TW465011B - Transfer device for subjects to be processed and semiconductor manufacturing apparatus with the device - Google Patents
Transfer device for subjects to be processed and semiconductor manufacturing apparatus with the device Download PDFInfo
- Publication number
- TW465011B TW465011B TW089114956A TW89114956A TW465011B TW 465011 B TW465011 B TW 465011B TW 089114956 A TW089114956 A TW 089114956A TW 89114956 A TW89114956 A TW 89114956A TW 465011 B TW465011 B TW 465011B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- linear motor
- aforementioned
- processed
- device body
- Prior art date
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 116
- 238000004519 manufacturing process Methods 0.000 title description 6
- 239000004065 semiconductor Substances 0.000 title description 5
- 238000012545 processing Methods 0.000 claims description 27
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 230000003213 activating effect Effects 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims 2
- 238000011084 recovery Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 168
- 239000000428 dust Substances 0.000 abstract description 22
- 239000013078 crystal Substances 0.000 description 12
- 230000002079 cooperative effect Effects 0.000 description 5
- 230000001172 regenerating effect Effects 0.000 description 5
- 230000002950 deficient Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000002054 transplantation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Non-Mechanical Conveyors (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21001799A JP4248695B2 (ja) | 1999-07-26 | 1999-07-26 | ウェハ移載装置の緊急停止装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW465011B true TW465011B (en) | 2001-11-21 |
Family
ID=16582455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089114956A TW465011B (en) | 1999-07-26 | 2000-07-26 | Transfer device for subjects to be processed and semiconductor manufacturing apparatus with the device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7393172B1 (enExample) |
| JP (1) | JP4248695B2 (enExample) |
| TW (1) | TW465011B (enExample) |
| WO (1) | WO2001008211A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4021125B2 (ja) | 2000-06-02 | 2007-12-12 | 東京エレクトロン株式会社 | ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置 |
| JP4298136B2 (ja) | 2000-06-02 | 2009-07-15 | 東京エレクトロン株式会社 | ウェハ移載ロボット着脱用台車 |
| US7066707B1 (en) * | 2001-08-31 | 2006-06-27 | Asyst Technologies, Inc. | Wafer engine |
| DE102006029003A1 (de) * | 2006-06-24 | 2008-01-03 | Vistec Semiconductor Systems Gmbh | Waferhandhabungsvorrichtung |
| JP5194776B2 (ja) * | 2007-12-21 | 2013-05-08 | 株式会社リコー | 情報表示システム、情報表示方法およびプログラム |
| JP2015076590A (ja) * | 2013-10-11 | 2015-04-20 | 株式会社ディスコ | ウェーハ搬送ロボット着脱治具 |
| US10853524B2 (en) * | 2018-01-23 | 2020-12-01 | Wipro Limited | System and method for providing security for robots |
| CN112840447B (zh) * | 2018-10-04 | 2025-11-21 | 应用材料公司 | 运输系统 |
| CN111099049B (zh) * | 2019-12-11 | 2021-06-15 | 范建华 | 一种使用方便的高效水泥灌装设备 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61293740A (ja) * | 1985-06-21 | 1986-12-24 | Hiroshi Teramachi | テ−ブル移送装置 |
| US4904153A (en) * | 1986-11-20 | 1990-02-27 | Shimizu Construction Co., Ltd. | Transporting robot for semiconductor wafers |
| JP2560371B2 (ja) * | 1988-01-05 | 1996-12-04 | 株式会社ニコン | 基板処理システム |
| US5040431A (en) * | 1988-01-22 | 1991-08-20 | Canon Kabushiki Kaisha | Movement guiding mechanism |
| US5170714A (en) * | 1988-06-13 | 1992-12-15 | Asahi Glass Company, Ltd. | Vacuum processing apparatus and transportation system thereof |
| DE19544328B4 (de) * | 1994-11-29 | 2014-03-20 | Ebara Corp. | Poliervorrichtung |
| JPH08162797A (ja) * | 1994-12-08 | 1996-06-21 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
| JPH0923679A (ja) * | 1995-07-05 | 1997-01-21 | Fanuc Ltd | リニアモータを用いたロボット駆動機構 |
| JP3069945B2 (ja) * | 1995-07-28 | 2000-07-24 | 東京エレクトロン株式会社 | 処理装置 |
| US5733096A (en) * | 1995-09-13 | 1998-03-31 | Silicon Valley Group, Inc. | Multi-stage telescoping structure |
| US5773951A (en) * | 1996-03-25 | 1998-06-30 | Digital Test Corporation | Wafer prober having sub-micron alignment accuracy |
| US6203582B1 (en) * | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| JPH1089357A (ja) * | 1996-09-10 | 1998-04-07 | Nippon Thompson Co Ltd | 直動案内装置用の制動装置 |
| JP3360001B2 (ja) * | 1996-10-30 | 2002-12-24 | 芝浦メカトロニクス株式会社 | 処理装置 |
| US5833426A (en) | 1996-12-11 | 1998-11-10 | Applied Materials, Inc. | Magnetically coupled wafer extraction platform |
| US5933902A (en) * | 1997-11-18 | 1999-08-10 | Frey; Bernhard M. | Wafer cleaning system |
| US6257827B1 (en) * | 1997-12-01 | 2001-07-10 | Brooks Automation Inc. | Apparatus and method for transporting substrates |
| WO1999046084A1 (en) * | 1998-03-09 | 1999-09-16 | Ebara Corporation | Polishing apparatus |
| JP3869938B2 (ja) * | 1998-06-05 | 2007-01-17 | キヤノン株式会社 | ステージ装置、露光装置、およびデバイス製造方法 |
| US6379096B1 (en) * | 1999-02-22 | 2002-04-30 | Scp Global Technologies, Inc. | Buffer storage system |
| US6252705B1 (en) * | 1999-05-25 | 2001-06-26 | Schlumberger Technologies, Inc. | Stage for charged particle microscopy system |
| WO2001010756A1 (en) * | 1999-08-11 | 2001-02-15 | Multilevel Metals, Inc. | Load lock system for foups |
-
1999
- 1999-07-26 JP JP21001799A patent/JP4248695B2/ja not_active Expired - Fee Related
-
2000
- 2000-07-26 TW TW089114956A patent/TW465011B/zh not_active IP Right Cessation
- 2000-07-26 US US10/048,012 patent/US7393172B1/en not_active Expired - Fee Related
- 2000-07-26 WO PCT/JP2000/004987 patent/WO2001008211A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001035899A (ja) | 2001-02-09 |
| US7393172B1 (en) | 2008-07-01 |
| WO2001008211A1 (en) | 2001-02-01 |
| JP4248695B2 (ja) | 2009-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |