TW499698B - Bell jar having integral gas distribution channeling - Google Patents

Bell jar having integral gas distribution channeling Download PDF

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Publication number
TW499698B
TW499698B TW089127172A TW89127172A TW499698B TW 499698 B TW499698 B TW 499698B TW 089127172 A TW089127172 A TW 089127172A TW 89127172 A TW89127172 A TW 89127172A TW 499698 B TW499698 B TW 499698B
Authority
TW
Taiwan
Prior art keywords
heat treatment
gas distribution
distribution plate
gas
patent application
Prior art date
Application number
TW089127172A
Other languages
English (en)
Chinese (zh)
Inventor
John Michael Mitzan
Original Assignee
Axcelis Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Tech Inc filed Critical Axcelis Tech Inc
Application granted granted Critical
Publication of TW499698B publication Critical patent/TW499698B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Carbon And Carbon Compounds (AREA)
TW089127172A 1999-12-21 2000-12-19 Bell jar having integral gas distribution channeling TW499698B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/468,238 US6302963B1 (en) 1999-12-21 1999-12-21 Bell jar having integral gas distribution channeling

Publications (1)

Publication Number Publication Date
TW499698B true TW499698B (en) 2002-08-21

Family

ID=23858991

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089127172A TW499698B (en) 1999-12-21 2000-12-19 Bell jar having integral gas distribution channeling

Country Status (5)

Country Link
US (1) US6302963B1 (https=)
EP (1) EP1111660A3 (https=)
JP (1) JP4665204B2 (https=)
KR (1) KR100559198B1 (https=)
TW (1) TW499698B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472482B2 (ja) * 1998-06-30 2003-12-02 富士通株式会社 半導体装置の製造方法と製造装置
KR100360401B1 (ko) * 2000-03-17 2002-11-13 삼성전자 주식회사 슬릿형 공정가스 인입부와 다공구조의 폐가스 배출부를포함하는 공정튜브 및 반도체 소자 제조장치
US6576981B1 (en) * 2001-07-03 2003-06-10 Lsi Logic Corporation Reduced particulate etching
FR3057390B1 (fr) * 2016-10-11 2018-12-07 Soitec Four vertical avec dispositif de piegeage de contaminants
US11266005B2 (en) * 2019-02-07 2022-03-01 Fermi Research Alliance, Llc Methods for treating superconducting cavities

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226820A (ja) * 1985-07-26 1987-02-04 Ibiden Co Ltd 炭化珪素質プラズマ分散板
US5062386A (en) 1987-07-27 1991-11-05 Epitaxy Systems, Inc. Induction heated pancake epitaxial reactor
JPH0642474B2 (ja) 1988-03-31 1994-06-01 株式会社東芝 半導体製造装置
JPH07120634B2 (ja) * 1988-12-27 1995-12-20 東京エレクトロン東北株式会社 処理装置
US5160545A (en) 1989-02-03 1992-11-03 Applied Materials, Inc. Method and apparatus for epitaxial deposition
JP2729238B2 (ja) * 1989-12-22 1998-03-18 東京エレクトロン株式会社 縦型処理装置
JP2992576B2 (ja) * 1990-03-31 1999-12-20 東京エレクトロン株式会社 縦型熱処理装置
JPH0468522A (ja) * 1990-07-10 1992-03-04 Tokyo Electron Sagami Ltd 縦型熱処理装置
JP3077195B2 (ja) * 1990-11-27 2000-08-14 日本電気株式会社 半導体熱処理用縦型プロセスチューブの構造
JPH04196522A (ja) * 1990-11-28 1992-07-16 Nec Corp 縦型拡散炉
US5318633A (en) * 1991-03-07 1994-06-07 Tokyo Electron Sagami Limited Heat treating apparatus
JPH04280420A (ja) * 1991-03-07 1992-10-06 Toshiba Corp 熱処理装置
JPH05251372A (ja) * 1992-03-06 1993-09-28 Matsushita Electron Corp 縦型拡散炉
JPH0620980A (ja) * 1992-07-01 1994-01-28 Nec Corp 縦型熱処理炉
JP2805589B2 (ja) * 1994-01-27 1998-09-30 黄 哲周 低圧化学蒸着装置
JPH08107082A (ja) * 1994-10-04 1996-04-23 Sony Corp 縦型熱処理装置
US5928427A (en) * 1994-12-16 1999-07-27 Hwang; Chul-Ju Apparatus for low pressure chemical vapor deposition
US5653806A (en) 1995-03-10 1997-08-05 Advanced Technology Materials, Inc. Showerhead-type discharge assembly for delivery of source reagent vapor to a substrate, and CVD process utilizing same
JPH09249455A (ja) * 1996-03-14 1997-09-22 Toyo Tanso Kk 炭化珪素成形体の製造方法
US6159297A (en) * 1996-04-25 2000-12-12 Applied Materials, Inc. Semiconductor process chamber and processing method
KR100227850B1 (ko) * 1996-05-06 1999-11-01 윤종용 산화막 성장 공정 및 lp cvd 공정 겸용 수직형 확산로
US5976261A (en) 1996-07-11 1999-11-02 Cvc Products, Inc. Multi-zone gas injection apparatus and method for microelectronics manufacturing equipment
US5653808A (en) * 1996-08-07 1997-08-05 Macleish; Joseph H. Gas injection system for CVD reactors

Also Published As

Publication number Publication date
JP2001237239A (ja) 2001-08-31
US6302963B1 (en) 2001-10-16
KR100559198B1 (ko) 2006-03-10
EP1111660A2 (en) 2001-06-27
EP1111660A3 (en) 2003-12-10
US20010037767A1 (en) 2001-11-08
JP4665204B2 (ja) 2011-04-06
KR20010062458A (ko) 2001-07-07

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