2). The angle β is preferably 7 to 16. The angle 0 is best for road stones, which are used as binders to absorb vibrations. They are made of thermoplastics and minerals, which are the ones with greater elasticity in thermoplastic resins. The drift elasticity is 85 ~ 350kg / mm2, especially the resin with the best floating elasticity is 100 ~ 300kg / nnn2, such as polyvinyl alcohol. The drift elasticity rate is calculated based on the measurement results of the flexural drift test method of plastics (JIS κ 7 丨 16._ .. 987.) and the following formula is calculated. .....
Et= L2*F/4bh3ifidt F :試驗荷重（kg) L :支點間距離（mm) b:試驗片之寬（mm) … h * 試驗片之高（mm) dt .飄移弯曲 _(Π1Π1.) 二二:-写香 熱固性樹脂砥石（以石碳酸樹脂4為結合劑之物）之飄 移彈性率為1040~ 1200 kg/mm2，.陶"'竟鄉.石...之飄移彈性率為 3000〜3500 kg/mm2。 砥粒依據所需求之處理程度遁當妹被決定，炭化珪素 被適當地使用。支撐構件3係為擁有.彳矣^^砥石片之機槭強. 度’最好其内部使用有加入鋼琴線等強化纖維之軟質 (50〜65Q)之橡膠（天然橡膠，SBR)、樹脂等。第2(：圖之6係 鋼琴線。 'Γ· 第2B圖顯示支撐構件層3設置於為遗收震動之彈性材 層4之上，彈性材層4設置於支撐其之支撐構件5之上，顯 本紙張尺度適用令國國家標準（CNS)A4規格（210 X 297公董7 -----i.--------{:!---^----—-訂I ϋ n J n 1 線 Ο------：-------------- (請先閱tt-·背面之注意事項再填寫本頁) A7 _______B7___ 、發明說明（4 ) 示其支撐之樣態β從第2A圖之整平輥之正面圖之左端至 右端為止，意即整平輥之長度依據應處理之印刷基板之大 小等種種條件而適當地浃定，最好為300〜800mm。第2Α 圖所示之角度α為零時，處理過之印刷基板之完成面會有 線進入之缺點，當角度0為零時，研磨（研削）音變大，無 法進行研磨。本發明中，砥石月1配列於支撐構件層3之上 ，必須接著。依據印刷基板之不同，會有大的凹凸，若考 ,.) 慮整平處理如是之基板時之震動，最好於支撐構件層之下 設置吸收震動之彈性材層4,設置彈性材層4時，為支撐彈 性材層4與旋轉軸聯繫，最好設置支撐基材層5。 以下舉實施例說明。 第3圖（第3Α〜3C圖）係於基板貼上銅箔說明開穴工程 及由該工程發生燒化（flash，nn)之說明圖，第3A圖係於基 板、第3B圖係於第3A圖之基板貼上銅箔所得之釉銅基板 ，第3C圖係於第3B圖之釉鋼基板穿貫通孔（through hole) 而得之擁有貫通孔之釉銅基板。第3圖中，11為基板，12 為銅箔，13為銅箔之小凹凸，Η為貫通孔之洞。第3C圖 之基板除凹凸之外還有燒化（未圖示）。為比較本發明之整 平輥與習知之不織布輥，進行了移除C圖之基板之凹凸與 燒化之實驗’得到以下之結果。 (1)使用習知之不織布輥時 1不織布之纖維質殘留於貫通孔洞内，结果不良。 2洞之端面有滴漏之結果（sagging)。洞周圍之銅箔之 端面變薄’有斷線之可能。 、 本紙張尺度適用t國國家標準（CNS)A4規格（210 X 297公釐） i-n I ai n n n n n I n I < n n n n n K n It 1 1 n I 線 (請先閲t»·背面之注意事項再填寫本頁) 7 { 4 5 616 7 A7 B7 五、發明說明（5 ) (2)使用本發明之整平輥時 1本發明之整平輥於外周部有砥材片，因未有細緻之 纖維，故沒有洞阻塞》 2本發明之整平輥之外周部之砥石片比洞大數十倍， 洞之端面未有滴漏_。 3可進行均一之整平β 第4囷（第4Α〜4C囷）於鋼箔表面擁有燒化之貫通孔釉 銅基板電鐘’埋入保護洞周邊之電鍍之樹脂之後，圖示研 削工程之說明圊。第4Α圖係圚示於銅_猪表面擁有燒化之 貫通孔釉銅基板電鍍所得之基板，第4B圖係於第4A圖之 基板之貫通孔部份埋入樹脂之圖，第4C圖係圖示於第4B 圖之貫通孔部份研削埋入樹脂之基板之後之基板狀態之圖 ’第4C圖（a)係以習知技術之不織布處理之基板，第 係以本發明之整平輥處理之基板。第4人圖係電鍍後之基 板’具有藉由電鍍而產生之微小凸部（雜削、突起等）16及 洞周邊之突起（未圖示）。第4A圖中，基板11、銅箔12、貫 通孔14與上述相同，15為電鍍銅層，16為微小凸部。上述 之雜削、突起等微小凸部、及產生於洞周邊之銅突起經由 研磨而去除，然後為作成模式而被描續^研磨前為保護第 4A囷之基板之洞周邊之電鍍，隨其需求於貫通孔部份埋 入樹脂，第4B圖示埋入該樹脂後之基板。為比較本發明 之整平輥與習知之不織布輥，進行去除第4A圖或4B之基 板之微小凸部之實驗，得到第4C圖之結果。第40圖（a)係 圖示使用不織布親18之結果，洞周邊經由概所削產生凹部 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） <諳先閱讀背面之注意事項再填寫本頁) i 丨·—訂·--------線"^. 錄濟部暫慧財產.局員工消費合作社印製 0 A7 B7 五、發明說明（6 ) 21。第4C圖（b)係使用本發明之整平輥，於洞周邊未生成 .凹部，顯示被平坦地研磨。 ： , '第5圖（第5A〜5E圖）係顯示'進行具有貫通孔之釉銅基Et = L2 * F / 4bh3ifidt F: test load (kg) L: distance between fulcrum points (mm) b: width of test piece (mm)… h * height of test piece (mm) dt. Drift bending_ (Π1Π1.) 22: -The drift elasticity of the fragrant thermosetting resin vermiculite (the thing with the sorbite 4 as the binding agent) is 1040 ~ 1200 kg / mm2. The drift elasticity of Tao " 'Jingxiang. Stone ... 3000 ~ 3500 kg / mm2. The granules were determined based on the degree of treatment required, and when carbonized, the carbonized halogen was used appropriately. The support member 3 is made of 槭 ^^ vermiculite. It is best to use a soft (50 ~ 65Q) rubber (natural rubber, SBR), resin, etc. with reinforced fibers such as piano wires. . Figure 2 (: 6 of the piano line. 'Γ · Figure 2B shows that the supporting member layer 3 is disposed on the elastic material layer 4 which is a vibrating vibration, and the elastic material layer 4 is disposed on the supporting member 5 supporting it. The paper size of this paper is applicable to the national standard (CNS) A4 specification (210 X 297) 7 ----- i .-------- {:! --- ^ ----—- Order I ϋ n J n 1 line 〇 ------: -------------- (please read the precautions on the back before filling in this page) A7 _______B7___, invention Explanation (4) shows the state of its support β from the left end to the right end of the front view of the leveling roller in FIG. 2A, which means that the length of the leveling roller is appropriately based on various conditions such as the size of the printed substrate to be processed. It is best to be 300 ~ 800mm. When the angle α shown in Figure 2A is zero, the finished surface of the processed printed substrate has the disadvantage of line entry. When the angle 0 is zero, the grinding (grinding) sound becomes louder. Grinding cannot be performed. In the present invention, vermiculite 1 is arranged on the support member layer 3 and must be followed. Depending on the printed substrate, there will be large bumps. If you consider, the vibration of the substrate when it is leveled is considered. , Preferably in support An elastic material layer 4 for absorbing vibration is provided under the component layer. When the elastic material layer 4 is provided, in order to support the elastic material layer 4 and the rotation axis, it is best to provide a supporting base material layer 5. The following description of the embodiment. (Figures 3A to 3C) are illustrations of attaching copper foil to the substrate to illustrate the cavitation process and flash (nn) generated by the process. Figure 3A is on the substrate, and Figure 3B is on the substrate in Figure 3A. The enamel copper substrate obtained by pasting copper foil, FIG. 3C is a through-hole enamel copper substrate obtained through the through hole of the enamel steel substrate in FIG. 3B. In FIG. 3, 11 is the substrate and 12 It is a copper foil, 13 is the small unevenness of the copper foil, and Η is a hole of a through hole. In addition to the unevenness, the substrate in FIG. 3C is burned (not shown). In order to compare the leveling roller of the present invention with the conventional non-woven fabric The roller was subjected to an experiment to remove the unevenness and firing of the substrate in Figure C. The following results were obtained. (1) When the conventional nonwoven roll is used, the fiber of 1 nonwoven fabric remains in the through hole, and the result is poor. End face of 2 holes The result of sagging. The end face of the copper foil around the hole becomes thinner. Yes. 、 This paper size is applicable to the national standard (CNS) A4 specification (210 X 297 mm) in I ai nnnnn I n I < nnnnn K n It 1 1 n I cable (please read t »· on the back Please fill in this page again for attention) 7 {4 5 616 7 A7 B7 V. Description of the invention (5) (2) When using the leveling roller of the present invention 1 The leveling roller of the present invention has a cymbal sheet on the outer periphery. There are fine fibers, so there is no hole blocking. 2 The vermiculite pieces in the outer periphery of the leveling roller of the present invention are dozens of times larger than the holes, and there is no dripping on the end faces of the holes. 3 Uniform leveling can be performed. Β 4th (4A ~ 4C 囷) has a fired through-hole enamel copper substrate electric clock on the surface of the steel foil, which is embedded in the plating resin around the protective hole. Explain. Fig. 4A is a substrate obtained by electroplating a copper-pig surface with a burned through-hole glaze copper substrate. Fig. 4B is a diagram of resin embedded in the through-hole portion of the substrate of Fig. 4A. Fig. 4C Figure 4B shows the state of the substrate after ground through the resin-embedded substrate in the through-hole portion. Figure 4C (a) is a non-woven substrate processed with a conventional technique, and the leveling roller of the present invention is used. Processed substrate. The fourth figure is a plated substrate ′ after electroplating, which has micro-protrusions (miscellaneous cuts, protrusions, etc.) 16 and protrusions (not shown) around the holes. In FIG. 4A, the substrate 11, the copper foil 12, and the through-hole 14 are the same as those described above, 15 is an electroplated copper layer, and 16 is a minute convex portion. The above-mentioned micro-protrusions such as miscellaneous cuts and protrusions, and the copper protrusions generated around the hole are removed by grinding, and then described as a pattern. ^ The plating around the hole around the hole to protect the substrate of 4A 囷 before grinding is followed by it. It is necessary to embed resin in the through-hole portion, and FIG. 4B shows the substrate after the resin is embedded. In order to compare the flattening roll of the present invention with the conventional non-woven roll, an experiment was performed to remove the minute protrusions of the substrate of Fig. 4A or 4B, and the result of Fig. 4C was obtained. Figure 40 (a) shows the result of using a non-woven pro 18, and the recesses around the hole are cut through the rough cut. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) < 谙 read the first Please fill in this page for the matters needing attention) i 丨 · —Order · -------- line " ^. Recorded by the Ministry of Economic Affairs temporary Hui property. Printed by the staff consumer cooperative of the Bureau 0 A7 B7 V. Description of invention (6) 21 . Fig. 4C (b) shows that the leveling roller of the present invention is used, and no recesses are formed around the hole, and it is shown that the surface is polished flat. :, 'Figure 5 (Figures 5A to 5E) shows' Made with copper enamel with through holes
• I 板之無電解電鍍與其整平輥處理之工程之說明圖。: .第5A圖係釉銅基板，第5B圖.係具有開洞後之貫违孔 - « 之基板，第5C圖係燒化後，於未貧鍍部份進行.晝線之基 板，第5D圖（第5D圖⑷〜第5D圖（c))係晝線後進行過電鍍 之基板，第5E圖（第5E圖⑷〜第5E圖（b))係進行過電鍍層及 基板之整平後之基板。第5A.〜第5B圖之基板11、銅箔12 、燒化16與上述相同。第5C圖係為使期待之處能:電鍍， 將不須電鍍之部份晝線，19顯示畫線(畫線部份）。第5D圖 (a)圖示晝線後電鍍之基板，19為畫線，15為電鍍銅，第5D 圖（b)係第5D圖（a)之電鍍銅部份毛部份擴大圖。第5D圖（c) 係圖示.電鍍後之基板之應整乎自標，以整平至a之厚度為 目標。本發明之整平輥與習知之不織布輥相比較，進行了 整平第5D圖（c)之基板之實驗，得到第5E圖之結果。第5E 圖（a)係使用不織布輥之結果，於洞周邊產.生洞滴漏2)，. 於畫線部份之間之電鍍銅部扮產生凹部23:.，無法平坦。相 ·. . : 對於此，使用本發明之整乎輥乏第5E圖（b)圖示可於洞及 電鍍部份獲得均一厚度。. 本發明之印刷基板用整平赛维持初期之研削力，提供 平坦而一定之完成面。 . · -有關以上說明，進行以下之詳細說明。 1.—種以熱可塑性樹脂作為結合材，結合砥粒成形之、 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公笼0 Γ丨！------ - i丨丨丨！丨訂- ------線 (請先閲讀背面之注意事項再填寫本頁)• An illustration of the process of electroless plating of the I-plate and its leveling roller treatment. : Figure 5A is a glaze copper substrate, Figure 5B. It is a substrate with through holes after opening-«, Figure 5C is after firing, and is performed on the non-lean plated portion. Daytime substrate, No. Figure 5D (Figures 5D to 5D (c)) shows the substrate that has been plated after daytime, and Figure 5E (Figures 5E to 5E (b)) shows the plating layer and the substrate to be finished. After the flat substrate. 5A. To 5B, the substrate 11, the copper foil 12, and the firing 16 are the same as those described above. Figure 5C is to enable the expected place: electroplating, part of the day line will not need electroplating, 19 line drawing (line drawing part). Figure 5D (a) shows the substrate plated after daytime, 19 is the line drawing, 15 is the electroplated copper, and Figure 5D (b) is the enlarged view of the gross part of the electroplated copper part in Figure 5D (a). Figure 5D (c) is a diagram. The substrate after plating should be completely self-standard, with the goal of leveling to a thickness. Comparing the leveling roller of the present invention with the conventional non-woven fabric roller, an experiment was performed to level the substrate of Fig. 5D (c), and the result of Fig. 5E was obtained. Figure 5E (a) is the result of using a non-woven roll. Holes are produced around the hole. 2). The electroplated copper part between the line drawing parts creates a recess 23 :. It cannot be flat. Phase ..: For this, using the present invention's full roll pattern Figure 5E (b) shows that uniform thickness can be obtained in the holes and plated parts. The leveling race of the printed circuit board of the present invention maintains the initial grinding force and provides a flat and constant finish. ·-The following description will be given in detail regarding the above description. 1.—A kind of thermoplastic resin is used as the binding material, which is combined with pellets. This paper size is applicable to China National Standard (CNS) A4 specifications (210 X 297 male cage 0 Γ 丨! -------i 丨 丨丨! 丨 Order ------- line (please read the precautions on the back before filling this page)
_Γ 4 5 6 1 6"? Α7 . _. Β7______ -、發明說明（7 ) 將四角形之複數個砥石片配列於支撐構件圈之外周面 接著而成之印刷基板用聱平輥’其特徵為：各個砥石 片之一方之侧面’對於輥之外周方向傾斜地配置，鄰 接於該一方之侧面之側面’對於輥之旋轉方向傾斜地 配置’且跑石片於輥外周面呈螺旋狀或不規則地配列 〇 2. 砥石片於輥之外周面呈螺旋狀地配列之上述第1項記載 之整平輥。 3. 紙石片之間之間隔為1.6〜3.6rnm之上述第1項記載之整 平輥》 4. 磁石片之大小為1〇〜i6mm之上述第1項記載之整平輥。 5. 砥石片之一方之側面對於輥外周方向成7〜16。地配置 ，且鄰接於該當一方之侧面之侧面對於輥之旋轉方向 呈7〜12°地配置之上述第1項記載之整平輥。 6. 砥石片為分割小片化，以熱可塑性樹脂作為結合材， 結合砥粒成形之板砥石後而得之上述第1項記載之整平 報。 7. 熱可塑性樹脂作為砥石時，砥石為飄移彈性率85〜 350kg/mm2之樹脂，上述第1項記載之整平輥。 8. 熱可塑性樹脂為聚乙烯醇之上述第1項記載之整平輥。 9. 砥粒為炭化珪素之上述第1項記載之整平輥〇 1〇_支撐部材為軟質（以橡膠硬度計測定之硬度：50〜65° ) 之樹脂或橡膠之上述第1項記載之整平輥。 _ 11.支撐部材圈之下擁有支撐彈性材層之硬質支撐基材之 本纸張尺度適用中國國家標準（CNS)A4说格<210 X 297公釐） (請先閲讀背面之注意事項再填寫本頁) .J,k」」 經濟部智慧財產局員工消费合作社印製_Γ 4 5 6 1 6 "? Α7. _. Β7 ______-, Description of the invention (7) A flattening roller for printed circuit boards formed by arranging a plurality of quadrangular vermiculite pieces on the outer peripheral surface of the support member ring is characterized by: One side of each vermiculite sheet is arranged obliquely to the outer circumferential direction of the roller, and the side face adjacent to the one side is arranged obliquely to the rotation direction of the roll, and the running stone pieces are arranged spirally or irregularly on the outer circumferential surface of the roll. 2. The vermiculite sheet is arranged in a spiral shape on the outer peripheral surface of the roller, as described in the first leveling roller of the above item. 3. The leveling roller according to the above item 1 with the interval between the paper and stone pieces being 1.6 ~ 3.6rnm. 4. The leveling roller according to the above item 1 with the size of the magnet pieces being 10 ~ 6mm. 5. The side of one side of the vermiculite sheet is 7 to 16 with respect to the outer circumferential direction of the roller. The leveling roller according to the above item 1 is arranged on the ground, and the side surface adjacent to the one side surface is arranged at 7 to 12 ° with respect to the rotation direction of the roller. 6. The vermiculite sheet is divided into small pieces, the thermoplastic resin is used as a binding material, and the vermiculite formed by the vermiculite is used to obtain the leveling report described in the above item 1. 7. When a thermoplastic resin is used as vermiculite, vermiculite is a resin having a drift elastic modulus of 85 to 350 kg / mm2, and a leveling roller described in the above item 1. 8. The thermoplastic resin is a leveling roller according to the above item 1 of polyvinyl alcohol. 9. The screed roll described in item 1 above where the pellets are carbonized halogen. 100__ The supporting member is made of soft (hardness measured by a rubber hardness meter: 50 ~ 65 °) resin or rubber as described in item 1 above. Flat roll. _ 11. The paper size of the hard supporting substrate with the supporting elastic material layer under the support ring is applicable to the Chinese National Standard (CNS) A4 Standard < 210 X 297 mm) (Please read the precautions on the back first) (Fill in this page) .J, k "" Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
_ I i) n n n —9 I I .^1 n IV 10 A7 ____B7 __.五、發明說明（8 ) 上述第11項記載之整平輥》 圖式之簡單說明：. 第1圖為示本發明整平輥之一例（長輥之一部）之透視 圖0 第2囷（.第2A〜2C啤）為說明本發明之.整平輕構造之模式圖。_ 第3圖（第3 A〜3 C圖）為於基板轴有銅箔，說明開洞發 D 生燒化之工程之說明圖》 第4圖（·第4A〜4C圖）顯示於銅箔表面具有燒化、於貫 通孔釉銅基板電鍍、為保護洞声邊之電鍍埋入樹脂後，研 削工程之說明圖。 第5圖（第5A〜5E圖）圖示具有貫通孔之釉銅基板之無 電解電鍍與進行該整平輥處理工程之說明圖。 〇 '本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） £ .....κ •—丨1--丨丨-r —丨！-裝· f— <tf'先間^背面之注惠事項再填寫本頁) 訂，. Ι1^··--1 j.: " ^456167 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（9 ) 元件標號對照表 1…紙石片 2…間隙 3…支撐構件圈（支撐構件層） 4…彈性材層 5…支撐構件 6…鋼琴線 11…基板 12…銅箔 13…銅羯表面之一部小凹 14…洞 15…電鍍銅 16…燒化 17…樹脂 18…不織布輥 19…晝線 21…凹部 22…洞滴落 23···凹部 (請先閱讀背面之注意事項再填寫本頁) ^ n n u _^i n n n , ϋ n n n al ϋ I I *_ I i) nnn —9 II. ^ 1 n IV 10 A7 ____B7 __. V. Description of the invention (8) The screed roller described in the above item 11 ”Brief description of the diagram: Figure 1 shows the invention A perspective view of an example of a flat roll (a part of a long roll) 0 The second 囷 (. 2A ~ 2C beer) is a schematic diagram illustrating the flat and light structure of the present invention. _ Figure 3 (Figures 3 A to 3 C) is a copper foil on the substrate axis, which illustrates the process of generating holes D and firing. Figure 4 (· 4A to 4C) is shown on the copper foil. The surface is sintered, electroplated on the through-hole enamel copper substrate, and the resin is embedded in the plating to protect the sound side of the cavity. Fig. 5 (Figs. 5A to 5E) illustrates an electroless plating of a glaze copper substrate having through holes and an illustration of performing the leveling roll processing process. 〇 'This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) £ ..... κ • — 丨 1-- 丨 丨 -r — 丨! -Install · f— < tf 'first time ^ Note the benefits on the back and then fill out this page) Order,. Ι1 ^ ·· -1 j .: " ^ 456167 A7 B7 Printed by the Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Fifth, the description of the invention (9) Table of component numbers 1 ... Paper and stone 2 ... Gap 3 ... Support member ring (support member layer) 4 ... Elastic material layer 5 ... Support member 6 ... Piano wire 11 ... Substrate 12 ... Copper foil 13 ... A small recess on one of the copper surface 14 ... hole 15 ... electroplated copper 16 ... firing 17 ... resin 18 ... non-woven roll 19 ... day line 21 ... recess 22 ... hole dripping 23 ... recess (please read the back first) (Notes on this page, please fill out this page) ^ nnu _ ^ innn, ϋ nnn al ϋ II *
.F 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 12.F This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 12