TW429540B - Semiconductor device and its manufacturing method - Google Patents

Semiconductor device and its manufacturing method

Info

Publication number
TW429540B
TW429540B TW088120172A TW88120172A TW429540B TW 429540 B TW429540 B TW 429540B TW 088120172 A TW088120172 A TW 088120172A TW 88120172 A TW88120172 A TW 88120172A TW 429540 B TW429540 B TW 429540B
Authority
TW
Taiwan
Prior art keywords
via holes
wiring
film
wiring grooves
tin
Prior art date
Application number
TW088120172A
Other languages
English (en)
Inventor
Hirobumi Sumi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of TW429540B publication Critical patent/TW429540B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW088120172A 1998-11-19 1999-11-18 Semiconductor device and its manufacturing method TW429540B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10329216A JP2000156406A (ja) 1998-11-19 1998-11-19 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW429540B true TW429540B (en) 2001-04-11

Family

ID=18218959

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088120172A TW429540B (en) 1998-11-19 1999-11-18 Semiconductor device and its manufacturing method

Country Status (3)

Country Link
JP (1) JP2000156406A (zh)
KR (1) KR20000035543A (zh)
TW (1) TW429540B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100528530B1 (ko) * 2000-12-20 2005-11-15 매그나칩 반도체 유한회사 반도체 디바이스의 배선 형성 방법
KR100430949B1 (ko) * 2001-10-22 2004-05-12 엘지.필립스 엘시디 주식회사 무전해 은 도금액 및 이를 이용한 금속 배선 형성방법
KR100701675B1 (ko) * 2001-12-28 2007-03-29 매그나칩 반도체 유한회사 반도체 소자의 구리배선 형성방법
JP2003218201A (ja) * 2002-01-24 2003-07-31 Mitsubishi Electric Corp 半導体装置およびその製造方法
KR100820780B1 (ko) * 2002-06-29 2008-04-10 주식회사 하이닉스반도체 반도체소자의 구리 배선 제조 방법
KR100727214B1 (ko) * 2004-12-15 2007-06-13 주식회사 엘지화학 팔라듐-은 활성화 방법을 이용한 은 전해도금방법
KR100690881B1 (ko) 2005-02-05 2007-03-09 삼성전자주식회사 미세 전자 소자의 듀얼 다마신 배선의 제조 방법 및 이에의해 제조된 듀얼 다마신 배선을 구비하는 미세 전자 소자
KR100791074B1 (ko) * 2006-08-23 2008-01-02 삼성전자주식회사 귀금속을 함유하는 장벽막을 갖는 콘택 구조체, 이를채택하는 강유전체 메모리 소자 및 그 제조방법들
KR100862826B1 (ko) * 2007-04-27 2008-10-13 동부일렉트로닉스 주식회사 반도체 소자의 구리배선 형성방법
JP2008199059A (ja) * 2008-05-01 2008-08-28 Sony Corp 固体撮像素子及びその製造方法
JP6187008B2 (ja) * 2013-08-07 2017-08-30 大日本印刷株式会社 金属充填構造体の製造方法及び金属充填構造体
KR102264160B1 (ko) * 2014-12-03 2021-06-11 삼성전자주식회사 비아 구조체 및 배선 구조체를 갖는 반도체 소자 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0168120B1 (ko) * 1994-12-30 1999-02-01 김주용 반도체 소자의 텅스텐-플러그 형성방법
KR970052537A (ko) * 1995-12-27 1997-07-29 김광호 반도체장치의 제조방법
KR100227622B1 (ko) * 1996-12-28 1999-11-01 김영환 반도체 소자의 비트 라인 형성 방법
KR100227843B1 (ko) * 1997-01-22 1999-11-01 윤종용 반도체 소자의 콘택 배선 방법 및 이를 이용한 커패시터 제조방법

Also Published As

Publication number Publication date
JP2000156406A (ja) 2000-06-06
KR20000035543A (ko) 2000-06-26

Similar Documents

Publication Publication Date Title
TW429540B (en) Semiconductor device and its manufacturing method
EP1261021A3 (en) Method of production of circuit board, semiconductor device, and plating system
TWI256677B (en) Barrier material and process for Cu interconnect
KR970072193A (ko) 다단 매립 배선구조
WO2003017359A1 (en) Semiconductor device and production method therefor, and plating solution
EP0952762A4 (en) PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
EP0269211A3 (en) Semiconductor device having a metallic layer
TW200608502A (en) Bond pad structure for copper metallization having increased reliability and method for fabricating same
WO2005013339A3 (en) Methods of forming conductive structures including titanium-tungsten base layers and related structures
TWI268012B (en) Electrically conductive structure formed between neighboring layers of circuit board and method for fabricating the same
KR880013239A (ko) 반도체소자의 접속구멍형성 방법
KR950034675A (ko) 범프형 집적회로 패키지용 막 회로 금속 시스템
US5499446A (en) Method for manufacturing printed circuit board with through-hole
TW200512871A (en) Method of selectively making copper using plating technology
EP0903781A3 (en) Method of forming embedded copper interconnections and embedded copper interconnection structure
WO2000075964A3 (en) Method of fabricating semiconductor device employing copper interconnect structure
EP0394722A3 (en) Multilevel metallization for vlsi and method for forming the same
AU581946B2 (en) Multilayer ohmic contact for P-type semiconductor and method of making same
WO2002041391A3 (en) Amorphized barrier layer for integrated circuit interconnects
IT1251005B (it) Struttura di interconnessione in un dispositivo a semiconduttore e relativo metodo
SG147268A1 (en) Integrated circuit with simultaneous fabrication of dual damascene via and trench
TW353217B (en) Method of producing semiconductor device having a multi-layer wiring structure
WO2001065599A3 (en) Nitride layer forming methods
TW366519B (en) Semiconductor device
KR20010076493A (ko) 다마신 공정으로 형성된 반도체 소자의 배선구조

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees