TW503469B - Cleaning method for coater - Google Patents

Cleaning method for coater Download PDF

Info

Publication number
TW503469B
TW503469B TW090121776A TW90121776A TW503469B TW 503469 B TW503469 B TW 503469B TW 090121776 A TW090121776 A TW 090121776A TW 90121776 A TW90121776 A TW 90121776A TW 503469 B TW503469 B TW 503469B
Authority
TW
Taiwan
Prior art keywords
valve
coating
coating liquid
liquid
cleaning
Prior art date
Application number
TW090121776A
Other languages
Chinese (zh)
Inventor
Koichi Nagasawa
Kazumasa Teramoto
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Application granted granted Critical
Publication of TW503469B publication Critical patent/TW503469B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027Cleaning the internal surfaces; Removal of blockages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)

Abstract

This invention provides a cleaning method for a coater that the coating liquid is diluted by a remaining liquid detergent is prevented when a new coating liquid is supplied after the cleaning of the coater. The inside of a pipeline, etc., are cleaned by opening, closing, or opening and closing valves, a first valve V1 to a fourth valve V4, installed in a supply pipeline 1 for supplying a coating liquid to a coating nozzle N, in an air discharge pipeline 2 for discharging air from the coating nozzle, and in a pump-air discharge pipeline 3.

Description

503469 A7 B7 五、發明説明(巧) 【發明所屬之技術領域】 本發明係關於塗敷裝置之洗淨方法。 【習知技術】 在玻璃基板或半導體晶圓表面,於塗敷光阻等之塗敷 液之塗敷裝置中,在替換塗敷液的種類,或者長時間停止 的時候,有必要將包含配管、過濾器、閥、泵、及塗敷噴 嘴,殘留於管路內部之塗敷液排出,以洗淨內部。 以往的洗淨方法係利用空氣或氮氣將殘留在配管等之 塗敷液加壓送液,或者驅動泵等而排出,接著將洗淨液送 到排管等,且藉由打開•關閉泵以洗淨配管內部等。 【發明所欲解決之課題】 以往的洗淨,係利用塗敷液溶媒或者含有塗敷液溶媒 之混合溶劑等作爲洗淨液。塗敷液溶媒或者含有塗敷液溶 媒等,雖然洗淨力強但是一般來說不易乾燥,且在供給新 的塗敷液的時候,塗敷液會被稀釋因而濃度產生變化。 另一方面,如果使用禪發性高的洗淨液的話,雖然可 容易地乾燥,但揮發性高的洗淨液有洗淨能力弱的問題。 【用以解決問題之手段】 爲解決上述課題,有關本發明之塗敷裝置之洗淨方法 係,以不易揮發,洗淨力強之低揮發性的洗淨液洗淨管路 內之後,利用洗淨力雖弱但揮發性高的洗淨液,再次將管 本紙張尺度適用中.國國家標準(CNS > A4規格(210 X 297公釐) :4二 ----- (請先閱讀背面之注意事項再填寫本頁) 訂 線 503469 A 7 _ _B7__ 五、發明説明(2 ) 路內等洗淨。 (請先閱讀背面之注意事項再填寫本頁) 藉由將高揮發性的洗淨液充塡管路內等,使殘留在內 部之低揮發性洗淨液去除,當供給新的塗敷液的時候,管 路內等完全地乾燥,且濃度不會產生變化。 上述低揮發性的洗淨液,亦即塗敷液溶媒或是含有塗 敷液溶媒之混合溶劑,以丙二醇-甲基醚乙酸酯、乙二醇 -乙基醚乙酸酯、環己銅、乙基乙氧丙酸酯、甲基戊酮、 乙基丙醇酸酯等爲例,上述高揮發性的洗淨液是以乙酸乙 酯、乙酸丙酯、甲基乙銅、異丙酯、丙銅等爲例,其在 25它時,蒸氣壓是在4x 103Pa〜35x 1 03Pa 的範圍。特別是乙酸乙酯、乙酸丙酯、甲基乙銅對於彩色 濾波器用光阻,或者是丙銅對於半導體用光阻,不會產生 異物,且溶解性良好有效。 【發明之實施形態】 以下說明本發明之實施形態。第1圖至第3圖係塗敷 裝置的槪略圖,各圖係顯示第1至第3的洗淨工程。 首先,塗敷裝置係具備有:塗敷噴嘴Ν,及供給塗敷 液至該塗敷噴嘴Ν之供給配管1,及從塗敷噴嘴Ν之噴嘴 內去除空氣用配管2,在塗敷液的供給配管,中設有過濾 器F1 ,第1閥VI及泵Ρ,第2閥V2及過濾器F2, 在噴嘴內去除空氣配管2中,設有第3閥V3,更且在此 實施例中,從泵Ρ導出泵內去除空氣用配管3,在此泵內 去除空氣用配管3設有第4閥V 4。 本紙張尺度適用中國國家標準(CNS > Α4規格(210 Χ 297公釐) 503469 A7 ____ B7 ____ 五、發明説明(3 ) I——“II‘·-I — f (請先閲讀背面之注意事項再填寫本頁} 在洗淨上述之塗敷裝置中,首先,將第1閥V 1至第 4閥V 4全部打開,將各配管,過濾器,閥及泵的內部所 殘留的塗敷液排出。該塗敷液之排出,係藉由空氣或氮氣 加壓送液排出或者驅動泵。 接著,使用低揮發性的洗淨液進行洗淨。此洗淨在本 實施例中分爲3工程進行。在各工程中閥V 1〜V 4的狀 態如以下(表1 )所示。 閥0 閥Θ 閥@ 閥Θ 第 將從瓶開始過濾器 F 1 ―閥 1 V1—泵P —閥V4 —排出爲止之 開閉 閉 閉 開 工 管路洗淨。 動作 程 第 將從瓶開始過濾器 F 1 ―閥 2 V1—泵P —閥V2 —過濾器F2 — 開 開閉 閉 閉 工 噴嘴N爲止的管路洗淨。 動作 程 (此時,將洗淨由噴嘴排出) 第 將從瓶開始過濾器 F 1 ―閥 3 V1—泵P —閥V2 —過濾器F2 — 開 開 開閉 閉 工 噴嘴N —閥V3 —排出爲止的管 動作 程 路洗淨。 線 如表1所示,在第1工程中,將第2閥V 2與第3閥 本紙張尺度通用中國國家標準(CNS〉A4規格(210X297公釐] ~ 503469 A7 B7 _ 五、發明説明(4 ) V 3關閉,第4閥V 4打開,在此狀態’利用空氣或氮氣 加壓送液,並且在第1閥V 1執行開閉動作。在此情況使 用空氣或氮氣加壓送液,也可藉由泵P送液。 在第1工程中,如第1圖所示般’塗敷液的供給配管 1之中到泵P爲止的部份與泵內去除空氣用配管3,更且 設於這些配管之過濾器F1、第1閥VI、泵P及第4閥 V 4被洗淨。再者,藉由第1閥V 1進行開閉動作’而產 生脈動,以進行有效地洗淨。 接著,進行第2工程。在第2工程中,將第1閥VI 打開,第3閥V 3與第4閥V 4關閉,在此狀態’驅動栗 P,並且在第2閥V2執行開閉動作。 在第2工程中,如第2圖所示般,塗敷液的供給配管 1 ,噴嘴N,更且過濾器F1、第1閥VI、泵P、第2 閥V 2及過濾器F 2被洗淨。 接著,進行第3工程。在此第3工程中,將第1閥 V 1及第2閥V 2打開,關閉第4閥V 4,在此狀態,驅 動泵P,並且在第3閥V3執行開閉動作。 在第3工程中,如第3圖所示般,塗敷液之供給配管 1、噴嘴內去除空氣用配管2、噴嘴N、更且過濾器 F1、第1閥VI、泵P、第2閥V2、過濾器F2及第 3閥V 3被洗淨。 在完成利用以上之低揮發性洗淨液之第1至第3工程 而成的前洗淨之後,進行利用高揮發性的洗淨液的後洗 淨。此後洗淨也是同樣地按照上述低揮發性之洗淨液的情 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇 Χ297公釐) ——I II ί — ? (請先閲讀背面之注意事項再填寫本頁) 訂 線 503469 A7 ___B7___ 五、發明説明(5 ) 況,進行表1所示之第1至第3工程。 但是,洗淨之第1至第3工程不拘泥於此順序,因應 須要而有改變之可能。又,並不只是在第1至第3工程的 前洗淨全部結束之後,才進行後洗淨,也可以是第1洗淨 之前洗淨結束後立刻進行後洗淨般地,在各個工程進行前 洗淨與後洗淨。 【發明之效果】 根據以上所述之有關本發明之塗敷裝置之洗淨方法, 以不易揮發,但洗淨力強的低揮發性洗淨液洗淨管路內 等,接著以洗淨力弱,但揮發性高的洗淨液再次洗淨管路 內等而成。洗淨後,塗敷裝置在短時間內乾燥,且在供給 新的塗敷液的時候,濃度不會產生變化。 【圖面之簡單說明】 第1圖係顯示洗淨之第1工程的圖示。 第2圖係顯示洗淨之第2工程的圖示。 第3圖係顯示洗淨之第3工程的圖示。 【圖號.說明】 1 :供給配管 2:噴嘴內去除空氣配管 3:泵內去除空氣配管 P :泵 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 線 503469 A7 B7 五、發明説明(6 N :噴嘴 F 1、F 2 :過濾器 V 1 :第1閥 V 2 :第2閥 V 3 :第3閥 V 4 :第4閥 (請先閲讀背面之注意事項再填寫本頁) i r 本紙張尺度適用中國國家標準(CNS ) A4規格(210Χ297公釐) -9 -503469 A7 B7 V. Description of the Invention (Technical Field) [TECHNICAL FIELD OF THE INVENTION] The present invention relates to a cleaning method for a coating device. [Know-how] In the coating device that applies a coating solution such as a photoresist on the surface of a glass substrate or a semiconductor wafer, it is necessary to include piping when replacing the type of coating solution or stopping it for a long time. , Filter, valve, pump, and coating nozzle, the coating liquid remaining in the pipeline is discharged to clean the inside. Conventional cleaning methods use air or nitrogen to pressurize the coating liquid remaining in the piping, etc., or drive the pump to discharge it, and then send the cleaning liquid to the discharge pipe. Wash the inside of the piping. [Problems to be Solved by the Invention] Conventional cleaning uses a coating liquid solvent or a mixed solvent containing a coating liquid solvent as a cleaning liquid. Although the coating liquid solvent or the coating liquid solvent has a strong cleaning power, it is generally not easy to dry, and when a new coating liquid is supplied, the coating liquid is diluted and the concentration changes. On the other hand, if a cleaning solution with a high sensation is used, it can be easily dried, but a cleaning solution with a high volatility has a problem of weak cleaning ability. [Means to solve the problem] In order to solve the above-mentioned problem, the cleaning method of the coating device of the present invention is to clean the inside of the pipeline with a low-volatile cleaning liquid that is not easily volatile and has a strong cleaning power, and then use Although the cleaning power is weak, but the highly volatile cleaning liquid, the paper size will be applied again. National National Standard (CNS > A4 size (210 X 297 mm)): 4 2 ----- (please first Read the precautions on the back and fill in this page.) 503469 A 7 _ _B7__ V. Description of the invention (2) Clean inside the road. (Please read the precautions on the back before filling out this page.) The cleaning solution is filled in the pipeline, etc., so that the low-volatile cleaning solution remaining in the interior is removed, and when a new coating liquid is supplied, the pipeline and the like are completely dried without changing the concentration. Volatile cleaning solution, that is, coating liquid solvent or mixed solvent containing coating liquid solvent, such as propylene glycol-methyl ether acetate, ethylene glycol-ethyl ether acetate, cyclohexyl copper, ethyl acetate Ethyl ethoxypropionate, methylpentanone, ethyl propionate, etc. The liquid is exemplified by ethyl acetate, propyl acetate, methyl ethyl copper, isopropyl ester, propyl copper, etc. At 25, the vapor pressure is in the range of 4x103Pa ~ 35x103Pa. Especially ethyl acetate , Propyl acetate, methyl ethyl copper for photoresistors for color filters, or propylene copper for semiconductor photoresists, does not generate foreign matter, and has good solubility. [Embodiments of the invention] The following describes the embodiments of the present invention. Figures 1 to 3 are schematic diagrams of the coating device, and each figure shows the cleaning process from 1 to 3. First, the coating device is provided with a coating nozzle N and a coating liquid to The supply pipe 1 of the coating nozzle N and the pipe 2 for removing air from the nozzle of the coating nozzle N are provided with a filter F1, a first valve VI and a pump P, and a second pipe. The valve V2 and the filter F2 are provided with a third valve V3 in the air removal pipe 2 in the nozzle, and in this embodiment, the air removal pipe 3 is led out from the pump P, and the air removal pipe is used in the pump. The piping 3 is provided with a fourth valve V 4. This paper size is in accordance with Chinese national standards (CNS > Α4 regulations) Grid (210 X 297 mm) 503469 A7 ____ B7 ____ V. Description of the invention (3) I —— “II '· -I — f (Please read the precautions on the back before filling this page} After washing the above coating In the application device, first, all of the first valve V1 to the fourth valve V4 are opened, and the coating liquid remaining in each pipe, filter, valve, and pump is discharged. The discharge of the coating liquid is borrowed Air or nitrogen is used to pressurize the liquid to discharge or drive the pump. Next, use a low-volatile cleaning solution for cleaning. This cleaning is divided into three processes in this embodiment. In each process, the valves V 1 to V The state of 4 is shown below (Table 1). Valve 0 Valve Θ Valve @ Valve Θ The filter will start from the bottle F 1 ― Valve 1 V1—Pump P — Valve V4 — Open and close until the discharge is completed The pipeline is cleaned. The filter will start from the bottle F 1 ― Valve 2 V1 — Pump P — Valve V2 — Filter F2 — Open, Close, Close, and Clean the pipeline up to nozzle N. The operation process (at this time, the cleaning is discharged from the nozzle) The filter F 1 will be started from the bottle. F 1 ― Valve 3 V1 — Pump P — Valve V2 — Filter F2 — Opening, Closing, Closing Nozzle N — Valve V3 — Until the discharge Wash the tube path. The line is shown in Table 1. In the first project, the paper size of the second valve V 2 and the third valve are common Chinese national standards (CNS> A4 specification (210X297 mm) ~ 503469 A7 B7 _ V. Description of the invention ( 4) V 3 is closed, and the fourth valve V 4 is opened. In this state, the liquid is pressurized with air or nitrogen, and the opening and closing operation is performed at the first valve V 1. In this case, the liquid is pressurized with air or nitrogen. The liquid can be pumped by the pump P. In the first process, as shown in FIG. 1, the portion of the coating liquid supply pipe 1 to the pump P and the air removal pipe 3 in the pump are provided. The filter F1, the first valve VI, the pump P, and the fourth valve V4 in these piping are washed. Further, the first valve V1 is opened and closed to generate a pulsation for effective washing. Next, the second process is performed. In the second process, the first valve VI is opened, the third valve V 3 and the fourth valve V 4 are closed, and in this state, the pump P is driven, and the opening and closing operation is performed on the second valve V2. In the second process, as shown in FIG. 2, the coating liquid supply pipe 1, the nozzle N, and the filter F1, the first valve VI, the pump P, the second valve V 2, and the filter F 2 Wash. Next, the third process is performed. In this third process, the first valve V 1 and the second valve V 2 are opened, and the fourth valve V 4 is closed. In this state, the pump P is driven, and in the third stage The valve V3 is opened and closed. In the third process, as shown in FIG. 3, the coating liquid supply pipe 1, the nozzle inside air removal pipe 2, the nozzle N, and the filter F1, the first valve VI, The pump P, the second valve V2, the filter F2, and the third valve V 3 are washed. After the pre-washing of the first to third processes using the above-mentioned low-volatile washing liquid is completed, the utilization high is performed. Post-cleaning of volatile cleaning solution. After that, the same applies to the above-mentioned low-volatile cleaning solution. The paper size applies the Chinese National Standard (CNS) A4 specification (21 × 297 mm) ——I II ί —? (Please read the notes on the back before filling this page) 503469 A7 ___B7___ 5. Description of the invention (5), the first to third projects shown in Table 1 are performed. However, the first The first to third projects are not limited to this order, and may be changed according to needs. Also, it is not just the front washing of the first to third projects. After all cleaning is completed, post-washing may be performed, and after the first washing before the washing is completed, the post-washing may be performed, and the pre-washing and the post-washing may be performed in each process. [Effects of the Invention] According to the above The cleaning method of the coating device according to the present invention is to clean the pipeline with a low-volatile cleaning liquid that is not easily volatile but has a strong cleaning power, and then uses a weak cleaning power but a high volatility. The washing liquid is cleaned in the pipeline again, etc. After washing, the coating device dries in a short time, and the concentration does not change when a new coating liquid is supplied. [Brief description of the drawing] Figure 1 is a diagram showing the first process of washing. Figure 2 is a diagram showing the second process of washing. Figure 3 is a diagram showing the third process of washing. [Figure No. Description] 1: Supply piping 2: Remove air piping in the nozzle 3: Remove air piping in the pump P: Pump This paper size applies to China National Standard (CNS) A4 size (210X 297 mm) (Please read the back first Please pay attention to this page and fill in this page again) Order line 503469 A7 B7 V. Description of the invention (6 N: Nozzle F 1, F 2: Filter V 1: First valve V 2: Second valve V 3: Third valve V 4 : No. 4 valve (please read the precautions on the back before filling this page) ir This paper size is applicable to China National Standard (CNS) A4 specification (210 × 297 mm) -9-

