TW503408B - Method for fabricating surface mountable chip inductor - Google Patents
Method for fabricating surface mountable chip inductor Download PDFInfo
- Publication number
- TW503408B TW503408B TW090117998A TW90117998A TW503408B TW 503408 B TW503408 B TW 503408B TW 090117998 A TW090117998 A TW 090117998A TW 90117998 A TW90117998 A TW 90117998A TW 503408 B TW503408 B TW 503408B
- Authority
- TW
- Taiwan
- Prior art keywords
- cylindrical body
- square
- forming
- item
- conductive paste
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 57
- 239000011230 binding agent Substances 0.000 claims abstract description 16
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 12
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 9
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 238000011049 filling Methods 0.000 claims description 12
- 238000004804 winding Methods 0.000 claims description 12
- 239000011247 coating layer Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 claims 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims 1
- 241000282320 Panthera leo Species 0.000 claims 1
- 229910052770 Uranium Inorganic materials 0.000 claims 1
- 239000002775 capsule Substances 0.000 claims 1
- 230000002079 cooperative effect Effects 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 238000010297 mechanical methods and process Methods 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 238000009941 weaving Methods 0.000 claims 1
- 230000001131 transforming effect Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- KOMIMHZRQFFCOR-UHFFFAOYSA-N [Ni].[Cu].[Zn] Chemical group [Ni].[Cu].[Zn] KOMIMHZRQFFCOR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000005252 bulbus oculi Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical group [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical group [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0044252A KR100376221B1 (ko) | 2000-07-31 | 2000-07-31 | 표면 실장형 칩 인덕터 제조방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW503408B true TW503408B (en) | 2002-09-21 |
Family
ID=19680958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090117998A TW503408B (en) | 2000-07-31 | 2001-07-24 | Method for fabricating surface mountable chip inductor |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100376221B1 (ko) |
| TW (1) | TW503408B (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7667565B2 (en) | 2004-09-08 | 2010-02-23 | Cyntec Co., Ltd. | Current measurement using inductor coil with compact configuration and low TCR alloys |
| US7915993B2 (en) | 2004-09-08 | 2011-03-29 | Cyntec Co., Ltd. | Inductor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113643890B (zh) * | 2021-08-03 | 2024-04-26 | 常州市英中电气有限公司 | 一种立式闭合铁轭及其生产工艺 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR900005501A (ko) * | 1988-09-30 | 1990-04-14 | 서주인 | 매립형 인닥터의 제조방법 |
| JPH06120062A (ja) * | 1992-10-06 | 1994-04-28 | Taiyo Yuden Co Ltd | 円柱セラミックインダクタの製造方法 |
| JPH09115756A (ja) * | 1995-10-19 | 1997-05-02 | Matsushita Electric Ind Co Ltd | コイル部品とその製造方法 |
| JPH11121234A (ja) * | 1997-10-14 | 1999-04-30 | Murata Mfg Co Ltd | インダクタの製造方法及びインダクタ |
| JPH11176685A (ja) * | 1997-12-12 | 1999-07-02 | Toko Inc | インダクタンス素子の製造方法 |
| JP2000036429A (ja) * | 1998-07-21 | 2000-02-02 | Murata Mfg Co Ltd | チップインダクタ |
| KR100303952B1 (ko) * | 1999-04-16 | 2001-09-26 | 조현복 | 박막형 인덕터 및 그 제조방법 |
-
2000
- 2000-07-31 KR KR10-2000-0044252A patent/KR100376221B1/ko not_active IP Right Cessation
-
2001
- 2001-07-24 TW TW090117998A patent/TW503408B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7667565B2 (en) | 2004-09-08 | 2010-02-23 | Cyntec Co., Ltd. | Current measurement using inductor coil with compact configuration and low TCR alloys |
| US7915993B2 (en) | 2004-09-08 | 2011-03-29 | Cyntec Co., Ltd. | Inductor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100376221B1 (ko) | 2003-03-15 |
| KR20020010782A (ko) | 2002-02-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |