TW506143B - Process for producing p-type gallium nitride-based compound semiconductor, process for producing gallium nitride-based compound semiconductor luminescent element, and gallium nitride-based compound semiconductor luminescent element - Google Patents
Process for producing p-type gallium nitride-based compound semiconductor, process for producing gallium nitride-based compound semiconductor luminescent element, and gallium nitride-based compound semiconductor luminescent element Download PDFInfo
- Publication number
- TW506143B TW506143B TW090116562A TW90116562A TW506143B TW 506143 B TW506143 B TW 506143B TW 090116562 A TW090116562 A TW 090116562A TW 90116562 A TW90116562 A TW 90116562A TW 506143 B TW506143 B TW 506143B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- based compound
- compound semiconductor
- gallium nitride
- type
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
- H10H20/8252—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/016—Thermal treatments
- H10H20/0165—Thermal treatments for recrystallisation
Landscapes
- Led Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000207701A JP4652530B2 (ja) | 2000-07-10 | 2000-07-10 | 窒化ガリウム系化合物半導体発光素子の作製方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW506143B true TW506143B (en) | 2002-10-11 |
Family
ID=18704419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090116562A TW506143B (en) | 2000-07-10 | 2001-07-06 | Process for producing p-type gallium nitride-based compound semiconductor, process for producing gallium nitride-based compound semiconductor luminescent element, and gallium nitride-based compound semiconductor luminescent element |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1172867A3 (enExample) |
| JP (1) | JP4652530B2 (enExample) |
| TW (1) | TW506143B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4581198B2 (ja) * | 2000-08-10 | 2010-11-17 | ソニー株式会社 | 窒化物化合物半導体層の熱処理方法及び半導体素子の製造方法 |
| AUPS240402A0 (en) | 2002-05-17 | 2002-06-13 | Macquarie Research Limited | Gallium nitride |
| KR101081158B1 (ko) | 2004-07-08 | 2011-11-07 | 엘지이노텍 주식회사 | 발광 다이오드 제조방법 |
| JP4694395B2 (ja) | 2006-03-22 | 2011-06-08 | 日本オプネクスト株式会社 | 窒化物半導体発光素子及びその製造方法 |
| JP2007311375A (ja) * | 2006-05-16 | 2007-11-29 | Showa Denko Kk | p型III−V族化合物半導体の作製方法及び発光素子の作製方法。 |
| JP2008034587A (ja) * | 2006-07-28 | 2008-02-14 | Sony Corp | 半導体レーザの製造方法、半導体素子の製造方法および素子の製造方法 |
| US7670933B1 (en) * | 2007-10-03 | 2010-03-02 | Sandia Corporation | Nanowire-templated lateral epitaxial growth of non-polar group III nitrides |
| EP2881982B1 (en) | 2013-12-05 | 2019-09-04 | IMEC vzw | Method for fabricating cmos compatible contact layers in semiconductor devices |
| JP6131908B2 (ja) * | 2014-05-08 | 2017-05-24 | 豊田合成株式会社 | Iii族窒化物半導体の製造方法、発光素子の製造方法 |
| CN113832453A (zh) * | 2021-11-03 | 2021-12-24 | 聚灿光电科技(宿迁)有限公司 | 一种mocvd放气装置及具有其的mocvd装置 |
| EP4231335B1 (en) * | 2022-02-16 | 2024-06-19 | Siltronic AG | A heteroepitaxial wafer for the deposition of gallium nitride |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07211903A (ja) * | 1993-12-02 | 1995-08-11 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH0832115A (ja) * | 1994-07-19 | 1996-02-02 | Sharp Corp | 電極構造およびその製造方法 |
| JP3620926B2 (ja) * | 1995-06-16 | 2005-02-16 | 豊田合成株式会社 | p伝導形3族窒化物半導体の電極及び電極形成方法及び素子 |
| JP4018177B2 (ja) * | 1996-09-06 | 2007-12-05 | 株式会社東芝 | 窒化ガリウム系化合物半導体発光素子 |
| JP3509514B2 (ja) * | 1997-11-13 | 2004-03-22 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の製造方法 |
| JPH11177134A (ja) * | 1997-12-15 | 1999-07-02 | Sharp Corp | 半導体素子の製造方法及び半導体素子、並びに発光素子の製造方法及び発光素子 |
| JPH11354458A (ja) * | 1998-06-11 | 1999-12-24 | Matsushita Electron Corp | p型III−V族窒化物半導体およびその製造方法 |
| JP3794876B2 (ja) * | 1998-09-09 | 2006-07-12 | 松下電器産業株式会社 | 半導体装置の製造方法 |
-
2000
- 2000-07-10 JP JP2000207701A patent/JP4652530B2/ja not_active Expired - Fee Related
-
2001
- 2001-07-04 EP EP01305791A patent/EP1172867A3/en not_active Withdrawn
- 2001-07-06 TW TW090116562A patent/TW506143B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1172867A2 (en) | 2002-01-16 |
| EP1172867A3 (en) | 2006-09-06 |
| JP2002026389A (ja) | 2002-01-25 |
| JP4652530B2 (ja) | 2011-03-16 |
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