Claims (1)

503469 A8 B8 C8 D8 、申請專利範圍 1·一種塗敷裝置之洗淨方法’其特徵爲:具備塗敷 噴嘴,及到此噴嘴的塗敷液供給配管,及自塗敷噴嘴之塗 敷液導回配管,在塗敷液供給配管中設有過濾器,閥及 泵,在塗敷液導回配管,設有閥之塗敷裝置之洗淨方法 中,將包含配管、過濾器、閥、泵及塗敷噴嘴之管路內的 塗敷液排出之後,以低揮發性的洗淨液洗淨上述之管路 內,之後,以高揮發性的洗淨液洗淨上述管路內。 2 · —種塗敷裝置之洗淨方法,其特徵爲:在申請專 利範圍第1項所述之塗敷裝置之洗淨方法中’上述低揮發 性的洗淨液係爲塗敷液溶媒或者含有塗敷液溶媒之混合溶 劑,上述高揮發性的洗淨液係爲蒸氣壓是4x 1 〇3P a〜 3 5 X 1 〇 3 P a (25 t:)之高揮發性有機溶劑。 10- (請先閲讀背面之注意事項再填寫本頁) 本紙張又度適用中國國家揉準(CNS)A4规格(210x297公釐)503469 A8 B8 C8 D8, patent application scope 1 · A cleaning method of a coating device 'characterized by having a coating nozzle, a coating liquid supply pipe to the nozzle, and a coating liquid guide from the coating nozzle The return pipe includes a filter, a valve, and a pump in the coating liquid supply pipe, and the cleaning method of the coating device with a coating liquid guide return pipe and a valve includes a pipe, a filter, a valve, and a pump. After the coating liquid in the pipe of the coating nozzle is discharged, the above-mentioned pipe is washed with a low-volatile washing liquid, and then the above-mentioned pipe is washed with a highly-volatile washing liquid. 2-A cleaning method of a coating device, characterized in that: in the cleaning method of the coating device described in item 1 of the scope of the patent application, the above-mentioned low-volatile cleaning liquid is a coating liquid solvent or A mixed solvent containing a coating liquid solvent. The above-mentioned highly volatile cleaning liquid is a highly volatile organic solvent having a vapor pressure of 4 x 1 0 3P a to 3 5 X 1 0 3 P a (25 t :). 10- (Please read the notes on the back before filling out this page) This paper is again suitable for China National Standard (CNS) A4 (210x297 mm)
TW090121776A 2000-09-04 2001-09-03 Cleaning method for coater TW503469B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000266613A JP4577964B2 (en) 2000-09-04 2000-09-04 Coating device cleaning method

Publications (1)

Publication Number Publication Date
TW503469B true TW503469B (en) 2002-09-21

Family

ID=18753666

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090121776A TW503469B (en) 2000-09-04 2001-09-03 Cleaning method for coater

Country Status (3)

Country Link
JP (1) JP4577964B2 (en)
KR (1) KR100799691B1 (en)
TW (1) TW503469B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381887B (en) * 2004-10-12 2013-01-11 Toppan Printing Co Ltd Coating machine having a cleaning mechanism, method of cleaning a coating machine, and cleaning mechanism for use in a coating machine

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4910276B2 (en) * 2003-10-09 2012-04-04 凸版印刷株式会社 Coating device having cleaning mechanism
JP4590877B2 (en) * 2004-02-09 2010-12-01 凸版印刷株式会社 Coating equipment
JP4910272B2 (en) * 2004-09-08 2012-04-04 凸版印刷株式会社 Coating apparatus having cleaning mechanism and cleaning method
JP4616637B2 (en) * 2004-12-22 2011-01-19 オリジン電気株式会社 Optical disc manufacturing equipment
KR100780718B1 (en) 2004-12-28 2007-12-26 엘지.필립스 엘시디 주식회사 Slit coater having apparatus of supplying coating fluid
KR100675643B1 (en) 2004-12-31 2007-02-02 엘지.필립스 엘시디 주식회사 Slit coater
KR100700180B1 (en) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 Slit coater having pre-spreading unit and method of coating using thereof
KR100700181B1 (en) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 Slit coater having standby unit of nozzle and method of coating using thereof
JP6420604B2 (en) 2014-09-22 2018-11-07 株式会社Screenホールディングス Coating device
JP6330624B2 (en) * 2014-11-04 2018-05-30 東京エレクトロン株式会社 Processing liquid supply device and cleaning method of processing liquid supply device
JP6966265B2 (en) * 2017-08-31 2021-11-10 株式会社Screenホールディングス Pump equipment, processing liquid supply equipment, substrate processing equipment, liquid draining method and liquid replacement method
CN108862177A (en) * 2018-04-19 2018-11-23 东莞塔菲尔新能源科技有限公司 A kind of slurry delivery system and the method for cleaning the system
CN108845112A (en) * 2018-06-22 2018-11-20 深圳市亚泰光电技术有限公司 A kind of oil product detection cleaning device and its application method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06320128A (en) * 1993-05-18 1994-11-22 Sumitomo Chem Co Ltd Washing solution and method for spin coater line piping
KR0138924B1 (en) * 1995-08-04 1998-04-27 배순훈 Cleaner for nozzle
JPH11102854A (en) * 1997-09-29 1999-04-13 Dainippon Screen Mfg Co Ltd Wafer cleaning device
JP3890787B2 (en) * 1998-11-30 2007-03-07 いすゞ自動車株式会社 Cleaning method and apparatus
KR100331286B1 (en) * 1999-12-30 2002-04-06 박종섭 Method for removing photo-resistor and cleaning

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381887B (en) * 2004-10-12 2013-01-11 Toppan Printing Co Ltd Coating machine having a cleaning mechanism, method of cleaning a coating machine, and cleaning mechanism for use in a coating machine

Also Published As

Publication number Publication date
KR20020018973A (en) 2002-03-09
JP4577964B2 (en) 2010-11-10
JP2002066487A (en) 2002-03-05
KR100799691B1 (en) 2008-02-01

Similar Documents

Publication Publication Date Title
TW503469B (en) Cleaning method for coater
KR100187445B1 (en) Method and apparatus of rinsing wafer
US6217665B1 (en) Method of cleaning substrate using ultraviolet radiation
KR20020000201A (en) Method cleaning Liquid Chrystal Display using Laser and Vapor Phase
WO1996004999A3 (en) Wafer rinsing system and filter bank
TW200700812A (en) Coating apparatus and operating method thereof
CN105242494A (en) Photoresist coating device and lithography equipment
JP3631775B2 (en) Automatic cleaning method and system
US20010017142A1 (en) Method of washing substrate with UV radiation and ultrasonic cleaning
TWI242240B (en) Supply system for clean liquid
TW438632B (en) Chemical spray system for semiconductor device fabrication facility and waste liquid tank used in the same
CN101728228B (en) Method for removing gummy residuals positioned on front surface of wafer
JP2992206B2 (en) Substrate processing equipment
CN114420598A (en) Wafer cleaning system with improved airflow and working method thereof
JP3631180B2 (en) Photoresist coating method, head cleaning mechanism, and coating apparatus
KR100328268B1 (en) Cleaner of chemical supply line
CN111045299A (en) Developing and edge-washing equipment and developing and edge-washing method
CN214767336U (en) Clinical atomizing of gynaecology's nursing cleaning and disinfection device
JPH0116309B2 (en)
CN221060878U (en) Cleaning, disinfecting and drying integrated equipment
CN211571024U (en) Device is applyed to forming machine auxiliary agent
KR20060000009A (en) Cleaning equipment
JPH0338908B2 (en)
KR100469130B1 (en) Vacuum cleaning device for semiconductor device transfer
KR19980027415A (en) Cleaning method using developer

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees