TW503469B - Cleaning method for coater - Google Patents

Cleaning method for coater Download PDF

Info

Publication number
TW503469B
TW503469B TW090121776A TW90121776A TW503469B TW 503469 B TW503469 B TW 503469B TW 090121776 A TW090121776 A TW 090121776A TW 90121776 A TW90121776 A TW 90121776A TW 503469 B TW503469 B TW 503469B
Authority
TW
Taiwan
Prior art keywords
valve
coating
coating liquid
liquid
cleaning
Prior art date
Application number
TW090121776A
Other languages
English (en)
Chinese (zh)
Inventor
Koichi Nagasawa
Kazumasa Teramoto
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Application granted granted Critical
Publication of TW503469B publication Critical patent/TW503469B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
TW090121776A 2000-09-04 2001-09-03 Cleaning method for coater TW503469B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000266613A JP4577964B2 (ja) 2000-09-04 2000-09-04 塗布装置の洗浄方法

Publications (1)

Publication Number Publication Date
TW503469B true TW503469B (en) 2002-09-21

Family

ID=18753666

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090121776A TW503469B (en) 2000-09-04 2001-09-03 Cleaning method for coater

Country Status (3)

Country Link
JP (1) JP4577964B2 (ko)
KR (1) KR100799691B1 (ko)
TW (1) TW503469B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381887B (zh) * 2004-10-12 2013-01-11 Toppan Printing Co Ltd 具有洗淨機構之塗層裝置、塗層裝置之洗淨方法及使用於塗層裝置之洗淨機構

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4910276B2 (ja) * 2003-10-09 2012-04-04 凸版印刷株式会社 洗浄機構を有する塗工装置
JP4590877B2 (ja) * 2004-02-09 2010-12-01 凸版印刷株式会社 塗工装置
JP4910272B2 (ja) * 2004-09-08 2012-04-04 凸版印刷株式会社 洗浄機構を有する塗工装置及び洗浄方法
JP4616637B2 (ja) * 2004-12-22 2011-01-19 オリジン電気株式会社 光ディスク製造装置
KR100780718B1 (ko) 2004-12-28 2007-12-26 엘지.필립스 엘시디 주식회사 도포액 공급장치를 구비한 슬릿코터
KR100675643B1 (ko) 2004-12-31 2007-02-02 엘지.필립스 엘시디 주식회사 슬릿코터
KR100700180B1 (ko) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 예비토출부를 구비한 슬릿코터 및 이를 이용한 코팅방법
KR100700181B1 (ko) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 노즐대기부를 구비한 슬릿코터 및 이를 이용한 코팅방법
JP6420604B2 (ja) 2014-09-22 2018-11-07 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置
JP6330624B2 (ja) * 2014-11-04 2018-05-30 東京エレクトロン株式会社 処理液供給装置及び処理液供給装置の洗浄方法
JP6966265B2 (ja) * 2017-08-31 2021-11-10 株式会社Ｓｃｒｅｅｎホールディングス ポンプ装置、処理液供給装置、基板処理装置、液抜き方法および液置換方法
CN108862177A (zh) * 2018-04-19 2018-11-23 东莞塔菲尔新能源科技有限公司 一种浆料输送系统及清洗该系统的方法
CN108845112A (zh) * 2018-06-22 2018-11-20 深圳市亚泰光电技术有限公司 一种油品检测清洗装置及其使用方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06320128A (ja) * 1993-05-18 1994-11-22 Sumitomo Chem Co Ltd スピンコータライン配管の洗浄液及び洗浄方法
KR0138924B1 (ko) * 1995-08-04 1998-04-27 배순훈 접착제 도포장치의 노즐 세정장치
JPH11102854A (ja) * 1997-09-29 1999-04-13 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP3890787B2 (ja) * 1998-11-30 2007-03-07 いすゞ自動車株式会社 洗浄方法及び装置
KR100331286B1 (ko) * 1999-12-30 2002-04-06 박종섭 포토레지스트 제거 및 세정방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381887B (zh) * 2004-10-12 2013-01-11 Toppan Printing Co Ltd 具有洗淨機構之塗層裝置、塗層裝置之洗淨方法及使用於塗層裝置之洗淨機構

Also Published As

Publication number Publication date
KR20020018973A (ko) 2002-03-09
KR100799691B1 (ko) 2008-02-01
JP4577964B2 (ja) 2010-11-10
JP2002066487A (ja) 2002-03-05

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees